CN107064166B - Treatment object analysis device, processing device, and treatment object analysis method - Google Patents
Treatment object analysis device, processing device, and treatment object analysis method Download PDFInfo
- Publication number
- CN107064166B CN107064166B CN201710023229.0A CN201710023229A CN107064166B CN 107064166 B CN107064166 B CN 107064166B CN 201710023229 A CN201710023229 A CN 201710023229A CN 107064166 B CN107064166 B CN 107064166B
- Authority
- CN
- China
- Prior art keywords
- image
- treatment
- target object
- unit
- treatment target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Theoretical Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Signal Processing (AREA)
- Quality & Reliability (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
Abstract
The present invention relates to a treatment object analysis device, a processing device, and a treatment object analysis method. The processing device includes: a housing configured to form a treatment space to treat a target subject; a table disposed in the housing and on which the treatment target object is mounted; a light irradiation unit configured to irradiate light on the stage; an inspection unit disposed on the stage separately and configured to obtain an image of each row, an image of each region, and a spectrum of the treatment target object processed by the light; and a treatment unit connected to the inspection unit and configured to determine a treatment status of the processed treatment target object using the image of each row, the image of each region, and the spectrum.
Description
Technical Field
The present invention relates to a treatment object analysis device, a processing device including the same, and a treatment object analysis method, and more particularly, to a treatment object analysis device, a processing device including the same, and a treatment object analysis method, which are capable of easily determining whether or not a non-uniformity defect or suitability of a treatment condition occurs on a treatment object.
Background
As display panels such as liquid crystal display devices have increased, various alternatives are being proposed and one of them is an annealing method using laser because it is difficult to ensure uniformity when performing an annealing process.
In other words, the laser beam emitted from the laser irradiator is emitted via the quartz window to be irradiated on the display panel. The laser beam is irradiated in a line type and a curtain type perpendicular or slightly inclined with respect to the display panel. Further, the laser beam is irradiated on the entire surface of the display panel while the display panel is horizontally moved in a direction perpendicular or slightly inclined with respect to the plane of the laser beam.
At this time, when abnormality occurs in the length, uniformity, energy, etc. of the irradiated laser beam, an uneven defect may occur on the surface of the display panel in the annealing process. For example, there are scanning unevenness formed in the vertical direction and exposure unevenness formed in the horizontal direction, which may occur due to different causes, as unevenness defects. Due to this non-uniform defect, when the entire screen is displayed in a specific hierarchical level, a specific area may be non-uniformly displayed.
Therefore, the treatment object analysis apparatus has been used to check whether an uneven defect occurs on the surface of the display panel. In other words, a typical treatment object analysis apparatus determines whether or not an uneven defect occurs by obtaining a display panel image in real time using a camera, monitoring an uneven defect state, and analyzing data regarding the same.
However, it is difficult to accurately determine whether or not the unevenness defect occurs using only the image, and when the camera malfunctions, the unevenness defect monitoring may be stopped. This may cause scheduling delay due to determination of whether or not uneven defect occurs and maintenance of the device, and processing efficiency is reduced.
[ citation ]
[ patent document ]
Disclosure of Invention
The invention provides a treatment object analysis device, a processing device including the same, and a treatment object analysis method, which can easily determine whether uneven defects occur during treatment of a treatment target object.
The present invention also provides a treatment target analysis device, a processing device including the same, and a treatment target analysis method capable of suppressing and preventing the occurrence of an uneven defect by increasing the applicability of treatment conditions.
The invention provides a subject analysis apparatus capable of improving efficiency and yield, a processing apparatus including the same, and a subject analysis method.
According to an exemplary embodiment, a treatment object analyzing device includes: a first inspection unit disposed separately on the treatment target object and configured to capture an image of each row and each region of the treated treatment target object; a second inspection unit separately disposed on the treatment target object and configured to display in a spectrum wavelengths of light reflected from the treated treatment target object; and a processing unit connected to the first and second inspection units and configured to process and analyze the images and spectra and determine a treatment status of the processed treatment target object.
The first checking unit may include: a first image capturing unit configured to capture an image of each row in one direction; and a second image capturing unit configured to capture an image of each area in a direction intersecting the one direction, wherein image capturing areas of the first image capturing unit and the second image capturing unit are distinguished from each other.
The processing unit may include: a data handling unit configured to collect data for each of the image, the image and the spectrum for each row, each region and to digitize the data; a data conversion unit configured to convert the digitized value based on the reference score; and a determination unit configured to determine an occurrence of a non-uniformity defect on the processed treatment target object or a treatment condition of the processed treatment target object according to the converted value from the data conversion unit.
The treatment object analysis device may further include a control unit configured to control a treatment operation for the treatment target object according to the determination result of the uneven defect occurrence communicated from the determination unit.
The treatment object analysis device may further include a control unit configured to control a treatment condition for the treatment target object according to a determination result of the treatment condition transferred from the determination unit.
The data handling unit may include: a first digitizing unit configured to digitize an average brightness of the image of each row and the image of each region; a second digitizing unit configured to edge-process the image of each line and the image of each area, and digitize roughness of the image of each line and the image of each area; and a third digitizing unit configured to binarize the image of each row and the image of each area, and to digitize black and white ratios of the binarized images.
The data handling unit may digitize peak spectra, peak values and band (band) regions of the spectrum.
According to another exemplary embodiment, a processing device comprises: a housing configured to form a treatment space to treat a target subject; a table disposed in the housing and on which a treatment target object is mounted; a light irradiation unit configured to irradiate light on the stage; an inspection unit separately disposed on the table and configured to obtain an image of each line, an image of each region, and a spectrum of a treatment target object processed by light; and a treatment unit connected to the examination unit and configured to determine a treatment status of the processed treatment target object using the image of each row, the image of each region, and the spectrum.
The inspection unit may include: a first inspection unit disposed in a moving direction of the stage and in a crossing direction crossing the moving direction to obtain an image of each line and an image of each area of the processed treatment target object; and a second inspection unit disposed in any one of the moving direction and the crossing direction and configured to obtain a wavelength of light reflected by the treated treatment target object.
The handling unit may include: a data handling unit configured to collect and digitize data for each of the images for each row, each of the images for each region, and each of the spectra; a data conversion unit configured to convert the digitized value based on the reference score; and a determination unit configured to determine an occurrence of an uneven defect on the processed treatment target object or a treatment condition of the processed treatment target object according to the converted values from the data conversion unit; and a control unit configured to control the light irradiation unit according to a determination result of the determination unit.
The data handling unit may digitize the average brightness, the roughness after edge emphasis, and the black and white ratio after binarization of the image of each line and the image of each region, and digitize the peak spectrum, the peak value, and the band region of the spectrum.
