CN106997031A - A kind of sensor module and its method for packing - Google Patents
A kind of sensor module and its method for packing Download PDFInfo
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- CN106997031A CN106997031A CN201710351877.9A CN201710351877A CN106997031A CN 106997031 A CN106997031 A CN 106997031A CN 201710351877 A CN201710351877 A CN 201710351877A CN 106997031 A CN106997031 A CN 106997031A
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- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000012856 packing Methods 0.000 title claims abstract description 16
- 230000005291 magnetic effect Effects 0.000 claims description 30
- 230000015556 catabolic process Effects 0.000 claims description 27
- 241000218202 Coptis Species 0.000 claims description 17
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 17
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- 238000003466 welding Methods 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
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- 238000010586 diagram Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000012491 analyte Substances 0.000 description 1
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- 239000000178 monomer Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R33/00—Arrangements or instruments for measuring magnetic variables
- G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
- G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
- G01R33/09—Magnetoresistive devices
- G01R33/091—Constructional adaptation of the sensor to specific applications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N50/00—Galvanomagnetic devices
- H10N50/10—Magnetoresistive devices
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- Measuring Magnetic Variables (AREA)
Abstract
The invention discloses a kind of sensor module and method for packing, wherein, sensor module include base, be arranged on the polylith magnet of base front surface, be arranged on magnet surface TMR magnetoresistive chips, be arranged on the internal pads being connected above base with TMR magnetoresistive chips and be arranged on the external pads that the back side of base and internal pads are connected.By by magnet, it is arranged in base and then is packaged after the assembling of TMR magnetoresistive chips, multiple magnet, can be that independently power supply works independently between the sensor unit of TMR magnetoresistive chips composition, multigroup differential signal can be exported simultaneously, used cooperatively with corresponding gear, the zero signal of signal all the way therein as encoder can be exported, due to being that multiple sensor units are integrated in same base, so that the space taken reduces, be conducive to the layout of electrical part, if needed can be by will be cut between multiple sensor units, it is changed into multiple independent sensor units, adapt to the use environment of encoder.
Description
Technical field
The present invention relates to magnetoresistive chip technical field, more particularly to a kind of sensor module and its method for packing.
Background technology
Magnetic induction detection is main to utilize magnetoresistance principle, due to measuring component compared to contacts such as piezo-resistances,
Magnetic susceptibility sensor can be to being tested analyte detection, with susceptibility height, lossless decomposition, unwise to oil pollution environment without contact
Sense, is widely used in industrial production, velocity measuring, angle detection, position detection, current detecting in vehicle etc. also have
Extensive use.
The different principle produced according to magnetoresistance, is divided into anisotropic magnetoresistance (Anisotropic Magneto
Resistance, AMR), giant magnetoresistance effect (Giant Magneto Resistance, GMR), tunnel magneto-resistance effect (Tunnel
Magneto Resistance, TMR).
TMR (Tunnel MagnetoResistance) sensor chip, utilizes the tunnel magnetoelectricity of Researches for Magnetic Multilayer Films
Inhibition effect senses to magnetic field, has bigger resistance change rate than AMR chip and GMR chips, has relative to GMR chips
More preferable temperature stability, higher sensitivity, the broader range of linearity.
Magnetoresistive chip in existing market generally has two kinds.It is a kind of to be utilized in the mode cloth that chip back places magnet
Office, signal leading point is followed successively by magnetoresistive chip, carrying wiring board and the back of the body from top to bottom in chip both sides, similar sandwich structure
In magnet, the structure, magnetoresistive chip can only be placed in magnet middle, and the magnet volume of back magnetic is huge, cause after combination
Sensor bulk is big, and space-consuming is more, is unfavorable for subsequent product exploitation.And the magnetic field of magnet radiation will pass through middle line plate
Can just act on magnetoresistive chip, the magnetic field that chip is received is weakened, be also not sufficiently stable (magnetic field size with distance increase be in power
Index reduces), in magnetoresistive chip and during magnetic field combination, slightly deviation, the magnetic field that magnetoresistive chip is received will change, cause
Otherness.The uniformity of uncontrollable product during industrialization, is not suitable for being applied to precision instrument and equipment.
