CN107025482B - 电子装置 - Google Patents

电子装置 Download PDF

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Publication number
CN107025482B
CN107025482B CN201610885066.2A CN201610885066A CN107025482B CN 107025482 B CN107025482 B CN 107025482B CN 201610885066 A CN201610885066 A CN 201610885066A CN 107025482 B CN107025482 B CN 107025482B
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capacitance
electrode
electrodes
generated
conductive
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CN107025482A (zh
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托马斯·苏沃德
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NXP BV
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NXP BV
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
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    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
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    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605—Measuring capacitance
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Abstract

根据本发明的第一方面，提供一种电子装置，该电子装置包括：基板；集成电路；导电胶的层，其位于基板与集成电路之间；至少一个第一电极，其连接到导电胶；以及至少一个第二电极，其连接到导电胶；其中第一电极和第二电极被布置成接收电压产生器输入，使得在所述第一电极与第二电极之间产生电容，其中所述电容的至少一部分贯穿导电胶的层产生；并且其中第一电极和第二电极被布置成输出所述电容。根据本发明的第二方面，构想出一种制造电子装置的对应的方法。

Description

电子装置
技术领域
本发明涉及一种电子装置。此外，本发明涉及一种制造电子装置的对应的方法。
背景技术
例如智能卡的电子装置现今在社会中广泛使用。例如，智能卡可以被用作电子身份(eID)卡。然而，这些eID卡的终端用户接受性仍相对较低。虽然由于通过嵌入式安全元件(例如，安全控制器芯片)提供的eID卡的加密能力使得eID卡是相对安全的，但是困难的是验证安全元件和所述安全元件安装在上面的装置主体(例如，基板)的特定组合是否是真实的。一般而言，困难的是验证集成电路(例如，处理单元)和所述集成电路安装在上面的装置主体(例如，基板)的特定组合是否是真实的。因此，所阐述的种类的电子装置仍然易受篡改的影响。
发明内容
根据本发明的第一方面，提供一种电子装置，该电子装置包括：基板；集成电路；导电胶的层，其位于基板与集成电路之间；至少一个第一电极，其连接到导电胶；以及至少一个第二电极，其连接到导电胶；其中第一电极和第二电极被布置成接收电压产生器输入，使得在所述第一电极与第二电极之间产生电容，其中所述电容的至少一部分贯穿导电胶的层产生；并且其中第一电极和第二电极被布置成输出所述电容。
