CN106969532A - Wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments - Google Patents
Wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments Download PDFInfo
- Publication number
- CN106969532A CN106969532A CN201710294681.0A CN201710294681A CN106969532A CN 106969532 A CN106969532 A CN 106969532A CN 201710294681 A CN201710294681 A CN 201710294681A CN 106969532 A CN106969532 A CN 106969532A
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- China
- Prior art keywords
- refrigerating medium
- temperature
- exchanging chamber
- paraffin
- heat exchanging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
- F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
Abstract
Wax phase change regenerator temperature adjusting means proposed by the present invention for semiconductor technology temperature controlling instruments, belong to temperature controlling instruments technical field, including multiple thermostat units shell and position in the inner, compressor air-discharging heat exchanging chamber is equipped between two neighboring thermostat unit and between thermostat unit and shell；Each thermostat unit the refrigerating medium heat exchanging chamber including middle part and the paraffin thermal positioned at its both sides；The upper and lower end of each paraffin thermal is connected by paraffin communicating pipe respectively, the two ends of each refrigerating medium heat exchanging chamber are equipped with refrigerating medium drain pipe, feed liquor interface tube respectively, and each compressor air-discharging heat exchanging chamber two ends are equipped with compressor air-discharging air inlet pipe, drain pipe interface respectively.Heat in compressor air-discharging used heat is stored in paraffin by the present apparatus, and paraffin realizes the heating temperature adjustment to refrigerating medium, make the more economical environmental protection and energy saving of temperature control device during phase transformation；Semiconductor enterprises can be reduced to attach troops to a unit the load of cooling-water machine, energy consumption is further reduced.
Description
Technical field
The invention belongs to temperature controlling instruments technical field, more particularly to a kind of paraffin phase for semiconductor technology temperature controlling instruments
Become regenerator temperature adjusting means, be related in more detail with compressor air-discharging used heat is utilized, by wax phase change accumulation of heat, to refrigerating
Agent carries out the device of temperature adjustment.
Background technology
In the production of semiconductor products process such as chip, wafer, liquid crystal panel, integrated circuit, semiconductor product life
Producing main process equipment has very harsh requirement to processing temperature.Main process equipment in semiconductor product process, it is necessary to
Constant environment temperature is maintained, if supporting temperature controlling instruments temperature fluctuation is excessive to will result in waste product and defect ware, causing need not
The economic waste wanted.The temperature controlling instruments temperature control capacity supporting to main process equipment of present main flow can reach warm under Light Condition
Degree fluctuation is no more than under ± 0.05 DEG C, band load state and is no more than ± 0.5 DEG C.Conventional temperature control method is indirect refrigeration system at present
System, be using temperature controlling instruments refrigeration system cooling refrigerating medium, then by electric heater carry out temperature adjustment, continuously to
Constant temperature refrigerating medium is supplied at main process equipment end, is carried out heat exchange by refrigerating medium and main process equipment heat exchange chamber, is maintained half
The temperature constant state of the main process equipment of conductor.
Current semicon industry is the equipment that main process equipment carries out temperature control, mainly using above-mentioned temperature control method.The temperature control
Structure and principle such as Fig. 1 of temperature controlling instruments used in mode, the temperature control working method of this kind equipment include refrigeration control working method
And refrigerating medium control working method, wherein：
During refrigeration control working method, the equipment is by compressor 1, condenser 2, electric expansion valve 3, evaporator 4, condenser
Water inlet pipe 8, leaving condenser water pipe 9, compressor exhaust pipe 10, condenser drain pipe 11, evaporator feed tube 12, compressor return air
The grade of pipe 13 part is constituted.Operation principle is described below：Compressor 1 is under motor driving by doing work the refrigerant of low-temp low-pressure
Steam is converted into the refrigerant gas of HTHP, and the exhaust of the HTHP of compressor 1 enters condensation by compressor exhaust pipe 10
In device 2, factory service water enters in condenser 2 via condenser water inlet pipe 8 carries out condensing heat-exchange to the exhaust of compressor 1, absorbs exhaust
Factory service water is delivered to factory service water cooling water dispenser by leaving condenser water pipe 9 and carries out cooling circulation after used heat；Condenser 2 steams high pressure-temperature
Vapour is condensed into the liquid refrigerant of HTHP, and entering electric expansion valve 3 via condenser drain pipe 11 carries out throttling cooling drop
Pressure；Low-temperature refrigerant liquid after throttling decrease temperature and pressure enters in evaporator 4 via evaporator feed tube 12, and by inhaling
The heat of vaporization for recording cryogen is saturation refrigerant vapour；Refrigerant low-temp low-pressure saturated vapor is via compressor return air pipe 13 times
Done work to compressor 1, and then enter back into next kind of refrigeration cycle.