According to a further exemplary embodiment, a method of treatment object analysis includes: obtaining a surface image and a spectrum of the processed treatment target object; processing the surface image and the spectrum with data for analysis; and determining a treatment status of the processed treatment target object using the data for analysis.
Processing with the data for analysis may include: digitizing the surface image and the spectrum; and converting the digitized value based on the reference score.
The digitizing of the surface image may comprise: average brightness of the digitized surface image; digitizing the second derivative calculation result after edge processing is carried out on the surface image; and the black and white ratio of the digitized surface image.
The digitization of the spectrum may comprise: a peak spectrum of the digitized spectrum; the peak of the digitized spectrum; and band regions of the digitized spectrum.
The determination of the treatment status of the processed treatment target object may include determining an uneven defect occurrence status of the processed treatment target object.
The determining of the uneven defect occurrence state may include comparing the converted value with a preset set value; and determining that an uneven defect occurs when the converted value is less than the set value.
The treated treatment target object may include multiple treatment regions treated at different energies. The treatment subject analysis method may further include determining a suitable state of a treatment condition of a treatment target subject treated at different energies.
Determining a suitable state of a treatment condition for treating the target subject may include: providing a value converted based on a reference value for each treatment region of the treatment target object treated with the differential energy; checking a maximum value of the converted values for each region; and determining that the treatment target subject treatment condition representing the maximum value is suitable for a reference treatment condition for the post-processed treatment target subject.
Drawings
Exemplary embodiments may be understood in more detail from the following description taken in conjunction with the accompanying drawings, in which:
fig. 1(a) is a side view illustrating a laser treatment apparatus including a treatment target analysis apparatus according to an embodiment of the present invention.
Fig. 1(b) is a plan view illustrating the laser treatment apparatus of fig. 1 (a).
Fig. 2 is a perspective view of the unevenness defect monitoring apparatus of fig. 1 (a).
Fig. 3 is a side view of the uneven defect monitoring apparatus of fig. 1 (a).
Fig. 4 is a view illustrating a treatment target object data acquisition region of an examination unit according to an embodiment of the present invention.
Fig. 5(a) is an exemplary view of an image of an inspection unit in a line shape.
Fig. 5(b) is an exemplary view of an image of the inspection unit in the shape of a region. Fig. 5(c) is an exemplary view of a spectrum obtained by the inspection unit.
Fig. 6 is a flowchart illustrating a treatment object analysis method for determining treatment conditions of a treatment object according to an embodiment of the present invention.
Fig. 7 is a flowchart illustrating a treatment object analysis method for determining a treatment status of a treatment object according to an embodiment of the present invention.
Fig. 8 is a schematic view for explaining the treatment object analysis method of fig. 7.
Fig. 9(a) is an exemplary view in which the image of each line is digitized by the first calculation unit.
Fig. 9(b) is an exemplary view in which the image of each line is digitized by the second calculation unit.
Fig. 9(c) is an exemplary view in which the image of each line is digitized by the third calculation unit.
Fig. 10(a) is an exemplary view in which an image of each region is digitized by the first calculation unit.
Fig. 10(b) is an exemplary view in which the image of each region is digitized by the second calculation unit.
Fig. 10(c) is an exemplary view in which the image of each region is digitized by the second calculation unit.
Fig. 11 is an image for explaining a data handling unit according to an embodiment of the present invention.
Fig. 12 is a graph for explaining a data handling result of a handling unit according to an embodiment of the present invention.
The reference numbers illustrate:
1: processing apparatus
100: laser generating unit/laser beam generating unit;
110: a laser source;
130: a mirror;
200: a housing;
300: a treatment object analysis device;
310: a first inspection unit;
310 a: a first image capturing unit;
310 b: a second image capturing unit;
315: an image capturing mirror;
330: a lighting unit;
330 a: a first lighting unit;
330 b: a second lighting unit;
350: a second inspection unit;
370: a processing unit;
371: a data handling unit;
372: a data conversion unit;
373: a determination unit;
374: a control unit;
s110: operating;
s120: operating;
s130: operating;
s140: operating;
s150: operating;
s210: operating;
s220: operating;
s230: operating;
s240: operating;
s250: operating;
s260: and (5) operating.
R: treatment space
G: treating a target object
S: table (Ref. Table)
L: laser beam
n1, n 5: examination results
Detailed Description
Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The drawings may be exaggerated to clarify the description, and the same reference numerals are used throughout the drawings to designate the same or similar elements.
A processing apparatus according to an embodiment of the present invention may perform a process for partially irradiating light on a specific area. Further, during treatment of a treatment target object using a treatment target analysis device, unevenness defects that may occur due to irradiation of light can be monitored in real time, and optimal conditions for treating the treatment target object (i.e., treatment conditions such that unevenness defects may not occur) can be determined.
At this time, the means for irradiating the laser beam on the treatment target object (amorphous film is formed thereon) in a linear form and for annealing the treatment target object may be realized by an optimum condition of a means in which an uneven defect on the treated treatment target object (hereinafter, simply referred to as treatment object) is inspected in real time and an energy used for irradiation by the laser beam.
However, the processing device is not limited to implementing the present invention, and may be applied to an object in which uneven defect occurrence is checked in real time in various devices using a laser beam (for example, a laser emitting device for removing a film on a treatment target object on which a laser beam is irradiated for each specific region, a laser heat treatment device, or a laser beam treatment device), and energy adjustment of the laser beam is required. Further, the processing means may also be used for various means of irradiating light other than a laser beam on each specific region. Therefore, hereinafter, the processing device may be a laser processing device, and the light irradiated on each specific region may be a laser beam.
Fig. 1(a) is a side view illustrating a processing apparatus including a treatment target analysis apparatus according to an embodiment of the present invention, fig. 1(b) is a plan view illustrating the laser treatment apparatus of fig. 1(a), fig. 2 is a perspective view of the unevenness defect monitoring apparatus of fig. 1(a), and fig. 3 is a side view of the unevenness defect monitoring apparatus. Further, fig. 4 is a view illustrating a treatment target object data acquisition region of a detection unit according to an embodiment of the present invention, and fig. 5(a) is an exemplary view of an inspection unit in a line shape, fig. 5(b) is an exemplary view of an inspection unit in a region shape, and fig. 5(c) is an exemplary view of a spectrum obtained by the inspection unit.
The processing apparatus 1 according to an embodiment of the present invention is an apparatus for irradiating a laser beam L on a treatment target object G and for determining a treatment state from surface state data of the treatment target object (hereinafter, simply referred to as a treatment object) treated by the laser beam L, and includes: a housing 200 for forming a treatment space R in which a treatment target object G is treated; a table S disposed in the housing 200 and on which a treatment target object G is mounted; a light irradiation unit for irradiating light on the stage S; and a treatment target analysis device 300, at least a part of which is disposed inside the housing 200 and which obtains an image of each line, an image of each area, and a spectrum of the treatment target object G processed by light, and determines whether an uneven defect occurs on the treatment target object G. Here, the light irradiation unit will be described as a laser generation unit 100 for irradiating a laser beam L on a treatment target object G.
