CN107026630B - Laminated filter - Google Patents
Laminated filter Download PDFInfo
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- CN107026630B CN107026630B CN201610903466.1A CN201610903466A CN107026630B CN 107026630 B CN107026630 B CN 107026630B CN 201610903466 A CN201610903466 A CN 201610903466A CN 107026630 B CN107026630 B CN 107026630B
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/12—Bandpass or bandstop filters with adjustable bandwidth and fixed centre frequency
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H2007/013—Notch or bandstop filters
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Abstract
The multilayer filter according to the present invention is characterized in that: the disclosed device is provided with: an element body formed by laminating a plurality of insulator layers and having a mounting surface and an opposing surface that face each other, and 4 side surfaces that connect the mounting surface and the opposing surface; an input terminal electrode and an output terminal electrode, which are arranged on the mounting surface of the element body; the element body is internally provided with: a 1 st LC parallel resonance unit, a 2 nd LC parallel resonance unit, and a matching coil; the 1 st coil and the 2 nd coil are respectively configured into a ring shape by taking the 1 st direction as an axis and are arranged at a specified interval in the 1 st direction, wherein, the 1 st direction is a direction in which a pair of side surfaces are opposite; the 1 st capacitor is configured between the 1 st coil and the mounting surface in a 2 nd direction, wherein the 2 nd direction is a direction opposite to the mounting surface and the opposite surface; the 2 nd capacitor is arranged between the 2 nd coil and the mounting surface in the 2 nd direction, and the matching coil is arranged between the 1 st capacitor or the 2 nd capacitor and the mounting surface in the 2 nd direction.
Description
Technical Field
The present invention relates to a multilayer filter.
Background
Patent document 1 (japanese patent application publication No. 2013-70288) discloses a bandpass filter including an input terminal, an output terminal, an LC resonator disposed between the input terminal and the output terminal and having one end grounded, and a trap resonator (trap resonator) disposed at least one of the LC resonator and the input terminal or the output terminal and provided so as to be coupled to the LC resonator.
Disclosure of Invention
In the bandpass filter described in patent document 1, the coil of the LC resonator is coupled to the coil of the trap resonator. Therefore, in the bandpass filter described in patent document 1, the insulation effect between the input terminal and the output terminal is reduced, and therefore the attenuation amount in a high frequency band is reduced.
The present invention aims to provide a multilayer filter capable of further improving attenuation characteristics.
The multilayer filter according to the present invention is characterized in that: the disclosed device is provided with: an element body formed by laminating a plurality of insulator layers, and having a mounting surface and an opposing surface that face each other, and four side surfaces that connect the mounting surface and the opposing surface; an input terminal electrode and an output terminal electrode, which are arranged on the mounting surface of the element body; the element body is internally provided with: a 1 st LC parallel resonance unit in which a 1 st capacitor and a 1 st coil are connected in parallel, a 2 nd LC parallel resonance unit in which a 2 nd capacitor and a 2 nd coil are connected in parallel and connected in series to the 1 st LC parallel resonance unit, and a matching coil connected in series to the 2 nd LC parallel resonance unit, wherein the 1 st coil and the 2 nd coil are each formed into a coil shape with the 1 st direction as an axis and are arranged with a predetermined interval in the 1 st direction, wherein the 1 st direction is a direction in which the pair of side surfaces face each other, the 1 st capacitor is arranged between the 1 st coil and the mounting surface in the 2 nd direction, wherein, the 2 nd direction is the direction that the installation face is relative with the relative face, and the 2 nd condenser is disposed between 2 nd coil and installation face in the 2 nd direction, and the matching coil is disposed between 1 st condenser or 2 nd condenser and installation face in the 2 nd direction.
In the multilayer filter according to the present invention, the matching coil connected in series to the 2 nd LC parallel resonance section is provided in the element body. The matching coil is disposed between the 1 st capacitor or the 2 nd capacitor and the mounting surface in the 2 nd direction. Thus, the 1 st capacitor or the 2 nd capacitor can suppress the matching coil from being coupled to at least one of the 1 st coil and the 2 nd coil. Therefore, the decrease in the insulating effect from the input terminal electrode to the output terminal electrode can be suppressed, and the decrease in the Q value can be suppressed. As a result, the multilayer filter can suppress a decrease in attenuation in a high frequency band, and thus can improve the attenuation characteristics.
In one embodiment, the 1 st capacitor and the 2 nd capacitor each include a pair of internal electrodes in their configuration, and the matching coil may be disposed: an inner electrode of the 1 st capacitor, which is connected to the end of the 1 st coil connected to the 2 nd coil, out of the pair of inner electrodes, or an inner electrode of the 2 nd capacitor, which is connected to the end of the 2 nd coil connected to the matching coil, out of the pair of inner electrodes, is interposed between the mounting surface and the mounting surface. With this configuration, formation of a parasitic capacitance (stray capacitance) between the internal electrode and the matching coil can be suppressed, and formation of a signal detour path can be suppressed. This prevents the signal that should pass through the matching coil from passing through a detour path without passing through the matching coil. As a result, the impedance mismatch can be more reliably eliminated by the matching coil.
In one embodiment, a plurality of 1 st LC parallel resonators are provided in the element body, and a plurality of 1 st coils may be arranged in the 1 st direction. This enables the 1 st coils to be efficiently coupled to each other.
In one embodiment, two 2 nd LC parallel resonators are provided in the element body, and the two 2 nd coils may be disposed at positions sandwiching the plurality of 1 st coils in the 1 st direction. This can suppress coupling between the 1 st coil and the 2 nd coil.
In one embodiment, the distance between the 1 st coils in the 1 st direction may also be greater than the distance between the 1 st and 2 nd coils in the 1 st direction. If the 1 st coil and the 2 nd coil are coupled, the attenuation amount in the high frequency band is reduced. In the multilayer filter according to one embodiment, the 1 st coil and the 2 nd coil can be suppressed from being coupled to each other by increasing the distance between the 1 st coil and the 2 nd coil. As a result, since the attenuation amount in the high frequency band can be suppressed from decreasing, the high frequency band can be effectively attenuated.
In one embodiment, the axis of the matching coil may be along the 2 nd direction. This can further suppress coupling between at least one of the 1 st coil and the 2 nd coil and the matching coil. In addition, the increase in the dimension in the 2 nd direction of the mounting surface and the opposing surface of the element body can be suppressed. Therefore, the multilayer filter can be downsized.
In one embodiment, the matching coil may be connected between the input terminal electrode or the output terminal electrode and the 2 nd LC parallel resonance portion. This can effectively eliminate impedance mismatch.
According to the present invention, the attenuation characteristics can be improved.
Drawings
Fig. 1 is a perspective view showing a multilayer filter according to an embodiment.
Fig. 2 is an exploded perspective view of the multilayer filter element body.
Fig. 3 is a perspective view showing an internal structure of the multilayer filter shown in fig. 1.