在一个或多个实施例中，电容取决于导电胶的层中的导电粒子的分布。
在一个或多个实施例中，导电粒子的分布实施物理不可克隆函数。
在一个或多个实施例中，装置另外包括：电压产生器，其被布置成产生电压产生器输入；测量单元，其被布置成测量所述电容并且输出对应的电容值；处理单元，其被布置成从测量单元中接收至少一个电容值，并且比较所述电容值与参考值。
在一个或多个实施例中，处理单元另外被布置成针对环境影响校正电容值。
在一个或多个实施例中，集成电路包括以下各项中的至少一者：处理单元、第一电极、第二电极、电压产生器、测量单元。
在一个或多个实施例中，装置另外包括连接到导电胶的多对第一电极和第二电极；其中每一对第一电极和第二电极被布置成接收电压产生器输入，使得在每一对之间产生电容，其中所述电容的至少一部分贯穿导电胶的层产生；并且其中每一对被布置成输出所述电容。
在一个或多个实施例中，每一对的电压产生器输入在一组控制信号的控制下产生。
在一个或多个实施例中，控制信号的组表示由包括在所述装置中的处理单元产生的挑战代码。
在一个或多个实施例中，处理单元另外被布置成比较多个所测量的电容值与预定的响应代码。
在一个或多个实施例中，集成电路是通用处理器芯片或应用程序处理器芯片。
在一个或多个实施例中，基板是印刷电路板。
在一个或多个实施例中，集成电路是安全元件，具体地说是安全控制器芯片。
在一个或多个实施例中，装置是智能卡。
根据本发明的第二方面，构想出制造电子装置的方法，该方法包括提供具有以下项的电子装置：基板；集成电路；导电胶的层，其位于基板与集成电路之间；至少一个第一电极，其连接到导电胶；以及至少一个第二电极，其连接到导电胶；其中第一电极和第二电极被布置成接收电压产生器输入，使得在所述第一电极与第二电极之间产生电容，其中所述电容的至少一部分贯穿导电胶的层产生；并且其中第一电极和第二电极被布置成输出所述电容。
附图说明
将参考附图更详细地描述实施例，在附图中：
图1示出了导电胶的例子；
图2示出了包括导电胶的组装件的例子；
图3示出了使用导电胶组装在基板上的芯片的例子；
图4示出了电子装置的示意性实施例；
图5示出了测量单元的示意性实施例；
图6示出了具有多个电容式传感器的芯片的示意性实施例；
图7示出了用于实施挑战/响应方案的系统的示意性实施例；
图8示出了生物计量系统的示意性实施例；
图9示出了具有嵌入式生物计量系统的芯片的示意性实施例；
图10示出了验证顺序的例子。
具体实施方式
如上文所提及，根据本发明的第一方面，提供一种电子装置，该电子装置包括：基板；集成电路；导电胶的层，其位于基板与集成电路之间；至少一个第一电极，其连接到导电胶；以及至少一个第二电极，其连接到导电胶；其中第一电极和第二电极被布置成接收电压产生器输入，使得在所述第一电极与第二电极之间产生电容，其中所述电容的至少一部分贯穿导电胶的层产生；并且其中第一电极和第二电极被布置成输出所述电容。
集成电路(集成电路，IC，)(例如，安全控制器芯片)通常组装到高安全性电子文档的卡主体中。卡主体的真实性和安全控制器芯片的真实性可以单独地验证，但是困难的是验证真实的安全控制器芯片已经以真实的方式组装到真实的卡主体中。换句话说，困难的是验证集成电路与卡主体(即，集成电路安装在上面的基板)的特定组合(即，特定组装件)是真实的。根据本发明，组装件的真实性可以通过相对较少的资源且以相对较低的成本验证。这通过利用用于将集成电路附接到基板的导电胶的物理特性获得。具体地说，可以预期的是电场以及在第一电极与第二电极之间产生的所引起的电容在不同组装件之间将是不同的，因为导电胶的物理特性对于每个组装件将是不同的。因此，通过测量这种电容，可有可能的是唯一地识别特定组装件。
在一个或多个实施例中，电容可以取决于导电胶的层中的导电粒子的分布。由于导电粒子的分布可能在不同组装件之中显著改变，所以组装件标识是独特的概率可以因此增大。此外，导电粒子的分布可以取决于制造过程中的固有的变异性，这可以允许导电粒子的半随机分布。因此，导电粒子的分布可以实施物理不可克隆函数(physical unclonablefunction，PUF)，这可以另外增大组装件标识独特的概率。换句话说，通过利用导电胶中的导电粒子的半随机分布，可以导出可以用于IC基板组装件标识的独特签名(即，用于验证IC基板组装件是真实的)。
