CN106993376A - A kind of water-cooled sealing surface mount elements mainboard maintenance tool - Google Patents
A kind of water-cooled sealing surface mount elements mainboard maintenance tool Download PDFInfo
- Publication number
- CN106993376A CN106993376A CN201710350198.XA CN201710350198A CN106993376A CN 106993376 A CN106993376 A CN 106993376A CN 201710350198 A CN201710350198 A CN 201710350198A CN 106993376 A CN106993376 A CN 106993376A
- Authority
- CN
- China
- Prior art keywords
- mainboard
- surface mount
- sealing surface
- mount elements
- maintenance tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 25
- 238000012423 maintenance Methods 0.000 title claims abstract description 19
- 239000000498 cooling water Substances 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 11
- 241001347978 Major minor Species 0.000 claims abstract description 10
- 230000008439 repair process Effects 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 238000004080 punching Methods 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910001335 Galvanized steel Inorganic materials 0.000 claims 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 2
- 239000008397 galvanized steel Substances 0.000 claims 2
- 239000010935 stainless steel Substances 0.000 claims 2
- 229910001220 stainless steel Inorganic materials 0.000 claims 2
- 239000004411 aluminium Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 238000003801 milling Methods 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229910000831 Steel Inorganic materials 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009835 boiling Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 235000021179 potluck Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a kind of water-cooled sealing surface mount elements mainboard maintenance tool, belong to a kind of maintenance tool.A kind of instrument that can cool in maintenance for sealing surface mount elements, it is characterized in that, described instrument includes a cooling water tank mono- and drives a pair of major-minor radiators of water pump or multipair major-minor radiator to carry out protection a pair of fast joint threeways of or multipair fast joint threeway to multiple sealing surface mount elements, the tool work flow is, cooling water in cooling water tank is by driving water pump to be sent to fast joint threeway, it is sent to the water inlet of major-minor radiator respectively afterwards, it is sent to the top that cooling water tank is returned to after fast joint threeway after circulation from the delivery port of major-minor radiator respectively, secondary radiator is provided with thermistor temperature sensor can monitor mainboard temperature in real time by interface connection electronic thermometer, because cooling water tank, which is transparent configuration, conveniently observation to drive pump working situation, make by tamper seal sticker piece element in less than 100 degrees Celsius of safe temperature.
Description
Technical field
The invention belongs to a kind of electronic circuit maintenance tool, specifically aim at mainboard and repair what is used with sealing surface mount elements
Instrument.
Background technology
Modern cell phones mainboard uses paster and sealing technology due to a large amount of, and causes Cellphone Repairs personnel to be torn open using hot blast
Welding stage faces great risk when changing band sealing surface mount elements ambient electron device.Present Cellphone Repairs personnel are to sealing paster member
The safeguard procedures of part are it to be covered with coin or radome or with adiabatic gum band and tinfoil, to stop hot blast sealing-off platform
Directly heat, but it is very fast using the mainboard heat conduction in dismounting operation of hot blast sealing-off platform, and the fusing point of low temperature scolding tin is 180 degree
High temperature scolding tin fusing point is 256 degree, once reaching or close to fusing point, heated sealing expansion is broken solder joint or printed line, surface mount elements
It can not just work.By virtue of experience it can only quickly carry out dismounting operation in short time big heat in this case.Such consequence
Be quality can not guaranteed efficiency it is more beneath because the anti-loaded hot blast that is added with nearly to be multiplied repeatedly, cause reparation customer's mobile phone to be got married
Normal potluck, repair rate is even more high.
The content of the invention
The present invention be directed to maintenance personal's problem encountered, so use main radiator cover sealing surface mount elements on every
Adiabatic wind sealing-off platform is directly heated, and major-minor radiator, which clamps mainboard, to be taken away mainboard in recirculated cooling water mode from tow sides and pass
The heat led makes sealing surface mount elements be maintained at less than 100 degrees Celsius (boiling point of water is 100 degrees Celsius).