Refrigerating medium control working method when, the equipment by evaporator 4, solution pump 5, electric heater 6, main process equipment end 7,
The parts such as refrigerating medium drain pipe 14, refrigerating medium liquid back pipe 15 are constituted.Operation principle is described below：Refrigerating medium passes through main process equipment
End 7 is carried out after heat exchange, is delivered to via refrigerating medium liquid back pipe 15 in evaporator 4 and is carried out cooling down, the refrigerating medium through cooling
Enter solution pump 5 via refrigerating medium drain pipe 14 and carry out circulation pumping；Refrigerating medium through cooling will less than main process equipment end 7
Temperature is sought, temperature adjustment need to be carried out by electric heater 6, satisfaction is sent into main process equipment end 7 after requiring and exchanged heat, so that complete
Into a complete recuperated cycle.
The temperature controlling instruments that the above-mentioned main process equipment of production of semiconductor products is attached troops to a unit is primarily present problems with：
1st, the temperature controlling instruments mainly adjusts the number by the inner refrigerant of evaporator 4 by the aperture of electric expansion valve 3,
So as to cooling down the heat that refrigerating medium is brought, the refrigerating medium through evaporator 4 cool it is latter as to be less than production of semiconductor products master
The operating temperature of process equipment requirement, it is therefore desirable to which heating temperature adjustment, a side are carried out by the refrigerating medium of 6 pairs of supercoolings of electric heater again
On the other hand face compressor 1 is used due to the heat that refrigerating medium is brought need to be fallen to thus needed many a certain amount of electric energy of consuming
Electric heater 6 carries out heat balance will expend substantial amounts of electric energy again, cause attached troops to a unit plant electrical power to increase, and electric current is also larger,
Electrical equipment type selecting and cable are corresponding increase, in addition usually high operating cost, are undoubtedly for semiconductor manufacturing enterprise
A kind of great burden.
2nd, special cooling-water machine is attached troops to a unit to compressor air-discharging institute by the factory service Shui Junshi semiconductor productions enterprise needed for condenser 2
The used heat of generation is condensed, it is condensed after the heat taken away of factory service water need to expend a certain amount of electric energy, be also a kind of energy
Amount is wasted.
The content of the invention
The purpose of the present invention is that the temperature control device attached troops to a unit for the main process equipment of semiconductor product is equipped with electric heater consumption
Can the big and aspect problem of factory service water cooling water dispenser energy consumption two, a kind of wax phase change regenerator temperature adjusting means of proposition.On the one hand utilize
The electric heater that the used heat of compressor air-discharging is configured by wax phase change regenerator temperature adjusting means instead of routine, to refrigerating medium
Temperature adjustment is carried out, is on the other hand condensed because a part of compressor air-discharging needs not move through condenser, so reducing factory service
The heat taken away needed for water, and then the power consumption of Semiconductor enterprises cooling-water machine is reduced, so as to play a part of energy-conservation, significantly lower
The operating cost of Semiconductor enterprises.
A kind of wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments proposed by the present invention, it is special
Levy and be, including shell and multiple thermostat units in the shell, between two neighboring thermostat unit, with
And compressor air-discharging heat exchanging chamber is equipped between thermostat unit and shell；Each thermostat unit includes the load at middle part
Cryogen heat exchanging chamber and the paraffin thermal positioned at the refrigerating medium heat exchanging chamber both sides；The upper and lower end of each paraffin thermal leads to respectively
The connection of paraffin communicating pipe is crossed, one end of each refrigerating medium heat exchanging chamber is equipped with refrigerating medium drain pipe interface, the other end and distinguishes equal respectively
Provided with refrigerating medium feed liquor interface tube, each compressor air-discharging heat exchanging chamber one end is equipped with compressor air-discharging intake pipe connection respectively, another
One end is equipped with compressor air-discharging drain pipe interface respectively.
