CN107000422A - Conducting film and conducting film cutter head - Google Patents

Conducting film and conducting film cutter head Download PDF

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Publication number
CN107000422A
CN107000422A CN201580065932.7A CN201580065932A CN107000422A CN 107000422 A CN107000422 A CN 107000422A CN 201580065932 A CN201580065932 A CN 201580065932A CN 107000422 A CN107000422 A CN 107000422A
Authority
CN
China
Prior art keywords
conducting film
knife face
cutter head
cut
blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201580065932.7A
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Chinese (zh)
Inventor
宫许彪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of CN107000422A publication Critical patent/CN107000422A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports

Abstract

A kind of conducting film (10), including resin bed (11) and scattering device multiple conducting particles (13) in the resin bed (11), conducting film (10) includes the first surface (111) and second surface (113) being disposed opposite to each other, first surface (111) is planar structure, the direction that second surface (113) is directed away from first surface is uniformly raised, the thickness of conducting film (10) is gradually reduced from by second surface (113) center and perpendicular to the transversal both sides towards parallel to cross section of first surface (111), conducting particles (13) is used to form conductive path on the thickness direction of conducting film (10).Conducting film can prevent component attach process there is bubble and cause component be electrically connected with sexual abnormality the problem of so that lifted component connection reliability and stability.

