CN106958746B - White light emitting module and LED lighting device - Google Patents

White light emitting module and LED lighting device Download PDF

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Publication number
CN106958746B
CN106958746B CN201610866041.8A CN201610866041A CN106958746B CN 106958746 B CN106958746 B CN 106958746B CN 201610866041 A CN201610866041 A CN 201610866041A CN 106958746 B CN106958746 B CN 106958746B
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white
white light
led packages
light
white led
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CN106958746A (en
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具元会
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/175Controlling the light source by remote control
    • H05B47/19Controlling the light source by remote control via wireless transmission
    • H05B47/195Controlling the light source by remote control via wireless transmission the transmission using visible or infrared light
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
    • H01L27/153Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/56Materials, e.g. epoxy or silicone resin
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • H05B45/22Controlling the colour of the light using optical feedback
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/20Controlling the colour of the light
    • H05B45/24Controlling the colour of the light using electrical feedback from LEDs or from LED modules
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10Controlling the light source
    • H05B47/175Controlling the light source by remote control
    • H05B47/19Controlling the light source by remote control via wireless transmission
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/235Details of bases or caps, i.e. the parts that connect the light source to a fitting; Arrangement of components within bases or caps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/237Details of housings or cases, i.e. the parts between the light-generating element and the bases; Arrangement of components within housings or cases
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • F21Y2113/10Combination of light sources of different colours
    • F21Y2113/13Combination of light sources of different colours comprising an assembly of point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48237Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a die pad of the item
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    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
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    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
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    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10Controlling the intensity of the light
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10Controlling the intensity of the light
    • H05B45/12Controlling the intensity of the light using optical feedback
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Abstract

The present invention provides an LED lighting device, which may include a white light emitting module including: a first white LED package emitting a first white light corresponding to a quadrangular region defined by color coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388), and (0.3179,0.3282) in a CIE1931 chromaticity diagram; a second white LED package emitting a second white light corresponding to a quadrangular region defined by color coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207), and (0.4589,0.4021) in a CIE1931 chromaticity diagram; a green LED package that emits green light having a peak wavelength of 520nm to 545 nm; and a driving controller which controls luminous flux levels of the first white light and the second white light to select a desired color temperature of the white light, and controls luminous flux of the green LED package to reduce a difference between a color coordinate corresponding to the selected color temperature of the white light and a black body locus.

Description

White light emitting module and LED lighting device
Cross Reference to Related Applications
This application claims priority and benefit of korean patent application No. 10-2015-.
Technical Field
The present exemplary embodiments of the subject matter described herein relate to an LED lighting device and a white light emitting module.
Background
A light emitting diode (hereinafter, referred to as "LED"), a semiconductor device that converts electrical energy into optical energy, may be composed of a compound semiconductor that emits light having a specific wavelength according to an energy band gap. Such LEDs are widely used as light sources in the field of lighting devices and display devices such as mobile displays, televisions and computer monitors.
In general, an LED illumination apparatus can generate white light by exciting a wavelength conversion material such as a phosphor using a semiconductor light emitting device that generates light in a range from ultraviolet light to blue light as an excitation light source. Specifically, a light emitting apparatus capable of providing white light having a color temperature suitable for user's demand and use environment by changing the color temperature of the white light is proposed.
Disclosure of Invention
An aspect of the present exemplary embodiments relates to an LED lighting apparatus and a white light emitting module capable of adjusting a variable color line in such a manner that a color coordinate of white light may be changed to be adjacent to a Black Body Locus (BBL) when a color temperature of the white light is changed.
According to an exemplary embodiment, an LED lighting apparatus may include: a lamp housing; a white light emitting module installed in the lamp housing; and a power supply unit supplying power to the white light emitting module. The white light emitting module includes: a first white LED package emitting a first white light corresponding to a quadrangular region defined by color coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388), and (0.3179,0.3282) in a CIE1931 chromaticity diagram; a second white LED package emitting a second white light corresponding to a quadrangular region defined by color coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207), and (0.4589,0.4021) in a CIE1931 chromaticity diagram; a green LED package that emits green light having a peak wavelength of 520nm to 545 nm; and a driving controller which controls luminous flux levels of the first white light and the second white light to select a desired color temperature of the white light, and controls luminous flux of the green LED package to reduce a difference between a color coordinate corresponding to the selected color temperature of the white light and a black body locus in a CIE1931 chromaticity diagram.
According to an exemplary embodiment, a white light emitting module may include: a first white LED package emitting a first white light corresponding to a quadrangular region defined by color coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388), and (0.3179,0.3282) in a CIE1931 chromaticity diagram; a second white LED package emitting a second white light corresponding to a quadrangular region defined by color coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207), and (0.4589,0.4021) in a CIE1931 chromaticity diagram; a green LED package that emits green light having a peak wavelength of 520nm to 545 nm; and a driving controller which controls levels of luminous fluxes of the first and second white lights to select a desired color temperature of the white light, and controls a luminous flux of the green LED package to reduce a difference between a color coordinate corresponding to the selected color temperature of the white light and a black body locus in a CIE1931 chromaticity diagram.
According to an exemplary embodiment, a white light emitting module may include: a plurality of first white LED packages emitting first white light corresponding to a quadrangular region defined by color coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388), and (0.3179,0.3282) in a CIE1931 chromaticity diagram; a plurality of second white LED packages emitting second white light corresponding to quadrangular regions defined by color coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207), and (0.4589,0.4021) in a CIE1931 chromaticity diagram; at least one green LED package that emits green light; and a driving controller which individually controls the levels of luminous fluxes of the first and second white lights and the luminous flux of the green light in such a manner that a color temperature of the final white light is substantially changed according to a black body locus in a CIE1931 chromaticity diagram.