导电胶可以是各向异性导电胶。各向异性导电胶是用于将裸露的小片组装到基板(例如，卡嵌体或印刷电路板(printed circuit boards，PCB))上的材料。集成电路可以是安全元件，例如，智能卡中的安全控制器芯片。在这种情况下，基板可以是安全控制器芯片组装在上面的卡嵌体。替代地，但是非限制性地，集成电路可以是通用处理器芯片或应用程序处理器芯片。在这种情况下，基板可以是处理器芯片组装在上面的PCB，例如，在移动装置中，并且IC基板组装件标识可用于实施伪造保护。
图1示出了导电胶100的例子。导电胶100包括分散于树脂中的导电粒子102。胶100可用于将裸露的小片组装到基板上，例如，印刷电路板或卡嵌体。导电粒子102可以是由包括银或金的金属制成的薄片。薄片可具有不规则的大小和形状并且由于制造过程中的固有的可变性可以是半随机地分布在导电胶100中的。例如表面张力等其它物理效应也可以影响粒子分布。所述薄片的中数直径可以涉及胶100附接到的接触垫的直径；根据经验，薄片直径可以选择为至少是接触垫的较小的宽度或长度的1/5。在实际实施方案中，直径介于10μm到30μm的范围。通过在芯片组装期间在垂直方向上施加压力，包含于胶100中的粒子102被冷凝直至在接触垫之间建立电接触。树脂被移置到侧面。在组装期间施加的热量或UV光起始树脂的固化过程。当固化时胶100提供芯片与基板之间的较强粘附。
图2示出了包括导电胶100的组装件的例子。组装件包括：第一接触垫200，例如，芯片(未示出)；以及第二接触垫202，例如，基板(未示出)。如可见，在胶100中的一些位置处存在触碰彼此和接触垫200、202的一连串的导电粒子，以便在所述接触垫200、202之间形成导电路径。
图3示出了使用导电胶100组装在基板302上的芯片300的例子。芯片300具有接触垫304、306，这些接触垫经由凸块下金属化物(under-bump metallization，UBM)310、312以及再分布层(redistribution layer，RDL)314、316连接到导电胶100。UBM 310、312嵌入在可以由聚酰亚胺制成的绝缘层308中。UBM 310、312形成接触垫304、306与RDL金属化物314、316之间的接触件，这些接触件可以由铜制成。
图4示出了电子装置的示意性实施例。电子装置包括第一电极400和第二电极402。第一电极400可以例如充当接收电极并且第二电极402可以例如充当驱动电极。替代地，第一电极400可以充当驱动电极并且第二电极402可以充当接收电极。第一电极400和第二电极402可以直接地耦合到芯片(未示出)或者形成其部分。电子装置另外包括在基板(未示出)旁边的接触垫410以在芯片旁边的另一接触垫412。第一电极400和第二电极402可以在不存在接触垫处方便地连接到导电胶100，如图4中所示。应注意一些粒子(例如，粒子404、408)可以不是完全冷凝的并且因此并不提供电接触。
根据本发明，在第一电极400与第二电极402之间施加电压并且因此产生电场。电场可以包括电极400和402之间的直接电场，其由电容器406表示。另外，所述电极400、402之间的电场的主要部分产生为由从两个电极400、402中的一个到达另一个的圆形虚线所指示的所谓的杂散场。存在于杂散场内的导电粒子修改电场，这直接地影响可以在两个电极400、402之间测量的电容。一些导电粒子，例如，粒子404，可以与两个电极400、402中的一个接触，这另外修改了电杂散场且因此修改了所引起的电容。因此，包含于导电胶100中的导电粒子的某种分布可以引起可以在两个电极400、402之间测量的对应的电容。此外，由于导电粒子的分布可以在不同IC基板组装件之中显著地改变，所以所测量的电容可以被视为此类组装件的独特标识符或独特签名。
图5示出了测量单元的示意性实施例。在此例子中，一对电极400、402已经嵌入到导电胶100中。在第一电极400与第二电极402之间产生的电杂散场引起电容Cs。如上文所提及，在电杂散场中的例如粒子102的导电粒子的存在修改所述场，这直接地影响电容Cs。可以通过例如通用输入/输出插脚502、504、506、集成电容器508和寄生电容器510等组件来促进场的产生和电容Cs的测量。技术人员将理解这种测量单元仅是一个例子，并且其它类型的测量单元也可以用于测量在两个电极400、402之间产生的电容Cs。