The laser generating unit 100 is a component through which a laser beam of the processing laser beam L irradiated on the treatment target object G passes, and includes: a laser source 110 that oscillates a laser beam L; an optical system (not shown) for processing the shape and energy distribution of the laser beam L oscillated from the laser source 110; a mirror 130 for reflecting at least a part of the processed laser beam L to the processing target object S; and a treatment target object irradiation lens system (not shown) for compressing the laser beam L reflected on the treatment target object S by the mirror.
The laser source 110 is a device for oscillating a laser beam and may be referred to as an oscillator. The laser source 110 is a known component for generating a laser beam, and one of its various kinds (e.g., KrF excimer laser or ArF excimer laser) can be employed according to the wavelength of the laser beam to be used. As the laser source, for example, there are gas lasers such as Ar laser, Kr laser, or excimer laser, glass laser, ruby laser, emerald laser, Ti: sapphire laser, copper vapor laser, gold vapor laser, or laser having a medium in which one or more kinds of Nd, Yb, Cr, Ti, Ho, Er, Tm, and Ta are added as dopants to YAG, YVO4、Mg2SiO4、YAlO3Or GdVO4Single crystal or added to ceramics, YAG, Y2O3、YVO4、YAlO3Or GdVO4A polycrystalline body of (4). And may use laser light oscillated from one or more kinds of laser light sources.
An optical system (not shown) is disposed on a traveling path (output direction) of the laser light and processes the shape and energy distribution of the laser light. In other words, the shape and energy distribution are processed such that the laser beam L has a beam type of a line shape. The laser beam L may be processed to have a line-shaped beam that is easier to condense the beam than a large area planar shape in which the laser beam is irradiated over the entire plane of the treatment target object. For this purpose, the optical system may comprise a beam expansion mirror tube for processing the shape of the laser beam and a beam homogenizer for homogenizing the energy distribution of the processed laser beam.
The mirror 130 is disposed to be inclined by 45 ° to the traveling direction of the laser beam and reflects the laser beam processed and output from the optical system to the processing target object. The oscillated laser beam is reflected to a direction intersecting the oscillation direction, and reaches a treatment target object irradiation lens system (not shown).
A treatment target object irradiation lens system (not shown) is formed of a combination of a plurality of convex lenses and/or concave lenses, and compresses the laser beam reflected from the mirror 130 to provide the compressed laser beam to the treatment target object.
The housing 200 forms therein a processing space R in which a treatment target object G is accommodated and a treatment of the treatment target object is performed using a laser beam L, and in the housing, an emission window 230 is installed, the emission window 230 passing through a central portion of an upper portion of the hollow body. Accordingly, the laser beam 41 oscillated from the laser beam generating unit 100 to be described later passes through the emission window 230 and is irradiated on the treatment target object S inside the housing 200. At this time, a treatment target object inlet port (not shown) and a treatment target object outlet port (not shown) may be formed at both sides of the housing 200 to facilitate the entry and exit of the treatment target object. On the other hand, in the present invention, the case 200 is represented as one body, and the opening portion thereof is not separately illustrated, but the case 200 may be formed such that either side of the body is opened and a door (not shown) closing the opened side may be disposed.
The stage S is a component on which the target object G is treated and is installed in the treatment space R, and the stage S reciprocates from side to side in the housing 200. Due to the reciprocating motion of the stage S from side to side, the laser beam L may be irradiated on the entire area of the surface of the treatment target object G facing the emission window 230, and the treatment target object G may be processed.
At this time, the energy value of the laser beam L irradiated on the treatment target object G and the irradiation condition of the laser beam L vary according to the processing environment, which causes an uneven defect to occur on the treatment target object G. In this case, although the occurrence of the mura defect may be detected via surface image capture for treating the target object G, the accuracy of determining whether the mura defect occurs may not be complete. To complement this, the processing apparatus 1 of the present invention includes a treatment target analysis apparatus 300.
The treatment target analysis device 300 is a component for detecting the processing state of the treatment target object G and easily setting the processing conditions of the treatment target object G while performing in real time. The treatment object analysis device 300 includes: an inspection unit for obtaining a surface image and a spectrum of the processed treatment target object G; and a processing unit 370 connected to the examination unit and for processing and analyzing the image and the spectrum of the treatment target object G to determine a state of the treatment target object G.
The inspection unit includes: a first examination unit 310 disposed separately on the treatment target object G and for capturing an image of each line and each region of the treatment target object G; and a second inspection unit 350 separately disposed on the treatment target object G and for displaying wavelengths of light reflected by the treatment target object G as a spectrum.
The first inspection unit 310 is a component disposed in a moving direction (one direction, x-axis direction) of the stage S and a direction (the other direction, y-axis direction) intersecting the moving direction and used to obtain an image of each line and each region of the processed treatment target object G. The first checking unit 310 includes: a first image capturing unit 310a for capturing an image of each line of the treatment target object G in one direction; and a second image capturing unit 310b for capturing an image of each region of the treatment target object G in the other direction. At this time, the images captured by the first image-capturing unit 310a and the second image-capturing unit 310b are superimposed on each other.
The first image capturing unit 310a functions as image capturing of a processed treatment target object, which is an inspection target. In other words, referring to fig. 5(a), the first image capturing unit 310a captures an image of a processed portion of the treatment target object G on which the laser beam L is irradiated and passed in a line shape, and obtains a schematic diagram of the image of the processed treatment target object G. The first image capturing unit 310a may be a CCD camera and captures an image of the treatment target object G in an inclined state on an upper side of the treatment target object by a specified angle toward the treatment target object. At this time, the first image capturing unit 310a is disposed in a direction parallel to the treatment target object G, and may include an image capturing mirror 315 installed at a position separated from the front end of the first image capturing unit 310 a. Accordingly, the first image capturing unit 310a may obtain an image of the treatment target object G reflected by the image capturing mirror 315.
The second image capturing unit 310b functions to generate an image of a region of the image capturing region of the treatment target object G for which the image is captured from the first image capturing unit 310 a. In other words, referring to fig. 5(b), the second image capturing unit 310b captures an image of a processed portion of the treatment target object G on which the laser beam L is irradiated and which passes in an area shape at a direction intersecting with a direction in which the first image capturing unit 310a faces, and obtains a schematic diagram of the image of the processed treatment target object G. In detail, the second image capturing unit 310b passes an image (in units of area) of an in-focus area (hereinafter, extraction area) from the image of the processed treatment target object G to the treatment unit 370 to be described later. At this time, the extracted region does not represent only the region indicated in fig. 5(b) and described above, which represents an in-focus image among region images captured by the second image-capturing unit 310 b. According to the treatment target object G, the extracted region may have different sizes according to an angle between the second image capturing unit 310b and the treatment target object G. Similar to the first image capturing unit 310a, the second image capturing unit 310b may be a CCD camera, and captures an image of the treatment target object G at an upper side of the treatment target object G in an inclined state in accordance with a specified angle toward the treatment target object.