Fig. 4 is an equivalent circuit diagram of the laminated filter.
Detailed description of the preferred embodiments
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements will be denoted by the same reference numerals, and redundant description thereof will be omitted.
Fig. 1 is a perspective view showing a multilayer filter according to an embodiment. The multilayer filter 1 shown in fig. 1 is a band-pass filter that passes a signal in a specific frequency band and does not pass (attenuate) a signal in a frequency band other than the specific frequency band.
As shown in fig. 1, the multilayer filter 1 includes: the element body 2, a 1 st terminal electrode (input terminal electrode) 3, a 2 nd terminal electrode (output terminal electrode) 4, a 1 st ground electrode 5, and a 2 nd ground electrode 6. The laminated filter 1 is mounted on an electronic device (for example, a circuit board or an electronic board) such that the 1 st terminal electrode 3 and the 2 nd terminal electrode 4 are connected to a signal line, and the 1 st ground electrode 5 and the 2 nd ground electrode 6 are connected to a ground.
The element body 2 has a rectangular parallelepiped shape. The element body 2 has, as its outer surface: the rectangular first main surface (opposing surface) 2a and the rectangular second main surface (mounting surface) 2b opposed to each other, the first side surface 2c and the second side surface 2d opposed to each other, and the first end surface (side surface) 2e and the second end surface (side surface) 2f opposed to each other. The longitudinal direction (1 st direction) of the element body 2 is a direction in which the 1 st end face 2e and the 2 nd end face 2f face each other. The width direction of the element body 2 is a direction in which the 1 st side surface 2c and the 2 nd side surface 2d face each other. The height direction (2 nd direction) of the element body 2 is a direction in which the 1 st main surface 2a and the 2 nd main surface 2b face each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corner portions and the ridge portions are chamfered, and a rectangular parallelepiped shape in which the corner portions and the ridge portions are rounded. The size of the element body 2 is, for example: the length L is 1.6 mm; the width W is 0.8 mm; the height T is of the order of 0.7 mm.
FIG. 2 is a layerAnd an exploded perspective view of the element body of the stacked filter. As shown in FIG. 2, the element body 2 is made of dielectric ceramic (BaTiO)3Ceramic-like or glass-ceramic). The element body 2 is formed by laminating a plurality of dielectric layers (insulator layers) 7(7a to 7 j). Each dielectric layer 7 is made of, for example, BaTiO3Material of the group Ba (Ti, Zr) O3Materials of the class (Ba, Ca) TiO3Materials, glass materials, or alumina materials, etc]The ceramic green sheet of (3) is a sintered body. The dielectric layers 7a and 7j among the dielectric layers 7 are disposed as protective layers on the outermost layers of the element body 2. In the actual element body 2, the dielectric layers 7 are integrated to such an extent that the boundaries between the layers cannot be visually recognized. The height direction of the element body 2, i.e., the direction in which the 1 st main surface 2a and the 2 nd main surface 2b face each other, coincides with the direction in which the plurality of dielectric layers 7 are stacked (hereinafter simply referred to as "stacking direction").
The 1 st coil conductor 10, the 2 nd coil conductor 11, the 3 rd coil conductor 12, and the 4 th coil conductor 13 are disposed on the dielectric layer 7 b. Each of the coil conductors 10 to 13 contains a conductive material (e.g., Ag or Pd). The coil conductors 10 to 13 are each constituted as a sintered body of a conductive paste containing a conductive material (e.g., Ag powder or Pd powder). The coil conductors described below are also formed in the same manner.
The 1 st coil conductor 10 has a substantially linear shape (substantially I-shaped). The 1 st coil conductor 10 is disposed substantially at the center of the dielectric layer 7 b. The 1 st coil conductor 10 is arranged such that the longitudinal direction of the 1 st coil conductor 10 is along the width direction of the element body 2.
The 2 nd coil conductor 11 has a substantially L-shape. The 2 nd coil conductor 11 is disposed on the dielectric layer 7b on the 2 nd end surface 2f side. The 1 st coil conductor 10 and the 2 nd coil conductor 11 are arranged at a predetermined interval in the longitudinal direction of the element body 2. The 2 nd coil conductor 11 has: the optical fiber includes a 1 st portion 11a having a straight line shape, and a 2 nd portion 11b having a straight line shape connected to one end of the 1 st portion 11a and extending in a direction substantially perpendicular to an extending direction of the 1 st portion 11 a. The length dimension of the 1 st portion 11a is greater than the length dimension of the 2 nd portion 11 b. The 1 st portion 11a of the 2 nd coil conductor 11 is arranged along the width direction of the element body 2. The 2 nd portion 11b of the 2 nd coil conductor 11 is located on the 1 st side surface 2c side along the longitudinal direction of the element body 2, and is arranged so as to extend from one end of the 1 st portion 11a to the inside (the 1 st coil conductor 10 side).
The 3 rd coil conductor 12 is substantially linear. The 3 rd coil conductor 12 is disposed substantially at the center of the dielectric layer 7 b. The 1 st coil conductor 10 and the 3 rd coil conductor 12 are disposed adjacent to each other in the longitudinal direction of the element body 2. Specifically, the 3 rd coil conductor 12 is disposed on the 1 st end face 2e side of the element body 2 with respect to the 1 st coil conductor 10. The interval between the 1 st coil conductor 10 and the 3 rd coil conductor 12 is smaller than the interval between the 1 st coil conductor 10 and the 2 nd coil conductor 11.
The 4 th coil conductor 13 has a substantially L-shape. The 4 th coil conductor 13 is disposed on the dielectric layer 7b on the 1 st end surface 2e side. The 3 rd coil conductor 12 and the 4 th coil conductor 13 are arranged at a predetermined interval in the longitudinal direction of the element body 2. The 4 th coil conductor 13 includes: a 1 st portion 13a having a straight line shape, and a 2 nd portion 13b having a straight line shape connected to one end of the 1 st portion 13a and extending in a direction substantially perpendicular to the extending direction of the 1 st portion 13 a. The length dimension of the 1 st portion 13a is greater than the length dimension of the 2 nd portion 13 b. The 1 st portion 13a of the 4 th coil conductor 13 is arranged along the width direction of the element body 2. The 2 nd portion 13b of the 4 th coil conductor 13 is located on the 1 st side surface 2c side along the longitudinal direction of the element body 2, and is arranged so as to extend from one end of the 1 st portion 13a to the inside (the 3 rd coil conductor 12 side).
On the dielectric layer 7b, the 1 st coil conductor 10 and the 2 nd coil conductor 11, and the 3 rd coil conductor 12 and the 4 th coil conductor 13 are disposed so as to be line-symmetrical about a straight line passing through the midpoint of the dielectric layer 7b and along the width direction of the element body 2.
The 5 th coil conductor 14, the 6 th coil conductor 15, the 7 th coil conductor 16, and the 8 th coil conductor 17 are disposed on the dielectric layer 7 c.