图6示出了具有多个电容式传感器的芯片的示意性实施例。电容式传感器可以包括布置在芯片的主动表面上的电极对。芯片的主动表面是可以包括集成组件和接触垫(后者在图6中示出为黑点)的芯片的侧面。芯片的主动表面是可以连接到导电胶的侧面。每对电极可以是互相交叉的(未示出)。每一对互相交叉的电极可以被称作电容式传感器600，因为使用该对电极以产生电杂散场并且测量或感测所引起的电容。在此例子中，存在组织在两行和四列中的八个电容式传感器。在互相交叉的模式中布置两个电极可以提供每区域的高电容密度。用于形成所谓的再分布层的现有过程模块可以用于在芯片的活动侧上形成和布置互相交叉的模式。
图7示出了用于实施挑战/响应方案的系统的示意性实施例。多个电容式传感器600可以布置在集成电路或芯片的表面上，如图6中所示。电容式传感器可以成行和列布置。一个行中的电容式传感器的全部第一电极可以连接到共有的行信号，该行信号进一步连接到接收电极控制电路702的输入端。一个列中的电容式传感器的全部第二电极可以连接到共有的列信号，该列信号进一步连接到驱动电极控制电路700的输出端。驱动电极控制电路700的输出可以被布置成驱动所连接的电极或在非活动(高阻抗)状态中。逻辑控制信号可用于选择两个状态中的一个。此类逻辑控制信号的组合可用于控制所述驱动电极控制电路700的全部输出。逻辑控制信号的所述组合因此表示第一挑战代码。接收电极控制电路702的输入可以被布置成感测电容或在非活动(高阻抗)状态中。逻辑控制信号可用于选择两个状态中的一个。此类逻辑控制信号的组合可用于控制所述接收电极控制电路702的全部输出。逻辑控制信号的所述组合因此表示第二挑战代码。在应用第一和第二挑战代码之后，可以评估主动地连接的电容式传感器的组合电容。所测量的电容表示对两个挑战代码的响应。通过依次执行各自基于不同组的挑战代码的所述电容测量，可以捕获对应的组的响应。所引起的挑战上的电容读数表示响应模式。
因此，在一个或多个实施例中，装置包括连接到导电胶的多对第一电极和第二电极。在这种情况下，电压产生器可被布置成产生在每一对第一电极与第二电极之间的电压，使得在每个对之间产生电容，其中所述电容的至少一部分贯穿导电胶的层产生。此外，测量单元可被布置成测量每一对之间的电容。电压产生器可以另外被布置成在一组控制信号的控制下在每一对之间产生所述电压，并且该组控制信号可以表示由处理单元产生的挑战代码。此外，处理单元可以被布置成比较多个所测量的电容值与预定的响应代码。以此方式，由于IC基板组装件的标识取决于多个电容测量，所以标识可以是更加精确的。
如上文所提及，还可能的是评估主动地连接的电容式传感器的组合电容。组合式电容可随后与参考值(即，期望响应)进行比较。组合电容的读数的顺序可以表示响应模式，在此情况下整个顺序可以一次与期望的响应模式进行比较。响应的熵是通过例如调节电容式传感器的大小、电容式传感器的数量、电容式传感器在例如芯片上的行和列中的布置、挑战代码的熵、所应用的挑战代码的数量以及与电极的维度成比例的导电粒子的维度而可缩放的。适当地调节多个因素可以引起高熵。
图8示出了生物计量系统的示意性实施例。这种系统可被称为生物计量系统，因为IC基板组装件的所导出的标识符或签名可以被视为所述组装件的物理指纹。在挑战环路802，应用至少一个挑战800并且所引起的响应是借助于所阐述的种类的一个或多个电容测量读数获得的。在环路的每个迭代中，一组驱动电极(或挑战电极)可以得到刺激804，并且通过导电粒子影响的电容(实施PUF 906)可以通过接收电极在808处测量或感测。所获得的响应可以基于例如环境影响呈现变化。为了使响应适用于另外的评估，它可能必须经受特征提取过程814，该特征提取过程提取不依赖于所述环境影响的可靠的一组标识特征。所提取的特征可以是电容读数，通过预处理812该读数已经针对包括例如温度、湿度和空气压力等环境影响得到校正。由此，可以获得IC基板组装件的更可靠的标识。所提取的标识特征可以是基于一系列挑战代码的一组电容测量。