The features of the present invention and beneficial effect：
1st, wax phase change characteristic accumulation of heat is utilized in wax phase change regenerator temperature adjusting means, semiconductor technology control can be avoided
The drawbacks of warm equipment is caused temperature rise excessive and is difficult to temperature control using compressor air-discharging direct heat transfer, it is possible to achieve temperature is put down
Weighing apparatus, stable temperature control；
2nd, wax phase change regenerator temperature adjusting means utilizes compressor air-discharging used heat, it is not necessary to expend additional electrical energy more, saves
Can be environmentally friendly, and the heat taken away by condenser can be reduced, reduce the energy consumption of Semiconductor enterprises factory service water cooling water dispenser；
3rd, it is reverse flow, Ke Yihe that wax phase change regenerator temperature adjusting means compressor air-discharging flow direction and refrigerating medium, which are flowed to,
Paraffin fully exchanges heat, and heat exchange efficiency is high, and heat is stable；
4th, wax phase change regenerator temperature adjusting means internal structure can take into full account liquefied petrolatum flowing heat endurance and
Phase transformation coproduct, it is safe and reliable.
Brief description of the drawings
Fig. 1 is the structure of existing temperature controlling instruments and the principle schematic of temperature control method.
Fig. 2 is the structural representation of wax phase change regenerator temperature adjusting means of the present invention.
Fig. 3 is the structure and the original of temperature control method of the temperature controlling instruments using wax phase change regenerator temperature adjusting means of the present invention
Manage schematic diagram.
Embodiment
A kind of wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments proposed by the present invention is combined
Drawings and the specific embodiments are further described below：
A kind of wax phase change regenerator temperature adjusting means 16 for semiconductor technology temperature controlling instruments proposed by the present invention, be
Using the phase-change characteristic of paraffin, liquefaction heat absorption solidifies heat release, using latent heat of phase change come accumulation of heat, instead of having temperature control as shown in Figure 1
Electric heater in equipment is used, and structural representation of the invention is as shown in Fig. 2 the thermoregulator includes shell 25 and is located at
Multiple thermostat units in the shell；Between two neighboring thermostat unit and thermostat unit and shell it
Between be equipped with compressor air-discharging heat exchanging chamber 22；Each thermostat unit includes the refrigerating medium heat exchanging chamber 24 at middle part and positioned at this
The paraffin thermal 23 of refrigerating medium heat exchanging chamber both sides, refrigerating medium heat exchanging chamber 24, paraffin thermal 23 and compressor air-discharging heat exchanging chamber
Refrigerating medium, paraffin and compressor air-discharging are separately filled with 22；The upper and lower end of each paraffin thermal 23 is connected by paraffin respectively
Siphunculus 26 is connected, and one end of each refrigerating medium heat exchanging chamber 24 is equipped with the interface of refrigerating medium drain pipe 18, the other end and is all provided with respectively respectively
There is the interface of refrigerating medium feed tube 17, each one end of compressor air-discharging heat exchanging chamber 22 is equipped with compressor air-discharging air inlet pipe 19 and connect respectively
Mouth, the other end are equipped with the interface of compressor air-discharging drain pipe 20 respectively；The cavity wall of shell and each heat exchanging chamber uses excellent heat conductivity
Material is made, and thermal conductivity factor is up to 237W/ (mK).
The heat exchange area of the single temperature control adjustment unit has 0.014m respectively2、0.020m2、0.026m2、0.050m2、
0.095m2It is a variety of available, according to various heat exchange area needs, it is determined that required temperature control adjustment unit quantity.
Using wax phase change regenerator temperature adjusting means 16 of the present invention constitute temperature control device structural representation as shown in figure 3,
The temperature control working method of the temperature controlling instruments equally includes refrigeration control working method and refrigerating medium control working method, with Fig. 1 institutes
Show unlike temperature controlling instruments：
During refrigeration control working method, increase compressor air-discharging air inlet pipe 19 and pressure respectively at the import and export end of condenser 2
Contracting machine is vented drain pipe 20；Each one end of compressor air-discharging heat exchanging chamber 22 in wax phase change regenerator temperature adjusting means 16 passes through
Compressor air-discharging intake pipe connection is connected with compressor air-discharging air inlet pipe 19, the other end passes through compressor air-discharging drain pipe interface
Connected with compressor air-discharging drain pipe 20, magnetic valve 21 is provided with compressor air-discharging air inlet pipe 19；
When refrigerating medium controls working method, the refrigerating of each refrigerating medium heat exchanging chamber in wax phase change regenerator temperature adjusting means 16
Agent drain pipe interface is connected by refrigerating medium drain pipe 18 with the entrance point at main process equipment end 7, refrigerating medium feed liquor interface tube
It is connected by refrigerating medium feed tube 17 with the one end of solution pump 5.
