CN106992242A - The encapsulating structure of UV LED chip - Google Patents
The encapsulating structure of UV LED chip Download PDFInfo
- Publication number
- CN106992242A CN106992242A CN201710117791.XA CN201710117791A CN106992242A CN 106992242 A CN106992242 A CN 106992242A CN 201710117791 A CN201710117791 A CN 201710117791A CN 106992242 A CN106992242 A CN 106992242A
- Authority
- CN
- China
- Prior art keywords
- parts
- insulating interlayer
- led chip
- heat conductive
- conductive insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011229 interlayer Substances 0.000 claims abstract description 26
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000004952 Polyamide Substances 0.000 claims abstract description 20
- 229920002647 polyamide Polymers 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 14
- -1 glycol stearate diester Chemical class 0.000 claims abstract description 13
- 150000005011 4-aminoquinolines Chemical class 0.000 claims abstract description 10
- 239000002202 Polyethylene glycol Substances 0.000 claims abstract description 10
- IGQLTMLBFFIKBR-UHFFFAOYSA-N SCO[Si](OC)(C)CCCO Chemical compound SCO[Si](OC)(C)CCCO IGQLTMLBFFIKBR-UHFFFAOYSA-N 0.000 claims abstract description 10
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003513 alkali Substances 0.000 claims abstract description 10
- BIOOACNPATUQFW-UHFFFAOYSA-N calcium;dioxido(dioxo)molybdenum Chemical compound [Ca+2].[O-][Mo]([O-])(=O)=O BIOOACNPATUQFW-UHFFFAOYSA-N 0.000 claims abstract description 10
- 150000002191 fatty alcohols Chemical class 0.000 claims abstract description 10
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims abstract description 10
- 229940100242 glycol stearate Drugs 0.000 claims abstract description 10
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 10
- 229920001223 polyethylene glycol Polymers 0.000 claims abstract description 10
- 229920002503 polyoxyethylene-polyoxypropylene Polymers 0.000 claims abstract description 10
- 229920002689 polyvinyl acetate Polymers 0.000 claims abstract description 10
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 10
- 239000011701 zinc Substances 0.000 claims abstract description 10
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims abstract description 7
- 229910000271 hectorite Inorganic materials 0.000 claims abstract description 7
- 229920003023 plastic Polymers 0.000 claims abstract description 7
- 239000004033 plastic Substances 0.000 claims abstract description 7
- 229910000349 titanium oxysulfate Inorganic materials 0.000 claims abstract description 7
- KEQFTVQCIQJIQW-UHFFFAOYSA-N N-Phenyl-2-naphthylamine Chemical class C=1C=C2C=CC=CC2=CC=1NC1=CC=CC=C1 KEQFTVQCIQJIQW-UHFFFAOYSA-N 0.000 claims description 9
- 210000002700 urine Anatomy 0.000 claims description 9
- 150000002170 ethers Chemical class 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 150000003467 sulfuric acid derivatives Chemical class 0.000 claims description 3
- 238000010292 electrical insulation Methods 0.000 abstract description 3
- 238000005457 optimization Methods 0.000 abstract description 3
- 230000032683 aging Effects 0.000 abstract description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical class CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 abstract 1
- 150000005002 naphthylamines Chemical class 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 239000011118 polyvinyl acetate Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 12
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 235000006708 antioxidants Nutrition 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004332 deodorization Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of encapsulating structure of UV LED chip, including：Metal substrate, anode terminal, cathode terminal, UV LED chip, heat conductive insulating interlayer, Plastic Division and lens section；The heat conductive insulating interlayer is composed of the following components：Polyamide, urinates aldehyde melmac, polyamide, magnesia, polyvinyl acetate, 4 aminoquinolines, hectorite, mercapto hydroxypropyl methyl dimethoxysilane, polyethylene glycol stearate diester, titanyl sulfate, alkali formula calcium molybdate zinc, the naphthylamines of N phenyl 2, N methyl pyrrolidones, Fatty alcohol polyoxyethylene polyoxypropylene ether.Rationally, using the heat conductive insulating interlayer Jing Guo special optimization, the electrical insulation capability of heat conductive insulating interlayer, heat conductivility, ageing-resistant performance are good, can put forward the performance of ultraviolet LED for encapsulating structure of the present invention.
