CN107039317B - Clamp for automatic wedge welding bonding machine - Google Patents
Clamp for automatic wedge welding bonding machine Download PDFInfo
- Publication number
- CN107039317B CN107039317B CN201710391365.5A CN201710391365A CN107039317B CN 107039317 B CN107039317 B CN 107039317B CN 201710391365 A CN201710391365 A CN 201710391365A CN 107039317 B CN107039317 B CN 107039317B
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- positioning
- device carrier
- base
- bonding machine
- vacuum hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Automatic Assembly (AREA)
Abstract
The invention discloses a clamp for an automatic wedge bonding machine, and relates to the technical field of semiconductor packaging; comprises a base, a device carrier and a plurality of positioning blocks; the device carrier is placed on the base, and the positioning block is placed on the device carrier; the base is provided with a plurality of screw positioning holes connected with the equipment; the front surface of the base is provided with a first vacuum hole; more than 2 bonding device positioning units are arranged on the device carrier; each bonding device positioning unit comprises a plurality of positioning counter bores, a positioning block matched with the positioning counter bores and at least one second vacuum hole; the second vacuum hole is communicated with the first vacuum hole through a second vacuum groove arranged on the back surface of the device carrier; simple structure, convenient to use is applicable to different products, and application range is wide, material saving, improvement work efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductor packaging.
Background
With the expansion of the production scale of semiconductor devices, automatic wedge bonding machines are increasingly used in bonding processes. The clamp of the automatic bonding equipment plays an important role in playing the advantages of stability, high efficiency and the like of the full-automatic equipment, and the quality of the design of the clamp can even influence the productivity of one automatic equipment. Most automatic bonder equipment manufacturers have single self-contained clamps and poor production versatility. At present, no clamp patent of an automatic wedge bonding machine exists in China. Similar bonding fixture design patent: the problems of the above designs or the complex structure requiring gear transmission or clamping of a device to be bonded by a spring or being only suitable for a single product are that the clamp manufacturing period is long or different product clamps are not compatible, and matrix production cannot be realized, so that the bonding clamps cannot be applied to automatic production.
Disclosure of Invention
The invention aims to solve the technical problems of the prior art, and provides the clamp for the automatic wedge welding bonding machine, which has the advantages of simple structure, convenience in use and strong universality, can be suitable for different products, saves materials, reduces cost and improves working efficiency.
In order to solve the technical problems, the invention adopts the following technical scheme: comprises a base, a device carrier and a plurality of positioning blocks; the device carrier is placed on the base, and the positioning block is placed on the device carrier; the base is provided with a plurality of screw positioning holes connected with equipment; the front surface of the base is provided with a first vacuum hole; the method is characterized in that: more than 2 bonding device positioning units are arranged on the device carrier; each bonding device positioning unit comprises a plurality of positioning counter bores, a positioning block matched with the positioning counter bores and at least one second vacuum hole; the second vacuum hole is communicated with the first vacuum hole through a second vacuum groove arranged on the back surface of the device supporting body.
Preferably, the device carrier is divided into a left device carrier and a right device carrier, one of which is covered on the first vacuum hole; independent positioning units are arranged on the left device supporting body and the right device supporting body.
Preferably, more than 2 bonding device positioning units are arranged in a matrix.
Preferably, the first vacuum groove is arranged on the back surface of the base, the starting end of the first vacuum groove corresponds to the vacuum hole on the bonder equipment, and the ending end of the first vacuum groove is connected with the first vacuum hole.
Preferably, the base is groove-shaped, a plurality of baffles are arranged at the edges of three sides of the base, the baffles are distributed at intervals, and screw positioning holes are formed between two adjacent baffles.
Preferably, the device carrier is also provided with an auxiliary positioning counter bore.
Preferably, the structure of the positioning block comprises a positioning plate and more than two inserting columns, the positioning plate is fixed on the inserting columns, the inserting columns are inserted into the positioning counter bores or the auxiliary positioning counter bores, the positioning plate is matched with the bonding device structure, and the distance between two adjacent inserting columns is matched with the distance between the positioning counter bores or the auxiliary positioning counter bores.