The work that the refrigeration control working method and refrigerating medium control working method of temperature controlling instruments are constituted using the present invention is former
Reason is substantially similar to temperature controlling instruments shown in Fig. 1, and difference is：The present invention is heated using the exhaust of compressor to refrigerating medium
Temperature adjustment, instead of original electric heater；A part of compressor air-discharging is shunted without condenser, so as to reduce semiconductor enterprise
Industry is attached troops to a unit the live load of cooling-water machine；Two aspects reduce power consumption, have saved operating cost.Specific control principle narration is such as
Under：
Compressor 1 is converted into the refrigeration of HTHP under motor driving by the refrigerant vapour done work low-temp low-pressure
Agent gas, 10 points by compressor exhaust pipe of compressor HTHP exhaust is two branch roads, and a branch road enters condenser 2
Interior, another branch road passes through electromagnetism via the compressor air-discharging air inlet pipe 19 being connected with wax phase change regenerator temperature adjusting means
Valve 21 control charge flow rate after enter wax phase change regenerator temperature adjusting means 16 compressor air-discharging heat exchanging chamber 22 in, and with phase
Paraffin in adjacent paraffin thermal 23 carries out heat exchange, and heat is stored by wax phase change characteristic, discharge refrigerant quilt
Be condensed into the liquid of HTHP, via the compressor air-discharging drain pipe 20 that is connected with wax phase change regenerator temperature adjusting means with
The liquid for carrying out condenser 2 is delivered to the progress throttling decrease temperature and pressure of electric expansion valve 3 via condenser drain pipe 11 together.
Refrigerating medium after being cooled down through evaporator 4 is pumped via refrigerating medium drain pipe 14 into solution pump 5, and refrigerating medium is again
Enter wax phase change regenerator temperature regulation dress via the refrigerating medium feed tube 17 being connected with wax phase change regenerator temperature adjusting means
In the refrigerating medium heat exchanging chamber 24 put heat is carried out with the paraffin in paraffin thermal 23 in wax phase change regenerator temperature adjusting means
Exchange, refrigerating medium is heated to form after required temperature, via the refrigerating medium being connected with wax phase change regenerator temperature adjusting means
Drain pipe 18 is delivered to main process equipment end 7 and circulated.
Control electricity is adjusted by the temperature feedback of refrigerating medium drain pipe interface in wax phase change regenerator temperature adjusting means
The open and close time span of magnet valve 21 (temperature is higher, and the opening time is shorter, and temperature is lower, and the time started is longer), so as to control
HTHP capacity into wax phase change regenerator temperature adjusting means 16, maintains wax phase change regenerator temperature to adjust with this
The balance of heat in device.
Being arranged on the paraffin communicating pipe 26 of each paraffin heat accumulation chamber end of wax phase change regenerator temperature adjusting means is used to liquefy
The flowing of paraffin, keeps the equalized temperature and phase variable volume coproduct of paraffin.
The key point of the present invention is to utilize compressor air-discharging used heat, by wax phase change regenerator temperature adjusting means, will
Heat in compressor air-discharging used heat is stored in paraffin, and paraffin realizes the heating temperature adjustment to refrigerating medium during phase transformation,
The electric heater that original high energy consumption, electric current are big, there is disaster hidden-trouble is instead of, makes the more economical environmental protection and energy saving of temperature control device；Together
When by shunting compressor air-discharging, reduce the compressor air-discharging used heat by condenser, Semiconductor enterprises can be reduced and matched somebody with somebody
Belong to the load of cooling-water machine, so as to reduce energy consumption；The two aspects can be effectively reduced energy consumption, reduce day-to-day operation cost, and
And safe and reliable environmental protection.
Claims (4)
1. a kind of wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments, it is characterised in that including outer
Between shell (25) and multiple thermostat units in the shell, two neighboring thermostat unit and temperature adjust
Compressor air-discharging heat exchanging chamber (22) is equipped between section unit and shell；Each thermostat unit includes the refrigerating medium at middle part
Heat exchanging chamber (24) and the paraffin thermal (23) positioned at the refrigerating medium heat exchanging chamber both sides；The upper and lower end of each paraffin thermal (23)
Connected respectively by paraffin communicating pipe (26), one end of each refrigerating medium heat exchanging chamber (24) is equipped with refrigerating medium drain pipe and connect respectively
Mouth, the other end are equipped with refrigerating medium feed liquor interface tube respectively, and each compressor air-discharging heat exchanging chamber (22) one end is equipped with compression respectively
Machine exhaust intake pipe connection, the other end are equipped with compressor air-discharging drain pipe interface respectively.