The 5 th coil conductor 14 has the same structure as the 1 st coil conductor 10. The 5 th coil conductor 14 is disposed at a position overlapping the 1 st coil conductor 10 in the lamination direction. The 5 th coil conductor 14 is electrically connected to the 1 st coil conductor 10 through the via conductor H1 and the via conductor H2.
The 6 th coil conductor 15 has the same structure as the 2 nd coil conductor 11. The 6 th coil conductor 15 has a 1 st portion 15a and a 2 nd portion 15 b. The 6 th coil conductor 15 is disposed at a position overlapping the 2 nd coil conductor 11 in the lamination direction. The 6 th coil conductor 15 is electrically connected to the 2 nd coil conductor 11 through the via conductor H3 and the via conductor H4.
The 7 th coil conductor 16 has the same structure as the 3 rd coil conductor 12. The 7 th coil conductor 16 is disposed at a position overlapping the 3 rd coil conductor 12 in the lamination direction. The 7 th coil conductor 16 is electrically connected to the 3 rd coil conductor 12 through the via conductor H5 and the via conductor H6.
The 8 th coil conductor 17 has the same structure as the 4 th coil conductor 13. The 8 th coil conductor 17 has a 1 st portion 17a and a 2 nd portion 17 b. The 8 th coil conductor 17 is disposed at a position overlapping the 4 th coil conductor 13 in the laminating direction. The 8 th coil conductor 17 is electrically connected to the 4 th coil conductor 13 through the via conductor H7 and the via conductor H8.
On the dielectric layer 7c, the 5 th coil conductor 14 and the 6 th coil conductor 15, and the 7 th coil conductor 16 and the 8 th coil conductor 17 are disposed so as to be line-symmetric about a straight line passing through the midpoint of the dielectric layer 7c and along the width direction of the element body 2.
The dielectric layer 7d is provided with a plurality of (here, 8) holes into which the via hole conductors H1 to H8 are inserted (arranged). Each hole penetrates the dielectric layer 7d in the thickness direction. The dielectric layer 7d is laminated in a plurality of layers (for example, 10 layers).
On the dielectric layer 7e, the 1 st inner electrode 20, the 1 st connection conductor 21, and the relay (via) conductors 22a, 22b, 22c, 22d, 22e, and 22f are disposed. The 1 st internal electrode 20 is linear. The 1 st inner electrode 20 is disposed such that the longitudinal direction of the 1 st inner electrode 20 is along the longitudinal direction of the element body 2. The 1 st internal electrode 20 is disposed on the 2 nd side surface 2d side with respect to the central portion of the dielectric layer 7 e. The 1 st connection conductor 21 has a linear shape. The 1 st connection conductor 21 is located on the 1 st side surface 2c side of the element body 2 and is arranged along the longitudinal direction of the element body 2. The 1 st connection conductor 21 is electrically connected to the via conductor H2 and the via conductor H6.
The relay conductor 22a is disposed at a position overlapping the via conductor H3 in the lamination direction, and is electrically connected to the via conductor H3. The relay conductor 22b is disposed at a position overlapping the via conductor H4 in the lamination direction, and is electrically connected to the via conductor H4. The relay conductor 22c is disposed at a position overlapping the via conductor H1 in the lamination direction, and is electrically connected to the via conductor H1. The relay conductor 22d is disposed at a position overlapping the via conductor H5 in the lamination direction, and is electrically connected to the via conductor H5. The relay conductor 22e is disposed at a position overlapping the via conductor H7 in the lamination direction, and is electrically connected to the via conductor H7. The relay conductor 22f is disposed at a position overlapping the via conductor H8 in the lamination direction, and is electrically connected to the via conductor H8.
On the dielectric layer 7e, the 1 st inner electrode 20, the 1 st connection conductor 21, and the relay conductors 22a to 22f are arranged in line symmetry with respect to a straight line passing through the midpoint of the dielectric layer 7e and along the width direction of the element body 2 as an axis.
On the dielectric layer 7f, the 2 nd inner electrode 23, the 3 rd inner electrode 24, and the relay conductors 25a, 25b, 25c, 25d, 25e, and 25f are disposed. The 2 nd internal electrode 23 is disposed on the dielectric layer 7f on the 2 nd end face 2f side and also on the 1 st side face 2c side. The 2 nd internal electrode 23 has a main body portion 23a and a lead portion 23b extending from one end of the main body portion 23 a. The main body portion 23a has a substantially rectangular shape. The lead portion 23b extends from one side of the inside of the main body portion 23a toward the center of the dielectric layer 7 f.
The 3 rd internal electrode 24 is disposed on the dielectric layer 7f on the 1 st end face 2e side and also on the 1 st side face 2c side. The 3 rd inner electrode 24 includes a main body portion 24a and a lead portion 24b extending from one end of the main body portion 24 a. The body portion 24a has a substantially rectangular shape. The lead portion 24b extends from one side of the inside of the main body portion 24a toward the center of the dielectric layer 7 f. The 2 nd internal electrode 23 and the 3 rd internal electrode 24 are disposed at positions not overlapping with the 1 st internal electrode 20 disposed on the dielectric layer 7e in the lamination direction.
The relay conductor 25a is disposed at a position overlapping the relay conductor 22a in the lamination direction, and is electrically connected to the relay conductor 22 a. The relay conductor 25b is disposed at a position overlapping the relay conductor 22c in the lamination direction, and is electrically connected to the relay conductor 22 c. The relay conductor 25c is disposed at a position overlapping the relay conductor 22d in the lamination direction, and is electrically connected to the relay conductor 22 d. The relay conductor 25d is disposed at a position overlapping the relay conductor 22e in the lamination direction, and is electrically connected to the relay conductor 22 e. The relay conductors 25e and 25f are disposed at positions overlapping the 1 st connection conductor 21 in the stacking direction, and are electrically connected to the 1 st connection conductor 21 by the via conductors H2 and H6.
On the dielectric layer 7f, the 2 nd inner electrode 23, the relay conductor 25a, the relay conductor 25b, and the relay conductor 25e are arranged in line symmetry with the 3 rd inner electrode 24, the relay conductor 25c, the relay conductor 25d, and the relay conductor 25f with respect to a straight line passing through the middle point of the dielectric layer 7f and along the width direction of the element body 2 as an axis.
On the dielectric layer 7g, a 4 th internal electrode 26, a 5 th internal electrode 27, a 6 th internal electrode 28, a 7 th internal electrode 29, and relay conductors 30a and 30b are arranged. The 4 th inner electrode 26 has a substantially rectangular shape. The 4 th internal electrode 26 is disposed on the central portion side of the dielectric layer 7g and also on the 2 nd side surface 2d side. The 4 th internal electrode 26 is disposed at a position where a part thereof faces the 1 st internal electrode 20 in the lamination direction. The 4 th inner electrode 26 is electrically connected to the 2 nd inner electrode 23 (lead portion 23b) via a via conductor H10.