Further, an accessory to prevent the second vacuum Kong Louqi is included.
Preferably, the attachment structure includes a post and a cover plate disposed over the post.
Preferably, the base, device carrier and the positioning block and accessory are all of metallic construction.
The beneficial effects of adopting above-mentioned technical scheme to produce lie in: the invention has simple structure, convenient use and strong universality, and can be suitable for different products; the invention is made of metal material, has good heat transfer property and is beneficial to heat dissipation; the screw positioning holes are favorable for fastening the device carrier with a heating platform of the bonding machine equipment, and the base is groove-shaped and can prevent the device carrier from moving; two device carriers are simultaneously placed on the base, so that the cyclic production can be realized, one device carrier can be used for preheating and loading and unloading operations while the other device carrier is used for producing, and the production efficiency is improved; according to the invention, the compatible positioning of products with different sizes is realized by adopting a method of pulling and inserting the positioning blocks on the device carrier, positioning counter bores for inserting and pulling the positioning blocks are distributed near the vacuum holes, and the position distribution of the counter bores is obtained through optimization calculation and is divided into a main position and an auxiliary position, so that different products can be compatible, the application range is wide, the materials are saved, the cost is reduced, and the working efficiency is improved; the automatic bonding machine has the function of matrix bonding, and the second vacuum holes and the positioning counter bores of each positioning unit are distributed on the clamp plane in a matrix manner, so that the requirement of matrix production is met, and the working efficiency is improved;
the invention saves the period of designing and manufacturing fixtures for different devices, saves the operation and heating time of switching fixtures, and the time of detecting and calibrating the initial position again, realizes matrix type bonding production and improves the production efficiency; one set of clamp can meet the production of various devices, and the production cost of clamp manufacture is reduced.
Drawings
FIG. 1 is a schematic view of the structure of the base of the present invention;
fig. 2 is a schematic view of the structure of the device carrier of the present invention;
FIG. 3 is a schematic view of the structure of the positioning block of the embodiment 1 of the present invention;
FIG. 4 is a schematic view of the structure of embodiment 2 of the positioning block of the present invention;
fig. 5 is a schematic view of the structure of the accessory of the present invention.
In the figure: 1. a base; 2. a screw positioning hole; 3. a first vacuum hole; 4. a baffle; 5. a device carrier; 6. a second vacuum hole; 7. positioning the counter bore; 8. auxiliary positioning of the counter bore; 9. a positioning block; 10. an accessory; 11. a positioning plate; 12. and (5) inserting a column.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description.
As shown in fig. 1-5, one embodiment of a clamp for an automatic wedge bonding machine according to the present invention,
example 1:
comprises a base 1, a device carrier 5 and a plurality of positioning blocks 9; the device carrier 5 is placed on the base 1, and the positioning block 9 is placed on the device carrier 5; the base 1 is provided with a plurality of screw positioning holes 2 connected with equipment; the front surface of the base 1 is provided with a first vacuum hole 3; more than 2 bonding device positioning units are arranged on the device carrier 5; each bonding device positioning unit comprises a plurality of positioning counter bores 7, a positioning block 9 matched with the positioning counter bores 7 and at least one second vacuum hole 6; the second vacuum hole 6 is communicated with the first vacuum hole 3 through a second vacuum groove arranged on the back surface of the device carrier 5.
The first vacuum holes 3 are one, and the second vacuum grooves are used for communicating the first vacuum holes 3 with the second vacuum holes 6 to play a role in drainage; the base 1 is used for fixing the device carrier 5; the positioning block 9 is used for fixing the bonding device.