In this way, the reason why the first image capturing unit 310a and the second image capturing unit 310b capture the images of the processed treatment target object G in directions different from each other is because the accuracy of the surface image is increased by capturing in various directions. Further, when the treatment target object G is obliquely inspected in the front surface or in the side surface, the unevenness defect occurring in various processes is well inspected. At this time, since the angles at which the first and second image capturing units 310a and 310b are tilted toward the treatment target object G may be changed according to the previous processing environment of the treatment target object G, the angle between the treatment target object G and the first examination unit is not limited.
On the other hand, illumination unit 330 may be connected or disposed in lower portions of first image capture unit 310a and second image capture unit 310 b. The illumination unit 330 may include a first illumination unit 330a and a second illumination unit 330b provided in the first image capturing unit 310a and the second image capturing unit 310b, respectively, and may be disposed obliquely in an upper side of the treatment target object G according to a specified angle toward the treatment target object G. Accordingly, the light emitted from the illumination unit 330 is reflected by the treatment target object G and is incident on the first image capturing unit 310a and the second image capturing unit 310 b. At this time, a white LED may be used as the lighting unit 330, but is not limited thereto, and an image of the processed treatment target object G may be clearly obtained using light sources of various wavelength bands (wavelength bands).
Further, filter units (not shown) may be provided in front ends of the first and second image-capturing units 310a and 310b, respectively. The filter unit is installed on the front ends of the lenses of the first and second image-capturing units 310a and 310b to filter light incident to the first and second image-capturing units 310a and 310 b. In other words, the filter unit passes only light in a visible light band in which uneven defects can be clearly inspected when they are observed from a wavelength band used as a light source of the illumination unit 330, and allows light to be displayed as an image. For example, when a white light emitting device is used as the illumination unit 330, visible light in which the treated treatment target object G is clearly checked is a green visible light band. Therefore, a filter for passing only light of a wavelength of about 490 to 570nm is used as the filter unit, and the filter passes light of a wavelength above among light reflected by the treatment target object G, and the passed light can be displayed as an image.
In this way, the first inspection unit 310 includes the first image capturing unit 310a, the second image capturing unit 310b, and the illumination unit 330, and inspects unevenness defects on the treatment target object G when processing the treatment target object G. Accordingly, since a procedure in which the processed treatment target object G is separately moved to the inspection position after the processing and the inspection is performed is omitted, the entire process is rapidly performed and the efficiency of the process can be increased.
The second inspection unit 350 is a component disposed in any one of one direction and the other direction to obtain the wavelength of light reflected by the processed treatment target object G. The second inspection unit 350 is disposed to face the treatment target object G in the same direction as any one of the first and second image capturing units 310a and 310b, and obtains a wavelength of light reflected by the treatment target object G from among light irradiated from any one of the first and second illumination units 330a and 330 b. In detail, the second inspection unit 350 may be disposed to face the treatment target object G in the same direction as any one of the first and second image capturing units 310a and 310b, and disposed to form the same angle as an alignment angle of any one of the first and second image capturing units 310a and 310 b. At this time, a device such as a spectrometer capable of quantitatively measuring, for example, the spectral intensity of the wavelength of the reflected light is used as the second inspection unit 350, and a spectrum as in fig. 5(c) can be obtained. On the other hand, the second inspection unit 350 has a characteristic of recognizing all bands of visible light, and thus, the filter unit of the first inspection unit 310 is not necessary.
In this way, the second inspection unit 350 may inspect, along with the first inspection unit 310, an uneven defect that may occur on the treatment target object G when the treatment target object is processed. In other words, since the second inspection unit 350 can monitor the surface state of the treatment target object G in real time together with the first inspection unit 310, the same effect as that of the first inspection unit 310 can be obtained, and even if maintenance for the first inspection unit 310 is necessary, the process for the treatment target object is not stopped.
As illustrated in fig. 4, the first and second inspection units 310 and 350 obtain surface images and spectra of the treatment target object G such that a plurality of inspection results (i.e., 5 inspection results for each of the first and second inspection units: n1 to n5) are provided when proceeding in one directional side (X-axis direction). However, the number of surface images and spectra of the treatment target object G obtained by the first inspection unit 310 and the second inspection unit 350 is not limited thereto, and as many numbers as the entire surface images and spectra can be obtained for the processed treatment target object G can be obtained.
The processing unit 370 is a component connected to the examination unit and determines a processing state of the treatment target object via the image and spectrum obtained by the examination unit. The processing unit 370 includes: a data handling unit 371 for collecting images for each line, images and spectra for each region and processing the collected content into data values; a data conversion unit 372 for converting each data value of the image of each line, the image of each region, and the spectrum based on the reference score; and a determination unit 373 for determining uneven defect occurrence or processing conditions of the treatment target object G from the reference score passed from the data conversion unit 372. Further, the processing unit 370 comprises a control unit 374 for controlling the laser beam generating unit 100 according to the determined result delivered from the determining unit 373.
In other words, the processing unit 370 determines whether an uneven defect occurs on the processed treatment target object G or whether the processing condition of the treatment target object G is appropriate via materials such as a surface image and a spectrum of the processed treatment target object G obtained from the first and second inspection units 310 and 350, and controls the laser beam generation unit 100 to stop irradiation of the laser beam L or adjust the energy value of the laser beam L.
The data handling unit 371 is a component for digitizing the image of each line, the image of each region, and the spectrum in order to analyze the material of the image of each line, the image of each region, and the spectrum. In this case, the data handling unit 371 includes: a first digitizing unit for digitizing an average brightness of the image of each line, the image of each region, and the spectrum obtained by the first inspection unit 310; a second digitizing unit for edge processing the image of each line and the image of each area and digitizing the roughness of the image of each line and the image of each area; and a third digitizing unit for binarizing the image of each line and the image of each area, and digitizing a ratio of black and white of the binarized image. Further, the data handling unit 371 digitizes the peak spectrum, the peak value, and the band region of the spectrum obtained by the second inspection unit 350.