The purpose of the present invention can be accomplished by the following way：One group of radiator (chief and vice two) multigroup can protect simultaneously
Multiple surface mount elements, the magnetic steel plate below strong magnet and secondary radiator pasted above main radiator is by mainboard from upper and lower surface
Very simple on workbench is arranged on after clamping convenient, contact surface can usually not add solid-state silicone grease, secondary radiator side is pacified
Dress thermistor temperature sensor connects electronic thermometer by interface can monitor mainboard temperature in real time.In maintenance sealing paster member
Magnet can will be pasted during part reverse side failure above the steel plate pasted below secondary radiator and support to be arranged on reference to rear dead spring
Used on workbench.
The present invention has the following advantages compared with the prior art：Effectively stop front heating, and the heat transfer of mainboard is rapid
Take away, user can be allowed to be preferably minimized risk is repaired.
Brief description of the drawings
Fig. 1 is the overall structure diagram of the embodiment of the present invention 1；
Fig. 2 is the cut-away view of the radiator of the embodiment of the present invention 2；
Cross section structure diagram when Fig. 3 works for the major-minor radiator of the embodiment of the present invention 3；
Fig. 4 is the supporting structure schematic diagram of the embodiment of the present invention 4；
Cross section structure diagram when Fig. 5 works for the secondary radiator combination support of the embodiment of the present invention 5；
Fig. 6 is installation thermistor temperature sensor structural representation on the secondary radiator of the embodiment of the present invention 6；
Fig. 7 is the common mainboard fixture in market
Embodiment
Embodiment 1, a kind of water-cooled sealing paster mainboard maintenance tool provided referring to Fig. 1, the present embodiment, main radiator
Paste strong magnet 2 and the mutually absorption of the lower magnetic steel plate 4 of secondary radiator 3 to reach the clamping to mainboard, positive secondary radiator in 1 top
Cooling water from cooling water tank 12 be sent to by flexible pipe 13 driving water pump 11 pressurize after be sent to by flexible pipe 15 after fast joint threeway 9
Main radiator 1 is sent to respectively through flexible pipe 5 and flexible pipe 7 is sent to secondary radiator 3, main radiator 1 after being circulated in major-minor radiator
Cooling water tank 12 is returned to by flexible pipe 6 and secondary radiator 3 by flexible pipe 14 after flexible pipe 8 is together sent to fast joint threeway 10 to push up
Portion forms circulation.
Embodiment 2, is the internal structure of major-minor radiator in embodiment 1, water inlet of the cooling water from radiator 1 referring to Fig. 2
From 16, dividing plate, breach enters between dividing plate 16 and dividing plate 17 in mouthfuls 19 left sides of dividing plate 16 entered in radiators 1, from dividing plate 17
Afterbody breach enters between dividing plate 17 and dividing plate 18, is flowed after entering the right side of dividing plate 18 from the head breach of dividing plate 18 from delivery port 20
Going out radiator 1 can make temperature uniform.
Embodiment 3, referring to Fig. 3, sectional view when this is main radiator 1 and the work of secondary radiator 2 utilizes 3 pairs of strong magnet
The gravitation of magnetic steel plate 4, the magnetic of the lower section of secondary radiator 2 for the another side of the absorption mainboard 21 of strong magnet 3 that the top of main radiator 1 is pasted
Steel plate 4 makes the secondary radiator 2 of 1 mainboard of main radiator 21 turn into stable one, then by mainboard 21 to be clamped to mainboard 21
It can be worked on Fig. 7 mainboard fixture 30.
Embodiment 4, referring to Fig. 4, magnet 23 has been pasted in the top of support 22, and four corners below secures four springs 24, composition
Stable pressure platform.
Embodiment 5, is the cross section structure diagram of secondary radiator 2 and the work in combination of support 22, secondary radiator 2 referring to Fig. 5
The absorption of magnet 23 above the magnetic steel plate 4 and support of lower section is integrally formed, and is against the mainboard folder that the lower section of mainboard 21 is arranged on Fig. 7
Tool 30 can work.
Embodiment 6, referring to Fig. 6, thermistor temp sensing is installed on the opposite of the delivery port 28 of water inlet 27 of secondary radiator 2
Device 26 is connected to electronic thermometer 29 by interface 25.
Claims (10)
1. the present invention is a kind of water-cooled sealing surface mount elements mainboard maintenance tool, including one group by two radiators of major-minor
Or multigroup radiator, one cooling water tank of a driving water pump, it is characterised in that major-minor radiator clamps mainboard flexible pipe and fast
Joint connects water pump and cooling water tank, and driving water pump driving cooling water is sent to positive secondary radiator and clamped mainboard is entered with reaching
Row cooling keeps it in less than 100 degrees Celsius of safe temperature, and secondary radiator side is provided with thermistor temperature sensor
Electronic thermometer is connected to by interface, to monitor mainboard temperature in real time, wherein secondary radiator can be against mainboard with holder combination
Protected when being repaired with facilitating to surface mount elements back-side circuit lower section.
2. water cooling sealing surface mount elements mainboard maintenance tool according to claim 1, it is characterised in that described main radiating
Stickup magnetic galvanized steel strap below strong magnet, secondary radiator is pasted above device to clamp mainboard to facilitate.
3. sealing surface mount elements mainboard maintenance tool according to claim 1, it is characterised in that described secondary radiator can
With holder combination using being protected in sealing paster back side repair circuit, support is by galvanized steel plain sheet or plastics and pastes thereon
The magnet composition of side, four corners below respectively installs a spring to ensure stability of the secondary radiator under mainboard.
4. sealing surface mount elements mainboard maintenance tool according to claim 1, positive secondary radiator can be welded with sheet copper
Form.
5. sealing surface mount elements mainboard maintenance tool according to claim 1, positive secondary radiator can use sheet copper punching press
Form.
6. sealing surface mount elements mainboard maintenance tool according to claim 1, positive secondary radiator can be used after aluminium sheet groove milling
Bonding or welding and.
7. sealing surface mount elements mainboard maintenance tool according to claim 1, positive secondary radiator can use stainless steel punching press
After bond or be welded.
8. sealing surface mount elements mainboard maintenance tool according to claim 1, positive secondary radiator can use sheet iron punching press
It is bonded after zinc-plated.
9. sealing surface mount elements mainboard maintenance tool according to claim 1, positive secondary radiator can be with stainless steel welded
Form.
10. thermistor temperature is installed in sealing surface mount elements mainboard maintenance tool according to claim 1, secondary radiator side
Degree sensor is connected to electronic thermometer to monitor mainboard temperature in real time by interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710350198.XA CN106993376A (en) | 2017-05-17 | 2017-05-17 | A kind of water-cooled sealing surface mount elements mainboard maintenance tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710350198.XA CN106993376A (en) | 2017-05-17 | 2017-05-17 | A kind of water-cooled sealing surface mount elements mainboard maintenance tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106993376A true CN106993376A (en) | 2017-07-28 |
Family
ID=59419495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710350198.XA Pending CN106993376A (en) | 2017-05-17 | 2017-05-17 | A kind of water-cooled sealing surface mount elements mainboard maintenance tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106993376A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN202506922U (en) * | 2012-03-14 | 2012-10-31 | 高波 | Multifunctional precise electronic welding table |
| CN203156723U (en) * | 2013-03-26 | 2013-08-28 | 佛山市顺德区顺达电脑厂有限公司 | Preheating maintaining platform |
| CN205003662U (en) * | 2015-09-23 | 2016-01-27 | 郑州工业应用技术学院 | Computer remote monitoring device |
| CN207460605U (en) * | 2017-05-17 | 2018-06-05 | 孙恒权 | A kind of water-cooled sealing surface mount elements mainboard maintenance tool |
-
2017
- 2017-05-17 CN CN201710350198.XA patent/CN106993376A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN202506922U (en) * | 2012-03-14 | 2012-10-31 | 高波 | Multifunctional precise electronic welding table |
| CN203156723U (en) * | 2013-03-26 | 2013-08-28 | 佛山市顺德区顺达电脑厂有限公司 | Preheating maintaining platform |
| CN205003662U (en) * | 2015-09-23 | 2016-01-27 | 郑州工业应用技术学院 | Computer remote monitoring device |
| CN207460605U (en) * | 2017-05-17 | 2018-06-05 | 孙恒权 | A kind of water-cooled sealing surface mount elements mainboard maintenance tool |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Sun Hengquan Document name: Notice of First Examination Opinion |
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| DD01 | Delivery of document by public notice | ||
| DD01 | Delivery of document by public notice |
Addressee: Sun Hengquan Document name: Deemed withdrawal notice |
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| DD01 | Delivery of document by public notice | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170728 |
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| WD01 | Invention patent application deemed withdrawn after publication |