The positioning block 9 is inserted into the positioning counter bore 7 in a matched manner with the positioning counter bore 7 to position the bonding device, the positioning block 9 can be inserted into or taken down from different positioning counter bores 7, different clamp and manufacturing periods designed for different devices are saved, the operation and heating time of switching the clamp are saved, and the time for detecting and calibrating the initial position again is saved; the working efficiency is greatly improved, the device has wide application range and is compatible with the device to be bonded. One set of clamp can meet the production of various devices, and the production cost of clamp manufacture is reduced. Compatible positioning of products with different sizes is achieved through a method for pulling and inserting the positioning blocks 9, a positioning mode is simplified, positioning counter bores 7 for pulling and inserting the positioning blocks 9 are distributed near the second vacuum holes 6, and the position distribution of the positioning counter bores 7 is obtained through optimization calculation, so that the problem that a clamp must be replaced when the products are replaced is solved.
The above 2 bonding device positioning units can meet the requirement that a plurality of identical bonding devices are placed on the same device carrier 5 for bonding, and also meet the requirement that a plurality of different building devices are placed on the same device carrier 5 for bonding, so that the bonding device positioning unit is suitable for different products and has strong universality.
Example 2:
the structure and assembly of the base 1, the device carrier 5, and the positioning block 9 are the same as those of embodiment 1.
The device carrier 5 is divided into a left device carrier and a right device carrier, one of which is covered on the first vacuum hole 3; independent positioning units are arranged on the left device supporting body and the right device supporting body.
When the device is used, the left device carrier is placed on the first vacuum hole 3, the left device carrier is firstly bonded, the right device carrier is preheated, after the left device carrier is completed, the left device carrier is taken down, the right device carrier is slid onto the first vacuum hole 3 on the base 1, and bonding of bonding devices on the right device carrier is performed.
The arrangement of the two device carriers can realize cyclic production, one device can perform preheating and loading and unloading operations while the other device is produced, and the production efficiency is improved.
Of course, the device carrier 5 may be 3 pieces or the like according to the size of the base 1
Example 3:
the structure and assembly of the base 1, the device carrier 5, and the positioning block 9 are the same as those of embodiment 1.
More than 2 bonding device positioning units are arranged in a matrix mode.
The second vacuum hole 6 and the positioning counter bore 7 are divided into a plurality of positioning units, and the positioning units are arranged in a matrix. The position distribution of the second vacuum hole 6 and the positioning counter bore 7 is obtained through calculation, and the requirements of the existing used device to be bonded are met; the position distribution of the second vacuum holes 6 and the positioning counter bores 7 of the positioning units in the device carrier 5 is obtained through optimization calculation, the positioning units are arranged in the device carrier 5 according to a matrix, the automatic bonding machine has the function of matrix bonding, the second vacuum holes 6 and the positioning counter bores 7 of each positioning unit are distributed on the plane of the device carrier 5 in matrix, the requirement of matrix production is met, the second vacuum holes 6 and the positioning counter bores 7 in matrix arrangement enable the automatic bonding machine to continuously bond devices according to a changed program, no pause exists in the middle, batch production is met, and the working efficiency is improved.
Example 4:
the structure and assembly of the base 1, the device carrier 5, and the positioning block 9 are the same as those of embodiment 1.
The back of the base 1 is provided with a first vacuum groove, the starting end of the first vacuum groove corresponds to a vacuum hole on the bonder equipment, and the ending end of the first vacuum groove is connected with the first vacuum hole 3.
The first vacuum groove is a strip-shaped rectangular groove, and plays a role in drainage, so that a vacuum hole on the bonding machine equipment is communicated with a first vacuum hole 3 on the base 1.
Example 5:
the structure and assembly of the base 1, the device carrier 5, and the positioning block 9 are the same as those of embodiment 1.
The base 1 is in a groove shape, a plurality of baffles 4 are arranged at the edges of three sides of the base 1, the baffles 4 are distributed at intervals, and screw positioning holes 2 are formed between two adjacent baffles 4.
The three side edges of the base 1 are provided with the baffle plates 4, so that the device carrier 5 can be conveniently taken and placed, the baffle plates 4 are distributed at intervals, the screw positioning holes 2 are formed between two adjacent baffle plates 4, materials are saved, the arrangement of the screw positioning holes 2 cannot be influenced, and the fixing of the base 1 cannot be hindered.
Example 6:
the structure and assembly of the base 1, the device carrier 5, and the positioning block 9 are the same as those of embodiment 1.
The device carrier 5 is also provided with an auxiliary positioning counter bore 8, and the auxiliary positioning counter bore 8 is a reserved hole, so that the compatibility of the product size can be expanded, and the device carrier can be used for laying a new size device in the future.
Example 7:
the structure and assembly of the base 1, the device carrier 5, and the positioning block 9 are the same as those of embodiment 1.
The structure of the positioning block 9 comprises a positioning plate 11 and more than two inserting columns 12, wherein the positioning plate 11 is fixed on the inserting columns 12, the inserting columns 12 are inserted into the positioning counter bores 7 or the auxiliary positioning counter bores 87, the positioning plate 11 is matched with the structure of a device to be bonded, and the distance between two adjacent inserting columns 12 is matched with the distance between the positioning counter bores 7 or the auxiliary positioning counter bores 87.
The positioning plate 11 can be rectangular, a right angle is formed by two rectangles, the inserting columns 12 are fixed below the positioning plate 11, and the number of the inserting columns 12 can be two, 3 or more; determining the distance of the inserted column 12 according to the distance of the positioning counter bore 7; the thickness of the positioning block 9 and the length of the inserting columns 12 are determined by the stability of the positioning block 9 placed on the device carrier 5, and the distance between the two inserting columns 12 is determined by the distance between the positioning counter bores 7.
The positioning block 9 is used for fixing the bonding device placed in the second vacuum hole 6, under the structure, the device to be bonded can be fixed only by fixing any vertical two sides of the bonding device, the positioning mode is simplified, the positioning method is simplified into a two-side positioning method by a general four-side positioning method, the use is more convenient, and the positioning is simpler and faster.
Example 8:
the structure and assembly of the base 1, the device carrier 5, and the positioning block 9 are the same as those of embodiment 1.
An attachment 10 is also included to prevent air leakage from the second vacuum port 6.
The structure of the accessory 10 comprises a plug 12 and a cover plate arranged on the plug 12, the accessory 10 has the function of inserting the plug 12 of the accessory 10 into the second vacuum hole 6 when the automatic bonding matrix is changed or the vacuum hole is not used, so as to prevent air leakage, and the accessory 10 mainly prevents air leakage of the idle second vacuum hole 6 on the device carrier 5; the attachment 10 may be configured with only the plug 12, so long as the second vacuum hole 6 is blocked.
The base 1, the device carrier 5, the positioning block 9 and the accessory 10 are all of metal structures, and the metal has good heat conductivity and is beneficial to heat transmission.
The using process comprises the following steps:
the device carrier 5 is placed on the base 1, the bonding device is placed on the second vacuum hole 6, the positioning block 9 is selected to be inserted into the positioning counter bore 7 on the device carrier 5 according to the size and shape of the device, any vertical two sides of the bonding device are blocked, the device to be bonded is arranged in a matrix to fill the device carrier 5, and vacuum is opened to enable production. The posts 12 of the attachment 10 are inserted into the second vacuum holes 6 when the automatic bonding matrix is changed or there are no used vacuum holes, preventing air leakage.
Two device carriers 5 are placed on the base 1, the left device carrier 5 placed on the first vacuum hole 3 on the base 1 is subjected to bonding production, the right device carrier 5 on the first vacuum hole 3 is not preheated, after the production of the left device carrier 5 is completed, the left device carrier 5 is taken down, the right device carrier 5 is moved to the position above the first vacuum hole 3, and the production of the right device carrier 5 is started.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (10)
1. The fixture for the automatic wedge welding bonding machine comprises a base (1), a device carrier (5) and a plurality of positioning blocks (9); the device carrier (5) is placed on the base (1), and the positioning block (9) is placed on the device carrier (5); a plurality of screw positioning holes (2) connected with equipment are formed in the base (1); the front surface of the base (1) is provided with a first vacuum hole (3); the method is characterized in that: more than 2 bonding device positioning units are arranged on the device carrier (5); each bonding device positioning unit comprises a plurality of positioning counter bores (7), a positioning block (9) matched with the positioning counter bores (7) and at least one second vacuum hole (6); the second vacuum hole (6) is communicated with the first vacuum hole (3) through a second vacuum groove arranged on the back surface of the device carrier (5).