Another structure is drawn in rear end for magnetoresistive chip is placed directly against on magnet and ties up staple line, the institute of overall structure figure two
Show.Magnetoresistive chip is close to magnetic field surface, is subjected to uniform magnetic field, and magnet and chip are all in package casing, structure
It is compact, wide adaptability.But it uses GMR magnetoresistive chips, such layout of putting is for GMR chips, it is impossible to increase
The gap of large sensor and gear, that is, measurement distance, general measure gap is in 0.2mm or so, it is impossible to meet industrially
It is required that.
In summary, can only be to be internally integrated a magnetoresistive chip in encapsulation in existing GMR, TMR magnetoresistive chip, can only
Export one group of electric signal, it is impossible to the zero signal of output coder.Two same sensors will be used when in use.Increase
Cost occupies excessive space simultaneously, also, is unfavorable for the imposition layout of electrical part, and signal quality is unstable or measurement
Gap is small, is not suitable for industrial production.
The content of the invention
The present invention proposes a kind of sensor module and its method for packing so that sensor module is integrated with multiple sensors
Unit, easily realizes the zero signal of output coder.
In order to solve the above technical problems, the embodiments of the invention provide a kind of sensor module, including base, it is arranged on institute
The polylith magnet of stating base front surface, the TMR magnetoresistive chips for being arranged on the magnet surface, it is arranged on above the base and institute
State the internal pads of TMR magnetoresistive chips connection and be arranged on the outside weldering that the back side of the base and the internal pads are connected
Disk.
Wherein, in addition to the magnetoresistive chip homonymy antistatic breakdown device of the magnet surface is arranged on, it is described
Magnetoresistive chip is connected with the internal pads again after being connected by gold thread with the antistatic breakdown device.
Wherein, the front of the base be provided with for install the magnet and with the one-to-one groove of the magnet and
The isolated island of formation between the groove, the internal pads are arranged on the surface of the isolated island, magnet described in polylith with
And be arranged on isolated island internal pads corresponding with the magnetoresistive chip and be symmetrical arranged on the center line of the isolated island.
Wherein, the size and magnetic field intensity of magnet described in polylith are equal.
Wherein, the same pole of magnet described in polylith away from the base or is close to the base simultaneously.
Wherein, in addition to be arranged on the embedding glue-line of the base front surface, the embedding glue-line by the magnet, it is described in
Portion's pad, the TMR magnetoresistive chips, the antistatic breakdown device and gold thread covering.
Wherein, in addition to be detachably arranged at the positive and base of the base formation sealing space encapsulation outside
Shell.
Wherein, in addition to it is arranged on the back side of the base and is used to fix the anchor pad of the base.
In addition, the embodiment of the present invention additionally provides a kind of sensor module method for packing, including：
Step 1, polylith surface is provided with TMR magnetoresistive chips, the magnet of antistatic breakdown device is corresponded and is arranged on
Front is set in reeded base；
Step 2, the TMR magnetoresistive chips and the antistatic breakdown device are connected by gold thread and connects described anti-quiet
The internal pads of electrical breakdown device and the isolated island being arranged between the groove of the base；
Step 3, filling glue-line is set to the front of the base so that the filling glue-line by the magnet, it is described in
Portion's pad, the TMR magnetoresistive chips, the antistatic breakdown device and gold thread covering.
Wherein, the step 1, including:Magnet described in polylith and to be arranged on the isolated island corresponding with the magnetoresistive chip
Internal pads be symmetrical arranged on the center line of the isolated island.
Sensor module and its method for packing that the embodiment of the present invention is provided, compared with prior art, with following excellent
Point：
Sensor module provided in an embodiment of the present invention, including base, be arranged on the polylith magnet of the base front surface, set
Put the magnet surface TMR magnetoresistive chips, be arranged on the inside that is connected above the base with the TMR magnetoresistive chips
Pad and it is arranged on the external pads that the back side of the base is connected with the internal pads.
Sensor module method for packing provided in an embodiment of the present invention, including：
Step 1, polylith surface is provided with TMR magnetoresistive chips, the magnet of antistatic breakdown device is corresponded and is arranged on
Front is set in reeded base；
Step 2, the TMR magnetoresistive chips and the antistatic breakdown device are connected by gold thread and connects described anti-quiet
The internal pads of electrical breakdown device and the isolated island being arranged between the groove of the base；
Step 3, filling glue-line is set to the front of the base so that the filling glue-line by the magnet, it is described in
Portion's pad, the TMR magnetoresistive chips, the antistatic breakdown device and gold thread covering.