所述所提取的特征可以通过模板产生器816作为模板格式化以用于针对模板数据库816中的参考模板的简单且快速的匹配。在装置制造阶段中，一组挑战-响应对可以得到确定并且作为一组参考模板存储在例如芯片的安全存储单元内的数据库816中。此过程被称作登记。所存储的挑战-响应对可以形成代码字母。在正常操作模式中，应用来自代码字母表的挑战并且所引起的响应针对参考模板匹配820。阈值可以定义为设置应该从一组挑战/响应对中获得的正验证的数目以获得总体的正验证结果822。可能有用的是通过限定新的一组挑战/响应对来更新物理指纹。按照原理此处所公开的系统能够提供可以被视为用于由生物计量系统所使用的代码字母的定义空间的较大且无限数目的挑战/响应对。
图9示出了具有嵌入式生物计量系统的芯片的示意性实施例。用于验证IC基板组装件的生物计量系统可以集成到形成所述组装件的一部分的IC 300(芯片)中，如图9中所示。IC 300可以是安全控制器芯片，其包括：数据接口902，以用于将IC 300连接到请求组装件的验证的服务；加密单元904；中央处理单元906；存储器单元908(例如，RAM和/或ROM)；以及输入/输出接口910、912，以用于将IC 300连接到挑战/响应电极914、916，这些挑战/响应电极连接到导电胶100。输入/输出接口910、912可以通过IC 300的中央处理单元906控制。如上文所提及，被布置成接收所测量的电容值并且比较它们与参考值的处理单元可以包括在IC 300中。就处理单元被篡改的风险可以减小的意义而言这是有用的因为它可以增大安全等级，具体地说在IC 300是安全控制器芯片的情况下。所述处理单元可以是例如图9中所示的中央处理单元906。
图10示出了验证顺序的例子。验证顺序包括在1000处接收标识请求，即，接收请求以根据本发明验证IC基板组装件的身份。，此外，验证顺序包括：在1002处，产生挑战模式；在1004处，将挑战模式转换到电极控制模式中；在1006处，配置输入/输出阶段；在1008处，输出挑战；在1010处，获得响应；在1012处，生物计量模式匹配；在1014处，产生标识响应；在1016处，返回标识响应。
出于安全组装件认证的目的，可能需要的是产生具有低错误接受率(FalseAcceptance Rate，FAR)与高错误拒绝率(False Reiect Rate，FRR)的可靠的验证。FAR可以通过调节待用于产生一个响应的挑战的数量容易地受到控制。FRR可以通过影响总体代码熵的不同因素的适当定义按比例调整。此外，当与芯片相关物理不可克隆函数(例如，SRAM-PUF)组合时，所引起的组合呈现与单独应用SRAM-PUF相比大的多的熵。
应注意，已经参考不同标的物描述了以上实施例。具体地说，一些实施例可能是已参考方法类的权利要求来描述的，而其它实施例可能是已参考设备类的权利要求来描述的。然而，本领域的技术人员将从上述内容了解到，除非另外指明，否则除属于一种类型的标的物的特征的任意组合外，与不同标的物相关的特征的任意组合，特别是方法类的权利要求的特征和设备类的权利要求的特征的组合，也视为与此文档一起公开。
此外，应注意，图式是示意性的。在不同图式中，用相同的参考标记表示类似或相同的元件。此外，应注意，为了提供对示意性实施例的简洁描述，可能并未描述属于技术人员的习惯做法的实施细节。应了解，在任何此类实施方案的发展中，如在任何工程或设计项目中，必须制定大量实施方案特定的决策以便实现研发者的特定目标，例如遵守系统相关的和商业相关的约束条件，所述约束条件在不同的实施方案中可能不同。此外，应了解，此类发展努力可能是复杂且耗时的，但不过是本领域的技术人员进行设计、制造和生产的例行任务。
最后，应注意，技术人员将能够在不脱离所附权利要求书的范围的情况下设计许多替代实施例。在权利要求书中，置于圆括号之间的任何参考标记不应解释为限制权利要求。词语“包括”不排除在权利要求中列出那些元件或步骤之外的元件或步骤的存在。元件之前的词语“一个”或“一”并不排除多个此类元件的存在。权利要求书中叙述的措施可以借助于包括若干不同元件的硬件和/或借助于适当编程的处理器来实施。在列出若干构件的装置权利要求中，可以通过硬件中的同一个物件实施若干这些构件。在彼此不同的从属权利要求中叙述某些措施这一单纯事实并不指示不能使用这些措施的组合来获得优势。