Drawings
The above and other aspects, features and advantages of the present exemplary embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
fig. 1 is a block diagram showing a main configuration of an LED illumination apparatus according to an exemplary embodiment;
fig. 2 is a CIE1931 chromaticity diagram illustrating the principle of color change of an LED lighting device according to an exemplary embodiment;
fig. 3 illustrates spectrums of light emitted by first and second white LED packages and a green LED package that may be employed in an LED lighting apparatus according to an exemplary embodiment;
fig. 4 is a block diagram showing a main configuration of an LED illumination apparatus according to another exemplary embodiment;
fig. 5 shows a schematic perspective view of an example of a white light emitting module that may be employed in an LED lighting device according to an exemplary embodiment;
FIG. 6 is a schematic diagram showing circuitry of groups of LED packages employed in the white light emitting module of FIG. 5;
fig. 7 is a CIE1931 chromaticity diagram showing an example of a binning process for constructing first and second white LED packages;
fig. 8 is a side sectional view illustrating an example of a white LED package that may be employed in a white light emitting module according to an exemplary embodiment;
FIG. 9 is a side cross-sectional view of an LED chip that may be employed in the white LED package shown in FIG. 8;
fig. 10 is a cross-sectional view illustrating another example of a white LED package that may be employed in exemplary embodiments;
fig. 11 is a CIE1931 chromaticity diagram illustrating wavelength converting materials that may be employed in white LED packages according to example embodiments;
fig. 12 is an exploded perspective view illustrating a bulb type lighting device employing the white light emitting module shown in fig. 5 as an example of the lighting device according to an exemplary embodiment;
fig. 13 is an exploded perspective view illustrating a tube type lighting device according to an exemplary embodiment;
fig. 14 is a schematic perspective view illustrating a flat panel lighting device according to an exemplary embodiment;
fig. 15 is a schematic diagram illustrating an exemplary embodiment of an indoor lighting control network system;
fig. 16 is a diagram illustrating an exemplary embodiment of a network system applied to an open space; and
fig. 17 is a block diagram illustrating a communication operation between the smart engine of the lighting apparatus and the mobile device according to visible light wireless communication.
Detailed Description
Hereinafter, exemplary embodiments of the subject matter described herein will be described as follows with reference to the accompanying drawings.
Fig. 1 is a block diagram showing a main configuration of an LED illumination apparatus according to an exemplary embodiment.
As shown in fig. 1, the LED lighting device 50 may include white light emitting modules 20 and 30 and a power supply unit 10 supplying power to the white light emitting modules. The white light emitting module shown in fig. 1 may be mounted in a housing formed in various ways (refer to fig. 12 to 14).
The power supply unit 10 may convert an AC current into a DC current, and may be connected to the corresponding first and second white LED package drivers 25a and 25b and the green LED package driver 25c to supply power of the converted current thereto.
The white light emitting module 20 may include a driving signal controller 21. The white light emitting module 30 may include a first white LED package 30A for cold white light and a second white LED package 30B for warm white light, and the first and second white lights emitted through the first and second white LED packages 30A and 30B may define a color temperature change section of the lighting apparatus 50 according to an exemplary embodiment.
To obtain a color temperature variation adjacent to the black body locus, the first white light may correspond to a quadrangular region defined by coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388) and (0.3179,0.3282) in the CIE1931 chromaticity diagram. The second white light may correspond to a quadrilateral region defined by coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207), and (0.4589,0.4021) in the CIE1931 chromaticity diagram. Each of the first and second white LED packages 30A and 30B satisfying such a color coordinate condition may be constituted by an array of a plurality of LED packages. The array of the plurality of LED packages may be prepared such that white light mixed by appropriately combining the LED packages binned according to the plurality of color coordinates may become desired white light (refer to fig. 7).
The driving signal controller 21 provides driving signals for individually controlling three drivers of the first and second white LED package drivers 25a and 25b and the green LED package driver 25 c.
The first and second white LED package drivers 25a and 25B may be connected to the power supply unit 10 to receive power, and may supply an amount of current controlled by a driving signal of the driving signal controller 21 to the first and second white LED packages 30A and 30B, so that the first and second white LED packages 30A and 30B may be driven to emit white light having a desired luminous flux, respectively.
The white light emitting module 30 may further include a green LED package 30C. When a change is made in the color space diagram by adjusting the luminous flux ratio of the first and second white LED packages 30A and 30B, the green light emitted by the green LED package 30C may adjust the color coordinates of the changed (or final) white light WL upward to be close to the Black Body Locus (BBL), and may serve to reduce the interval therebetween. The green LED package driver 25C may be connected to the power supply unit 10 to receive power and may supply an amount of current controlled by the driving signal of the driving signal controller 21 to the green LED package 30C, and the green LED package 30C may emit green light having an amount of luminous flux required to adjust the coordinates upward. The peak wavelength of the green light may be 520nm to 545 nm. For example, the full width at half maximum (FWHM) of green light may be 10 to 50 nm.
As shown in fig. 2, the color temperature change principle applied to the exemplary embodiment will be described in more detail.
As shown in fig. 2, the first and second white LED packages 30A and 30B may emit first and second white lights denoted as "W1" and "W2", respectively, and a luminous flux ratio of the first and second white lights may be adjusted to obtain a desired color temperature in a color temperature section defined by the first and second white lights W1 and W2. For example, when a desired color temperature of the white light Wa is determined, the driving signal controller 21 may generate a driving signal for each of the first and second white LED package drivers 25a and 25b and may transmit the driving signal thereto. The first and second white LED package drivers 25a and 25B may drive the first and second white LED packages 30A and 30B to emit first and second white lights W1 and W2 in a luminous flux ratio according to the received driving signal.
In this case, as can be seen in fig. 2, since the color change of the luminous flux ratio using the first white light W1 and the second white light W2 is almost linear along the line denoted as "CL", the light Wa' in which only the first white light W1 and the second white light W2 are mixed may significantly deviate from the Black Body Locus (BBL), and thus, the desired white light of the CIE standard may not be obtained. The green LED package 30C may be driven such that the color coordinates of the light Wa are adjustable upward from the Black Body Locus (BBL) by an amount substantially equal to the distance "g". Specifically, the color coordinates of the white light WL may be located on the Black Body Locus (BBL), but in most practical driving operations, the color coordinates may be adjusted to be adjacent to the black body locus, that is, the color coordinates may be adjusted such that the distance between the coordinates and the closest point of the Black Body Locus (BBL) in the CIE1931 chromaticity diagram is 0.005 or less.