The first digitizing unit digitizes the average brightness of the original images of the image of each line and the image of each region obtained by the first image capturing unit 310a and the second image capturing unit 310b of the first examination unit 310, so as to determine the processing state of the treatment target object G via the image of each line and the image of each region. At this time, the reason why the average brightness of the original image is digitized is that it is directly related to whether or not the unevenness defect exists on the treatment target object G, and the image of the portion where the unevenness defect occurs on the treatment target object G appears dark, and the image of the portion where the unevenness defect does not occur appears bright. For example, due to the multiple tests, when the treatment target object has a good quality in the process, the result analyzed by the second examination unit 350 represents a value of about 520nm band. At this time, when the unevenness defect occurs on the treatment target object G, since the analyzed result of the second inspection unit 350 exceeds the band of about 490nm to 570nm, the reflected light is filtered out and the image appears dark.
Accordingly, the treatment status of the treatment target object G can be checked from the digitization and analysis of the average brightness of the obtained image.
The second digitizing unit image-processes the original image into an edge-processed image (hereinafter, preliminarily processed image), and then performs digitization so as to determine the processing state of the treatment target object G via the image of each line and the image of each region. This is because unevenness can be clearly seen in the first processed image due to the edge emphasis processing for the original image, and the surface state of the treatment target object G can be checked more clearly.
The third digitizing unit digitizes an image binarized from the primarily processed image (hereinafter, secondarily processed image) so as to determine a processing state of the treatment target object G via the image of each line and the image of each area. This is to classify the preliminarily processed image into black and white using a set threshold value and calculate its ratio to digitize it. In this way, the reason why the preliminarily processed image is binarized is considered because the unevenness defect can be further strengthened in the binarized image and displayed only in black and white. At this time, since the uneven defect on the treatment target object is displayed in white, it can be checked that the uneven defect occurs on the treatment target object G as the digitized value of the black-to-white ratio of the secondarily processed image becomes larger.
On the other hand, the data treatment unit 371 digitizes the peak spectrum, the peak value, and the band region of the spectrum to determine the treatment state of the treatment target object G via the spectrum. At this time, the values of the peak and band regions among the digitized values of the spectrum serve as important elements in observing the state of the treatment target object G. This is because when the digitized peak and band regions represent large values, the amount of light reflected by the treatment target object G increases and it can be determined that no uneven defect has occurred on the treatment target object G.
The data conversion unit 372 is a component for converting the data values (i.e., digitized values) transferred from the data handling unit 371 based on the reference scores, converting the digitized values of the image of each line based on the reference scores, converting the digitized values of the image of each region based on the reference scores, and converting the digitized values of the spectrum based on the reference scores. To explain the first checking unit as an example, the data conversion unit 372 preliminarily converts the average brightness of the digitized raw image, the preliminarily processed image values, and the secondarily processed image values of each line into respective 100-point conversion scores, and divides each value by a specified ratio to secondarily convert into 100-point conversion scores. In other words, the value from the first digitizing unit is converted to a value corresponding to a 100-point scale, and the value from the second digitizing unit is converted to a value corresponding to a 100-point scale, and the value from the third digitizing unit is converted to a value corresponding to a 100-point scale. In addition, the first to third digitizing units reflect and convert into a score of 100-point scale according to a ratio of 40:40: 20.
On the other hand, to explain the second inspection unit 350 as an example, the data conversion unit 372 preliminarily converts the peak, peak spectrum, and band regions of the spectrum into respective scores on a 100-point scale, and divides each value by a specified ratio to secondarily convert into a score on a 100-point scale. In other words, the peak value is converted to a score of 100-point scale, the peak wavelength is converted to a score of 100-point scale, and the band region is converted to a score of 100-point scale. In addition, peak spectrum conversion score: peak conversion score: the band transformation score is reflected in a ratio of 40:40:20 and transformed to a 100-point scale score.
At this time, in the present invention, the reflection ratio of the conversion score is set to 40:40:20, but the present invention is not limited thereto, and the ratio may be changed by those skilled in the art.
First, determining whether an uneven defect occurs on the treatment target object G is performed by comparing the conversion score delivered from the data conversion unit 372 with a preset set value. In other words, when the score value delivered from the data conversion unit 372 is smaller than a preset set value, it is determined that the defect of unevenness occurs on the treatment target object G, and when the conversion score is larger than the set value, it is determined that the defect of unevenness does not occur on the treatment target object G. At this time, through a plurality of processes, the set value may be the minimum value that the data conversion unit 372 may represent in a state in which the uneven defect does not occur on the treatment target object G.
On the other hand, determining the treatment condition of the treatment target object G is performed by determining, by the determination unit 373, that the energy value of the laser beam L when the maximum value of the conversion score delivered from the data conversion unit 372 occurs is the energy value of the laser beam L that does not allow the treatment target object G to have the occurrence of the mura defect.
The control unit 374 is configured to control the laser beam generation unit 100 according to the determined result of the determination unit 373, and to control a treatment operation for the treatment target object G according to the result of whether the mura defect occurs, which is transferred from the determination unit 373. Further, the treatment condition for treating the target object G may be controlled according to the treatment condition determination result transferred from the determination unit 373.
Hereinafter, referring to fig. 6 to 12, a treatment object analysis method using a processing device according to an embodiment of the present invention will be described.
Fig. 6 is a flowchart illustrating a treatment object analysis method for determining a treatment condition of a treatment object according to an embodiment of the present invention, fig. 7 is a flowchart illustrating a treatment object analysis method for determining a treatment state of a treatment object according to an embodiment of the present invention, and fig. 8 is a schematic view for explaining the treatment object analysis method of fig. 7. Fig. 9(a) is an exemplary view in which the image of each line is digitized by the first calculation unit. Fig. 9(b) is an exemplary view in which the image of each line is digitized by the second calculation unit. Fig. 9(c) is an exemplary view in which the image of each line is digitized by the third calculation unit. Fig. 10(a) is an exemplary view in which an image of each region is digitized by the first calculation unit. Fig. 10(b) is an exemplary view in which the image of each region is digitized by the second calculation unit. Fig. 10(c) is an exemplary view in which the image of each region is digitized by the second calculation unit. Fig. 11 is a schematic diagram for explaining a treatment process of a spectrum of a data treatment unit. Fig. 12 is a graph for explaining a data handling result of a handling unit according to an embodiment of the present invention.
A treatment object analysis method according to an embodiment of the present invention includes an operation for obtaining a surface image and a spectrum of a processed treatment target object, an operation for processing the surface image and the spectrum into data for analysis, and an operation for determining a treatment state of the processed treatment target object using the data for analysis. At this time, the determination of the treatment status of the treated treatment target object may be any of the following: an operation for determining an occurrence of an uneven defect on a processed treatment target object; and an operation for determining whether treatment conditions for treating the target object treated with different energies are appropriate. Hereinafter, a treatment object analysis method including an operation for determining whether treatment conditions of a treatment target object treated with different energies are appropriate will be described.
