CN107022929A - A kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper - Google Patents
A kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper Download PDFInfo
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- CN107022929A CN107022929A CN201710302432.1A CN201710302432A CN107022929A CN 107022929 A CN107022929 A CN 107022929A CN 201710302432 A CN201710302432 A CN 201710302432A CN 107022929 A CN107022929 A CN 107022929A
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- CN
- China
- Prior art keywords
- aramid fiber
- performance
- circuit board
- manufacture method
- insulating paper
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21F—PAPER-MAKING MACHINES; METHODS OF PRODUCING PAPER THEREON
- D21F9/00—Complete machines for making continuous webs of paper
-
- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H13/00—Pulp or paper, comprising synthetic cellulose or non-cellulose fibres or web-forming material
- D21H13/10—Organic non-cellulose fibres
- D21H13/20—Organic non-cellulose fibres from macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- D21H13/26—Polyamides; Polyimides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
- H01B3/52—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials wood; paper; press board
Abstract
The invention discloses a kind of manufacture method of circuit board with high-performance p-aramid fiber insulating paper, belong to p-aramid fiber insulating paper preparing technical field, technical points comprise the steps：(1) shearing of aramid fiber；(2) outfit of pretreatment fluid；(3) pretreating process process；(4) introduction of fiber surface activity group；(5) papermaking process；(6) paper is dried；(7) high-pressure process；The present invention is intended to provide a kind of technique is simple, excellent product performance, the manufacture method of environment-friendly and circuit board high-performance p-aramid fiber insulating paper with low cost；Manufacture for high-performance p-aramid fiber insulating paper.
Description
Technical field
The present invention relates to a kind of manufacture method of p-aramid fiber insulating paper, more specifically, more particularly to a kind of circuit board
With the manufacture method of high-performance p-aramid fiber insulating paper.
Background technology
Aramid insulating paper is as a kind of new high insulating property special material, in the last few years in military, civil area
Important application progressively expands.Although China's aramid insulating paper industry obtained development faster, domestic big portion in the last few years
Divide enterprise still in lab scale and pilot scale stage, still had a long way to go with the technical merit of developed countries, Some Key Technologies are still
For external relevant company monopolizing.Aramid insulating paper main at present is mainly manufactured by papermaking wet method papermaking process.It is main former
Material has two classes：One class is the meta-aramid fibers that strand arrangement is serrated, and China is referred to as aramid fiber 1313；One class is molecule
Chain arranges linearly para-aramid fiber, and China is referred to as Fanglun l414.The aramid fiber manufactured paper with pulp by meta-aramid fibers is exhausted
Aramid paper of the edge paper resistance to elevated temperatures with insulating properties not as obtained by para-aramid fiber, therefore selection para-aramid fiber
The application limitation of aramid insulating paper can be tackled.But para-aramid fiber is due to the stability of its structure, hydrophobicity and easily wads a quilt with cotton
Also therefore the features such as solidifying, cause the paper uniformity difference obtained by it even difficult into paper, the development of China's aramid insulating paper industry
It is affected and hinders.And the technological means taken this is mainly that surface is modified both at home and abroad at present, mainly face coat method,
Chemical modification and physical modification.Patent of the present invention proposes have to para-aramid fiber and PPTA-pulp using coupling agent
Imitate surface to be modified, high activity group is introduced on the surface texture of aramid fiber, improve interfibrous adhesion, while adding suitable
The dispersing aid and surfactant matched somebody with somebody, make it preferably be dispersed in water, and improve into the paper uniformity, finally the virtue to manufacturing paper with pulp
Synthetic fibre paper carries out HTHP and is partly dissolved processing, manufactures high performance aramid insulating paper.
At this stage, domestic insulation aramid fiber material is regardless of Aero-Space, military defense, circuit board, ship, guided missile, radar
Etc. high-tech area, or the field such as the high rigidity such as aircraft, steamer, it all have accumulated certain experience, but its strength character, resistance to height
Warm nature, fire-retardant and insulating properties and developed countries still have certain gap；The country is using the more excellent p-aramid fiber of performance simultaneously
The technology of fiber copy paper is even more the presence of a huge breach, belongs to the exploratory stage, in terms of focusing on fiber surface modification.
The content of the invention
It is an object of the invention to for above-mentioned the deficiencies in the prior art there is provided a kind of technique is simple, excellent product performance,
The manufacture method of environment-friendly and with low cost circuit board high-performance p-aramid fiber insulating paper.Prepare high intensity, resistance to height
Warm, fire-retardant and excellent electrical insulation capability aramid insulating paper.
The technical proposal of the invention is realized in this way：A kind of circuit board is with the manufacturer of high-performance p-aramid fiber insulating paper
Method, this method comprises the steps：
(1) shearing of aramid fiber：Para-aramid fiber is cut into chopped fiber；
(2) outfit of pretreatment fluid：Ammoniacal liquor is diluted to the solution that mass fraction is 5%-50%, pretreatment fluid is obtained, it is standby
With；
(3) pretreating process process：Pretreatment fluid provisioned in step (2) is maintained to 25-100 DEG C of temperature conditionss
Under, aramid fiber is pre-processed, pretreating process includes immersion and stirring, and soak time is 10-90min, obtain pre- place
Aramid fiber or pulp after reason；
(4) introduction of fiber surface activity group：The pretreated aramid fiber or pulp that step (3) is obtained enter
Row drying process, then processing is modified with coupling agent, coupling agent loading capacity is calculated as 10-200ml/ by aramid fiber oven-dry weight
G, constant temperature is under 20-50 DEG C of temperature conditionss, and processing time is 20-120min；
(5) papermaking process：Aramid fiber or pulp after being handled through step (4) are cleaned, and remove unnecessary coupling agent, plus
Enter dispersant, dispersant loading capacity is the 0.5-10% of fibrous suspension volume, discongest 3000-100000 and turn, use automatic copy paper
Machine is into paper；
(6) paper is dried：To under vacuum it be dried through aramid paper made from step (5), drying time is 15-
60min；
(7) high-pressure process：The aramid paper obtained through step (6) is entered into the processing of horizontal high voltage light, to obtain the fiber of high densification
The aramid fiber paper surface of structure and smooth, the time is 15-60min.
In a kind of manufacture method of the above-mentioned circuit board with high-performance p-aramid fiber insulating paper, step (1) is specially：Aramid fiber
The shearing of fiber：Para-aramid fiber is cut into 6-8cm chopped fiber, grammes per square metre 40-150g/m2。
In a kind of manufacture method of above-mentioned circuit board high-performance p-aramid fiber insulating paper, step (3), pretreating process
Also include ultrasonication, ultrasonic treatment time is 10-60min.
In a kind of manufacture method of above-mentioned circuit board high-performance p-aramid fiber insulating paper, step (3), pretreatment fluid
Amount is defined by covering aramid fiber or pulp, in immersion process every 30min stirrings once.
In a kind of manufacture method of the above-mentioned circuit board with high-performance p-aramid fiber insulating paper, the coupling described in step (4)
Agent is pure coupling agent or mass ratio is 1：0.5-0.8 coupling agent -ol solution or mass ratio is 1：0.5-0.8 coupling agent-water
Solution or mass ratio are 1：0.5-0.7：0.3-0.5 coupling agent -ol-aqueous solution.
In a kind of manufacture method of above-mentioned circuit board high-performance p-aramid fiber insulating paper, step (4), the virtue after immersion
The loading capacity of pretreatment fluid is 10-200ml/g by aramid fiber over dry re-computation on synthetic fibre fiber.
In a kind of manufacture method of above-mentioned circuit board high-performance p-aramid fiber insulating paper, step (5), dispersant is poly-
Acrylamide or PEO or polyethylene glycol or above-mentioned three kinds of any mixture.
In a kind of manufacture method of above-mentioned circuit board high-performance p-aramid fiber insulating paper, step (6), during vacuum drying
Temperature be 20 DEG C -200 DEG C.
In a kind of manufacture method of above-mentioned circuit board high-performance p-aramid fiber insulating paper, step (7), the high press polish
Processing be specifically temperature be 30-300 DEG C, pressure be 1-50Mpa under conditions of handled.
The present invention with alkalescent pretreatment fluid to the surface of aramid fiber using after above-mentioned technique, first carrying out depth and moistens to rise to make
The specific surface area increase of its fiber a, while alkaline environment is provided for coupling agent treatment below, beneficial to the hydrolysis of coupling agent
Reaction；The processing of coupling agent is to be reacted using its hydrolysate with fiber surface group contacts, finally introduces active group,
Its hydrophobic performance is reduced, makes it easier to manufacture paper with pulp into paper.Therefore either high-purity coupling agent, coupling agent -ol treatment fluid, coupling
Agent-water process liquid, or coupling agent -ol-water process liquid, can reach modifying function, modified effect then with treatment fluid concentration phase
Close, the treatment fluid of reasonable concentration can reach excellent modified effect.Into after paper, aramid fiber part is made by HTHP
Dissolving, realizes interfibrous welding certainly, fills up pore structure, paper structure is densified and smooth, final to be made a kind of
Novel high-performance aramid insulating paper.
The present invention compared with prior art, has the following advantages that：
(1) have technique simple, excellent product performance, it is environment-friendly and with low cost the features such as.
(2) the features such as there is high intensity, high temperature resistant, fire-retardant and excellent electrical insulation capability.
(3) the para-aramid fiber content that the technical method is used is significantly larger than existing technology of preparing, obtained aramid paper
Performance is more excellent, it is adaptable to circuit board, and technology is mainly to be carried out to the hydrophobicity and the aspect of easy flocculability two of para-aramid fiber
Efficient property improvement.Para-aramid fiber surface lacks polar group, therefore hydrophily extreme difference easily flocculates, using coupling agent
Modification, can on aramid fiber grafted polar group, including carboxyl, hydroxyl, amino etc., improve the surface polarity of fiber, improve
The wetability of fiber.
Embodiment
With reference to specific embodiment, the present invention is described in further detail, but does not constitute to any of the present invention
Limitation.
A kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper of the present invention, it is characterised in that this method
Comprise the steps：
(1) shearing of aramid fiber：Para-aramid fiber is cut into 6-8cm chopped fiber, grammes per square metre 40-150g/m2；
(2) outfit of pretreatment fluid：Ammoniacal liquor is diluted to the solution that mass fraction is 5%-50%, pretreatment fluid is obtained, it is standby
With；
(3) pretreating process process：Pretreatment fluid provisioned in step (2) is maintained to 25-100 DEG C of temperature conditionss
Under, aramid fiber is pre-processed, pretreating process includes immersion and stirring, the amount of pretreatment fluid with cover aramid fiber or
Pulp is defined, and, soak time is 10-90min in immersion process every 30min stirrings once, obtains pretreated aramid fiber fine
Dimension or pulp；
Preferably, pretreating process also includes ultrasonication, and ultrasonic treatment time is 10-60min.
(4) introduction of fiber surface activity group：The pretreated aramid fiber or pulp that step (3) is obtained enter
Row drying process, then processing is modified with coupling agent, coupling agent loading capacity is calculated as 10-200ml/ by aramid fiber oven-dry weight
G, constant temperature is under 20-50 DEG C of temperature conditionss, and processing time is 20-120min, and pretreatment fluid adds on the aramid fiber after immersion
Carrying capacity is 10-200ml/g by aramid fiber over dry re-computation.；
In the present embodiment, described coupling agent is pure coupling agent or mass ratio is 1：0.5-0.8 coupling agent -ol solution
Or mass ratio is 1：0.5-0.8 coupling agent-aqueous solution or mass ratio is 1：0.5-0.7：0.3-0.5 coupling agent -ol-water-soluble
Liquid.
(5) papermaking process：Aramid fiber or pulp after being handled through step (4) are cleaned, and remove unnecessary coupling agent, plus
Enter dispersant, dispersant loading capacity is the 0.5-10% of fibrous suspension volume, discongest 3000-100000 and turn, use automatic copy paper
Machine is into paper；
In the present embodiment, dispersant is any of polyacrylamide or PEO or polyethylene glycol or above-mentioned three kinds
Mixture.
(6) paper is dried：To under vacuum it be dried through aramid paper made from step (5), temperature during vacuum drying
For 20 DEG C -200 DEG C, drying time is 15-60min；
(7) high-pressure process：The aramid paper that will be obtained through step (6) is 30-300 DEG C in temperature, and pressure is 1-50Mpa bar
Enter the processing of horizontal high voltage light under part, to obtain the fibre structure of high densification and the aramid fiber paper surface of smooth, the time is 15-
60min。
Embodiment provided above is the better embodiment of the present invention, only illustrates the present invention for convenient, not to this hair
It is bright to make any formal limitation, any those of ordinary skill in the art, if putting forward skill not departing from the present invention
In the range of art feature, using the equivalent embodiment for locally changing or modifying made by disclosed technology contents, and
Without departing from the technical characteristic content of the present invention, in the range of still falling within the technology of the present invention feature.
Claims (9)
1. a kind of circuit board manufacture method of high-performance p-aramid fiber insulating paper, it is characterised in that this method includes following steps
Suddenly：
(1) shearing of aramid fiber：Para-aramid fiber is cut into chopped fiber；
(2) outfit of pretreatment fluid：Ammoniacal liquor is diluted to the solution that mass fraction is 5%-50%, pretreatment fluid is obtained, it is standby；
(3) pretreating process process：Pretreatment fluid provisioned in step (2) is maintained under 25-100 DEG C of temperature conditionss, it is right
Aramid fiber is pre-processed, and pretreating process includes immersion and stirring, and soak time is 10-90min, is obtained pretreated
Aramid fiber or pulp；
(4) introduction of fiber surface activity group：The pretreated aramid fiber or pulp that step (3) is obtained are done
Dry processing, then processing is modified with coupling agent, coupling agent loading capacity is calculated as 10-200ml/g by aramid fiber oven-dry weight, permanent
Temperature is under 20-50 DEG C of temperature conditionss, and processing time is 20-120min；
(5) papermaking process：Aramid fiber or pulp after being handled through step (4) are cleaned, and are removed unnecessary coupling agent, are added and divide
Powder, dispersant loading capacity be fibrous suspension volume 0.5-10%, discongest 3000-100000 turn, with automatic paper machine into
Paper；
(6) paper is dried：To under vacuum it be dried through aramid paper made from step (5), drying time is 15-60min；
(7) high-pressure process：The aramid paper obtained through step (6) is entered into the processing of horizontal high voltage light, to obtain the fibre structure of high densification
And the aramid fiber paper surface of smooth, the time is 15-60min.
2. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper according to claim 1, its feature exists
In step (1) is specially：The shearing of aramid fiber：Para-aramid fiber is cut into 6-8cm chopped fiber, grammes per square metre 40-
150g/m2。
3. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper according to claim 1, its feature exists
In in step (3), pretreating process also includes ultrasonication, and ultrasonic treatment time is 10-60min.
4. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper according to claim 1, its feature exists
In in step (3), the amount of pretreatment fluid is defined by covering aramid fiber or pulp, and one is stirred every 30min in immersion process
It is secondary.
5. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper according to claim 1, its feature exists
It is pure coupling agent in, the coupling agent described in step (4) or mass ratio is 1：0.5-0.8 coupling agent -ol solution or mass ratio is
1：0.5-0.8 coupling agent-aqueous solution or mass ratio is 1：0.5-0.7：0.3-0.5 coupling agent -ol-aqueous solution.
6. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper, its feature according to claim 1 or 5
It is, in step (4), the loading capacity of pretreatment fluid is 10- by aramid fiber over dry re-computation on the aramid fiber after immersion
200ml/g。
7. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper according to claim 1, its feature exists
In in step (5), dispersant is polyacrylamide or PEO or polyethylene glycol or above-mentioned three kinds of any mixture.
8. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper according to claim 1, its feature exists
In in step (6), temperature during vacuum drying is 20 DEG C -200 DEG C.
9. a kind of manufacture method of circuit board high-performance p-aramid fiber insulating paper according to claim 1, its feature exists
In in step (7), it in temperature is 30-300 DEG C that the high press polish processing, which is specifically, and pressure is to be located under conditions of 1-50Mpa
Reason.
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| CN201710302432.1A CN107022929B (en) | 2017-05-02 | 2017-05-02 | A kind of manufacturing method of circuit board high-performance p-aramid fiber insulating paper |
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| CN107419573A (en) * | 2017-09-12 | 2017-12-01 | 成都新柯力化工科技有限公司 | A kind of preparation method of high-strength packaging chemical fiber paper |
| CN108442170A (en) * | 2018-03-15 | 2018-08-24 | 广东超华科技股份有限公司 | A kind of manufacturing method of high-frequency high-speed substrate prepreg |
| CN109457533A (en) * | 2018-10-10 | 2019-03-12 | 华南理工大学 | A kind of preparation method regenerating aramid fiber extrusion coating paper |
| CN109468882A (en) * | 2018-10-18 | 2019-03-15 | 华南理工大学 | A kind of manufacturing method of gradient-structure nanometer aramid paper |
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| CN109468882A (en) * | 2018-10-18 | 2019-03-15 | 华南理工大学 | A kind of manufacturing method of gradient-structure nanometer aramid paper |
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| CN107022929B (en) | 2019-04-05 |
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