In this way, in the driving operation for color temperature variation, the green LED packages may be driven at an appropriate luminous flux according to the luminous flux ratio of the first white light W1 and the second white light W2, so that the color coordinates of the finally emitted white light WL may be adjacent to the Black Body Locus (BBL).
Fig. 3 illustrates spectrums of light emitted by first and second white LED packages and a green LED package that may be employed in an LED lighting apparatus according to an exemplary embodiment.
As shown in fig. 3, spectra of the first white light and the second white light and the green light are shown. The color temperature of the first white light and the color temperature of the second white light may be 6500K and 2700K, respectively, and the peak wavelength of the green light may be 530nm and the FWHM may be 30 nm.
The levels of luminous fluxes of the first white light and the second white light may be controlled to change the color temperature from 6500K to 2700K, and the luminous flux ratio of the green light may be controlled to provide white light adjacent to a Black Body Locus (BBL) according to the changed color temperature. Table 1 shows various white light characteristics (e.g., Color Rendering Index (CRI) and R9) as well as luminous flux ratios and color coordinates according to a color temperature change of white light.
[ Table 1]
Figure BDA0001123696730000061
Figure BDA0001123696730000071
As shown in table 1, when the luminous flux ratio of the first white light, the luminous flux ratio of the second white light, and the luminous flux ratio of the green light are represented as W1, W2, and G, respectively, W1+ W2+ G is 100%, and each of W1 and W2 may be complementarily changed in the range of 0 to (100-G)%. In such a variation section, the luminous flux ratio G of green light may be varied in the range of 0 to 10%.
The color temperature of the finally emitted white light can be varied in a color temperature range of 2700K to 6500K. In addition, the Color Rendering Index (CRI) of the white light may be 80 or more in the color temperature change section, relatively high, and a relatively high Color Rendering Index (CRI) may be stably maintained.
Specifically, in the central region of the color temperature change section, for example, in the section of 3500K to 5000K, since the distance of deviation from the Black Body Locus (BBL) is large, the luminous flux ratio G of green light can be adjusted to 7% or more, relatively high. In such a central region, it can be confirmed that the whole exhibits a relatively high Color Rendering Index (CRI).
Fig. 4 is a block diagram showing a main configuration of an LED illumination apparatus according to other exemplary embodiments. The LED illumination device 80 shown in fig. 4 differs from the embodiment 50 shown in fig. 1 in that a light detector 61 such as a spectrometer is utilized in controlling the white light characteristics.
As shown in fig. 4, the LED illumination apparatus 80 may include white light emitting modules 20' and 30 and a power supply unit 10 supplying power to the white light emitting modules. The white light emitting module 20 'may include a driving controller 21'. Unless otherwise stated, components employed in this embodiment may be understood to be the same as or similar to components described in the previous embodiments.
The driving controller 21' provides driving signals for individually controlling the three of the first and second white LED package drivers 25a and 25b and the green LED package driver 25 c. The drive controller 21' includes an analog-to-digital converter (ADC)21a, a microcontroller 21b, and a digital-to-analog converter (DAC)21 c.
The exemplary embodiment may also include a light detector 61 that detects and analyzes the white light WL ultimately emitted. For example, the light detector 61 may be a spectrometer. The light detector 61 may obtain information such as a color temperature, a color rendering index, or R9 of the finally emitted white light WL. The information may be passed as an analog signal from the detection information driver 65 to the analog-to-digital converter ADC 21 a. The ADC 21a may convert the analog signal into a digital signal, and may transmit the digital signal to the microcontroller 21 b. When the light detector 61 is a spectrometer, the detection information driver 65 may be a spectrometer driver.
A desired color temperature may be input to the analog-to-digital converter ADC 21a through the user interface 70, and information input together with currently measured information may be input to the microcontroller 21 b. The microcontroller 21B may calculate a change in luminous flux of the corresponding LED package 30A, 30B, and 30C based on a difference between a desired color temperature and a currently detected color temperature, and may transmit a driving signal according to the calculated change in luminous flux to the corresponding LED package driver 25a, 25B, and 25C through a digital-to-analog converter (DAC)21C, thereby driving the corresponding LED package 30A, 30B, and 30C at a desired luminous flux level.
Meanwhile, in the case where there is a deviation in the color temperature of actual white light according to the previously input color temperature and the previously input signal, the microcontroller 21B may compensate the calculation program of the driving signal for controlling the level of luminous flux of the corresponding LED packages 30A, 30B, and 30C to reduce the deviation.
Fig. 5 is a schematic perspective view illustrating an example of a white light emitting module that may be employed in an LED lighting apparatus according to an example embodiment of the present inventive concept.
As shown in fig. 5, the white light emitting module 150 according to an exemplary embodiment may include four first white LED packages 130A, four second white LED packages 130B, two green LED packages 130C, and a driving control chip 120 mounted on a circular substrate 110.
In an exemplary embodiment, the four first white LED packages 130A may be set to emit coldAn LED array of white light, and the four second white LED packages 130B may be provided as an LED array emitting warm white light. As shown in fig. 6, each of the four first white LED packages 130A and the four second white LED packages 130B may be connected in series with each other through a circuit pattern implemented on the substrate 110, and may pass a current I supplied from a corresponding driver (e.g., 25a and 25B of fig. 1)w1And Iw2Are independently driven. Similarly, the two green LED packages 130C may also be supplied with current I from separate drivers (e.g., 25C of fig. 1)gAnd (5) driving. In this manner, the corresponding arrays of the LED packages 130A, 130B, and 130C may be independently driven, and may emit light having different levels of luminous flux.
The first and second white LED packages 130A and 130B and the green LED package 130C may be arranged bilaterally symmetrical to each other or rotationally symmetrical to each other to provide uniform light distribution. As shown in fig. 5, the first and second white LED packages 130A and 130B for configuring white light may be arranged at constant intervals along the circumference of the substrate 110, and may be alternately arranged. Meanwhile, the two green LED packages 130C may be arranged in parallel with each other at the center of the substrate 110. By means of the symmetrical arrangement, the desired white light can be provided by a homogeneous color mixing even in the case of varying luminous flux ratios.