The 5 th internal electrode 27 has a substantially rectangular shape. The 5 th internal electrode 27 is disposed on the central portion side of the dielectric layer 7g and also on the 2 nd side surface 2d side. The 5 th internal electrode 27 is disposed at a position where a part thereof faces the 1 st internal electrode 20 in the stacking direction. The 5 th internal electrode 27 is electrically connected to the 3 rd internal electrode 24 through a via conductor H11. The 4 th internal electrode 26 and the 5 th internal electrode 27 are disposed adjacent to each other in the longitudinal direction of the element body 2.
The 6 th internal electrode 28 is disposed on the dielectric layer 7g on the 2 nd end face 2f side. The 6 th internal electrode 28 is disposed at a position where a part thereof faces the 1 st internal electrode 20 in the lamination direction. The 7 th internal electrode 29 is disposed on the dielectric layer 7g on the 1 st end face 2e side. The 7 th internal electrode 29 is disposed at a position where a part thereof faces the 1 st internal electrode 20 in the stacking direction. The 6 th and 7 th internal electrodes 28 and 29 are disposed at positions sandwiching the 4 th and 5 th internal electrodes 26 and 27 in the longitudinal direction of the element body 2.
The relay conductors 30a and 30b are disposed on the dielectric layer 7g on the 1 st side surface 2c side. The relay conductors 30a and 30b are arranged in parallel along the longitudinal direction of the element body 2. The relay conductor 30a is disposed at a position overlapping the relay conductor 25e in the lamination direction, and is electrically connected to the relay conductor 25 e. The relay conductor 30b is disposed at a position overlapping the relay conductor 25f in the lamination direction, and is electrically connected to the relay conductor 25 f.
On the dielectric layer 7g, the 4 th inner electrode 26, the 6 th inner electrode 28, and the relay conductor 30a, and the 5 th inner electrode 27, the 7 th inner electrode 29, and the relay conductor 30b are disposed so as to be line-symmetric about a straight line passing through the midpoint of the dielectric layer 7g and along the width direction of the element body 2.
On the dielectric layer 7h, the 8 th inner electrode 31 and the relay conductors 32a and 32b are disposed. The 8 th inner electrode 31 has a substantially rectangular shape. The 8 th internal electrode 31 is disposed in the center of the dielectric layer 7 h. The relay conductor 32a is disposed on the dielectric layer 7h on the 2 nd end face 2f side and also on the 1 st side face 2c side. The relay conductor 32b is disposed on the dielectric layer 7f on the 1 st end face 2e side and also on the 1 st side face 2c side. The intermediate conductors 32a and 32b are disposed on the dielectric layer 7h at positions sandwiching the 8 th inner electrode 31.
The relay conductor 32a is disposed at a position overlapping the 6 th inner electrode 28 in the stacking direction, and is electrically connected to the 6 th inner electrode 28 through the via conductor H12. The relay conductor 32b is disposed at a position overlapping the 7 th inner electrode 29 in the stacking direction, and is electrically connected to the 7 th inner electrode 29 through the via conductor H13. On the dielectric layer 7h, the 8 th inner electrode 31 and the relay conductors 32a and 32b are disposed so as to be line-symmetric about a straight line passing through the midpoint of the dielectric layer 7h and running along the width direction of the element body 2.
On the dielectric layer 7i, the 9 th coil conductor 33, the 10 th coil conductor 34, and the 2 nd connection conductor 35 are disposed. The 9 th coil conductor 33 has a substantially U-shape. The 9 th coil conductor 33 is disposed on the dielectric layer 7i on the 2 nd end surface 2f side. One end of the 9 th coil conductor 33 is electrically connected to the relay conductor 32a through a via conductor H12. The other end of the 9 th coil conductor 33 is electrically connected to the 2 nd terminal electrode 4 disposed on the dielectric layer 7j (the 2 nd main surface 2b of the element body 2) through the via conductor H14.
The 10 th coil conductor 34 has a substantially U-shape. The 10 th coil conductor 34 is disposed on the dielectric layer 7i on the 1 st end surface 2e side. One end of the 10 th coil conductor 34 is electrically connected to the relay conductor 32b through a via conductor H13. The other end of the 10 th coil conductor 34 is electrically connected to the 1 st terminal electrode 3 disposed on the dielectric layer 7j (the 2 nd main surface 2b of the element body 2) via the via conductor H15.
The 2 nd connection conductor 35 is disposed substantially at the center on the dielectric layer 7 i. The 2 nd connecting conductor 35 is disposed between the 9 th coil conductor 33 and the 10 th coil conductor 34. The 2 nd connecting conductor 35 has a substantially H-shape. The 2 nd connection conductor 35 is electrically connected to the 8 th inner electrode 31 through via conductors H16a to H16 f. The 2 nd connection conductor 35 is electrically connected to the 2 nd ground electrode 6 disposed on the dielectric layer 7j (the 2 nd main surface 2b of the element body 2) through the via conductors H17a, H17 b. The 2 nd connection conductor 35 is electrically connected to the 1 st ground electrode 5 disposed on the dielectric layer 7j (the 2 nd main surface 2b of the element body 2) through the via conductors H17a, H17 b.
On the dielectric layer 7i, the 9 th coil conductor 33, the 10 th coil conductor 34, and the 2 nd connection conductor 35 are disposed in line symmetry with a straight line passing through the midpoint of the dielectric layer 7i and along the width direction of the element body 2 as an axis.
As shown in fig. 1 and 2, the 1 st terminal electrode 3 and the 2 nd terminal electrode 4 are disposed on the 2 nd main surface 2b of the element body 2. The 1 st terminal electrode 3 and the 2 nd terminal electrode 4 are each rectangular. The 1 st terminal electrode 3 is positioned on the 1 st end face 2e side of the 2 nd main face 2b, and is arranged such that the longitudinal direction of the 1 st terminal electrode 3 is along the width direction of the element body 2. The 2 nd terminal electrode 4 is positioned on the 2 nd end face 2f side of the 2 nd main face 2b, and is arranged such that the longitudinal direction of the 2 nd terminal electrode 4 is along the width direction of the element body 2. The 1 st terminal electrode 3 and the 2 nd terminal electrode 4 are arranged at a predetermined interval in the longitudinal direction of the element body 2.
The 1 st ground electrode 5 and the 2 nd ground electrode 6 are disposed on the 2 nd principal surface 2b of the element body 2. The 1 st ground electrode 5 and the 2 nd ground electrode 6 each have a rectangular shape. The 1 st ground electrode 5 is disposed between the 1 st terminal electrode 3 and the 2 nd terminal electrode 4. The 1 st ground electrode 5 is positioned on the 1 st side surface 2c side of the 2 nd main surface 2b, and is disposed so that the longitudinal direction of the 1 st ground electrode 5 is along the longitudinal direction of the element body 2. The 2 nd ground electrode 6 is disposed between the 1 st terminal electrode 3 and the 2 nd terminal electrode 4. The 2 nd ground electrode 6 is positioned on the 2 nd side surface 2d side of the 2 nd main surface 2b, and is arranged such that the longitudinal direction of the 2 nd ground electrode 6 is along the longitudinal direction of the element body 2. The 1 st ground electrode 5 and the 2 nd ground electrode 6 are arranged with a predetermined interval in the width direction of the element body 2.
Each of the terminal electrodes 3 to 6 contains a conductive material (e.g., Ag or Pd). The terminal electrodes 3 to 6 are each constituted as a sintered body of a conductive paste containing a conductive material (e.g., Ag powder or Pd powder). A plating layer is formed on the surface of each of the terminal electrodes 3 to 6. The plating layer is formed by, for example, electroplating. The plating layer has a layer structure composed of a Cu plating layer, a Ni plating layer, and a Sn plating layer, a layer structure composed of a Ni plating layer and a Sn plating layer, or the like.
Fig. 3 is a perspective view showing an internal structure of the multilayer filter shown in fig. 1. Fig. 4 is an equivalent circuit diagram of the laminated filter. As shown in fig. 4, the multilayer filter 1 includes, in the element body 2: a 1 st LC parallel resonance unit 40, a 2 nd LC parallel resonance unit 42, a 3 rd LC parallel resonance unit 44, a 4 th LC parallel resonance unit 46, a 1 st matching coil 48, a 2 nd matching coil 50, and a capacitor unit 52. As shown in fig. 4, the multilayer filter 1 is configured to be line-symmetric.
The 1 st LC parallel resonant unit 40 includes a 1 st capacitor C1 and a 1 st coil L1. The 1 st capacitor C1 and the 1 st coil L1 are connected in parallel. The 1 st capacitor C1 and the 1 st coil L1 constitute an LC filter.
As shown in fig. 2 and 3, the 1 st capacitor C1 includes the 4 th internal electrode 26 disposed on the dielectric layer 7g and the 8 th internal electrode 31 disposed on the dielectric layer 7 h. The 4 th internal electrode 26 and the 8 th internal electrode 31 face each other with the dielectric layer 7g interposed therebetween.
The 1 st coil L1 includes a 1 st coil conductor 10, a 5 th coil conductor 14, a via conductor H1, and a via conductor H2. One end of the 1 st coil L1 is electrically connected to the other end of the 2 nd coil L2 described later via the relay conductor 22c, the relay conductor 25b, the 4 th inner electrode 26, the 2 nd inner electrode 23, and the relay conductor 22 b. The other end of the 1 st coil L1 is electrically connected to the 1 st ground electrode 5 and the 2 nd ground electrode 6 via the 1 st connection conductor 21, the relay conductor 25e, the relay conductor 30a, the 8 th inner electrode 31, and the 2 nd connection conductor 35.
As shown in fig. 4, the 2 nd LC parallel resonance section 42 is composed of a 2 nd capacitor C2 and a 2 nd coil L2. The 2 nd capacitor C2 and the 2 nd coil L2 are connected in parallel. The 2 nd capacitor C2 and the 2 nd coil L2 constitute an LC filter. The 2 nd LC parallel resonant unit 42 is connected in series to the 1 st LC parallel resonant unit 40. The 2 nd LC parallel resonant section 42 is a so-called trap resonator provided to secure a necessary attenuation amount in a predetermined frequency band outside the pass band.
As shown in fig. 2 and 3, the 2 nd capacitor C2 includes the 2 nd internal electrode 23 disposed on the dielectric layer 7f and the 6 th internal electrode 28 disposed on the dielectric layer 7 g. The 2 nd internal electrode 23 and the 6 th internal electrode 28 face each other with the dielectric layer 7f interposed therebetween.
The 2 nd coil L2 includes a 2 nd coil conductor 11, a 6 th coil conductor 15, a via conductor H3, and a via conductor H4. One end of the 2 nd coil L2 is electrically connected to the 2 nd terminal electrode 4 through the relay conductor 22a, the relay conductor 25a, the 6 th inner electrode 28, the relay conductor 32a, and the 9 th coil conductor 33. The other end of the 2 nd coil L2 is electrically connected to one end of the 1 st coil L1 through the relay conductor 22b, the 2 nd inner electrode 23, the 4 th inner electrode 26, the relay conductor 25b, and the relay conductor 22 c.
As shown in fig. 4, the 3 rd LC parallel resonance section 44 is composed of a 3 rd capacitor C3 and a 3 rd coil L3. The 3 rd capacitor C3 and the 3 rd coil L3 are connected in parallel. The 3 rd capacitor C3 and the 3 rd coil L3 constitute an LC filter.
As shown in fig. 2 and 3, the 3 rd capacitor C3 includes the 5 th internal electrode 27 disposed on the dielectric layer 7g and the 8 th internal electrode 31 disposed on the dielectric layer 7 h. The 5 th internal electrode 27 and the 8 th internal electrode 31 face each other with the dielectric layer 7g interposed therebetween.
The 3 rd coil L3 includes a 3 rd coil conductor 12, a 7 th coil conductor 16, a via conductor H5, and a via conductor H6. One end of the 3 rd coil L3 is electrically connected to the other end of the 4 th coil L4 described later via the relay conductor 22d, the relay conductor 25c, the 5 th inner electrode 27, the 3 rd inner electrode 24, and the relay conductor 22 f. The other end of the 3 rd coil L3 is electrically connected to the 1 st ground electrode 5 and the 2 nd ground electrode 6 via the 1 st connection conductor 21, the relay conductor 25f, the relay conductor 30b, the 8 th inner electrode 31, and the 2 nd connection conductor 35. The 3 rd coil L3 is electrically connected to the 1 st coil L1 via the 1 st connecting conductor 21.
As shown in fig. 4, the 4 th LC parallel resonance section 46 is composed of a 4 th capacitor C4 and a 4 th coil L4. The 4 th capacitor C4 and the 4 th coil L4 are connected in parallel. The 4 th capacitor C4 and the 4 th coil L4 constitute an LC filter. The 4 th LC parallel resonant unit 46 is connected in series to the 3 rd LC parallel resonant unit 44. The 4 th LC parallel resonant section 46 is a so-called trap resonator provided to secure a necessary attenuation amount in a predetermined frequency band outside the pass band.
As shown in fig. 2 and 3, the 4 th capacitor C4 includes the 3 rd inner electrode 24 disposed on the dielectric layer 7f and the 7 th inner electrode 29 disposed on the dielectric layer 7 g. The 3 rd internal electrode 24 and the 7 th internal electrode 29 face each other with the dielectric layer 7f interposed therebetween.
The 4 th coil L4 is composed of the 4 th coil conductor 13, the 8 th coil conductor 17, a via conductor H7, and a via conductor H8. One end of the 4 th coil L4 is electrically connected to the 1 st terminal electrode 3 through the relay conductor 22e, the relay conductor 25d, the 7 th inner electrode 29, the relay conductor 32b, and the 10 th coil conductor 34. The other end of the 4 th coil L4 is electrically connected to one end of the 3 rd coil L3 through the relay conductor 22f, the 3 rd inner electrode 24, the 5 th inner electrode 27, the relay conductor 25c, and the relay conductor 22 d.