2. temperature-adjusting device as claimed in claim 1, it is characterised in that the refrigerating medium heat exchanging chamber (24), paraffin accumulation of heat
Refrigerating medium, paraffin and compressor air-discharging are separately filled with chamber (23) and compressor air-discharging heat exchanging chamber (22).
3. temperature-adjusting device as claimed in claim 1, it is characterised in that the cavity wall of the shell and each heat exchanging chamber is used
Heat Conduction Material is made.
4. temperature-adjusting device as claimed in claim 1, it is characterised in that the heat exchange area of the single thermostat unit
For 0.014m2、0.020m2、0.026m2、0.050m2、0.095m2Any of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710294681.0A CN106969532A (en) | 2017-04-28 | 2017-04-28 | Wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710294681.0A CN106969532A (en) | 2017-04-28 | 2017-04-28 | Wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106969532A true CN106969532A (en) | 2017-07-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710294681.0A Pending CN106969532A (en) | 2017-04-28 | 2017-04-28 | Wax phase change regenerator temperature adjusting means for semiconductor technology temperature controlling instruments |
Country Status (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110772374A (en) * | 2019-12-09 | 2020-02-11 | 电子科技大学中山学院 | Portable medical cold and hot compress system |
| CN111562801A (en) * | 2020-07-14 | 2020-08-21 | 北京京仪自动化装备技术有限公司 | Circulating liquid temperature adjusting method, circulating liquid temperature adjusting control device and circulating liquid temperature adjusting control system |
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
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| JPH01291067A (en) * | 1988-05-19 | 1989-11-22 | Hitachi Ltd | Thermoaccumulation type freezer |
| JPH1123079A (en) * | 1997-06-27 | 1999-01-26 | Mitsubishi Heavy Ind Ltd | Refrigerator |
| JP2004050991A (en) * | 2002-07-22 | 2004-02-19 | Denso Corp | Cold storage type refrigeration cycle device |
| CN1900636A (en) * | 2005-07-19 | 2007-01-24 | 东京毅力科创株式会社 | Water removal apparatus and inspection apparatus including same |
| JP2016138722A (en) * | 2015-01-28 | 2016-08-04 | 三浦工業株式会社 | Heat storage tank and heat exchange system including the same |
| JP6037089B1 (en) * | 2015-08-17 | 2016-11-30 | 三菱電機株式会社 | Heat utilization device |
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2017
- 2017-04-28 CN CN201710294681.0A patent/CN106969532A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01291067A (en) * | 1988-05-19 | 1989-11-22 | Hitachi Ltd | Thermoaccumulation type freezer |
| JPH1123079A (en) * | 1997-06-27 | 1999-01-26 | Mitsubishi Heavy Ind Ltd | Refrigerator |
| JP2004050991A (en) * | 2002-07-22 | 2004-02-19 | Denso Corp | Cold storage type refrigeration cycle device |
| CN1900636A (en) * | 2005-07-19 | 2007-01-24 | 东京毅力科创株式会社 | Water removal apparatus and inspection apparatus including same |
| JP2016138722A (en) * | 2015-01-28 | 2016-08-04 | 三浦工業株式会社 | Heat storage tank and heat exchange system including the same |
| JP6037089B1 (en) * | 2015-08-17 | 2016-11-30 | 三菱電機株式会社 | Heat utilization device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110772374A (en) * | 2019-12-09 | 2020-02-11 | 电子科技大学中山学院 | Portable medical cold and hot compress system |
| CN111562801A (en) * | 2020-07-14 | 2020-08-21 | 北京京仪自动化装备技术有限公司 | Circulating liquid temperature adjusting method, circulating liquid temperature adjusting control device and circulating liquid temperature adjusting control system |
| CN112416029A (en) * | 2021-01-25 | 2021-02-26 | 北京京仪自动化装备技术有限公司 | Temperature control system and temperature control method for semiconductor production |
| CN112416029B (en) * | 2021-01-25 | 2021-07-20 | 北京京仪自动化装备技术股份有限公司 | Temperature control system and temperature control method for semiconductor production |
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 100176 floor 3, building a, building 14, yard 8, Liangshuihe Second Street, Beijing Economic Development Zone, Daxing District, Beijing Applicant after: Beijing Jingyi automation equipment Technology Co.,Ltd. Address before: 100176 401, block a, building 14, yard 8, Liangshuihe Second Street, Beijing Economic Development Zone, Daxing District, Beijing Applicant before: BEIJING JINGYI AUTOMATION EQUIPMENT Co.,Ltd. |
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Application publication date: 20170721 |