Even in the case where the first white LED package 130A and the second white LED package 130B are located in the same group, they may not have the same color coordinates. In fact, even in the case where the packages are manufactured to emit light having the same color coordinates, the packages may emit white light having different color coordinates due to manufacturing errors. In this way, white LED packages having different color characteristics (e.g., peak wavelength and output) can be binned according to a plurality of color coordinate regions, and the binned LED packages can be appropriately combined, and thus an array of white LED packages emitting white light having desired color coordinates can be manufactured.
For example, in the case of the first white LED package 130A, color coordinates of a plurality of white LED packages manufactured as the first white LED package 130A may be measured and divided into four bins b1, b2, b3, and b4 shown in fig. 7. To satisfy the color coordinate conditions required in the corresponding bin groups, a combination of the first white LED packages 130A located in different bins may be selected. By the binning operation and the combining operation, white LED packages deviating from a desired target color coordinate region can also be used.
The exemplary embodiment shows a case where the LED packages are arranged in a specific arrangement, but the LED packages may be arranged in other arrangements such as a straight arrangement and a matrix arrangement. In addition, the substrate 110 may be exemplified to have a circular shape, but it may have a different shape according to the structure of the lighting device.
In the light emitting module according to the foregoing embodiment, the LED package formed in various manners may be used. Specifically, the first white LED package and the second white LED package may be provided as packages of different shapes in which a wavelength conversion material such as a phosphor is combined with the semiconductor light emitting diode chip.
Fig. 8 is a side sectional view illustrating an example of a white LED package that may be employed in a white light emitting module according to an example embodiment of the inventive concepts.
As shown in fig. 8, the white LED package 230 according to an exemplary embodiment may include a package substrate 210 having a mounting surface and a semiconductor light emitting diode chip 200 flip-chip bonded on the mounting surface of the package substrate 210.
The wavelength conversion film 235 may be disposed on the upper surface of the semiconductor light emitting diode chip 200 mounted on the package substrate 210. The wavelength conversion film 235 may include a wavelength conversion material that converts a wavelength of a portion of light emitted by the semiconductor light emitting diode chip 200 into another wavelength. The wavelength conversion film 235 may be a resin layer in which a wavelength conversion material is dispersed, or may be a ceramic film formed of a sintered body of a ceramic phosphor. The semiconductor light emitting diode chip 200 may emit blue light, and the wavelength conversion film 235 may convert a portion of the blue light into yellow and/or red and green, so that the semiconductor light emitting device 30 emitting white light may be provided. Wavelength converting materials usable in the embodiments will be described later (refer to table 2 below).
As shown in fig. 9, a semiconductor light emitting diode chip 200 that may be employed in a white LED package 230 may include a substrate 201 and a first conductive type semiconductor layer 224, an active layer 225, and a second conductive type semiconductor layer 226 sequentially arranged on the substrate 201. The buffer layer 222 may be disposed between the substrate 201 and the first conductive type semiconductor layer 224.
The substrate 201 may be an insulating substrate such as sapphire. However, the substrate 201 is not limited thereto, and alternatively, it may be a conductive substrate or a semiconductor substrate in addition to an insulating substrate. For example, the substrate 201 may be made of SiC, Si, MgAl, in addition to sapphire2O4、MgO、LiAlO2、LiGaO2Or GaN. The uneven structure P may be formed on the upper surface of the substrate 201. The uneven structure P may improve light extraction efficiency and may improve the quality of a grown single crystal.
The buffer layer 222 may be InxAlyGa1-x-yN (x is more than or equal to 0 and less than or equal to 1, y is more than or equal to 0 and less than or equal to 1, and x + y is more than or equal to 0 and less than or equal to 1). For example, the buffer layer 222 may be GaN, AlN, AlGaN, or InGaN. A combination of multiple layers or a layer formed by gradually changing the composition may also be used as the material of the buffer layer 222 as needed.
The semiconductor layer 224 of the first conductive type may satisfy n-type InxAlyGa1-x-yN (0. ltoreq. x < 1,0. ltoreq. y < 1,0. ltoreq. x + y < 1), and the N-type dopant may be silicon (Si). For example, the first conductive type semiconductor layer 224 may include n-type GaN. The semiconductor layer 226 of the second conductive type may be a p-type InxAlyGa1-x-yN (0. ltoreq. x < 1,0. ltoreq. y < 1,0. ltoreq. x + y < 1), and the p-type dopant may be magnesium (Mg). For example, the second conductive type semiconductor layer 226 may be implemented as a single layer structure, but, as in this example, may have a multi-layer structure including different compositions. The active layer 225 may have a Multiple Quantum Well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked. For example, the quantum well layer and the quantum barrier layer may be In of different compositionsxAlyGa1-x-yN (x is more than or equal to 0 and less than or equal to 1, y is more than or equal to 0 and less than or equal to 1, and x + y is more than or equal to 0 and less than or equal to 1). In a particular embodiment, the quantum well layer may be InxGa1-xN (x is more than 0 and less than or equal to 1), and the quantum barrier layer can be GaN or AlGaN. Each of the quantum well layer and the quantum barrier layer may have a thickness ranging from about 1nm to 50 nm. The structure of the active layer 225 is not limited to a Multiple Quantum Well (MQW) structure but may be a Single Quantum Well (SQW) structure.
The first electrode 229a and the second electrode 229b may be disposed on the mesa-etched region of the first conductive type semiconductor layer 224 and the second conductive type semiconductor layer 226, respectively, in such a manner that they are located on the same plane. The first electrode 229 may include (without limitation) a material such as Ag, Ni, Al, Cr, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, or the like, and may have a single layer or a structure of two or more layers. The second electrode 229b may be a transparent electrode such as a transparent conductive oxide or nitride, or may include graphene, as needed. The second electrode 229b may include at least one of Al, Au, Cr, Ni, Ti, and Sn.