Description
Technical field
The present invention relates to the encapsulating structure of UV LED chip.
Background technology
Ultraviolet LED refers generally to LED of the centre of luminescence wavelength in below 400nm, but when emission wavelength being more than into 380nm sometimes
Referred to as near ultraviolet LED, and it is referred to as deep ultraviolet LED when being shorter than 300nm.Because the bactericidal effect of short wavelength light is high, therefore ultraviolet LED
It is usually used in the purposes such as the sterilization and deodorization of refrigerator and household electrical appliances etc..
The performance of ultraviolet LED and the encapsulating structure of UV LED chip are closely bound up, particularly the radiating of UV LED chip
Performance, has been largely fixed the performance of ultraviolet LED.
The content of the invention
It is an object of the invention to provide a kind of encapsulating structure of UV LED chip, its encapsulating structure is reasonable, using process
The heat conductive insulating interlayer of special optimization, the electrical insulation capability of heat conductive insulating interlayer, heat conductivility, ageing-resistant performance are good, and heat conduction
Insulating interlayer also has heat-resisting, anti-oxidant, corrosion-resistant, fire-retardant performance, and good reliability can put forward the performance of ultraviolet LED.
To achieve the above object, the technical scheme is that designing a kind of encapsulating structure of UV LED chip, including：
Metal substrate, anode terminal and cathode terminal on metal substrate, be installed on metal substrate and by lead respectively with
Anode terminal and the UV LED chip of cathode terminal electrical connection, the heat conductive insulating folder between UV LED chip and metal substrate
Layer, on metal substrate and by UV LED chip and the Plastic Division of lead-in wire sealing, and protruded by Plastic Division central part
Lens section；
By weight, the heat conductive insulating interlayer is composed of the following components：
28~32 parts of polyamides,
27~31 parts of urine aldehyde melmacs,
4~8 parts of polyamide,
1~4 part of magnesia,
5~8 parts of polyvinyl acetates,
2~6 parts of 4- aminoquinolines,
1~3 part of hectorite,
7~9 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
6~8 parts of polyethylene glycol stearate diesters,
1~3 part of titanyl sulfate,
2~4 parts of alkali formula calcium molybdate zinc,
3~8 parts of N- phenyl-2-naphthylamines,
4~9 parts of 1-METHYLPYRROLIDONEs,
1~6 part of Fatty alcohol polyoxyethylene polyoxypropylene ether.
It is preferred that, the heat conductive insulating interlayer is composed of the following components：
28 parts of polyamides,
27 parts of urine aldehyde melmacs,
4 parts of polyamide,
1 part of magnesia,
5 parts of polyvinyl acetates,
2 parts of 4- aminoquinolines,
1 part of hectorite,
7 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
6 parts of polyethylene glycol stearate diesters,
1 part of titanyl sulfate,
2 parts of alkali formula calcium molybdate zinc,
3 parts of N- phenyl-2-naphthylamines,
4 parts of 1-METHYLPYRROLIDONEs,
1 part of Fatty alcohol polyoxyethylene polyoxypropylene ether.
It is preferred that, by weight, the heat conductive insulating interlayer is composed of the following components：
32 parts of polyamides,
31 parts of urine aldehyde melmacs,
8 parts of polyamide,
4 parts of magnesia,
8 parts of polyvinyl acetates,
6 parts of 4- aminoquinolines,
3 parts of hectorites,
9 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
8 parts of polyethylene glycol stearate diesters,
3 parts of titanyl sulfates,
4 parts of alkali formula calcium molybdate zinc,
8 parts of N- phenyl-2-naphthylamines,
9 parts of 1-METHYLPYRROLIDONEs,
6 parts of Fatty alcohol polyoxyethylene polyoxypropylene ethers.