First, after a treatment target object G desired to be processed is installed on a stage S, treatment for the treatment target object G is performed to provide a treatment target object G processed at different energies for each region (operation S210). In other words, as illustrated in fig. 8, treatment target objects having treatment regions a 1-a 10 treated with different treatment energies are provided.
Surface data of each region of the processed treatment target object is then obtained using the first and second inspection units 310 and 350 (operation S220). In other words, an image of each line and an image of each region for each of the treatment regions a1 to a10 are obtained via the first image capturing unit 310a and the second image capturing unit 310b, and a spectrum of the respective treatment regions a1 to a10 is obtained via the second inspection unit 350. In other words, the first inspection unit 310 and the second inspection unit 350 obtain data of the first image capturing unit image acquisition region P1, the second image capturing unit image acquisition region P2, and the second inspection unit data acquisition region P3. At this time, the operation for obtaining the surface data of each region allows the first and second inspection units 310 and 350 fixedly mounted in the housing 200 to obtain the surface data of each region of the processed treatment target object while moving the stage S by a specified distance. When surface data of each region of the processed treatment target object is acquired, the data acquired for each region is processed into data for analysis. In other words, the operation for processing the acquired data of each area into data for analysis includes an operation for digitizing the surface image and the spectral data (operation S230) and an operation for converting the digitized values based on the reference scores.
Referring to fig. 9(a) to 10(c), operations for digitizing the surface image and the spectrum may be performed in the data handling unit 371. At this time, digitizing the surface image by the data handling unit 371 includes: an operation for digitizing the average luminance of the surface image by the first computing unit, an operation for digitizing the result of the second-order operation by the second computing unit after edge processing is performed on the surface image, and an operation for digitizing the black-to-white ratio of the surface image by the third computing unit. In other words, as described above, the first to third calculation units digitize the image of each line and the image of each region (a1 to a 10). In this way, the data values of the image of each line and the image of each area digitally processed by the data handling unit 371 are presented in table 1 and table 2 below.
[ Table 1]
[ Table 2]
Table 1 represents the digitized values of the image of each line of each treatment region a 1-a 10. Table 2 represents digitized values of an image of each of the treatment regions a1 through a 10.
Furthermore, the digitization of the spectrum includes an operation for digitizing the peak spectrum of the spectrum and an operation for digitizing the band region of the spectrum. In this way, the data values of the spectrum digitally processed by the data handling unit 371 are presented in the following [ table 3 ].
[ Table 3]
Table 3 represents the digitized values of the spectra of the respective treatment regions a1 to a 10.
In this way, the digitized values of the image of each line, the image of each region, and the spectrum realized by the data handling unit 371 may be converted by the data conversion unit 372 based on the reference scores (operation S240). At this time, the reference score is based on 100 points, and the digitized values of the image of each line, the image of each region, and the spectrum are converted based on 100 points. In detail, the image of each line and the image of each area are converted based on 100 points at a ratio of the first calculation unit to the second calculation unit to the third calculation unit set to 40:40:20 with respect to the values from the first to third calculation units.
At this time, the conversion results of the respective digitized values of the image of each line, the image of each region, and the spectrum presented in [ table 1] to [ table 3] are presented in [ table 4] to [ table 6] below.
[ Table 4]
Table 4 is a table representing the conversion results of the digitized values of the image of each line obtained for each treatment area via the first image capturing unit. Here, when the conversion score of the image of each line is considered, it can be checked that the a4 region among the treatment regions represents the maximum value.
[ Table 5]
Table 5 is a table representing the conversion result of the digitized values of the image of each region obtained for each treated region via the second image capturing unit. Here, when the conversion score of the image of each region is considered, it can be checked that the a4 region among the treatment regions represents the maximum value.
[ Table 6]
Table 6 is a table representing the conversion results of the digitized values of the spectrum obtained for each treatment region via the second image capturing unit. Here, when the conversion score of the spectrum is considered, it can be checked that the a3 region among the treatment regions represents the maximum value.
Similar to [ table 4] to [ table 6], when the images of each row, the images of each region, and the spectra for each treatment region a1 to a10 are converted into conversion scores, the average thereof is calculated to obtain a final conversion score as presented in [ table 7 ].
[ Table 7]
In other words, similarly to [ table 7], the conversion scores of the first image-capturing unit, the second image-capturing unit, and the second inspection unit are summed up to calculate a sum, and an average value is calculated from the summed value to obtain a final conversion score.
In this way, when the conversion score of each treatment region a1 to a10 is obtained by the data conversion unit 372, the treatment energy of the region having the maximum value among the conversion values from each region is checked (operation S250). In other words, when the a4 region (which is a region having the maximum value from among the average values in [ table 7 ]) is processed, the energy value of the laser beam L is checked. At this time, the reason why energy is checked when processing a region having a maximum value from among the average values is because when the surface data value is large, it relates to a phenomenon that no uneven defect occurs on the processed treatment target object G. Therefore, when the treatment target object G that is not treated by the laser beam energy of the region having the maximum value among the average values is treated, it can be determined as the optimum treatment condition that can suppress or prevent the occurrence of the uneven defect on the treatment target object G.
Hereinafter, after the operation for determining the maximum value check and the optimal treatment condition determination operation, the determined treatment energy may be set as the treatment energy of the treatment target object G in the post-processing (operation S260).
The above treatment target analysis method is a method of presenting an optimal treatment condition of a treatment target object before treating the treatment target object, and presenting surface data for analyzing and determining each region of the treatment target object treated with different energies.
Hereinafter, referring to fig. 7, a treatment analysis method capable of checking whether an uneven defect occurs on a treatment target object in real time during treatment of the treatment target object G.
First, a treatment target object G desired to be processed is mounted on a stage S. Subsequently, the laser beam generation unit 100 is activated to allow the laser beam L to be irradiated on the treatment target object G, and the treatment of the treatment target object is continued. At this time, when the treatment for treating the target object G is underway, the stage S moves by a specified distance so as to irradiate the laser beam L on the upper surface of the treatment target object G.
In this way, when the treatment for treating the target object G is underway, surface data of the treated treatment target object (treatment object) is obtained via the first and second inspection units 310 and 350 (operation S110). In other words, the first examination unit 310 and the second examination unit 350 obtain data of processed data of the rear stage in the treatment direction based on the direction in which the treatment target object G is treated. At this time, as described above, the surface data acquisition may be performed via the first image-capturing unit 310a, the second image-capturing unit 310b, and the second inspection unit 350.
When the processed surface data of the treatment target object is acquired, the surface data is processed into data for analysis. In other words, the operation for processing the processed surface data of the treatment target object as data for analysis includes operation S120 for digitizing the surface image and the spectral data and operation S130 for converting the digitized values based on the reference scores. In contrast to operations S230 and S240 above, this is performed in the same way, except that the treated treatment target object is in a state of being treated with a single energy.