Fig. 10 is a sectional view illustrating another example of a white LED package that may be employed in example embodiments of the inventive concepts.
The white LED package 330 shown in fig. 10 may include the semiconductor light emitting diode chip 200, the mounting substrate 310, and the encapsulation portion 320 shown in fig. 9. The semiconductor light emitting diode chip 200 may be mounted on the mounting substrate 310 and electrically connected thereto through a wire W. The mounting substrate 310 may include a substrate body 311, an upper electrode 313, a lower electrode 314, and a through electrode 312 connecting the upper electrode 313 and the lower electrode 314. The mounting substrate 310 may be provided as a board such as a PCB, MCPCB, MPCB, FPCB, etc., and its structure may be used in various ways.
The encapsulation part 320 may have a convex lens shape with an upper surface convex upward, but according to other exemplary embodiments, it may have another shape so that an orientation angle of light emitted through the structure of the encapsulation part 320 may be controlled.
The encapsulating portion 320 may include a wavelength converting material 321 such as phosphor and/or quantum dots. As the wavelength conversion material, various materials such as a phosphor and/or a quantum dot may be used.
Fig. 11 is a CIE1931 chromaticity diagram illustrating wavelength conversion materials that may be employed in white LED packages according to example embodiments.
The color of light emitted by the LED package may be controlled according to the wavelength and type of the LED chip and the mixing ratio of the wavelength conversion material. In the case of a white LED package, a color temperature and a color rendering index thereof may be controlled.
For example, a semiconductor diode chip emitting ultraviolet light or blue light may implement white light by combining appropriate ones of yellow, green, red, and blue phosphors, and may emit white light having various color temperatures according to a mixing ratio of the selected phosphors.
The lighting apparatus can adjust a Color Rendering Index (CRI) from a level of light emitted from a sodium halide lamp to a daylight level, and can generate various white lights having a color temperature ranging from 1500K to 20000K. In addition, the lighting device may generate violet, blue, green, red or orange light or infrared light as needed to adjust the color of the light according to the surrounding atmosphere and the user's mind. In addition, the lighting device may generate light of a specific wavelength for accelerating plant growth.
The white light formed by combining the yellow, green, and red phosphors with the blue semiconductor diode chip and/or combining the green and red light emitting devices may have two or more peak wavelengths, and its coordinates (x, y) in the CIE1931 color space of fig. 11 may be located in a region of line segments connecting (0.4476, 0.4074), (0.3484, 0.3516), (0.3101, 0.3162), (0.3128, 0.3292), and (0.3333 ). Alternatively, its coordinates (x, y) in the CIE1931 color space may lie in the area enclosed by the line segment and the black body locus. The color temperature of the white light may be in the range of 1500K to 20000K. In fig. 11, white light near a point E (0.3333 ) located below the black body locus may be in a state in which the level of yellow light is relatively low, and may be used as an illumination light source in an area presenting a brighter or fresh feeling to the naked eye. Therefore, a lighting product using white light near a point E (0.3333 ) located below the black body locus may be very effective as a lighting device for a retail store selling sundries, clothes, and the like.
The phosphor that can be used in the inventive concept may have the following composition and color.
The oxide may be: yellow and green Y3Al5O12:Ce、Tb3Al5O12:Ce、Lu3Al5O12:Ce。
The silicate may be: yellow and green (Ba, Sr)2SiO4Eu, yellow and orange (Ba, Sr)3SiO5:Ce。
The nitride may be: eu, yellow La as green beta-SiAlON3Si6N11Ce, orange alpha-SiAlON Eu, red CaAlSiN3:Eu、Sr2Si5N8:Eu、SrSiAl4N7:Eu、SrLiAl3N4:Eu、Ln4-x(EuzM1-z)xSi12-yAlyO3+x+yN18-x-y((0.5. ltoreq. x.ltoreq.3, 0. ltoreq. z < 0.3, 0. ltoreq. y.ltoreq.4) -formula (1)).
In formula (1), Ln may be at least one element selected from group IIIa elements and rare earth elements, and M may be at least one element selected from calcium (Ca), barium (Ba), strontium (Sr), and magnesium (Mg).
The fluoride may be: red K2SiF6:Mn4+、K2TiF6:Mn4+、NaYF4:Mn4+、NaGdF4:Mn4+、K3SiF7:Mn4+
The composition of the phosphor should be substantially stoichiometric and each element may be replaced by other elements from each group of the periodic table. For example, strontium (Sr) may be substituted by barium (Ba), calcium (Ca), magnesium (Mg), or the like in the alkaline earth group (II), and yttrium (Y) may be substituted by a lanthanum (La) series element such as terbium (Tb), lutetium (Lu), scandium (Sc), gadolinium (Gd), or the like. In addition, europium (Eu), which is an activator, may be replaced with cerium (Ce), terbium (Tb), praseodymium (Pr), erbium (Er), ytterbium (Yb), etc., according to a desired energy level, and the activator may be applied alone or together with a co-activator to change the characteristics of the phosphor.
Table 2 below shows the types of phosphors according to the application fields of the white light emitting device using the UV or blue LED chip.
[ Table 2]
Figure BDA0001123696730000131
Figure BDA0001123696730000141
Further, as the wavelength conversion material, a material such as Quantum Dots (QDs) or the like may be used instead of the phosphor.
The quantum dot can realize various colors according to sizes, and in particular, when the quantum dot is used as a phosphor substitute, it can be used as a red or green phosphor. The use of quantum dots may allow for a narrow FWHM (e.g., about 35 nm).
The wavelength converting material may be provided in a form of being contained in an encapsulant, or alternatively, the wavelength converting material may be fabricated in advance as a film and attached to a surface of an optical device such as a light guide plate or a semiconductor light emitting device. In the case of using a wavelength converting material manufactured in advance as a film, a wavelength converting material having a uniform thickness can be easily realized.
The LED module according to the embodiment may be advantageously used in lighting apparatuses having various forms.