The sensor module and its method for packing, by will be arranged on after magnet, the assembling of TMR magnetoresistive chips in base so
After be packaged, each magnet is connected to form sensor unit with TMR magnetoresistive chips with being arranged on the internal pads of base, multiple
It can be that independently power supply works independently between magnet, the sensor unit of TMR magnetoresistive chips composition, can export multigroup simultaneously
Differential signal, is used cooperatively with corresponding gear, can export the zero signal of signal all the way therein as encoder.Due to
Multiple sensor units are integrated in same base so that the space of occupancy reduces, and is conducive to the layout of electrical part, if needed may be used
By will be cut between multiple sensor units, being changed into multiple independent sensor units, adapting to use and answering encoder
Use environment.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 is a kind of structural representation of embodiment of sensor module provided in an embodiment of the present invention；
Fig. 2 is a kind of positive structure schematic of embodiment of sensor module provided in an embodiment of the present invention；
Fig. 3 is a kind of structure schematic diagram of embodiment of sensor module provided in an embodiment of the present invention；
Fig. 4 for sensor module provided in an embodiment of the present invention a kind of embodiment in be cut into single sensing
The structural representation of device unit；
Fig. 5 is a kind of step flow of embodiment of sensor module method for packing provided in an embodiment of the present invention
Schematic diagram.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1~Fig. 5 is refer to, Fig. 1 is a kind of embodiment of sensor module provided in an embodiment of the present invention
Structural representation；Fig. 2 illustrates for a kind of Facad structure of embodiment of sensor module provided in an embodiment of the present invention
Figure；Fig. 3 is a kind of structure schematic diagram of embodiment of sensor module provided in an embodiment of the present invention；Fig. 4 is
The structure of single sensor unit is cut into a kind of embodiment of sensor module provided in an embodiment of the present invention
Schematic diagram；Fig. 5 is a kind of step flow of embodiment of sensor module method for packing provided in an embodiment of the present invention
Schematic diagram.
In a kind of embodiment, the sensor module, including base 10, to be arranged on the base 10 positive
Polylith magnet 20, the TMR magnetoresistive chips 30 for being arranged on the surface of magnet 20, be arranged on above the base 10 with it is described
Internal pads 60 that TMR magnetoresistive chips 30 are connected and be arranged on the back side of the base 10 and the internal pads 60 are connected outside
Portion's pad 70.
By being arranged in base 10 and then being packaged after assembling magnet 20, TMR magnetoresistive chips 30, each magnet 20
It is connected to form sensor unit with being arranged on the internal pads 60 of base 10 with TMR magnetoresistive chips 30, multiple magnet 20, TMR magnetic
It can be that independently power supply works independently between the sensor unit that resistance chip 30 is constituted, multigroup difference letter can be exported simultaneously
Number, use cooperatively, the zero signal of signal all the way therein as encoder can be exported with corresponding gear.Passed due to multiple
Sensor cell is integrated in same base so that the space of occupancy reduces, and is conducive to the layout of electrical part, can pass through if needed
It will be cut between multiple sensor units, be changed into multiple independent sensor units, adapt to the use environment of encoder.
Due to the small volume of sensor unit, sensitivity is very high, therefore is once environmental stimuli, and its corresponding speed is very
It hurry up, in order to reduce the detection inaccuracy that external interference is likely to result in, the sensor module also includes and the magnetoresistive chip
30 homonymies are arranged on the antistatic breakdown device 40 on the surface of magnet 20, and the magnetoresistive chip 30 is prevented by gold thread 50 with described
Electrostatic breakdown device 40 is connected with the internal pads 60 again after connecting.By setting antistatic breakdown device 40 so that make
During, the interference of the detection for the sensor that electrostatic interaction is caused can be removed, the accuracy of detection is improved.
Further to improve the integrated level of whole sensor module, volume is reduced, and for the ease of follow-up convenient by biography
Sensor module is divided into sensor unit one by one, the front of the base 10 be provided with for install the magnet 20 and with institute
The one-to-one groove of magnet 20 and the isolated island of the formation between the groove are stated, the internal pads 60 are arranged on described
The surface of isolated island, magnet 20 described in polylith and is arranged on isolated island internal pads 30 corresponding with the magnetoresistive chip 30 and closes
It is symmetrical arranged in the center line of the isolated island.
In actual applications, two sensors are integrated with a sensor module can complete the defeated of two groups of electric signals
Go out, used cooperatively with corresponding gear, the zero signal of signal all the way therein as encoder can be exported.