In this way, when the final conversion value of the surface data of the processed treatment target object G is calculated by the data conversion unit 372, operation S140 for determining the state of occurrence of the uneven defect on the processed treatment target object G is performed via the final conversion value. At this time, the operation for determining the state of occurrence of the mura defect on the processed treatment target object G via the final converted value includes an operation for comparing the final converted value with a preset set value, and an operation for determining the occurrence of the mura defect on the processed treatment target object G when the converted value has a value smaller than the set value. Here, the set value means a minimum value that the conversion value can represent in the treatment condition such that the uneven defect does not occur on the treated treatment target object.
In this way, whether or not uneven defects occur on the treated treatment target object G is determined, and a treatment operation for the treatment target object G is controlled (operation S150). In other words, when it is determined that an uneven defect occurs on the treated treatment target object, it is determined that there is a failure in the setting of the laser beam L of the laser beam generation unit 100, and the treatment operation for treating the treatment target object (such as irradiation of the laser beam from the laser beam generation unit 100 and movement of the stage S for treating the treatment target object) is controlled to be stopped.
According to the embodiments of the present invention, the occurrence of the mura defect is determined in real time during the treatment of the treatment target object, and the treatment condition for treating the target object that can suppress or prevent the occurrence of the mura defect can be easily obtained. In other words, a surface image and a spectrum of a processed treatment target object (hereinafter, treatment object) are obtained and digitized, and it is possible to check whether or not an uneven defect occurs and a treatment condition that makes it possible to suppress and prevent the uneven defect.
Therefore, the probability of occurrence of uneven defects on the treatment object can be reduced, and the product quality can be increased. Further, the treatment table of the treatment object can be inspected in real time, and occurrence of an abnormality on the treatment object in the respective treatments can be easily detected, and the efficiency of the process is increased.
Although the treatment object analysis device, the processing device including the same, and the treatment object analysis method have been described with reference to the specific embodiments, they are not limited thereto. Accordingly, it will be readily understood by those skilled in the art that various modifications and changes may be made thereto without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (13)
1. A treatment object analysis apparatus characterized by comprising:
a first inspection unit disposed separately on a treatment target object and configured to capture an image of each line and each region of the treatment target object that is processed;
a second inspection unit separately disposed on the treatment target object and configured to display in a spectrum wavelengths of light reflected from the treated treatment target object; and
a processing unit connected to the first examination unit and the second examination unit and configured to process and analyze the image and spectrum and determine a treatment status of the treated target object that is processed,
wherein the processing unit comprises:
a data handling unit configured to collect data for each of the image, the image and the spectrum for each row, each region and to digitize the data;
a data conversion unit configured to convert the digitized value based on the reference score; and
a determination unit configured to determine an occurrence of a non-uniformity defect on the treated treatment target object or a treatment condition of the treated treatment target object according to the converted values from the data conversion unit;
wherein the data handling unit comprises:
a first digitizing unit configured to digitize an average brightness of the image of each row and the image of each region;
a second digitizing unit configured to edge process the image of each row and the image of each region to generate a first treated image, and to digitize a roughness of the first treated image; and
a third digitizing unit configured to binarize the first treated image and to digitize a black and white ratio of the binarized first treated image,
wherein the data conversion unit is configured to calculate a final conversion score which is an average of the conversion scores of the image of each row and the image of each region and the digitization values from each of the first, second and third digitization units are reflected at a predetermined ratio, and a conversion score for converting after digitization of data in the spectrum.
2. The treatment object analysis device according to claim 1, wherein the first examination unit includes:
a first image capture unit configured to capture the image of each row in one direction; and
a second image capturing unit configured to capture the image of each area in a direction intersecting the one direction,
wherein image capturing areas of the first image capturing unit and the second image capturing unit are distinguished from each other.
3. The treatment object analysis device of claim 1, further comprising a control unit configured to control a treatment operation for the treatment target object according to a determination result of the uneven defect occurrence communicated from the determination unit.
4. The treatment object analysis device of claim 1, further comprising a control unit configured to control a treatment condition for the treatment target object according to a determination result of the treatment condition communicated from the determination unit.
5. The treated subject analysis device of claim 1, wherein the data treatment unit digitizes peak spectra, peak values, and band regions of the spectrum.
6. A processing apparatus, characterized by comprising:
a housing configured to form a treatment space to treat a target subject;
a table disposed in the housing and on which the treatment target object is mounted;
a light irradiation unit configured to irradiate light on the stage;
an inspection unit disposed separately on the table and configured to obtain an image of each row, an image of each region, and a spectrum of the treatment target object processed by the light; and
a treatment unit connected to the inspection unit and configured to determine a treatment status of the treatment target object being processed using the image of each row, the image of each region, and the spectrum,
wherein the treatment unit comprises:
a data handling unit configured to collect and digitize data of each of the images of each row, each of the images of each region, and each of the spectra;
a data conversion unit configured to convert the digitized value based on the reference score;
a determination unit configured to determine an occurrence of a non-uniformity defect on the treated treatment target object or a treatment condition of the treated treatment target object according to the converted values from the data conversion unit; and
a control unit configured to control the light irradiation unit according to a determination result of the determination unit;
wherein the data handling unit comprises:
a first digitizing unit configured to digitize an average brightness of the image of each row and the image of each region;
a second digitizing unit configured to edge process the image of each row and the image of each region to generate a first treated image, and to digitize a roughness of the first treated image; and
a third digitizing unit configured to binarize the first treated image and to digitize a black and white ratio of the binarized first treated image,
wherein the data conversion unit is configured to calculate a final conversion score which is an average of the conversion scores of the image of each row and the image of each region and the digitization values from each of the first, second and third digitization units are reflected at a predetermined ratio, and a conversion score for converting after digitization of data in the spectrum.
7. The processing apparatus according to claim 6, wherein the checking unit comprises:
a first inspection unit disposed in a moving direction of the stage and in a crossing direction crossing the moving direction to obtain the image of each line of the treatment target object and the image of each region that are processed; and
a second inspection unit disposed in either one of the moving direction and the crossing direction and configured to obtain a wavelength of light reflected by the treated treatment target object.
8. A treatment object analysis method characterized by comprising:
obtaining a surface image and a spectrum of the processed treatment target object;
processing the surface image and the spectrum with data for analysis; and
determine a treatment status of the treated target object using the data for analysis,
wherein the processing with the data for analysis comprises:
digitizing the surface image and the spectrum; and
the digitized values are converted based on the reference scores,
wherein the digitizing of the surface image comprises:
digitizing the average brightness of the surface image;
edge processing the surface image to generate a first treated image, and digitizing a roughness of the first treated image; and
binarizing the first treated image and digitizing a black and white ratio of the binarized first treated image,
the converted digitized values are used to calculate a final conversion score that is an average of the conversion scores of the surface images and the digitized values from each of the average luminance, roughness and black and white ratios are reflected in a predetermined ratio, and a conversion score converted after the data in the spectrum is digitized.