Fig. 12 is an exploded perspective view illustrating a bulb type lighting apparatus employing the white light emitting module shown in fig. 5 as an example of the lighting apparatus according to an exemplary embodiment.
As shown in fig. 12, the lighting apparatus 4300 may include a housing composed of a plurality of components, a white light emitting module 150, and a power supply unit 4220. The housing of the lighting device 4300 may include a screw seat 4210 and a heat sink 4230.
In an exemplary embodiment, the white light emitting module 150 may include a substrate 110 and an LED array and a driving control chip 120 arranged on the substrate 110. The LED array may have a symmetrical arrangement structure including four first white LED packages 130A, four second white LED packages 130B, and two green LED packages 130C. The driving control chip 120 may have a function corresponding to that of the driving controller of fig. 1 and 4, and may store driving information on the LED array.
The screw seat 4210 may be configured to mate with existing light fixtures and thus replace existing light bulbs, such as incandescent light bulbs. Power to the lighting device 4200 may be applied through the screw seat 4210. The power supply unit 4220 may include an AC/DC power supply. The white light emitting module 150 may receive power from the power supply unit 4220 and may emit light to the reflection plate 4310. As shown in the embodiment, the power supply unit 4220 may include a first power supply unit 4221 and a second power supply unit 4222. The first power supply unit 4221 and the second power supply unit 4222 may be assembled to form the power supply unit 4220. The radiator 4230 may include an inner radiator 4231 and an outer radiator 4232. The internal heat sink 4231 may be directly connected to the white light emitting module 150 and/or the power supply unit 4220, thereby transmitting heat to the external heat sink 4232.
The reflection plate 4310 is disposed above the light source module 4240, and here, the reflection plate 4310 serves to allow light from the light source to be uniformly dispersed toward lateral and rear sides thereof, and thus glare may be reduced. In addition, a communication module 4320 may be installed on an upper portion of the reflection plate 4310, and home network communication may be achieved through the communication module 4320. For example, the communication module 4320 may be utilized
Figure BDA0001123696730000151
Wi-Fi or light fidelity (Li-Fi), and may control lighting installed inside or outside a house, such as turning lighting on or off, adjusting the brightness of lighting, etc., through a smartphone or a wireless controller. In addition, home appliances or automobile systems inside or outside a house such as a TV, a refrigerator, an air conditioner, a door lock, or an automobile may be controlled by using a visible wavelength Li-Fi communication module of a lighting device installed inside or outside the house. The reflection plate 4310 and the communication module 4320 may be covered by a cover unit 4330.
Fig. 13 is an exploded perspective view illustrating a tube type lighting apparatus according to an exemplary embodiment of the inventive concept.
The lighting device 4400 illustrated in fig. 13 may include a housing constructed of various components and a white light emitting module 1150. The housing may include a heat sink 4410, a cover 4441, a first pin base 4460 and a second pin base 4470. The stopper protrusions 4433 may be formed on both ends of the heat sink 4410. A plurality of the heat radiating fins 4420 and 4431 may be formed on the inner and/or outer surface of the heat sink 4410 in a concave-convex pattern, and the heat radiating fins 4420 and 4431 may be designed to have various shapes and have spaces (spaces) therebetween. A support 4432 having a protruding shape may be formed on the inner side of the heat sink 4410.
A stopper groove 4442 may be formed in the cover 4441, and the stopper protrusion 4433 of the heat sink 4410 may be coupled to the stopper groove 4442. The positions of the stopper groove 4442 and the stopper protrusion 4433 may be interchanged.
The white light emitting module 1150 may include an LED array. The white light emitting module 1150 may include a circuit board 1110, LED arrays 1130A, 1130B and 1130C, and a driving control chip 1120. The LED array may have a bilaterally symmetrical arrangement, and may include first and second white LED packages 1130A and 1130B alternately arranged in a row and green LED packages 1130C arranged two by two on both sides of the first and second white LED packages. As described above, the driving control chip 1120 may perform the function of the driving controller described with reference to fig. 1 and 4, and may store driving information on the LED package arrays 1130A, 1130B, and 1130C. Circuit wiring is formed on the circuit board 1110 to operate the LED package arrays 1130A, 1130B, and 1130C.
A first pin base 4460 and a second pin base 4470 as a pair of pin bases are respectively coupled to opposite ends of a cylindrical cover unit including a heat sink 4410 and a cover 4441. For example, the first pin holder 4460 may include an electrode terminal 4461 and a power supply device 4462, and a dummy terminal 4471 may be disposed on the second pin holder 4470. Additionally, an optical sensor and/or communication module may be mounted in the first pin base 4460 or the second pin base 4470. For example, an optical sensor and/or a communication module may be installed in the second pin base 4470 in which the dummy terminal 4471 is disposed. In another example, the optical sensor and/or the communication module may be mounted in the first pin lamp head 4460 where the electrode terminal 4461 is disposed.
Fig. 14 is a schematic perspective view illustrating a flat panel lighting apparatus according to an exemplary embodiment of the inventive concept.
As shown in fig. 14, the flat panel lighting device 4500 may include a white light emitting module 4510, a power supply unit 4520, and a housing 4530. According to example embodiments, the light emitting module 4510 may include an array of LED packages similar to the previous embodiments. The power supply unit 4520 may include an AC/DC power supply. The white light emitting module 4510 may be formed to have an overall planar shape such that it corresponds to the structure of the lighting apparatus. According to an embodiment, the white light emitting module 4510 may include a light emitting diode and a driving controller storing driving information of the light emitting diode.
The power supply unit 4520 may be configured to supply power to the white light emitting module 4510. The housing 4530 may have an accommodation space to accommodate the white light emitting module 4510 and the power supply unit 4520 and have a hexahedral shape with one side open, but the shape of the housing 4530 is not limited thereto. The white light emitting module 4510 may be arranged to emit light toward an open side of the housing 4530.
Fig. 15 is a schematic diagram showing an indoor lighting control network system.