参考符号列表
100 导电胶
102 导电粒子
200 接触垫
202 接触垫
300 芯片
302 基板
304 接触垫
306 接触垫
308 聚酰亚胺绝缘层
310 凸块下金属化物
312 凸块下金属化物
314 RDL金属化物
316 RDL金属化物
400 电极
402 电极
404 导电粒子
406 电容器
408 导电粒子
410 接触垫
412 接触垫
500 测量单元
502 通用输入/输出插脚
504 通用输入/输出插脚
506 通用输入/输出插脚
508 集成电容器
510 寄生电容器
600 电容式传感器
700 驱动电极控制
702 接收电极控制
800 挑战代码
802 挑战环路
804 刺激挑战电极
806 物理不可克隆函数
808 感测接收电极
810 组装响应代码
812 预处理
814 特征提取
816 模板产生器
818 参考模板
820 模板匹配
822 验证结果
900 服务请求验证
902 数据接口
904 加密单元
906 中央处理单元
908 存储器单元
910 输入/输出接口
912 输入/输出接口
914 挑战/响应电极
916 挑战/响应电极
1000 接收标识请求
1002 产生挑战模式
1004 转换到电极控制模式中
1006 配置输入/输出阶段
1008 输出挑战
1010 获得响应
1012 生物计量模式匹配
1014 产生标识响应
1016 返回标识响应

Claims (8)

1.一种电子装置，其特征在于，包括：
基板；
集成电路；
导电胶的层，其位于所述基板与所述集成电路之间；
连接到所述导电胶的至少一个第一电极，以及连接到所述导电胶的至少一个第二电极；
其中所述第一电极和所述第二电极被布置成接收电压产生器输入，使得在所述第一电极与第二电极之间产生电容，其中所述电容的至少一部分贯穿所述导电胶的层产生；
并且其中所述第一电极和所述第二电极被布置成输出所述电容，
其中，所述装置另外包括：
电压产生器，其被布置成产生所述电压产生器输入；
测量单元，其被布置成测量所述电容并且输出对应的电容值；
处理单元，其被布置成从所述测量单元接收至少一个电容值，并且比较所述电容值与参考值，并且其中，所述处理单元另外被布置成针对环境影响校正所述电容值。
2.根据权利要求1所述的装置，其特征在于，所述电容取决于所述导电胶的层中的导电粒子的分布。
3.根据权利要求2所述的装置，其特征在于，所述导电粒子的分布实施物理不可克隆函数。
4.根据权利要求1所述的装置，其特征在于，
其进一步包括连接到所述导电胶的多对第一电极和第二电极；
其中每一对第一电极和第二电极被布置成接收所述电压产生器输入，使得在每一对之间产生电容，其中所述电容的至少一部分贯穿所述导电胶的层产生；
并且其中每一对被布置成输出所述电容。
5.根据权利要求4所述的装置，其特征在于，每一对的所述电压产生器输入在一组控制信号的控制下产生。
6.根据权利要求5所述的装置，其特征在于，所述一组控制信号表示由包括在所述装置中的处理单元产生的挑战代码。
7.根据权利要求6所述的装置，其特征在于，所述处理单元另外被布置成比较多个所测量的电容值与预定的响应代码。
8.一种制造电子装置的方法，其特征在于，所述方法包括提供具有以下项的电子装置：
基板；
集成电路；
导电胶的层，其位于所述基板与所述集成电路之间；
连接到所述导电胶的至少一个第一电极，以及连接到所述导电胶的至少一个第二电极；
其中所述第一电极和所述第二电极被布置成接收电压产生器输入，使得在所述第一电极与第二电极之间产生电容，其中所述电容的至少一部分贯穿所述导电胶的层产生；
并且其中所述第一电极和所述第二电极被布置成输出所述电容，其中，所述装置另外包括：
电压产生器，其被布置成产生所述电压产生器输入；
测量单元，其被布置成测量所述电容并且输出对应的电容值；
处理单元，其被布置成从所述测量单元接收至少一个电容值，并且比较所述电容值与参考值，并且其中，所述处理单元另外被布置成针对环境影响校正所述电容值。
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