The advantages of the present invention are：A kind of encapsulating structure of UV LED chip is provided, its encapsulating structure is closed
Reason, using the heat conductive insulating interlayer Jing Guo special optimization, the electrical insulation capability of heat conductive insulating interlayer, heat conductivility, resistance to ag(e)ing
Can be good, and heat conductive insulating interlayer also has heat-resisting, anti-oxidant, corrosion-resistant, fire-retardant performance, good reliability can carry ultraviolet LED
Performance.
The performance of heat conductive insulating interlayer be based on its material, and the performance of heat conductive insulating sandwich material be by its component and
What proportioning was determined, the present invention is specifically optimized to the component and proportioning of heat conductive insulating sandwich material, makes heat conductive insulating interlayer
Material has excellent heat conductivility, and heat conductive insulating sandwich material also has heat-resisting, anti-oxidant, corrosion-resistant, fire-retardant performance,
Good reliability, is highly suitable for UV LED chip.
The performance of heat conductive insulating sandwich material is determined by its component and proportioning, and the non-letter of determination of component and proportioning
Single ground " addition ", i.e., the performance of heat conductive insulating sandwich material can be drawn by not the performance of each component adding up one by one；Heat conduction
Different component in insulating interlayer material can influence each other, and such as fruit component and its proportioning be not mutually coordinated, and single component is brought
Beneficial effect, can be cut down by other components and even eliminate, when serious, different component is mutually contradicted, not have overall comprehensive
Cooperation is used, and produces negative interaction and substandard products.The present invention obtains heat conductive insulating interlayer material by a large amount of creative works, verify repeatedly
The optimal component and proportioning of material so that multiple components combine, mutually coordinated and produce positive comprehensive effect, finally make
Heat conductive insulating sandwich material has excellent heat conductivility, also further make heat conductive insulating sandwich material have it is heat-resisting, anti-oxidant,
Corrosion-resistant, fire resistance, heat conductive insulating interlayer good reliability, is highly suitable for UV LED chip.
Embodiment
With reference to embodiment, the embodiment to the present invention is further described.Following examples are only used for more
Plus technical scheme is clearly demonstrated, and can not be limited the scope of the invention with this.
The technical scheme that the present invention is embodied is：
Embodiment 1
A kind of encapsulating structure of UV LED chip, including：Metal substrate, anode terminal and cathode terminal on metal substrate
Son, the UV LED chip for being installed on metal substrate and being electrically connected respectively with anode terminal and cathode terminal by lead, is located at
Heat conductive insulating interlayer between UV LED chip and metal substrate, on metal substrate and by UV LED chip and lead-in wire sealing
Plastic Division, and the lens section protruded by Plastic Division central part；
By weight, the heat conductive insulating interlayer is composed of the following components：
28~32 parts of polyamides,
27~31 parts of urine aldehyde melmacs,
4~8 parts of polyamide,
1~4 part of magnesia,
5~8 parts of polyvinyl acetates,
2~6 parts of 4- aminoquinolines,
1~3 part of hectorite,
7~9 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
6~8 parts of polyethylene glycol stearate diesters,
1~3 part of titanyl sulfate,
2~4 parts of alkali formula calcium molybdate zinc,
3~8 parts of N- phenyl-2-naphthylamines,
4~9 parts of 1-METHYLPYRROLIDONEs,
1~6 part of Fatty alcohol polyoxyethylene polyoxypropylene ether.
Embodiment 2
On the basis of embodiment 1, difference is, the heat conductive insulating interlayer is composed of the following components：
28 parts of polyamides,
27 parts of urine aldehyde melmacs,
4 parts of polyamide,
1 part of magnesia,
5 parts of polyvinyl acetates,
2 parts of 4- aminoquinolines,
1 part of hectorite,
7 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
6 parts of polyethylene glycol stearate diesters,
1 part of titanyl sulfate,
2 parts of alkali formula calcium molybdate zinc,
3 parts of N- phenyl-2-naphthylamines,
4 parts of 1-METHYLPYRROLIDONEs,
1 part of Fatty alcohol polyoxyethylene polyoxypropylene ether.