The network system 5000 according to the embodiment may be a complex intelligent lighting network system combining lighting technology using light emitting devices such as LEDs, internet of things (IoT) technology, wireless communication technology, and the like. The network system 5000 may be implemented using various lighting devices and wired/wireless communication means, and may be implemented by sensors, controllers, communication units, software for network control and maintenance, and the like.
The network system 5000 is even applicable to an open space such as a park or a street, and a closed space such as a home or an office. The network system 5000 may be implemented based on an IoT environment to collect and process a range of information and provide it to users. Here, the LED lighting apparatus 5200 included in the network system 5000 is not only usable to receive information about the surrounding environment from the gateway 5100 and control the lighting of the LED lighting apparatus 5200 itself, but also to check and control the operation states of the other devices 5300 to 5800 included in the IoT environment based on the functions of the LED lighting apparatus 5200 such as visible light communication and the like.
As shown in fig. 15, the network system 5000 may include: a gateway 5100 that processes data sent and received according to different communication protocols; an LED lighting 5200 connected to be communicable with the gateway 5100 and including an LED lighting device; and a plurality of devices 5300 to 5800 connected to communicate with the gateway 5100 according to various wireless communication schemes. To implement the IoT environment-based network system 5000, each of the apparatuses 5300 to 5800 and the LED lighting 5200 may include at least one communication module. In an example embodiment, the LED lighting 5200 is connectable to be operable according to a protocol such as Wi-Fi,
Figure BDA0001123696730000181
Or Li-Fi, to communicate with the gateway 5100, and in this regard, the LED lighting device 5200 may include at least one communication module 5210 for the lamp.
As described above, the network system 5000 is applicable even to an open space such as a park or a street, and a closed space such as a home or an office. When the network system 5000 is applied to a home, the plurality of devices 5300 to 5800 included in the network system and connected to be communicable with the gateway 5100 based on the IoT technology may include a home appliance 5300 such as a TV 5310 or a refrigerator 5320, a digital door lock 5400, a garage door lock 5500, a lamp switch 5600 installed on a wall or the like, a router 5700 for relaying a wireless communication network, and a mobile device 5800 such as a smart phone, a tablet PC, or a notebook computer.
In the network system 5000, the LED lighting device 5200 may utilize a wireless communication network installed in a house ((r))
Figure BDA0001123696730000182
Wi-Fi, Li-Fi, etc.) checks the operation state of each device 5300 to 5800, or may automatically control the illumination of the LED illumination apparatus 5200 itself according to the surrounding environment or situation. Additionally, the packets may be controlled using Li-Fi communication using visible light emitted by the LED lighting device 5200The apparatuses 5300 to 5800 included in the network system 5000.
First, the LED lighting apparatus 5200 may automatically adjust the lighting of the LED lighting apparatus 5200 based on the information of the ambient environment transmitted from the gateway 5100 through the communication module 5210 for lamps or the information of the ambient environment collected from the sensors installed in the LED lighting apparatus 5200. For example, the brightness of the illumination of the LED illumination 5200 may be automatically adjusted according to the type of program aired on the TV 5310 or the screen brightness. In this regard, the LED lighting 5200 may receive operation information of the TV 5310 from the communication module for lamp 5210 connected to the gateway 5100. The communication module 5210 for the lamp may be integrally modular with the sensors and/or controller included in the LED lighting device 5200.
For example, when the TV program is a TV show, the color temperature of the illumination may be lowered to 12000K or less, for example, to 5000K, and the color tone may be adjusted according to a preset value, so that a comfortable atmosphere may be formed. In contrast, when the program value is a comedy program, the network system 5000 may be configured such that the color temperature of the illumination is increased to 5000K or more according to a preset value, and the illumination is adjusted to blue-based white illumination.
In addition, when no one is at home and a predetermined time elapses after the digital door lock 5400 is locked, all the turned-on LED devices 5200 are turned off to prevent waste of electricity. In addition, when a security mode is set by the mobile device 5800 or the like, and the digital door lock 5400 is locked when no one is at home, the LED lighting apparatus 5200 can be kept in an open state.
The operation of the LED lighting device 5200 may be controlled according to ambient environment information collected by various sensors connected to the network system 5000. For example, when the network system 5000 is implemented in a building, lighting, a location sensor, and a communication module are combined in the building and location information of a person in the building is collected and the lighting is turned on or off, or the collected information may be provided in real time to effectively manage facilities or effectively utilize a vacant space. Generally, lighting such as the LED lighting 5200 is arranged in almost every space of each floor of a building, and therefore, various information of the building can be collected by a sensor provided together with the LED lighting 5200 and used for managing facilities and utilizing vacant space.
Meanwhile, the LED lighting 5200 may be combined with an image sensor, a storage device, and a communication module 5210 for a lamp to be used as a device for maintaining building safety, or sensing and coping with an emergency. For example, when a smoke sensor or a temperature sensor or the like is attached to the LED lighting 5200, a fire can be sensed quickly to minimize loss. In addition, the brightness of the illumination may be adjusted in consideration of the external weather or the amount of sunlight, thereby saving energy and providing a pleasant illumination environment.
Fig. 16 is a diagram showing an example of a network system applied to an open space.
Referring to fig. 16, a network system 5000' according to the current example embodiment may include: the communications connection 5100'; a plurality of lighting devices 5200 ' and 5300 ' installed at every predetermined interval and connected to be communicable with the communication connection apparatus 5100 '; a server 5400'; a computer 5500 ', which manages a server 5400'; a communication base station 5600'; communication network 5700'; mobile device 5800', etc.
Each of the plurality of lighting devices 5200 'and 5300' installed in an open external space such as a street or park may include a smart engine 5210 'and 5310', respectively. The smart engines 5210 'and 5310' may include a lighting device, a driver of the lighting device, a sensor collecting information of surrounding environment, a communication module, and the like. The smart engines 5210 'and 5310' may be based on a hardware such as Wi-Fi,
Figure BDA0001123696730000191
And the communication protocol of the Li-Fi is communicated with other adjacent equipment through the communication module.