Therefore, in one embodiment of the invention, the quantity of the magnet 20 is two pieces, and the front of the base 10 is set
Being equipped with two is used to set the groove of the magnet 20 and the isolated island of the formation between two grooves, the internal welding
Disk 60 is arranged on the surface of the isolated island, two magnet 20 and to be arranged on the isolated island corresponding with the magnetoresistive chip 30
Internal pads 60 be symmetrical arranged on the center line of the isolated island.The region of acceptance of integrated two groups of magnetoresistive chips 30 in sensor module
Domain, two groups of magnetoresistive chips 30 are spaced a distance, every group of Magnetic Sensor one gear of correspondence, exportable 90 degree of 2 groups of differences
Cosine and sine signal.Because two groups of magnetoresistive chips 30 are powered respectively, the two is separate, can be changed into when necessary from centre cut-out
The sensor unit of the sine and cosine differential signal of two output, one group of 90 degree of difference.Signal is defeated after the processing of subsequent conditioning circuit
Go out.Due to the sine and cosine differential signal of integrated 90 degree of two groups of differences, encoder product can be met to scanning signal and reference signal
Demand, therefore, a sensor module can solve the problem of all signals are inputted so that product encapsulation small volume, and
Using highly sensitive TMR magnetoresistive chips 30, relative to conventional GMR chips, sensitivity is high, receives distance big.Achievable pair
The wide arc gap measurement of gear.
If only needing to the sine and cosine differential signal of one group of 90 degree of difference, the Magnetic Sensor of sensor module can be cut from centre
It is disconnected, as the sensor unit for including single TMR magnetoresistive chips 30, as shown in figure 4, in each sensor unit, equally including
Have and be provided with TMR magnetic resistance cores on magnet 20, the groove of installation magnet 20, the isolated island for setting internal pads 60, magnet 20
Piece 30, is arranged on the antistatic breakdown device 40 on the surface of magnet 20, and the magnetoresistive chip 30 is prevented by gold thread 50 with described
Electrostatic breakdown device 40 is connected with the internal pads 60 again after connecting, such structure design so that the sensing in the present invention
Device module, can both be used multiple sensor units are integrated, compare singly write a biography sensor using multiple in the prior art and
Speech, reduces volume, and due to Integrated manufacture, cost is reduced again, if necessary to use single sensor unit, it is necessary to edge
The center line for isolated island is cut, the sensor unit as single Dan Li as shown in Figure 4, is easy to extensive making, drop
Low cost.
In the present invention, it is not specifically limited for the spacing between the adjacent magnet 20, for the table of magnet 20
The magnetic field intensity in face is not specifically limited, and different spacing, the sensor module of magnetic field intensity can be designed according to requirements.
It is pointed out that the position during TMR magnetoresistive chips 30 are set in the present invention must be the magnetic pole of magnet 20, can
Think S poles or N i.e., performance can be different.
In the present invention, the magnetic field intensity of polylith magnet 20 be able to can also be differed with identical, but in view of may with
It is the sensor unit that performance is the same after cutting afterwards, requires that magnetic field intensity is identical in production process, for two pieces of bar shapeds
It is ferromagnetic to be also sized to ask identical.
And can be identical magnetic pole carton identical direction or not for the placement direction of polylith magnet 20
Same direction.As long as the spacing between polylith magnet 20 is remote enough, it can be placed with opposite polarity, but which adds whole
The volume of tactility apparatus module, therefore in order to reduce the volume of whole sensor as far as possible, the same pole of magnet 20 is same described in polylith
When away from the base 10 or be close to the base 10.I.e. multiple TMR magnetoresistive chips 30 are all the same N poles for being arranged on magnet 20
Or S poles.
And the height for multiple TMR magnetoresistive chips 30 relative to base 10, it be able to can also be differed with identical, but examine
Consider the requirement of the same monomer sensor unit of the performance after cutting and the quality for product, it is phase typically to require height
With.
The present invention is not specifically limited for the particular location that TMR magnetoresistive chips 30 are placed in magnet 20, in order to subtract as far as possible
Few occupancy to space, is not clashed, the center for being placed in magnet 20 of TMR magnetoresistive chips 30 with other devices.
Quantity such as TMR magnetoresistive chips 30 is two, and two TMR magnetoresistive chips 30 are without relative position relation.
And in order to which in use, gold thread 50 or TMR magnetoresistive chips 30 in sensor module etc. are difficult extraneous
Contact or be contaminated by dust, the sensor module also includes being arranged on the positive embedding glue-line of the base 10, the embedding
Glue-line is by the magnet 20, the internal pads 60, the TMR magnetoresistive chips 30, the antistatic breakdown device 40 and described
Gold thread 50 is covered.
It is pointed out that the present invention is not limited for the type, depositing operation mode and thickness of embedding glue-line.
And for the ease of transport, further sensor module formation is protected, the sensor module also includes detachable
It is arranged on the package casing of the positive and base 10 formation sealing space of the base 10.
The external pads 70 at the back side of sensor module in the present invention be with order to follow-up electrical part welding, this
Invention is not limited the position of external pads 70, due to sensor module be generally not in use be independently operated, and
It is to be used in combination with other devices, therefore generally requires and be integrated on other circuit boards, therefore welds for convenience,
The back side that the sensor module also includes being arranged on the base 10 is used for the anchor pad 80 for fixing the base 10.
The present invention is not limited for the position of anchor pad 80, but is distinguished for convenience with external pads 70, quickly
Recognize, typically the two is independently set.For example the cross section of base 10 is rectangle, and external pads 70 and anchor pad 80 are distinguished
Occupy two opposite side at the back side of base 10.
In one embodiment, the sensor module is made up of sandwich construction, and first layer is external pads 70, is mainly used
Welded in follow-up electrical part, pad is in bottom surface layer, and the outward flange of pad is in whole packaging appearance, the bottom surface of each pad area
And with it is gold-plated on the face of plane perpendicular.Internal pads 60 are placed on the middle isolated island part of whole base 10, two magnet 20
Isolated island both sides are symmetrically disposed at, in the same direction, TMR magnetoresistive chips 30 are close to the surface of magnet 20 to magnetic pole, relative to middle isolated island pair
Claim to place, have the device that antistatic punctures between TMR magnetoresistive chips 30 and internal pads 60, bound using gold thread 50, outermost one
Layer is casting glue, and whole devices are wrapped up.
In addition, the embodiment of the present invention additionally provides a kind of sensor module method for packing, as shown in figure 5, including：
Step 1, polylith surface is provided with TMR magnetoresistive chips, the magnet of antistatic breakdown device is arranged on positive setting
In reeded base；By setting groove, magnet is arranged in groove, the convenient fixation for magnet.
Step 2, the TMR magnetoresistive chips and the antistatic breakdown device are connected by gold thread and connects described anti-quiet
The internal pads of electrical breakdown device and the isolated island being arranged between the groove of the base；By being set on isolated island between the grooves
Internal pads are put, the electric signal of TMR magnetoresistive chips is exported by internal pads.
Step 3, filling glue-line is set to the front of the base so that the filling glue-line by the magnet, it is described in
Portion's pad, the TMR magnetoresistive chips, the antistatic breakdown device and gold thread covering, in order to TMR magnetoresistive chips and
Related device and Xining protection, by setting filling glue-line to realize, the thickness and technique of the invention for filling glue-line is not
Limit.
The region of acceptance of integrated multigroup magnetoresistive chip in sensor module in the present invention, magnetoresistive chip interval it is certain away from
From every group of Magnetic Sensor one gear of correspondence, the sine and cosine differential signal of exportable multigroup 90 degree of difference.Due to magnetoresistive chip point
It is not independently-powered, it can be changed into the sensor of the cosine and sine signal of one group of 90 degree of difference of multiple outputs from centre cut-out when necessary
Unit.Signal is exported after the processing of subsequent conditioning circuit.Due to the sine and cosine differential signal of integrated multigroup 90 degree of difference, it can meet
Encoder product is to scanning signal and the demand of reference signal, and a sensor module can solve asking for all signal inputs
Topic, the small volume of product encapsulation, and highly sensitive TMR magnetoresistive chips are used, relative to conventional GMR chips, sensitivity is high,
Receive distance big.It can be achieved to measure the wide arc gap of gear.
If only needing to the sine and cosine differential signal of one group of 90 degree of difference, the Magnetic Sensor of sensor module can be cut from centre
It is disconnected, as the sensor unit for including single TMR magnetoresistive chips, volume is both reduced, cost is reduced again.
And for convenience split sensor module, the step 1, including:Multiple magnet and it is arranged on
Isolated island internal pads corresponding with the magnetoresistive chip are symmetrical arranged on the center line of the isolated island, by by multiple sensings
Device unit is symmetrical arranged, it is only necessary to along middle wire cutting.
It is pointed out that the external pads of the sensor module in the present invention are also to have corresponding close with TMR magnetoresistive chips
System, the external pads and TMR magnetoresistive chips of same sensor are located at the homonymy of isolated island.
In summary, sensor module provided in an embodiment of the present invention and its method for packing, by by magnet, TMR magnetic resistance
It is arranged in base and then is packaged after chip assembling, each magnet and TMR magnetoresistive chips and the internal welding for being arranged on base
Disk connects to form sensor unit, can independently supply between multiple magnet, the sensor unit of TMR magnetoresistive chips composition
Electrically independent work, multigroup signal can be exported simultaneously and is used cooperatively with corresponding gear, can regard signal all the way therein as coding
The zero signal output of device.Because multiple sensor units are integrated in same base so that the space of occupancy reduces, and is conducive to electricity
The layout of device, can be changed into multiple independent sensors by will be cut between multiple sensor units if needed
Unit, adapts to the use environment of encoder.
Sensor module provided by the present invention and its method for packing are described in detail above.It is used herein
Specific case is set forth to the principle and embodiment of the present invention, and the explanation of above example is only intended to help and understands this
The method and its core concept of invention.It should be pointed out that for those skilled in the art, not departing from this hair
On the premise of bright principle, some improvement and modification can also be carried out to the present invention, these are improved and modification also falls into power of the present invention
In the protection domain that profit is required.
Claims (10)
1. a kind of sensor module, it is characterised in that including base, be arranged on the polylith magnet of the base front surface, be arranged on
The TMR magnetoresistive chips of the magnet surface, it is arranged on the internal pads being connected above the base with the TMR magnetoresistive chips
The external pads being connected with the back side for being arranged on the base with the internal pads.
2. sensor module as claimed in claim 1, it is characterised in that also described including being arranged on the magnetoresistive chip homonymy
The antistatic breakdown device of magnet surface, the magnetoresistive chip be connected by gold thread with the antistatic breakdown device after again with institute
State internal pads connection.
3. sensor module as claimed in claim 2, it is characterised in that the front of the base is provided with for installing the magnetic
Iron and with the one-to-one groove of the magnet and the isolated island of the formation between the groove, the internal pads are arranged on
The surface of the isolated island, magnet described in polylith and be arranged on isolated island internal pads corresponding with the magnetoresistive chip on
The center line of the isolated island is symmetrical arranged.
4. sensor module as claimed in claim 3, it is characterised in that the size and magnetic field intensity of magnet described in polylith are equal.
5. sensor module as claimed in claim 4, it is characterised in that the same pole of magnet described in polylith is simultaneously away from described
Base is close to the base.
6. sensor module as claimed in claim 5, it is characterised in that the also casting glue including being arranged on the base front surface
Layer, the embedding glue-line is by the magnet, the internal pads, the TMR magnetoresistive chips, the antistatic breakdown device and institute
State gold thread covering.
7. sensor module as claimed in claim 6, it is characterised in that also including be detachably arranged at the front of the base with
The package casing of the base formation sealing space.
8. sensor module as claimed in claim 7, it is characterised in that also be used to fix including being arranged on the back side of the base
The anchor pad of the base.
9. a kind of sensor module method for packing, it is characterised in that including：
Step 1, polylith surface is provided with TMR magnetoresistive chips, the magnet of antistatic breakdown device corresponds and is arranged on front
Set in reeded base；
Step 2, the TMR magnetoresistive chips and the antistatic breakdown device are connected and the antistatic is connected by gold thread and hit
Wear the internal pads of device and the isolated island being arranged between the groove of the base；
Step 3, filling glue-line is set to the front of the base so that the filling glue-line is by the magnet, the internal welding
Disk, the TMR magnetoresistive chips, the antistatic breakdown device and gold thread covering.
10. sensor module method for packing as claimed in claim 9, it is characterised in that the step 1, including:Magnetic described in polylith
Iron and it is arranged on isolated island internal pads corresponding with the magnetoresistive chip and is symmetrical arranged on the center line of the isolated island.
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| CN110007254A (en) * | 2017-11-27 | 2019-07-12 | Tdk株式会社 | The installation method of sensing system, sensor module and sensing system |
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| CN106997031B (en) | 2024-05-10 |
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