Description

Conducting film and conducting film cutter head Technical field
The present invention relates to electronic equipment manufacturing field, more particularly to a kind of conducting film and conducting film cutter head.
Background technology
Anisotropic conductive film (Anisotropic Conductive Film, ACF) because of it after hot-pressing, it is conductive along film thickness direction, and along film surface direction insulate the characteristics of, be widely used in electronic equipment manufacturing field.In the electronic equipments such as smart mobile phone, tablet personal computer, notebook computer, the performance and Consumer's Experience of whole electronic equipment are related to as the LCDs of man-machine interaction window or the performance of touching display screen and stability.At present, in the LCDs or touching display screen module of electronic equipment, driving element is mostly to realize to be electrically connected with by ACF for transmitting between the FPC of data and display base plate, ACF connects driving element and substrate electrode between the two using conducting particles and forms conductive path, conducting short circuit between adjacent two electrode is avoided that again simultaneously, so as to reach the effect only turned in a direction perpendicular to the substrate.When being attached applied to driving element, the ACF of whole shaping is first generally cut into strips of conductive film and web-like is accommodated, when in use, the anisotropic conductive film of strip is cut into the section shape conducting film suitable with driving element size by cutter head, and by thermal head by section shape conducting film hot pressing to display base plate, and then attach driving element on described section of shape conducting film.But, because section shape conducting film is usually 2.0mm*20um*2cm film-form, when it is attached on the display base plate of plane, if the two ends of section shape conducting film first contact display base plate compared to center section, then being easily caused the air of center section can not exclude completely, so as to form bubble between conducting film and substrate, it is abnormal that the bubble causes corresponding driving element to be electrically connected with when product is used because of expanded by heating, and then influences the reliability and stability of product.
The content of the invention
Technical problem to be solved of the embodiment of the present invention is there is provided a kind of conducting film, to solve to cause the problem of component is electrically connected with abnormal because there is bubble during conducting film attaching in the prior art, so as to lift the reliability and stability of component connection.In addition, the present invention also provides a kind of conducting film cutter head.
First aspect there is provided a kind of conducting film, including resin bed and scattering device it is many in the resin bed Individual conducting particles, the conducting film includes the first surface and second surface being disposed opposite to each other, the first surface is planar structure, the direction that the second surface is directed away from the first surface is uniformly raised, the thickness of the conducting film is gradually reduced from by the second surface center and perpendicular to the transversal of the first surface towards the both sides parallel to the cross section, and the conducting particles is used to form conductive path on the thickness direction of the conducting film.
With reference to first aspect, in the first possible implementation, the conducting film is strip form film structure, the second surface is arc, and the thickness of the conducting film is coplanar and be gradually reduced perpendicular to the transversal of the first surface towards the both sides parallel to the cross section from the center line with the second surface along the conducting film length direction.
With reference to the first possible implementation of first aspect, in second of possible implementation, the second surface includes the first cambered surface and the second cambered surface, the direction that first cambered surface and the second cambered surface are directed away from the first surface is uniformly raised, and coplanar and symmetrical perpendicular to the cross section of the first surface relative to the center line with the second surface along the conducting film length direction.
With reference to first aspect, in the third possible implementation, the conducting film is strip form film structure, the second surface is wedge shape, and the thickness of the conducting film is coplanar and be gradually reduced perpendicular to the transversal of the first surface towards the both sides parallel to the cross section from the center line with the second surface along the conducting film length direction.
With reference to the third possible implementation of first aspect, in the 4th kind of possible implementation, the second surface includes the first wedge surface and the second wedge surface, and first wedge surface and the second wedge surface are coplanar relative to the center line with the second surface along the conducting film length direction and symmetrical perpendicular to the cross section of the first surface.
Second aspect, a kind of conducting film cutter head is provided, including the first knife face and the second knife face being symmetrically set, first knife face and the second knife face are concave structure, described first knife face one end and one end of second knife face are intersecting, and form the first blade in intersecting position, first blade is used to cut conducting film, first knife face and the second knife face are used for while first blade is cut, the conducting film is pressurizeed and heated by preset pressure and preset temperature, to form outwards uniform raised surface on the conducting film, the thickness of the conducting film towards both sides parallel to the cross section is gradually reduced from the center by the convex surfaces and perpendicular to the transversal of the surface opposite with the convex surfaces.
With reference to second aspect, in the first possible implementation, first knife face and the second knife face are equal For the globoidal structure of depression, one end of one end of first knife face and second knife face is intersected, and forms in intersection first blade.
With reference to second aspect, in second of possible implementation, first knife face and the second knife face respectively include one first cut surface and one second cut surface, first cut surface and the second cut surface are planar structure, the first cut surface and the second cut surface of first knife face are connected in obtuse angle, the first cut surface and the second cut surface of second knife face are connected in obtuse angle, one end of second cut surface of one end of the second cut surface of first knife face and second knife face is intersected, and forms in intersection first blade.
With reference to second of possible implementation of the first possible implementation or second aspect of second aspect, in the third possible implementation, an at least heating rod fixing hole is provided between first knife face and the second knife face, the fixing hole is used to fix heating rod, to be heated by the heating rod to the cutter head.
With reference to second aspect, in the 4th kind of possible implementation, the cutter head also includes end face, it is connected smoothly between the end face and first knife face and the second knife face, the end face includes center line, the cutter head forms the second blade in the centerline outwardly convex of the end face, and second blade intersects with first blade.