9. The treatment object analysis method according to claim 8, wherein the digitization of the spectrum comprises:
digitizing a peak spectrum of the spectrum;
digitizing peaks of the spectrum; and
the band regions of the spectrum are digitized.
10. The treatment object analysis method of claim 8, wherein the determination of the treatment status of the treatment target object being processed comprises determining an uneven defect occurrence status of the treatment target object being processed.
11. The treatment object analysis method according to claim 10, wherein the determination of the uneven defect occurrence state includes:
comparing the converted value with a preset set value; and
determining that the non-uniformity defect occurs when the converted value is less than the set value.
12. The treatment object analysis method of claim 8, wherein the treatment target object being processed comprises a plurality of treatment regions treated at different energies, and further comprising determining a suitable state of a treatment condition of the treatment target object treated at different energies.
13. The treatment subject analysis method as recited in claim 12, wherein the determining the appropriate state of the treatment condition of the treatment target subject includes:
providing a value converted based on a reference value for each of the treatment regions of the treatment target subject treated with a differential energy;
examining a maximum of the converted values for each of the treatment regions; and
determining that a treatment target subject treatment condition representing the maximum value is appropriate for a reference treatment condition of the treatment target subject for post-processing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160004297A KR101862312B1 (en) | 2016-01-13 | 2016-01-13 | substrate analysis device and the treatment apparatus having it, substrate analysis method |
| KR10-2016-0004297 | 2016-01-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107064166A CN107064166A (en) | 2017-08-18 |
| CN107064166B true CN107064166B (en) | 2021-08-03 |
Family
ID=59462858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710023229.0A Active CN107064166B (en) | 2016-01-13 | 2017-01-12 | Treatment object analysis device, processing device, and treatment object analysis method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101862312B1 (en) |
| CN (1) | CN107064166B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109001213B (en) * | 2018-07-19 | 2021-08-10 | 华南理工大学 | Reel-to-reel ultrathin flexible IC substrate appearance detection method |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09138200A (en) * | 1995-11-14 | 1997-05-27 | Nkk Corp | Method for determining surface defect of strip material |
| US6069690A (en) * | 1998-11-13 | 2000-05-30 | Uniphase Corporation | Integrated laser imaging and spectral analysis system |
| JP2006112939A (en) * | 2004-10-15 | 2006-04-27 | Nikon Corp | Flaw inspection device |
| CN100376889C (en) * | 2004-12-31 | 2008-03-26 | 张健 | Intelligent digital graphics context detection system and detection method |
| KR20070113032A (en) * | 2006-05-24 | 2007-11-28 | 주식회사 포스코 | Method for determining surface quality grade of strip using surface defect informations |
| KR100801439B1 (en) * | 2006-10-11 | 2008-02-11 | 주식회사 디이엔티 | Apparatus for detecting and repair of color filter |
| KR101217174B1 (en) * | 2010-04-26 | 2012-12-31 | 엘아이지에이디피 주식회사 | Apparatus for inspecting substrate and method of inspecting substrate |
| JP2012080001A (en) * | 2010-10-05 | 2012-04-19 | Hitachi High-Technologies Corp | Inspection method and inspection device of polycrystalline silicon thin film |
| JP2012119512A (en) * | 2010-12-01 | 2012-06-21 | Hitachi High-Technologies Corp | Substrate quality evaluation method and apparatus therefor |
| JP2012243929A (en) * | 2011-05-19 | 2012-12-10 | Hitachi High-Technologies Corp | Inspection method and device of polycrystalline silicon thin film |
-
2016
- 2016-01-13 KR KR1020160004297A patent/KR101862312B1/en active IP Right Grant
-
2017
- 2017-01-12 CN CN201710023229.0A patent/CN107064166B/en active Active
Non-Patent Citations (3)
| Title |
|---|
| Noncontact roughness measurement of turned parts using machine vision;Shahabi;《Int J Adv Manuf Technol》;20101231;275-284 * |
| 一种基于表面图像灰度的工程陶瓷粗糙度研究;田欣利;《机械科学与技术》;20120531;第31卷(第5期);801-805 * |
| 基于机器视觉的表面粗糙度检测系统设计;姚松丽;《工业控制计算机》;20151231;第28卷(第6期);71-72 * |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101862312B1 (en) | 2018-05-29 |
| KR20170084895A (en) | 2017-07-21 |
| CN107064166A (en) | 2017-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012119512A (en) | Substrate quality evaluation method and apparatus therefor | |
| JP4546830B2 (en) | Dark field inspection system | |
| JP5132982B2 (en) | Pattern defect inspection apparatus and method | |
| CN102004107B (en) | Method and device for the detection of defects in an object | |
| US7295305B2 (en) | Method and its apparatus for inspecting a pattern | |
| KR100838656B1 (en) | Quality tester of glass board | |
| JP4521240B2 (en) | Defect observation method and apparatus | |
| JP4864504B2 (en) | Crystal wafer inspection method and apparatus for silicon wafer | |
| JP2001194323A (en) | Method and device for inspecting pattern defect | |
| JP2008502929A (en) | Inspection apparatus or inspection method for fine structure by reflected or transmitted infrared light | |
| KR19990036574A (en) | Pattern defect inspection device and pattern defect inspection method | |
| CN103100792A (en) | Laser preprocessing and restoring method and device having on-line detection function and used for optical elements | |
| CN112639451B (en) | Wafer inspection method and inspection device | |
| CN107037053B (en) | Apparatus and method for detecting spot defects | |
| CN115428125A (en) | Inspection device and inspection method | |
| JP2021128097A (en) | Defect detector, defect detection method, and defect correction device | |
| DE10297337T5 (en) | Automatic inspection apparatus and method for detecting anomalies in a 3-dimensional translucent object | |
| CN107064166B (en) | Treatment object analysis device, processing device, and treatment object analysis method | |
| JP4971456B2 (en) | Glass substrate quality inspection apparatus and inspection method thereof | |
| TWI553981B (en) | Laser processing apparatus and method | |
| JP2001209798A (en) | Method and device for inspecting outward appearance | |
| JP2002214158A (en) | Defect detecting method and detecting device for transparent plate-like body | |
| JP2008039444A (en) | Method and apparatus for inspecting foreign matter | |
| KR101745764B1 (en) | Apparatus and Method for Optically Inspecting Surface of Plate Member | |
| JP2010230611A (en) | Pattern defect inspecting device and method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |