CN107017193B - A kind of substrate picks and places and transfer device - Google Patents
A kind of substrate picks and places and transfer device Download PDFInfo
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- CN107017193B CN107017193B CN201710311755.7A CN201710311755A CN107017193B CN 107017193 B CN107017193 B CN 107017193B CN 201710311755 A CN201710311755 A CN 201710311755A CN 107017193 B CN107017193 B CN 107017193B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of pick-and-place of substrate and transfer devices, comprising: first picks and places component, the second pick-and-place component and transfer assembly；The first first straight line mover for picking and placing component drives the first vacuum chuck by the first cylinder, successively moves back and forth between initial position, the first response location, the first access position；The second second straight line mover for picking and placing component drives the second vacuum chuck by the second cylinder, successively moves back and forth between the second access position, the second response location, and the second response location corresponds to second reaction zone setting；The substrate support plate of transfer assembly is set between the first access position and the second access position, and the third straight line mover of transfer assembly drives substrate support plate to move back and forth between the first access position and the second access position.The present invention is automatically performed the transfer and pick-and-place of substrate by transfer assembly and the first, second pick-and-place component, avoids manually-operated inefficient and risk, shifts and picks and places the safe and efficient transfer of substrate may be implemented.
Description
Technical field
The invention belongs to atomic deposition field of film preparation to use more particularly, to a kind of pick-and-place of substrate and transfer device
In the substrate for picking and placing and shifting preparation atomic layer deposition thin film.
Background technique
With semicon industry, the development of integrated circuit and to the urgent need of microdevice, people are to thin film technique
It puts forward new requirements, i.e., film thickness is smaller and smaller, and uniformity is become better and better.And traditional depositing operation, as physical vapor is heavy
Product (PVD), chemical vapor deposition (CVD) have been difficult to meet the use demand of people.Atomic layer deposition (ALD) is a kind of emerging
Processing film technique, it be gaseous precursor is passed into the form of pulse is alternate in reactor and with the base in reactor
Adsorption reaction occurs for bottom, eventually forms one layer of monomolecular film.It, can be to the thickness of film because the growth of its film has from restricted
Accurately controlled, obtain film gauge uniformity well and the good film of compactness, extensive use minute manufacturing, electronics device
Material, semiconductor field are torn in part field, catalyst field, new energy field, energy storage open.
Traditional time isolation atomic layer deposition carries out under vacuum conditions, and depositional environment cleans so as to avoid impurity pair
The interference of film, deposition gained film are with high purity, high-quality.But with the fast development in the fields such as consumer electronics, time isolation
Atomic layer deposition manufacturing process is difficult to adapt to realize the need of high quality deposition in the occasion of high-volume large area in deposition rate
It asks.Time isolation atom layer deposition process deposits completion every time and needs to open vacuum cavity, completes sampling and reapposes sample
It just can be carried out the deposition of next group substrate afterwards.Since deposition process cannot be carried out continuously, the need of high-volume deposition cannot be met
It asks.Atomic layer deposition is isolated due to breaching time isolation precursor form in space, can accelerate movement velocity to improve deposition
Efficiency, this technique is just demand is extensive, occasion of successive sedimentation manifests the advantage of its high effective deposition.
Current space isolation atomic layer deposition is chiefly used in depositing single kind film, when needing to deposit certain thickness layer
When stacked a variety of films, substrate is needed to be shifted between different conversion zones.Due to the substrate in deposition reaction
Temperature is higher, completes substrate pick-and-place using manual operations and transfer can be than relatively hazardous, and this mode the degree of automation is lower,
It is difficult to meet the needs of extensive, mass, automation film preparation.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention is intended to provide a kind of be used for automatic clamping and placing and transfer
The mechanical device of the substrate of atomic layer deposition thin film is prepared, can not achieve automatically for solving current space isolation atomic layer equipment
The problem of substrate of change is shifted and picked and placed improves production efficiency, while can be to avoid the manual risky operation shifted and pick and place.
In order to achieve the above object, the present invention provides a kind of pick-and-place of substrate and transfer devices, comprising: the first pick-and-place group
Part, second pick and place component and transfer assembly；
First pick-and-place component includes first straight line mover, the first cylinder, the first vacuum chuck；First straight line mover level is put
It sets, the first cylinder is vertically arranged on first straight line mover；First vacuum chuck is mounted at the top of the telescopic rod of the first cylinder；Its
In, first straight line mover drives the first vacuum chuck by the first cylinder, successively in initial position, the first response location, first
It is moved back and forth between access position, the corresponding first reaction zone setting of the first response location；
Second pick-and-place component includes second straight line mover, the second mounting base, the second cylinder, the second vacuum chuck；Second is straight
Line mover is horizontal positioned, and the second mounting base is installed on second straight line mover, and the second cylinder is vertically arranged in the second mounting base；
Second vacuum chuck is mounted at the top of the telescopic rod of the second cylinder；Wherein, second straight line mover drives second by the second cylinder
Vacuum chuck successively moves back and forth between the second access position, the second response location, corresponding second reaction of the second response location
Area's setting；
Transfer assembly includes third straight line mover, substrate support plate；Substrate support plate is installed on third straight line mover, base
Piece support plate is equipped with the opening in the first reaction zone of direction direction, and the width of the opening is greater than the first vacuum chuck and second
The width of vacuum chuck, less than the width of substrate；Wherein, substrate support plate be set to the first access position and the second access position it
Between, third straight line mover drives substrate support plate to move back and forth between the first access position and the second access position, and first is true
The elemental height of suction disk and the second vacuum chuck is below substrate support plate.
Further, including heating component, heating component include heater, heater support frame；Heater, which is installed on, to be added
On hot device support frame, and between the first reaction zone and second reaction zone；The height of heater is higher than the height of substrate support plate
Degree.
Further, heating component further include: the first thermal insulation board, the second thermal insulation board, third thermal insulation board；First thermal insulation board and
Second thermal insulation board is oppositely arranged, and height is lower than substrate support plate, between substrate support plate and the first thermal insulation board, the second thermal insulation board
Vertical range allow the first vacuum chuck and the second vacuum chuck to pass freely through；Between first thermal insulation board, the second thermal insulation board
Horizontal distance allows the first pick-and-place component and the second pick-and-place component to pass freely through；Third thermal insulation board is located at transfer assembly side, and
Towards the heating interval setting below heater.
Further, the first pick-and-place component includes the first cylinder thermal insulation board, and the first cylinder thermal insulation board is set to the first cylinder
Telescopic rod at the top of, the first vacuum chuck is mounted on the first cylinder thermal insulation board；Second pick-and-place component includes that the second cylinder is heat-insulated
Plate, the second cylinder thermal insulation board are set at the top of the telescopic rod of the second cylinder, and the second vacuum chuck is mounted on the second cylinder thermal insulation board
On.
Further, including line slide rail component, line slide rail component include the first sliding block, the second sliding block and first
The linear guide that sliding block and the second sliding block share；First, which picks and places component, includes the first pedestal, and the first pedestal is installed on first straight line
On mover and the first sliding block, the first cylinder is installed on the first pedestal；Second, which picks and places component, includes the second pedestal, the second pedestal peace
Loaded on second straight line mover and the second sliding block, the second cylinder is installed on the second pedestal.
In general, the above technical scheme conceived by the present invention compared with prior art, can obtain following beneficial to effect
Fruit:
(1) substrate transfer process can be automatically performed by transfer assembly, be avoided manually-operated inefficient and dangerous
Property, the safe and efficient transfer of substrate may be implemented；
(2) substrate fetching process can cooperate first straight line mover and the by the flexible of the first cylinder and the second cylinder
The movement of two straight line movers is automatically performed, and avoids manually-operated inefficient and risk, it is safe and efficient that substrate may be implemented
It picks and places；
(3) by the way that heater is arranged between the first reaction zone and second reaction zone, the base in transfer process is realized
Piece preheating, reduces the heating time for entering reaction zone meron, further improves production efficiency；
(4) since vacuum chuck has certain adsorption capacity, it can prevent substrate from picking and placing and falling in reaction process, improve
The reliability of equipment；
(5) vacuum chuck and substrate support plate are all installation parts, and size rule can be freely replaced according to needs of production
Lattice form a series of combination, to improve the scalability of device processing object range；
(6) first, second, third thermal insulation boards cooperation heater surrounds a heating space, compared to open heating, energy
It is enough to concentrate on the heat radiation of heater in one lesser space, heat utilization rate is improved, while high-temperature damage can be prevented
Cylinder and transfer assembly improve the service life of device；
(7) since there are spacing between the first thermal insulation board and the second thermal insulation board, setting cylinder thermal insulation board is further heat-insulated, really
Protecting cylinder will not damage because heter temperature is excessively high.
Detailed description of the invention
Fig. 1 is the overall structure assembling schematic diagram of the preferred embodiment of the present invention；
Fig. 2 is the first assembling schematic diagram for picking and placing component and the second pick-and-place component in Fig. 1；
Fig. 3 is the partial perspective schematic view of Fig. 1；
Fig. 4 is the part-structure assembling schematic diagram of transfer assembly in Fig. 1；
Fig. 5 is the structural schematic diagram of substrate support plate in Fig. 1；
Fig. 6 is the side view of Fig. 1；
Fig. 7 (a)~7 (e) is the course of work schematic diagram of the preferred embodiment of the present invention.
In all the appended drawings, identical appended drawing reference is used to denote the same element or structure, in which:
1- line slide rail component
11- pedestal 12- linear guide the first sliding block of 13-
14- the second sliding block 15- track
2- first picks and places component
21- first straight line mover 22- the first pedestal the first mounting plate of 221-
23- the first cylinder 231- the first cylinder thermal insulation board 24- the first suction cup support frame
25- the first vacuum chuck the first drag chain of 26-
3- second picks and places component
31- second straight line mover 32- the second pedestal the second mounting plate of 321-
33- the second cylinder 331- the second cylinder thermal insulation board 34- the second suction cup support frame
35- the second vacuum chuck the second drag chain of 36-
4- transfer assembly
41- third pedestal 42- lead screw 43- third straight line mover
44- motor 45- shaft coupling 46- backplate
The 47- substrate support plate 471- opening spacing zone 472-
48- transfer assembly support frame
5- heating component
51- heater 52- heater support frame the first thermal insulation board of 53-
54- the second thermal insulation board 55- third thermal insulation board
6- substrate
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
Attached drawing 1-6 is please referred to, is a preferred embodiment of the present invention, picks and places and turn this embodiment offers a kind of substrate
Moving device, comprising: line slide rail component, first pick and place component, the second pick-and-place component, transfer assembly, heating component.
Please refer to Fig. 1,2, line slide rail component includes: pedestal, four the first sliding blocks, four the second sliding blocks, four first
The track of two linear guides and linear motor that sliding block and four the second sliding blocks share.The section of pedestal is " ㄩ " type structure
It makes, two linear guides are respectively arranged on the convex ribs of pedestal two sides；Four the first sliding blocks are symmetrically distributed in two straight lines two-by-two and lead
On rail, four the second sliding blocks are equally symmetrically distributed in two-by-two in two linear guides；Track is arranged in pedestal along the axis of pedestal
Bottom surface on, and be located between two linear guides.
The present embodiment first pick-and-place component include: first straight line mover, the first pedestal, the first cylinder, the first cylinder every
Hot plate, the first suction cup support frame, the first vacuum chuck, the first drag chain.In the present embodiment, first straight line mover is linear motor
Mover, be placed horizontally on track.First pedestal is installed on first straight line mover and the first sliding block, and the first cylinder is with flexible
The upward mode of bar is vertically arranged on the first pedestal.First cylinder thermal insulation board is set at the top of the telescopic rod of the first cylinder, from
Depression angle observation, the first cylinder thermal insulation board can block completely the first cylinder.First suction cup support frame is engraved structure, peace
Loaded on the first cylinder thermal insulation board, hollow out position is convenient for the wiring of the first vacuum chuck.First vacuum chuck is mounted on the first sucker
On support frame comprising the base portion of middle part fluting and the micropore ceramics sucker being installed in slot area.First drag chain is used for
Associated cable is protected during the first pick-and-place component movement.The first Base body portion in order to mitigate weight, in the present embodiment
It is divided into " ㄩ " type construction, top is provided with the first mounting plate, and the first cylinder is mounted on the first mounting plate.
Wherein, first straight line mover drives the first vacuum chuck by the first cylinder, successively in initial position, the first reaction
It is moved back and forth between position, the first access position, the corresponding first reaction zone setting of the first response location.
The present embodiment second pick-and-place component include: second straight line mover, the second pedestal, the second cylinder, the second cylinder every
Hot plate, the second suction cup support frame, the second vacuum chuck, the second drag chain.In the present embodiment, second straight line mover is also straight-line electric
The mover of machine, is placed horizontally on track, and shares the same track with first straight line mover.It is straight that second pedestal is installed on second
On line mover and the second sliding block, the second cylinder is vertically arranged on the second pedestal in the upward mode of telescopic rod.Second cylinder every
Hot plate is set at the top of the telescopic rod of the second cylinder, and from depression angle, the second cylinder thermal insulation board can be complete by the second cylinder
It blocks entirely.Second suction cup support frame is engraved structure, is installed on the second cylinder thermal insulation board, and hollow out position is convenient for the suction of the second vacuum
Disk wiring.Second vacuum chuck is mounted on the second suction cup support frame comprising the base portion and be installed on fluting that middle part is slotted
Micropore ceramics sucker in region.Second drag chain is used to protect associated cable during the second pick-and-place component movement.In order to subtract
Light weight, the second Base body part in the present embodiment are " ㄩ " type construction, and top is provided with the second mounting plate, the second cylinder
It is mounted on the second mounting plate.
Fig. 1 and Fig. 3-5 is please referred to, the transfer assembly of the present embodiment includes third pedestal, lead screw, third straight line mover, electricity
Machine, shaft coupling, backplate, substrate support plate, transfer assembly support plate.Lead screw, third straight line mover, motor, common group of shaft coupling
At ball-screw, third straight line mover, that is, ball-screw mover.Ball-screw is installed on third pedestal, the installation of third pedestal
In in transfer assembly support plate, to be at suitable height.Substrate support plate is installed on third straight line mover, substrate branch
Fagging is equipped with the opening in the first reaction zone of direction direction, and the width of the opening is greater than the first vacuum chuck and the second vacuum
The width of sucker has the spacing zone of a recess less than the width of substrate around opening, for placing substrate and limiting substrate
Position；Wherein, substrate support plate is set between the first access position and the second access position, and third straight line mover drives substrate support
Plate moves back and forth between the first access position and the second access position.On the one hand backplate is used for Auxiliary support substrate support plate,
On the other hand play the role of protecting lead screw.In the present embodiment, the elemental height of the first vacuum chuck and the second vacuum chuck
It is below substrate support plate.The distance of first reaction zone and second reaction zone is 400mm, and the size of heater is also 400mm, can
To be preheated in substrate transfer overall process to substrate, substrate is reduced in the heating time of conversion zone, is further increased thin
The reaction efficiency of film deposition.
Please refer to Fig. 1,3,6, the heating component of the present embodiment include: heater, heater support frame, the first thermal insulation board,
Second thermal insulation board, third thermal insulation board.Heater is installed on heater support frame, and is located at the first reaction zone and second reaction zone
Between；The height of heater is higher than the height of substrate support plate.First thermal insulation board and the second thermal insulation board are oppositely arranged, and height is low
Vertical range between substrate support plate, substrate support plate and the first thermal insulation board, the second thermal insulation board allows the first vacuum chuck
It is passed freely through with the second vacuum chuck；Horizontal distance between first thermal insulation board, the second thermal insulation board allow first pick and place component and
Second pick-and-place component passes freely through；Third thermal insulation board is located at transfer assembly side, and sets towards the heating interval below heater
It sets.
Fig. 6 is please referred to, in the present embodiment, heater, the first thermal insulation board, the second thermal insulation board, third thermal insulation board enclose jointly
At a heating space.On the one hand, open heating, the scheme energy of this implementation are directly carried out compared to using only a heater
It is enough to concentrate on the heat radiation of heater in one lesser space, improve heat utilization rate；On the other hand, it can prevent from radiating
Thermogenetic high-temperature damage cylinder and transfer assembly, improve the service life of device.Due to the first thermal insulation board and the second thermal insulation board
Between there are spacing, the first cylinder thermal insulation board is set and the second cylinder thermal insulation board is further heat-insulated, it is ensured that cylinder will not be because of heating
Device temperature is excessively high and damages.
In the following, introducing the working principle of the invention and the course of work:
During entire film deposition reaction, the first conversion zone and second reaction zone are located at transfer assembly two
End, due to having a certain distance between the first conversion zone second reaction zone, it is therefore desirable to substrate support it is onboard substrate turn
Move certain distance.Linear motor is the first straight line mover moved in the first conversion zone respectively, second there are two mover
The second straight line mover moved in conversion zone drives substrate in corresponding reaction zone by the vacuum chuck of each self installation
Movement carries out deposition reaction.In carrying out atomic layer deposition reaction process, the first vacuum chuck, the second vacuum chuck keep inhaling
Attached power, prevents substrate from falling.In the present embodiment, when carrying out deposition reaction, the telescopic rod of cylinder is in contraction state.Linear motor
On first straight line mover substrate carried by the first vacuum chuck moved back and forth in the first reaction zone and carry out film preparation, when the
After deposition process in one reaction zone, need substrate by being transferred to second on the first vacuum chuck of the first conversion zone
On second vacuum chuck of conversion zone.
The above-mentioned course of work can substantially be divided into five steps, and 7 (a)~7 (e) are situated between to each step with reference to the accompanying drawing
It continues, for convenient for the course of work is presented, attached drawing 7 (a)~7 (e) omit most of components and simplified to each component.
When initial shown in state such as Fig. 7 (a) of each components, firstly, the telescopic rod of the first cylinder is in contraction state,
The starting of first vacuum chuck, absorption substrate prevent it from falling, and drive substrate to exist under the effect (not shown) of first straight line mover
First conversion zone moves back and forth.It is taken at this point, substrate support plate is driven by ball-screw to close to the first of the first conversion zone
It puts region and stops and await orders, and plane locating for substrate is lower than plane locating for substrate support plate.To the heavy of the first reaction zone
After reaction, first straight line mover drives the first cylinder to carry substrate and moves to the right product, when substrate motion to substrate support
On the left of plate enough apart from when (this distance can guarantee that substrate does not occur dry with substrate support plate when the telescopic rod elongation of the first cylinder
Relate to), substrate is then jacked up, is higher than plane locating for substrate locating for substrate support plate by the telescopic rod elongation of the first cylinder
Plane.
Then, first straight line mover continues that the first cylinder is driven to carry substrate and move to the right, and in substrate support plate
Surface stops, and then the telescopic rod of the first cylinder is shunk, and the first vacuum chuck discharges substrate, and substrate is put into spacing zone (not
Diagram).Meanwhile second cylinder be located at right side close to second reaction zone second pick-and-place region awaiting orders, the second cylinder is stretched
Contracting bar is in contraction state, makes the second vacuum chuck lower than substrate support plate.At this time shown in the state of each components such as Fig. 7 (b).
Next, lead screw drives third straight line mover to drive substrate support plate as shown in Fig. 7 (c), carries substrate and transport to the right
It moves to the second pick-and-place region and stops, be located at substrate right above the second vacuum chuck.
Then, the telescopic rod elongation of the second cylinder, substrate is jacked up, and the starting of the second vacuum chuck adsorbs substrate to prevent
It falls；Then, second straight line mover drives the second cylinder to carry substrate and is moved to the left distance enough (this distance can guarantee the
Substrate is not interfered with substrate support plate when the telescopic rod of two cylinders is shunk), the telescopic rod of the second cylinder is shunk, and makes substrate height
Degree is lower than substrate support plate, at this time shown in the state of each components such as Fig. 7 (d).
It moves right finally, second straight line mover drives the second cylinder to carry substrate, substrate is sent into second reaction zone,
And moved back and forth in second reaction zone, carry out second of deposition reaction.At this time shown in the state of each components such as Fig. 7 (e).
It, then can be by if necessary to successively carrying out Multiple depositions reaction between the first conversion zone and second reaction zone
It is suitable according to Fig. 7 (a) → 7 (b) → 7 (c) → 7 (d) → 7 (e) → 7 (d) → 7 (c) → 7 (b) → 7 (a) → 7 (b) → 7 (c) ...
Sequence operates repeatedly, and repeatedly depositing repeatedly for automation can be realized.
If whole deposition reactions terminate in the first conversion zone, substrate can be transported back to the position of Fig. 7 (a), make substrate
The first conversion zone is left to remove again later.If whole deposition reactions terminate in second reaction zone, substrate can both be transported
The position for returning Fig. 7 (a) is removed again after so that substrate is left the first conversion zone, can also be by the movement model of second straight line mover
It encloses and is set as to exceed except second reaction zone to the right, with after the deposition reaction of second reaction zone, second is straight
Line mover continues to move right, and so that substrate is left second reaction zone, conveniently removes.
In above-mentioned reaction process, when the first cylinder, the second cylinder are by below heater, since the first cylinder is heat-insulated
Plate can block completely the first cylinder, i.e. the lateral dimension of the first cylinder thermal insulation board lateral dimension that is greater than the first cylinder, and the
One cylinder thermal insulation board can stop the heat of heater, prevent the first cylinder from crossing cause thermal damage, improve the service life of device.At this
In embodiment, when carrying out deposition reaction, the height of substrate is lower than the height of substrate support plate, is stretched with reducing cylinder in fetching process
The times of exercise of contracting bar, further increases efficiency.
It, can be first using the present apparatus since having heaters is arranged between the first conversion zone and second reaction zone
Substrate is preheated while transfer substrates between conversion zone and second reaction zone.
(not shown) in other embodiments, linear motor and ball-screw are replaced by the linear motion of other forms
Mechanism further increases the substitutability of components.For example, first picks and places in component, first straight line mover can be ball wire
The mover of bumper structure, track can correspond to and change lead screw into；In transfer assembly, third straight line mover can be the dynamic of linear motor
Son, lead screw can correspond to and change track into；Above-mentioned straight line mover, which can also be, to be mounted on conveyer chain, can be done with conveyer chain past
The component of linear motion.As long as to sum up, be able to drive the first cylinder, the second cylinder does the component of straight reciprocating motion,
It is properly termed as straight line mover, is not limited by the specific embodiment of the invention.
(not shown) in other embodiments, first straight line mover and second straight line mover can not also share track；Such as
Fruit first straight line mover and second straight line mover are all the movers of ball screw arrangement, then do not share lead screw.
(not shown) in other embodiments, first straight line mover, second straight line mover the direction of motion can also be vertical
In the direction of motion or any other angle of third straight line mover, as long as area can be picked and placed in the first conversion zone and first
Between domain and second reaction zone and second picks and places transport substrate between region.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (6)
1. a kind of substrate picks and places and transfer device, pick-and-place and transfer substrates between the first reaction zone and second reaction zone are used for,
It is characterised by comprising: first picks and places component, the second pick-and-place component and transfer assembly；
First pick-and-place component includes first straight line mover, the first cylinder, the first vacuum chuck；First straight line mover is horizontal positioned,
First cylinder is vertically arranged on first straight line mover；First vacuum chuck is mounted at the top of the telescopic rod of the first cylinder；Wherein,
First straight line mover drives the first vacuum chuck by the first cylinder, successively picks and places in initial position, the first response location, first
It is moved back and forth between position, the corresponding first reaction zone setting of the first response location；
Second pick-and-place component includes second straight line mover, the second mounting base, the second cylinder, the second vacuum chuck；Second straight line is dynamic
Son is horizontal positioned, and the second mounting base is installed on second straight line mover, and the second cylinder is vertically arranged in the second mounting base；Second
Vacuum chuck is mounted at the top of the telescopic rod of the second cylinder；Wherein, second straight line mover drives the second vacuum by the second cylinder
Sucker successively moves back and forth between the second access position, the second response location, and the second response location corresponds to second reaction zone and sets
It sets；
Transfer assembly includes third straight line mover, substrate support plate；Substrate support plate is installed on third straight line mover, substrate branch
Fagging is equipped with the opening in the first reaction zone of direction direction, and the width of the opening is greater than the first vacuum chuck and the second vacuum
The width of sucker, less than the width of substrate；Wherein, substrate support plate is set between the first access position and the second access position,
Third straight line mover drives substrate support plate to move back and forth between the first access position and the second access position.
2. a kind of substrate as described in claim 1 picks and places and transfer device, which is characterized in that including heating component, heating group
Part includes heater, heater support frame；Heater is installed on heater support frame, and is located at the first reaction zone and second instead
It answers between area；The height of heater is higher than the height of substrate support plate.
3. a kind of substrate as claimed in claim 2 picks and places and transfer device, which is characterized in that heating component further include: first
Thermal insulation board, the second thermal insulation board, third thermal insulation board；First thermal insulation board and the second thermal insulation board are oppositely arranged, and height is lower than substrate branch
Fagging, the vertical range between substrate support plate and the first thermal insulation board, the second thermal insulation board allow the first vacuum chuck and second very
Suction disk passes freely through；Horizontal distance between first thermal insulation board, the second thermal insulation board allows first to pick and place component and the second pick-and-place
Component passes freely through；Third thermal insulation board is located at transfer assembly side, and is arranged towards the heating interval below heater.
4. a kind of substrate pick-and-place and transfer device as claimed in claim 2 or claim 3, which is characterized in that first, which picks and places component, includes
First cylinder thermal insulation board, the first cylinder thermal insulation board are set at the top of the telescopic rod of the first cylinder, and the first vacuum chuck is mounted on the
On one cylinder thermal insulation board；Second, which picks and places component, includes the second cylinder thermal insulation board, and the second cylinder thermal insulation board is set to the second cylinder
At the top of telescopic rod, the second vacuum chuck is mounted on the second cylinder thermal insulation board.
5. a kind of substrate as claimed in claim 4 picks and places and transfer device, which is characterized in that including line slide rail component, directly
Line slide track component includes the linear guide that the first sliding block, the second sliding block and the first sliding block and the second sliding block share；First picks and places
Component includes the first pedestal, and the first pedestal is installed on first straight line mover and the first sliding block, and the first cylinder is installed on the first base
On seat；Second, which picks and places component, includes the second pedestal, and the second pedestal is installed on second straight line mover and the second sliding block, the second cylinder
It is installed on the second pedestal.
6. a kind of substrate as claimed in any one of claims 1-3 picks and places and transfer device, which is characterized in that sliding including straight line
Rail assembly, line slide rail component are led including the shared straight line of the first sliding block, the second sliding block and the first sliding block and the second sliding block
Rail；First, which picks and places component, includes the first pedestal, and the first pedestal is installed on first straight line mover and the first sliding block, the first cylinder peace
Loaded on the first pedestal；Second, which picks and places component, includes the second pedestal, and the second pedestal is installed on second straight line mover and the second sliding block
On, the second cylinder is installed on the second pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710311755.7A CN107017193B (en) | 2017-05-05 | 2017-05-05 | A kind of substrate picks and places and transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710311755.7A CN107017193B (en) | 2017-05-05 | 2017-05-05 | A kind of substrate picks and places and transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107017193A CN107017193A (en) | 2017-08-04 |
| CN107017193B true CN107017193B (en) | 2019-08-20 |
Family
ID=59450590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710311755.7A Active CN107017193B (en) | 2017-05-05 | 2017-05-05 | A kind of substrate picks and places and transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107017193B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681466A (en) * | 2013-11-29 | 2015-06-03 | 株式会社日立国际电气 | Substrate Processing Apparatus, Method Of Manufacturing Semiconductor Device |
| CN105552010A (en) * | 2015-12-11 | 2016-05-04 | 中国电子科技集团公司第四十八研究所 | Substrate conveying system for silicon epitaxial growth |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070116872A1 (en) * | 2005-11-18 | 2007-05-24 | Tokyo Electron Limited | Apparatus for thermal and plasma enhanced vapor deposition and method of operating |
| US20070116888A1 (en) * | 2005-11-18 | 2007-05-24 | Tokyo Electron Limited | Method and system for performing different deposition processes within a single chamber |
-
2017
- 2017-05-05 CN CN201710311755.7A patent/CN107017193B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681466A (en) * | 2013-11-29 | 2015-06-03 | 株式会社日立国际电气 | Substrate Processing Apparatus, Method Of Manufacturing Semiconductor Device |
| CN105552010A (en) * | 2015-12-11 | 2016-05-04 | 中国电子科技集团公司第四十八研究所 | Substrate conveying system for silicon epitaxial growth |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107017193A (en) | 2017-08-04 |
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