Embodiment 3
On the basis of embodiment 1, difference is, by weight, and the heat conductive insulating interlayer is composed of the following components：
32 parts of polyamides,
31 parts of urine aldehyde melmacs,
8 parts of polyamide,
4 parts of magnesia,
8 parts of polyvinyl acetates,
6 parts of 4- aminoquinolines,
3 parts of hectorites,
9 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
8 parts of polyethylene glycol stearate diesters,
3 parts of titanyl sulfates,
4 parts of alkali formula calcium molybdate zinc,
8 parts of N- phenyl-2-naphthylamines,
9 parts of 1-METHYLPYRROLIDONEs,
6 parts of Fatty alcohol polyoxyethylene polyoxypropylene ethers.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvements and modifications can also be made, these improvements and modifications
Also it should be regarded as protection scope of the present invention.
Claims (3)
1. the encapsulating structure of UV LED chip, it is characterised in that including：Metal substrate, the anode terminal on metal substrate
And cathode terminal, the ultraviolet LED for being installed on metal substrate and being electrically connected respectively with anode terminal and cathode terminal by lead
Chip, the heat conductive insulating interlayer between UV LED chip and metal substrate, on metal substrate and by UV LED chip
With the Plastic Division of lead-in wire sealing, and the lens section protruded by Plastic Division central part；
By weight, the heat conductive insulating interlayer is composed of the following components：
28~32 parts of polyamides,
27~31 parts of urine aldehyde melmacs,
4~8 parts of polyamide,
1~4 part of magnesia,
5~8 parts of polyvinyl acetates,
2~6 parts of 4- aminoquinolines,
1~3 part of hectorite,
7~9 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
6~8 parts of polyethylene glycol stearate diesters,
1~3 part of titanyl sulfate,
2~4 parts of alkali formula calcium molybdate zinc,
3~8 parts of N- phenyl-2-naphthylamines,
4~9 parts of 1-METHYLPYRROLIDONEs,
1~6 part of Fatty alcohol polyoxyethylene polyoxypropylene ether.
2. the encapsulating structure of UV LED chip according to claim 1, it is characterised in that by weight, the heat conduction
Insulating interlayer is composed of the following components：
28 parts of polyamides,
27 parts of urine aldehyde melmacs,
4 parts of polyamide,
1 part of magnesia,
5 parts of polyvinyl acetates,
2 parts of 4- aminoquinolines,
1 part of hectorite,
7 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
6 parts of polyethylene glycol stearate diesters,
1 part of titanyl sulfate,
2 parts of alkali formula calcium molybdate zinc,
3 parts of N- phenyl-2-naphthylamines,
4 parts of 1-METHYLPYRROLIDONEs,
1 part of Fatty alcohol polyoxyethylene polyoxypropylene ether.
3. the encapsulating structure of UV LED chip according to claim 1, it is characterised in that by weight, the heat conduction
Insulating interlayer is composed of the following components：
32 parts of polyamides,
31 parts of urine aldehyde melmacs,
8 parts of polyamide,
4 parts of magnesia,
8 parts of polyvinyl acetates,
6 parts of 4- aminoquinolines,
3 parts of hectorites,
9 parts of mercapto hydroxypropyl methyl dimethoxysilanes,
8 parts of polyethylene glycol stearate diesters,
3 parts of titanyl sulfates,
4 parts of alkali formula calcium molybdate zinc,
8 parts of N- phenyl-2-naphthylamines,
9 parts of 1-METHYLPYRROLIDONEs,
6 parts of Fatty alcohol polyoxyethylene polyoxypropylene ethers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710117791.XA CN106992242A (en) | 2017-03-01 | 2017-03-01 | The encapsulating structure of UV LED chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710117791.XA CN106992242A (en) | 2017-03-01 | 2017-03-01 | The encapsulating structure of UV LED chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106992242A true CN106992242A (en) | 2017-07-28 |
Family
ID=59411724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710117791.XA Pending CN106992242A (en) | 2017-03-01 | 2017-03-01 | The encapsulating structure of UV LED chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106992242A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202308042U (en) * | 2011-10-22 | 2012-07-04 | 华南师范大学 | High heat dispersion packaging structure of power-type light-emitting diode (LED) |
| JP2015018829A (en) * | 2011-11-11 | 2015-01-29 | パナソニック株式会社 | Polymer structure material |
| CN105482741A (en) * | 2015-12-15 | 2016-04-13 | 苏州鑫德杰电子有限公司 | High strength heat dissipation binding material for electronic products and preparation method thereof |
| CN106103346A (en) * | 2014-03-14 | 2016-11-09 | 大日精化工业株式会社 | Heat conductivity composite oxides, its manufacture method, compositions containing heat conductivity composite oxides and its use |
| CN106317878A (en) * | 2016-08-17 | 2017-01-11 | 安徽福恩光电科技有限公司 | LED lamp cooling fin capable of facilitating cooling |
-
2017
- 2017-03-01 CN CN201710117791.XA patent/CN106992242A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202308042U (en) * | 2011-10-22 | 2012-07-04 | 华南师范大学 | High heat dispersion packaging structure of power-type light-emitting diode (LED) |
| JP2015018829A (en) * | 2011-11-11 | 2015-01-29 | パナソニック株式会社 | Polymer structure material |
| CN106103346A (en) * | 2014-03-14 | 2016-11-09 | 大日精化工业株式会社 | Heat conductivity composite oxides, its manufacture method, compositions containing heat conductivity composite oxides and its use |
| CN105482741A (en) * | 2015-12-15 | 2016-04-13 | 苏州鑫德杰电子有限公司 | High strength heat dissipation binding material for electronic products and preparation method thereof |
| CN106317878A (en) * | 2016-08-17 | 2017-01-11 | 安徽福恩光电科技有限公司 | LED lamp cooling fin capable of facilitating cooling |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104080300B (en) | A kind of moistureproof communication outdoor cabinet | |
| WO2011056324A3 (en) | Solid state emitter package including multiple emitters | |
| CN204230263U (en) | A kind of anti-PID crystal silicon solar battery component | |
| CN106992242A (en) | The encapsulating structure of UV LED chip | |
| CN201129904Y (en) | Electronic type refrigerator master control board box | |
| CN106085622A (en) | A kind of LED chip cleanout fluid | |
| CN104019291A (en) | Composite tube special for air conditioner and tube fitting of composite tube | |
| CN102070859A (en) | Poly vinyl chloride (PVC) processing molding composite heat stabilizer composition and preparation method thereof | |
| US10546986B2 (en) | Light-emitting device package and light-emitting apparatus comprising same | |
| CN205052327U (en) | Agricultural polyolefin changes light canopy membrane | |
| CN106987145A (en) | A kind of encapsulating structure of UV LED chip | |
| CN110408333A (en) | A kind of anti-line EVA adhesive film | |
| CN101546688A (en) | Fluorescent lamp for poultry and livestock cultivation | |
| CN106905902A (en) | A kind of ultraviolet LED module | |
| CN106876565A (en) | It is exclusively used in the encapsulating structure of UV LED chip | |
| CN205092992U (en) | Bottom plate and microwave oven | |
| CN201037634Y (en) | Energy-saving flush light panel | |
| CN107904031A (en) | A kind of LED panel cleaning solution | |
| CN203876313U (en) | Gluewater-free solar film | |
| CN106880851A (en) | Ultraviolet LED sterilizing unit | |
| CN209087622U (en) | A kind of power switch based on KNX bus | |
| CN204217291U (en) | A kind of traffic signaling equipment improved that dispels the heat | |
| CN103183867A (en) | Polyolefin moistureproof masterbatch and radiation crosslinking type heat shirnkable sleeving production technology | |
| CN208167086U (en) | A kind of Tin-zinc-aluminium capacitor metallized film evaporator | |
| CN106978109A (en) | A kind of ultraviolet LED sterilizing unit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170728 |