The conducting film is uniformly raised by the way that the second surface is provided towards into the direction away from the first surface, so that the thickness of the conducting film is gradually reduced from by the second surface center and perpendicular to the transversal of the first surface towards the both sides parallel to the cross section, so that the conducting film is when for component to be attached on substrate, gradually contacted from the center of the second surface to the both sides parallel to the cross section with the substrate, to discharge the air between the conducting film and the substrate, prevent from producing bubble between the conducting film and substrate during component is attached, and then lift the reliability and stability of component connection.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, the required accompanying drawing used in embodiment or description of the prior art will be briefly described below, apparently, drawings in the following description are only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the first structural representation for the conducting film that the present invention is provided；
Fig. 2 is schematic cross-section of the conducting film shown in Fig. 1 along A1-A2 directions；
Fig. 3 is second of structural representation of the conducting film that the present invention is provided；
Fig. 4 is schematic cross-section of the conducting film shown in Fig. 3 along B1-B2 directions；
Fig. 5 is the first structural representation for the conducting film cutter head that the present invention is provided；
Fig. 6 is schematic cross-section of the cutter head shown in Fig. 5 along C1-C2 directions；
Fig. 7 is second of structural representation of the conducting film cutter head that the present invention is provided；
Fig. 8 is schematic cross-section of the cutter head shown in Fig. 7 along D1-D2 directions；
Fig. 9 is the application scenarios schematic diagram of conducting film shown in Fig. 1.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made belongs to the scope of protection of the invention.
Fig. 1 is the first structural representation for the conducting film that the present invention is provided.
Referring to Fig. 1, first aspect of the embodiment of the present invention provides a kind of conducting film 10, it can apply in the electronic equipments such as smart mobile phone, tablet personal computer, notebook computer, to realize the electric connection between component and substrate.Wherein, the conducting film 10 is anisotropic conductive film, when the component is connected on the substrate by the conducting film 10, pass through the hot pressing function to the conducting film 10, the conducting film 10 is set to be upwardly formed conductive path perpendicular to the side of the substrate, and insulated on the direction parallel to the substrate, so as to realize the electric connection between the component and the substrate.
The conducting film 10 includes resin bed 11 and the multiple conducting particles 13 being arranged in the resin bed 11, the conducting film 10 includes the first surface 111 and second surface 113 being disposed opposite to each other, the first surface 111 is planar structure, the direction that the second surface 113 is directed away from the first surface 111 is uniformly raised, the thickness of the conducting film 10 to both sides parallel to the cross section 115 is gradually reduced from the center by the second surface 113 and perpendicular to the cross section 115 of the first surface 111, the conducting particles 13 is used to form conductive path on the thickness direction of the conducting film 10.
Wherein, the resin bed 11 is resin adhesive agent, and the conducting particles 13 is uniformly distributed in the resin bed 11, and is not in contact with each other.When the conducting film 10 is heated, the resin bed 11 is softened into Colloidal state.Now, if applying certain pressure to the conducting film 10, it may be such that the conducting particles 13 being distributed along the thickness direction of conducting film 10 is extruded, so as to form conductive path by the conducting particles 13 being extruded on the thickness direction of the conducting film 10, then due to the buffer action of the resin bed 11 on the direction vertical with the thickness direction, it is separate between the conducting particles 13, so as to keep insulation.Wherein, the direction that the first surface 111 perpendicular to the conducting film 10 is referred to along the thickness direction of conducting film 10.It is appreciated that, when in use, the conducting film 10 can be cut into by arbitrary shape, such as strip, section shape, circle, rectangle, rhombus according to the size of component, the second surface 113 can be cambered surface, wedge surface, hemisphere face, circular conical surface, rectangular pyramid face etc..
The conducting film 10 is strip form film structure, the second surface 113 is arc, and the thickness of the conducting film 10 is coplanar and be gradually reduced perpendicular to the cross section 115 of the first surface 111 to the both sides parallel to the cross section 115 from the center line with the second surface 113 along the length direction of conducting film 10.
Fig. 2 is schematic cross-section of the conducting film shown in Fig. 1 along A1-A2 directions.
Refer to Fig. 2, wherein, the second surface 113 includes the first cambered surface 1131 and the second cambered surface 1133, the direction that the cambered surface 1133 of first cambered surface 1131 and second is directed away from the first surface 111 is uniformly raised, and coplanar and symmetrical perpendicular to the cross section 115 of the first surface 111 relative to the center line with the second surface 113 along the length direction of conducting film 10.Wherein, the thickness of the conducting film 10 is maximum in the position (the intersecting position of the i.e. described cambered surface 1133 of first cambered surface 1131 and second) where the cross section 115, and is gradually reduced with the radian change of the cambered surface 1133 of the first cambered surface 1131 and second from the cross section 115 to the both sides parallel to the cross section 115.
Fig. 3 is second of structural representation of the conducting film that the present invention is provided.
Referring to Fig. 3, first aspect of the embodiment of the present invention also provides the conducting film 10 ' of another structure, it is differed only in conducting film 10 shown in Fig. 1, and the second surface 113 ' of the conducting film 10 ' is wedge shape.The thickness of the conducting film 10 ' is coplanar and be gradually reduced perpendicular to the cross section 115 ' of the first surface 111 ' to the both sides parallel to the cross section 115 ' from the center line with the second surface 113 ' along the length direction of conducting film 10 '.
Fig. 4 is schematic cross-section of the conducting film shown in Fig. 3 along B1-B2 directions.
Refer to Fig. 4, wherein, the second surface 113 ' includes the first wedge surface 1131 ' and the second wedge surface 1133 ', first wedge surface 1131 ' and the second wedge surface 1133 ' are planar structure, and relative to described coplanar with center line of the second surface 113 ' along the length direction of conducting film 10 ' and perpendicular to described first The cross section 115 ' on surface is symmetrical.Wherein, the thickness of the conducting film 10 ' is maximum in the position (the intersecting position of i.e. described first wedge surface 1131 ' and the second wedge surface 1133 ') where the cross section 115 ', and is gradually reduced with first wedge surface 1131 ' and the second wedge surface 1133 ' from the cross section 115 ' to the both sides parallel to the cross section 115 '.
Fig. 5 is the first structural representation for the conducting film cutter head that the present invention is provided.
Referring to Fig. 5, second aspect of the embodiment of the present invention provides a kind of conducting film cutter head 20, for the anisotropic conductive film of whole shaping to be cut into the conducting film with uniform convex surfaces.
The cutter head 20 includes the first knife face 21 and the second knife face 23 being symmetrically set, the knife face 23 of first knife face 21 and second is concave structure, described one end of first knife face 21 and one end of second knife face 23 are intersecting, and form the first blade 25 in intersecting position, first blade 25 is used to cut conducting film, the knife face 23 of first knife face 21 and second is used for while first blade 25 is cut, the conducting film is pressurizeed and heated by preset pressure and preset temperature, to form outwards uniform raised surface on the conducting film, the thickness of the conducting film towards both sides parallel to the cross section is gradually reduced from the center by the convex surfaces and perpendicular to the transversal of the surface opposite with the convex surfaces.Wherein, the concave structure refers to the surface being recessed to inner side that first knife face 21 and second knife face 23 are upwardly formed in the side parallel with first blade 25.Specifically, first knife face 21 is upwardly formed the surface being recessed towards the side of the second knife face 23 in the side parallel with first blade 25；Second knife face 23 is upwardly formed the surface being recessed towards the side of the first knife face 21 in the side parallel with first blade 25.It is appreciated that the conducting film 10, any one of 10 ' that the conducting film can provide for first aspect of the embodiment of the present invention.
Fig. 6 is schematic cross-section of the cutter head shown in Fig. 5 along C1-C2 directions.
Referring to Fig. 6, wherein, the knife face 23 of the first knife face 21 and second is the globoidal structure of depression, and one end of one end of first knife face 21 and second knife face 23 is intersected, and forms in intersection first blade 25.It is appreciated that it is identical with the structure of conducting film 10 shown in Fig. 1 that the conducting film formed is cut by cutter head 20 shown in Fig. 5.The radian that first knife face 21 is recessed and radian that first cambered surface 1131 is raised can be with identical, and the radian that second knife face 23 is recessed can be with identical with the radian of the projection of the second cambered surface 1133.
Be provided with an at least heating rod fixing hole 27 between the knife face 23 of first knife face 21 and second, the heating rod fixing hole 27 is used to fix heating rod (not shown), with by the heating rod to the cutting Cutter head 20 is heated.In the present embodiment, two heating rod fixing holes 27 are provided between the knife face 23 of the first knife face 21 and second, the heating rod fixing hole 27 is set along the direction parallel to first blade 25, and symmetrical relative to first blade 25.
It is appreciated that, the cutter head 20 also includes end face 29, it can be connected between the end face 29 and the knife face 23 of first knife face 21 and second by smooth cambered surface transition, the end face includes center line 291, the cutter head 20 second blade of outwardly convex formation at the center line 291 of the end face 29, second blade intersects with first blade 25.It is appreciated that second blade can be to intersect vertically with first blade 25, can also be intersecting by round-corner transition.When cutting conducting film using the cutter head 20, the conducting film is cut on the direction that the cutter head 20 advances by second blade first, with ensure the cutter head 20 cut the conducting film when with good by property, and then further cutting is complete by first blade 25, and pressurize and heat by 23 pairs of 21 and second knife face of the first knife face conducting film, to form outwards uniform raised surface on the conducting film.
Fig. 7 is second of structural representation of the conducting film cutter head that the present invention is provided；Fig. 8 is schematic cross-section of the cutter head shown in Fig. 7 along D1-D2 directions.
Also referring to Fig. 7 and Fig. 8, second aspect of the embodiment of the present invention also provides the cutter head 20 ' of another structure, and Fig. 8 show schematic cross-section of the cutter head 20 ' along D1-D2 directions.The cutter head 20 ' is differed only in cutter head 20 shown in Fig. 5, first knife face 21 ' of the cutter head 20 ' and the second knife face 23 ' respectively include one first cut surface 211, 231 and one second cut surface 213, 233, first cut surface 211, 231 and second cut surface 213, 233 be planar structure, the first cut surface 211 and the second cut surface 213 of first knife face 21 ' are connected in obtuse angle, the first cut surface 231 and the second cut surface 233 of second knife face 23 ' are connected in obtuse angle, one end of second cut surface 213 of first knife face 21 ' and one end of the second cut surface 233 of second knife face 23 ' are intersecting, and form the first blade 25 ' in intersection.It is appreciated that it is identical with the structure of conducting film 10 ' shown in Fig. 3 that the conducting film formed is cut by cutter head 20 ' shown in Fig. 7.The angle between angle and first wedge surface 1131 ' and the second wedge surface 1133 ' between first cut surface 211 of first knife face 21 ' and the first cut surface 231 of second knife face 23 ' is complementary in 360 degree, i.e., two angle sums are 360 degree.If for example, the angle between the first cut surface 211 of first knife face 21 ' and the first cut surface 231 of second knife face 23 ' is 240 degree, the angle between first wedge surface 1131 ' and the second wedge surface 1133 ' is 120 degree.
It is appreciated that, the cutter head 20 ' also includes end face 29 ', it can be connected between the end face 29 ' and first knife face 21 ' and the second knife face 23 ' by smooth cambered surface transition, the end face includes center line 291 ', the cutter head 20 ' forms the second blade in the place of the center line 291 ' outwardly convex of the end face 29 ', and second blade intersects with first blade 25 '.
Fig. 9 is the application scenarios schematic diagram of conducting film shown in Fig. 1.
Also referring to Fig. 1 and Fig. 9, first, the anisotropic conductive film 100 of whole shaping is cut into by strips of conductive film 10 by cutter head 20.Wherein, the strips of conductive film 10 is to have identical structure with conducting film 10 shown in Fig. 1, include resin bed 11 and the multiple conducting particles 13 being arranged in the resin bed 11, the conducting film 10 includes the first surface 111 and second surface 113 being disposed opposite to each other, the first surface 111 is planar structure, the direction that the second surface 113 is directed away from the first surface 111 is uniformly raised, the thickness of the conducting film 10 to both sides parallel to the cross section 115 is gradually reduced from the center by the second surface 113 and perpendicular to the cross section 115 of the first surface 111.Then, by cutter device 30 by the strips of conductive film 10 cut into component size identical section shape conducting film 10, and then described section of shape conducting film 10 is heated to by plastic state by thermal head 40, and be pressure bonded on substrate 50.Wherein, when described section of shape conducting film 10 is pressure bonded on substrate 50, the second surface 113 is gradually contacted and pressed with the substrate 50 towards the substrate 50, and from center line of the second surface 113 along the described section of length direction of shape conducting film 10 to the both sides parallel to the cross section 115.Finally, component (such as driving chip 51, FPC 53) is conformed on described section of shape conducting film 10, to make between the component and the substrate 50 to be electrically connected on the direction perpendicular to the substrate 50 by the conducting particles 13.
The conducting film is uniformly raised by the way that the second surface is provided towards into the direction away from the first surface, so that the thickness of the conducting film is gradually reduced from by the second surface center and perpendicular to the transversal of the first surface towards the both sides parallel to the cross section, so that the conducting film is when for component to be attached on substrate, gradually contacted from the center of the second surface to the both sides parallel to the cross section with the substrate, to discharge the air between the conducting film and the substrate, prevent from producing bubble between the conducting film and substrate during component is attached, and then lift the reliability and stability of component connection.
Above disclosed is only presently preferred embodiments of the present invention, the interest field of the present invention can not be limited with this certainly, one of ordinary skill in the art will appreciate that realizing all or part of stream of above-described embodiment Journey, and the equivalent variations made according to the claims in the present invention, still fall within and invent covered scope.

Claims (10)

  1. A kind of conducting film, it is characterized in that, including resin bed and scattering device multiple conducting particles in the resin bed, the conducting film includes the first surface and second surface being disposed opposite to each other, the first surface is planar structure, the direction that the second surface is directed away from the first surface is uniformly raised, the thickness of the conducting film is gradually reduced from by the second surface center and perpendicular to the transversal of the first surface towards the both sides parallel to the cross section, and the conducting particles is used to form conductive path on the thickness direction of the conducting film.
  2. Conducting film as claimed in claim 1, it is characterized in that, the conducting film is strip form film structure, the second surface is arc, and the thickness of the conducting film is coplanar and be gradually reduced perpendicular to the transversal of the first surface towards the both sides parallel to the cross section from the center line with the second surface along the conducting film length direction.
  3. Conducting film as claimed in claim 2, it is characterized in that, the second surface includes the first cambered surface and the second cambered surface, the direction that first cambered surface and the second cambered surface are directed away from the first surface is uniformly raised, and coplanar and symmetrical perpendicular to the cross section of the first surface relative to the center line with the second surface along the conducting film length direction.
  4. Conducting film as claimed in claim 1, it is characterized in that, the conducting film is strip form film structure, the second surface is wedge shape, and the thickness of the conducting film is coplanar and be gradually reduced perpendicular to the transversal of the first surface towards the both sides parallel to the cross section from the center line with the second surface along the conducting film length direction.
  5. Conducting film as claimed in claim 4, it is characterized in that, the second surface includes the first wedge surface and the second wedge surface, and first wedge surface and the second wedge surface are coplanar relative to the center line with the second surface along the conducting film length direction and symmetrical perpendicular to the cross section of the first surface.
  6. A kind of conducting film cutter head, it is characterised in that the cutter head includes being symmetrically set The first knife face and the second knife face, first knife face and the second knife face are concave structure, described first knife face one end and one end of second knife face are intersecting, and form the first blade in intersecting position, first blade is used to cut conducting film, first knife face and the second knife face are used for while first blade is cut, the conducting film is pressurizeed and heated by preset pressure and preset temperature, to form outwards uniform raised surface on the conducting film, the thickness of the conducting film towards both sides parallel to the cross section is gradually reduced from the center by the convex surfaces and perpendicular to the transversal of the surface opposite with the convex surfaces.
  7. Conducting film cutter head as claimed in claim 6, it is characterised in that first knife face and the second knife face are the globoidal structure of depression, one end of one end of first knife face and second knife face is intersected, and forms in intersection first blade.
  8. Conducting film cutter head as claimed in claim 6, it is characterized in that, first knife face and the second knife face respectively include one first cut surface and one second cut surface, first cut surface and the second cut surface are planar structure, the first cut surface and the second cut surface of first knife face are connected in obtuse angle, the first cut surface and the second cut surface of second knife face are connected in obtuse angle, one end of second cut surface of one end of the second cut surface of first knife face and second knife face is intersected, and forms in intersection first blade.
  9. Conducting film cutter head as claimed in claim 7 or 8, it is characterised in that an at least heating rod fixing hole is provided between first knife face and the second knife face, the fixing hole is used to fix heating rod, to be heated by the heating rod to the cutter head.
  10. Conducting film cutter head as claimed in claim 6, it is characterized in that, the cutter head also includes end face, it is connected smoothly between the end face and first knife face and the second knife face, the end face includes center line, the cutter head forms the second blade in the centerline outwardly convex of the end face, and second blade intersects with first blade.
CN201580065932.7A 2015-09-30 2015-09-30 Conducting film and conducting film cutter head Pending CN107000422A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/091213 WO2017054169A1 (en) 2015-09-30 2015-09-30 Electrically conductive film and cutting head therefor

Publications (1)

Publication Number Publication Date
CN107000422A true CN107000422A (en) 2017-08-01

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Application Number Title Priority Date Filing Date
CN201580065932.7A Pending CN107000422A (en) 2015-09-30 2015-09-30 Conducting film and conducting film cutter head

Country Status (2)

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CN (1) CN107000422A (en)
WO (1) WO2017054169A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733410A (en) * 1996-06-03 1998-03-31 Motorola, Inc. Labeling apparatus for applying labels with a rolling motion
JPH1140607A (en) * 1997-07-22 1999-02-12 Oki Electric Ind Co Ltd Manufacture of semiconductor device and sealing member
CN1869142A (en) * 2005-05-23 2006-11-29 蓝永辉 Adhesion method of hanging article adhesive band and base seat and adbesion device
CN101447243A (en) * 2007-11-30 2009-06-03 Tdk株式会社 Transparent conductive material and transparent conductor
CN203126092U (en) * 2013-01-04 2013-08-14 东莞市德派精密机械有限公司 Jointing mechanism

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733410A (en) * 1996-06-03 1998-03-31 Motorola, Inc. Labeling apparatus for applying labels with a rolling motion
JPH1140607A (en) * 1997-07-22 1999-02-12 Oki Electric Ind Co Ltd Manufacture of semiconductor device and sealing member
CN1869142A (en) * 2005-05-23 2006-11-29 蓝永辉 Adhesion method of hanging article adhesive band and base seat and adbesion device
CN101447243A (en) * 2007-11-30 2009-06-03 Tdk株式会社 Transparent conductive material and transparent conductor
CN203126092U (en) * 2013-01-04 2013-08-14 东莞市德派精密机械有限公司 Jointing mechanism

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Application publication date: 20170801