As shown in fig. 2, the 1 st coil L1, the 2 nd coil L2, the 3 rd coil L3, and the 4 th coil L4 have an axial center Ax1 along the longitudinal direction of the element body 2. The 1 st coil L1, the 2 nd coil L2, the 3 rd coil L3, and the 4 th coil L4 are formed in a loop shape around the axial center Ax 1.
The 1 st coil L1 and the 2 nd coil L2 are arranged with a predetermined interval in the longitudinal direction of the element body 2 (the axial center Ax1 direction). The 3 rd coil L3 and the 4 th coil L4 are arranged at a predetermined interval in the longitudinal direction of the element body 2. The 1 st coil L1 and the 3 rd coil L3 are arranged adjacently. The 2 nd coil L2 and the 4 th coil L4 are arranged so as to sandwich the 1 st coil L1 and the 3 rd coil L3 in the longitudinal direction of the element body 2. The distance between the 1 st coil L1 and the 2 nd coil L2 in the longitudinal direction of the element body 2 and the distance between the 3 rd coil L3 and the 4 th coil L4 in the longitudinal direction of the element body 2 are greater than the distance between the 1 st coil L1 and the 3 rd coil L3.
The 1 st matching coil 48 is a coil (inductor) for impedance matching. As shown in fig. 4, the 1 st matching coil 48 is disposed between the 2 nd LC parallel resonance section 42 and the 2 nd terminal electrode 4. The 1 st matching coil 48 is formed of the 9 th coil conductor 33 disposed on the dielectric layer 7 i. The 9 th coil conductor 33 is connected in series to the 2 nd LC parallel resonance section 42.
As shown in fig. 2, the 9 th coil conductor 33 is disposed below the 2 nd coil L2 (the 2 nd coil conductor 11, the 5 th coil conductor 14, the via conductor H3, and the via conductor H4) (between the 2 nd coil L2 and the 2 nd main surface 2b) in the height direction (stacking direction) of the element body 2. That is, the 9 th coil conductor 33 is disposed at a position overlapping the 2 nd coil L2 in the height direction of the element body 2 and closer to the 2 nd main surface 2b side than the 2 nd coil L2. A 2 nd capacitor C2 (the 2 nd inner electrode 23 and the 6 th inner electrode 28) is disposed between the 2 nd coil L2 and the 9 th coil conductor 33. The 9 th coil conductor 33 is disposed below the 6 th inner electrode 28 on the 2 nd main surface 2b side (between the 6 th inner electrode 28 and the 2 nd main surface 2b) in the 2 nd capacitor C2. Specifically, the 9 th coil conductor 33 is disposed: of the 2 nd inner electrode 23 and the 6 th inner electrode 28 constituting the 2 nd capacitor C2, the 6 th inner electrode 28 connected to the end of the 2 nd coil L2 connected to the 1 st matching coil 48 is located below. That is, the 9 th coil conductor 33 is disposed: of the 2 nd inner electrode 23 and the 6 th inner electrode 28 constituting the 2 nd capacitor C2, the potential is equal (the potential difference is smaller) than that of the 6 th inner electrode 28 of the 9 th coil conductor 33 which is located on the opposite side of the end connected to the 2 nd terminal electrode 4.
The 9 th coil conductor 33 has an axial center Ax2 along the height direction of the element body 2. The axial center Ax2 of the 9 th coil conductor 33 is perpendicular to the axial centers Ax1 of the 1 st coil L1 and the 2 nd coil L2.
The 2 nd matching coil 50 is a coil for impedance matching. As shown in fig. 4, the 2 nd matching coil 50 is disposed between the 4 th LC parallel resonance section 46 and the 1 st terminal electrode 3. The 2 nd matching coil 50 is formed of the 10 th coil conductor 34 disposed on the dielectric layer 7 i. The 10 th coil conductor 34 is connected in series to the 4 th LC parallel resonance section 46.
As shown in fig. 3, the 10 th coil conductor 34 is disposed below the 4 th coil L4 (the 4 th coil conductor 13, the 8 th coil conductor 17, the via conductor H7, and the via conductor H8) (between the 4 th coil L4 and the 2 nd main surface 2b) in the height direction of the element body 2. The 10 th coil conductor 34 is disposed at a position overlapping the 4 th coil L4 in the height direction of the element body 2 and closer to the 2 nd main surface 2b side than the 4 th coil L4. A 4 th capacitor C4 (the 3 rd inner electrode 24 and the 7 th inner electrode 29) is disposed between the 4 th coil L4 and the 10 th coil conductor 34. The 10 th coil conductor 34 is disposed below the 7 th inner electrode 29 on the 2 nd main surface 2b side (between the 7 th inner electrode 29 and the 2 nd main surface 2b) in the 4 th capacitor C4. Specifically, the 10 th coil conductor 34 is disposed: among the 3 rd and 7 th internal electrodes 24 and 29 constituting the 4 th capacitor C4, the 7 th internal electrode 29 connected to the end of the 4 th coil L4 connected to the 2 nd matching coil 50 is located below. That is, the 10 th coil conductor 34 is disposed: of the 3 rd inner electrode 24 and the 7 th inner electrode 29 constituting the 4 th capacitor C4, the potential is equal (the potential difference is smaller) than that of the 7 th inner electrode 29 of the 10 th coil conductor 34 which is located on the opposite side end to the end connected to the 1 st terminal electrode 3.
The 10 th coil conductor 34 has an axial center Ax3 along the height direction of the element body 2. The axial center Ax3 of the 10 th coil conductor 34 is perpendicular to the axial centers Ax1 of the 3 rd coil L3 and the 4 th coil L4.
As shown in fig. 4, the capacitor unit 52 includes a 5 th capacitor Ca, a 6 th capacitor Cb, a 7 th capacitor Cc, and an 8 th capacitor Cd. The capacitor unit 52 is disposed between the 1 st coil L1, the 2 nd coil L2, the 3 rd coil L3, and the 4 th coil L4, and the 1 st matching coil 48 and the 2 nd matching coil 50 in the height direction of the element body 2. The 5 th capacitor Ca, the 6 th capacitor Cb, the 7 th capacitor Cc, and the 8 th capacitor Cd are attenuation poles. In addition, the 5 th capacitor Ca, the 6 th capacitor Cb, the 7 th capacitor Cc, and the 8 th capacitor Cd have a function of adjusting coupling of the respective coils.
The 5 th capacitor Ca is composed of the 1 st internal electrode 20 and the 6 th internal electrode 28. The 1 st internal electrode 20 and the 6 th internal electrode 28 face each other with the dielectric layer 7e and the dielectric layer 7f interposed therebetween. The 6 th capacitor Cb is constituted by the 1 st internal electrode 20 and the 4 th internal electrode 26. The 1 st internal electrode 20 and the 4 th internal electrode 26 face each other with the dielectric layer 7e and the dielectric layer 7f interposed therebetween.
The 7 th capacitor Cc is composed of the 1 st internal electrode 20 and the 5 th internal electrode 27. The 1 st internal electrode 20 and the 5 th internal electrode 27 face each other with the dielectric layer 7e and the dielectric layer 7f interposed therebetween. The 8 th capacitor Cd is constituted by the 1 st internal electrode 20 and the 7 th internal electrode 29. The 1 st internal electrode 20 and the 7 th internal electrode 29 face each other with the dielectric layer 7e and the dielectric layer 7f interposed therebetween.
As described above, the multilayer filter 1 according to the present embodiment includes, in the element body 2: a 1 st matching coil 48 connected in series to the 2 nd LC parallel resonant unit 42, and a 2 nd matching coil 50 connected in series to the 4 th LC parallel resonant unit 46. The 1 st matching coil 48 is disposed between the 2 nd capacitor C2 and the 2 nd main surface 2b in the height direction of the element body 2. The 2 nd matching coil 50 is disposed between the 4 th capacitor C4 and the 2 nd main surface 2b in the height direction of the element body 2. Thus, the 2 nd capacitor C2 and the 4 th capacitor C4 can realize: the 1 st matching coil 48 is inhibited from being coupled to at least one of the 1 st coil L1 and the 2 nd coil L2; the 2 nd matching coil 50 is suppressed from being coupled to at least one of the 3 rd coil L3 and the 4 th coil L4. Therefore, the insulation effect from the 1 st terminal electrode 3 to the 2 nd terminal electrode 4 can be suppressed from being reduced, and the reduction in the Q value can be suppressed. As a result, the multilayer filter 1 can suppress a decrease in attenuation in a high frequency band, and thus can improve the attenuation characteristics.
In the present embodiment, the 9 th coil conductor 33 constituting the 1 st matching coil 48 is disposed: of the 2 nd inner electrode 23 and the 6 th inner electrode 28 constituting the 2 nd capacitor C2, the 6 th inner electrode 28 connected to the end portion of the 2 nd coil L2 connected to the 1 st matching coil 48 is located between the 2 nd main surface 2 b. The 10 th coil conductor 34 constituting the 2 nd matching coil 50 is disposed: of the 3 rd and 7 th inner electrodes 24 and 29 constituting the 4 th capacitor C4, the 7 th inner electrode 29 connected to the end of the 4 th coil L4 connected to the 2 nd matching coil 50 is located between the 2 nd main surface 2 b. With this configuration, formation of parasitic capacitances between the 6 th inner electrode 28 and the 9 th coil conductor 33 and between the 7 th inner electrode 29 and the 10 th coil conductor 34 can be suppressed, and formation of a signal detour path can be suppressed. This prevents the signal to be passed through the 1 st matching coil 48 or the 2 nd matching coil 50 from passing through a bypass path formed by a parasitic capacitance, not through the 1 st matching coil 48 or the 2 nd matching coil 50. As a result, the impedance mismatch can be further reliably eliminated by the 1 st matching coil 48 or the 2 nd matching coil 50.
In the present embodiment, the distance between the 1 st coil L1 and the 3 rd coil L3 in the longitudinal direction of the element body 2 is greater than the distance between the 1 st coil L1 and the 2 nd coil L2 and the distance between the 3 rd coil L3 and the 4 th coil L4. If the 1 st coil L1 and the 2 nd coil L2 and the 3 rd coil L3 and the 4 th coil L4 are coupled, the attenuation amount in the high frequency band is reduced. For the laminated filter 1. By increasing the distance between the 1 st coil L1 and the 2 nd coil L2 and between the 3 rd coil L3 and the 4 th coil L4, the 1 st coil L1 and the 2 nd coil L2 and the 3 rd coil L3 and the 4 th coil L4 can be suppressed from being coupled. As a result, since the attenuation amount in the high frequency band can be suppressed from decreasing, the high frequency band can be effectively attenuated.
In the present embodiment, the axial center Ax1 of the 1 st coil L1, the 2 nd coil L2, the 3 rd coil L3, and the 4 th coil L4 is along the longitudinal direction of the element body 2. The axial center Ax2 of the 1 st matching coil 48 and the axial center Ax3 of the 2 nd matching coil 50 are along the height direction of the element body 2. This can further suppress: at least one of the 1 st coil L1 and the 2 nd coil L2 is coupled to the 1 st matching coil 48, and at least one of the 3 rd coil L3 and the 4 th coil L4 is coupled to the 2 nd matching coil 50. In addition, the increase in the dimension of the element body 2 in the height direction can be suppressed. Therefore, the multilayer filter 1 can be downsized.
In the present embodiment, the 1 st matching coil 48 is connected between the 2 nd terminal electrode 4 and the 2 nd LC parallel resonance section 42. The 2 nd matching coil 50 is connected between the 1 st terminal electrode 3 and the 4 th LC parallel resonance section 46. This enables the multilayer filter 1 to effectively eliminate impedance mismatch.
In the present embodiment, the 2 nd coil conductor 11, the 4 th coil conductor 13, the 6 th coil conductor 15, and the 8 th coil conductor 17 are all substantially L-shaped. This can increase the inductance as compared with the case of a straight line, for example.
In the present embodiment, the 1 st coil L1 includes the 1 st coil conductor 10 and the 5 th coil conductor 14 having the same shape, and the 2 nd coil L2 includes the 2 nd coil conductor 11 and the 6 th coil conductor 15 having the same shape. The 3 rd coil L3 includes the 3 rd coil conductor 12 and the 7 th coil conductor 16, and the 4 th coil L4 includes the 4 th coil conductor 13 and the 8 th coil conductor 17. Accordingly, the Q values of the coils L1 to L4 can be increased by arranging the coil conductors having the same shape in the stacking direction for the coils L1 to L4. This can suppress the occurrence of attenuation loss in the coils L1 to L4, and can effectively obtain attenuation.
The present invention is not limited to the above-described embodiments. For example, in the above-described embodiment, an example is described in which the 1 st matching coil 48 (the 9 th coil conductor 33) is disposed below the 6 th inner electrode 28, and the 2 nd matching coil 50 (the 10 th coil conductor 34) is disposed below the 7 th inner electrode 29. However, the 1 st matching coil 48 and the 2 nd matching coil 50 may be disposed below the 8 th inner electrode 31.
In the above embodiment, the 2 nd coil conductor 11, the 4 th coil conductor 13, and the 6 th coil conductor 15 have been described as an example of the substantially L-shaped form, but these coil conductors may have other forms (for example, I-shaped forms).