2. The clamp for the automatic wedge bonding machine according to claim 1, characterized in that the device carrier (5) is divided into a left device carrier and a right device carrier, one of which is covered on the first vacuum hole (3); independent positioning units are arranged on the left device supporting body and the right device supporting body.
3. The jig for an automatic wedge bonding machine according to claim 1, wherein the at least 2 bonding device positioning units are arranged in a matrix.
4. The fixture for the automatic wedge bonding machine according to claim 1, wherein the back of the base (1) is provided with a first vacuum groove, the starting end of the first vacuum groove corresponds to a vacuum hole on the bonding machine equipment, and the ending end of the first vacuum groove is connected with the first vacuum hole (3).
5. The fixture for the automatic wedge bonding machine according to claim 1, wherein the base (1) is in a groove shape, a plurality of baffles (4) are arranged at the edges of three sides of the base (1), the baffles (4) are distributed at intervals, and screw positioning holes (2) are formed between every two adjacent baffles (4).
6. The fixture for the automatic wedge bonding machine according to claim 1, wherein the device carrier (5) is further provided with an auxiliary positioning counter bore (8).
7. The fixture for the automatic wedge bonding machine according to claim 1, wherein the structure of the positioning block (9) comprises a positioning plate (11) and more than two inserting columns (12), the positioning plate (11) is fixed on the inserting columns (12), the inserting columns (12) are inserted into the positioning counter bores (7) or the auxiliary positioning counter bores (8), the positioning plate (11) is matched with the structure of the bonding device, and the distance between two adjacent inserting columns (12) is matched with the distance between the positioning counter bores (7) or the auxiliary positioning counter bores (8).
8. The clamp for an automatic wedge bonding machine according to claim 1, further comprising an accessory (10) for preventing the second vacuum hole (6) from leaking.
9. The automated wedge bonding machine fixture of claim 8, wherein the attachment (10) structure includes a post (12) and a cover plate disposed over the post (12).
10. The fixture for automatic wedge bonding machine according to claim 1, wherein the base (1), the device carrier (5), the positioning block (9) and the accessory (10) are all of a metal structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710391365.5A CN107039317B (en) | 2017-05-27 | 2017-05-27 | Clamp for automatic wedge welding bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710391365.5A CN107039317B (en) | 2017-05-27 | 2017-05-27 | Clamp for automatic wedge welding bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107039317A CN107039317A (en) | 2017-08-11 |
| CN107039317B true CN107039317B (en) | 2023-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710391365.5A Active CN107039317B (en) | 2017-05-27 | 2017-05-27 | Clamp for automatic wedge welding bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107039317B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465199A (en) * | 2013-09-27 | 2013-12-25 | 广东尚能光电技术有限公司 | Adjustable vacuum clamp |
| CN105428993A (en) * | 2015-12-30 | 2016-03-23 | 重庆贝华科技有限公司 | Coaxial laser bonding wire fixture device |
| CN206742206U (en) * | 2017-05-27 | 2017-12-12 | 中国电子科技集团公司第十三研究所 | Automatic wedge bonding bonder fixture |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030062346A1 (en) * | 2001-09-28 | 2003-04-03 | Asia Ic Mic-Process, Inc. | Method of vacuum holes formation on carrier film of chemical mechanical polishing machine |
-
2017
- 2017-05-27 CN CN201710391365.5A patent/CN107039317B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103465199A (en) * | 2013-09-27 | 2013-12-25 | 广东尚能光电技术有限公司 | Adjustable vacuum clamp |
| CN105428993A (en) * | 2015-12-30 | 2016-03-23 | 重庆贝华科技有限公司 | Coaxial laser bonding wire fixture device |
| CN206742206U (en) * | 2017-05-27 | 2017-12-12 | 中国电子科技集团公司第十三研究所 | Automatic wedge bonding bonder fixture |
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| Publication number | Publication date |
|---|---|
| CN107039317A (en) | 2017-08-11 |
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