Although the embodiment including the 2 nd connecting conductor 35 has been described as an example, the 2 nd connecting conductor 35 may not be provided. In this case, it suffices if the 8 th internal electrode 31 and the 1 st ground electrode 5 are connected by via conductors H17c, H17d and the 8 th internal electrode 31 and the 2 nd ground electrode 6 are connected by via conductors H17a, H17 b. In the above embodiment, the 2 nd connecting conductor 35 has been described as an example of the substantially H-shaped form, but the 2 nd connecting conductor 35 is not limited to this form.
In the above embodiment, the embodiment in which the 1 st LC parallel resonant unit 40 and the 3 rd LC parallel resonant unit 44 are provided has been described as an example, but these LC parallel resonant units may be further provided.
In the above embodiment, the description has been given of an example in which the 9 th coil conductor 33 constituting the 1 st matching coil 48 is disposed between the 6 th inner electrode 28 and the 2 nd main surface 2b, and among the 2 nd inner electrode 23 and the 6 th inner electrode 28 constituting the 2 nd capacitor C2, the 6 th inner electrode 28 is connected to the end portion of the 2 nd coil L2 connected to the 1 st matching coil 48. However, the 9 th coil conductor 33 may be disposed in: the 8 th inner electrode 31 constituting the 1 st capacitor C1 connected to the end of the 1 st coil L1 connected to the 2 nd coil L2 is located below. In the above-described embodiment, the description has been given of an example in which the 10 th coil conductor 34 constituting the 2 nd matching coil 50 is disposed between the 7 th inner electrode 29 and the 2 nd main surface 2b, and among the 3 rd inner electrode 24 and the 7 th inner electrode 29 constituting the 4 th capacitor C4, the 7 th inner electrode 29 is connected to the end of the 4 th coil L4 connected to the 2 nd matching coil 50. However, the 10 th coil conductor 34 may be disposed in: the 8 th inner electrode 31 constituting the 3 rd capacitor C3 connected to the end of the 3 rd coil L3 connected to the 4 th coil L4 is located below.
In the above embodiment, the distance between the 1 st end face 2e and the 2 nd end face 2f in the element body 2 is described as an example of a case where the distance between the 1 st main face 2a and the 2 nd main face 2b and the distance between the 1 st side face 2c and the 2 nd side face 2d are larger, but the shape of the element body is not limited to this.
Claims (7)
1. A stacked filter, characterized in that:
the disclosed device is provided with: an element body formed by laminating a plurality of insulator layers, and having a mounting surface and an opposing surface that face each other, and four side surfaces that connect the mounting surface and the opposing surface; an input terminal electrode and an output terminal electrode disposed on the mounting surface of the element body;
in the element body are provided: a 1 st LC parallel resonance unit formed by connecting a 1 st capacitor and a 1 st coil in parallel; a 2 nd LC parallel resonance unit configured by a 2 nd capacitor and a 2 nd coil connected in parallel and connected in series to the 1 st LC parallel resonance unit; and a matching coil connected in series to the 2 nd LC parallel resonance section,
the 1 st LC parallel resonance section, the 2 nd LC parallel resonance section, and the matching coil are connected to a line between the input terminal electrode and the output terminal electrode,
the 1 st coil and the 2 nd coil are each configured in a loop shape with a 1 st direction as an axis and are arranged with a predetermined interval in the 1 st direction, wherein the 1 st direction is a direction in which the pair of side surfaces face each other,
the 1 st capacitor is disposed between the 1 st coil and the mounting surface in a 2 nd direction, wherein the 2 nd direction is a direction in which the mounting surface opposes the opposing surface,
the 2 nd capacitor is disposed between the 2 nd coil and the mounting surface in the 2 nd direction,
the matching coil is disposed between the 1 st capacitor or the 2 nd capacitor and the mounting surface in the 2 nd direction.
2. The multilayer filter according to claim 1, wherein:
the 1 st capacitor and the 2 nd capacitor each include a pair of internal electrodes in their configuration,
the matching coil is configured to: the internal electrode connected to the end portion of the 1 st coil connected to the 2 nd coil out of the pair of internal electrodes of the 1 st capacitor, or the internal electrode connected to the end portion of the 2 nd coil connected to the matching coil out of the pair of internal electrodes of the 2 nd capacitor is interposed between the mounting surface and the internal electrode.
3. The multilayer filter according to claim 1, wherein:
a plurality of the 1 st LC parallel resonance parts are provided in the element body,
the 1 st coils are arranged in the 1 st direction.
4. The multilayer filter according to claim 3, wherein:
two of the 2 nd LC parallel resonance parts are provided in the element body,
the two 2 nd coils are disposed at positions sandwiching the plurality of 1 st coils in the 1 st direction.
5. The multilayer filter according to claim 4, wherein:
the 1 st coils in the 1 st direction are spaced apart from each other by a distance greater than a distance between the 1 st coils and the 2 nd coils in the 1 st direction.
6. The multilayer filter according to any one of claims 1 to 5, wherein:
the axis of the matching coil is along the 2 nd direction.
7. The multilayer filter according to any one of claims 1 to 5, wherein:
the matching coil is connected between the input terminal electrode or the output terminal electrode and the 2 nd LC parallel resonance section.
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| JP2015205506A JP6693080B2 (en) | 2015-10-19 | 2015-10-19 | Multilayer filter |
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| JP7358847B2 (en) * | 2019-08-28 | 2023-10-11 | Tdk株式会社 | Manufacturing method of laminated coil parts and laminated coil parts |
| JP7489199B2 (en) | 2020-02-17 | 2024-05-23 | Tdk株式会社 | Multilayer Filter |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101072017A (en) * | 2006-05-11 | 2007-11-14 | 精工爱普生株式会社 | Split ring resonator bandpass filter, electronic device including said bandpass filter, and method of producing said bandpass filter |
| CN103023449A (en) * | 2011-09-23 | 2013-04-03 | 株式会社村田制作所 | Band-pass filter |
| CN104348440A (en) * | 2013-07-24 | 2015-02-11 | 株式会社村田制作所 | High frequency component and filter component |
| CN104426496A (en) * | 2013-08-28 | 2015-03-18 | 株式会社村田制作所 | High frequency component |
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| JP5598548B2 (en) * | 2010-11-16 | 2014-10-01 | 株式会社村田製作所 | Multilayer bandpass filter |
| JP5861693B2 (en) * | 2013-12-03 | 2016-02-16 | 株式会社村田製作所 | Multilayer bandpass filter |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101072017A (en) * | 2006-05-11 | 2007-11-14 | 精工爱普生株式会社 | Split ring resonator bandpass filter, electronic device including said bandpass filter, and method of producing said bandpass filter |
| CN103023449A (en) * | 2011-09-23 | 2013-04-03 | 株式会社村田制作所 | Band-pass filter |
| CN104348440A (en) * | 2013-07-24 | 2015-02-11 | 株式会社村田制作所 | High frequency component and filter component |
| CN104426496A (en) * | 2013-08-28 | 2015-03-18 | 株式会社村田制作所 | High frequency component |
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