For example, one smart engine 5210 'may be connected to communicate with another smart engine 5310'. Here, Wi-Fi extension technology (Wi-Fi mesh) may be applied to the communication between the smart engines 5210 'and 5310'. At least one smart engine 5210 ' may be connected to a communications connection 5100 ' connected to the communications network 5700 ' by wired/wireless communications. To improve communication efficiency, some smart engines 5210 ' and 5310 ' may be combined and connected to a single communication connection 5100 '.
The communication connection device 5100 'may be an Access Point (AP) that may be used for wired/wireless communication, which may relay communication between the forwarding communication network 5700' and other apparatuses. The communications link 5100 ' may be connected to the communications network 5700 ' in a wired or wireless manner, for example, the communications link 5100 ' may be mechanically housed in either of the lighting devices 5200 ' and 5300 '.
The communicatively connected device 5100 'may be connected to the mobile device 5800' via a communication protocol, such as Wi-Fi. A user of the mobile device 5800 ' can receive the ambient information collected by the plurality of smart engines 5210 ' and 5310 ' through the communications link 5100 ' connected with the smart engine 5210 ' adjacent to the lighting apparatus 5200 ' of the mobile device 5800 '. The ambient information may include nearby traffic information, weather information, and the like. The mobile device 5800 ' may be connected to the communications network 5700 ' by the communications base station 5600 ' according to a wireless cellular communication scheme, such as 3G or 4G.
Meanwhile, the server 5400 'connected to the communication network 5700' may receive information collected by the smart engines 5210 'and 5310' installed in the lighting devices 5200 'and 5300', respectively, and monitor the operation state and the like of each of the lighting devices 5200 'and 5300'. In order to manage the lighting apparatuses 5200 'and 5300' based on the monitoring result of the operation states of the lighting apparatuses 5200 'and 5300', the server 5400 'may be connected to the computer 5500' that provides the management system. The computer 5500 ' may execute software and the like capable of monitoring and managing the operating status of the lighting devices 5200 ' and 5300 ' (specifically, the smart engines 5210 ' and 5310 ').
Fig. 17 is a block diagram illustrating a communication operation between a smart engine of a lighting apparatus and a mobile device according to visible light wireless communication.
Referring to fig. 17, the smart engine 5210 'may include a signal processing unit 5211', a control unit 5212 ', an LED driver 5213', a light source unit 5214 ', a sensor 5215', and the like. The mobile device 5800 ' connected to the smart engine 5210 ' through visible light communication may include a control unit 5801 ', a light receiving unit 5802 ', a signal processing unit 5803 ', a memory 5804 ', an input/output unit 5805 ', and the like.
Visible Light Communication (VLC) technology (light fidelity (Li-Fi)) is a wireless communication technology that wirelessly transmits information using light having a visible light wavelength band that is recognizable to the naked eye. The visible light communication technology is different from the existing wired optical communication technology and infrared data association (IrDA) in that it utilizes light having a visible light wavelength band (that is, a specific visible light frequency) from the light-emitting device package according to the above-described exemplary embodiment, and in that the communication environment is based on a wireless scheme. In addition, unlike RF wireless communication, VLC technology (or Li-Fi) is convenient in that it can be used without adjustment or authorization in terms of frequency use, and has a difference in that physical security is excellent, and allows a user to confirm a communication link with his or her eyes. Above all, VLC technology (or Li-Fi) differs in that it has a feature as a convergence technology to achieve both unique use and communication functions of a light source.
The signal processing unit 5211 'of the smart engine 5210' may process data intended to be transmitted and received by VLCs. In an example embodiment, the signal processing unit 5211 ' may process information collected by the sensor 5215 ' into data and transmit the processed data to the control unit 5212 '. The control unit 5212 'may control the operation of the signal processing unit 5211', the LED driver 5213 ', and the like, and in particular, the control unit 5212' may control the operation of the LED driver 5213 'based on data transmitted from the signal processing unit 5211'. The LED driver 5213 'controls the light source unit 5214' to emit light according to a control signal transmitted from the control unit 5212 ', thereby transmitting data to the mobile device 5800'.
In addition to the control unit 5801 ', the memory 5804' storing data, the input/output unit 5805 'including a display, a touch screen, an audio output unit, etc., and the signal processing unit 5803', the mobile device 5800 'may further include a light receiving unit 5802' for recognizing visible light including data. The light-receiving unit 5802 ' may sense visible light and convert the sensed visible light into an electrical signal, and the signal-processing unit 5803 ' may decode data included in the electrical signal converted by the light-receiving unit 5802 '. The control unit 5801 'may store the data decoded by the signal processing unit 5803' in the memory 5804 ', or may output the decoded data through the input/output unit 5805' to allow a user to recognize the data.
As described above, according to example embodiments, when the color temperature is changed using the first and second white LED packages having different color temperatures, the color coordinate of the final white light may be adjusted to be adjacent to the black body locus by increasing the luminous flux of the green LED package. In addition, the color rendering index may be increased to 80% or more, and further, 85% or more. With only the additional configuration of the green LED package, white light in compliance with the CIE standard can be provided even in a lighting apparatus having a wide color variation section (e.g., 2700 to 6500K).
While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and changes may be made without departing from the scope of the invention as defined by the claims.

Claims (16)

1. An LED lighting apparatus comprising:
a lamp housing;
a white light emitting module mounted in the lamp housing; and
a power supply unit for supplying power to the white light emitting module,
wherein the white light emitting module includes:
a first white LED package configured to emit a first white light corresponding to a quadrangular region defined by color coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388) and (0.3179,0.3282) in a CIE1931 chromaticity diagram,
a second white LED package configured to emit a second white light corresponding to a quadrangular region defined by color coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207) and (0.4589,0.4021) in a CIE1931 chromaticity diagram,
a green LED package configured to emit green light having a peak wavelength of 520nm to 545nm, and
a driving controller which controls luminous flux levels of the first white light and the second white light to select a desired color temperature of the white light, and controls luminous flux of the green LED package to reduce a difference between a color coordinate corresponding to the selected color temperature of the white light and a black body locus in a CIE1931 chromaticity diagram,
wherein when a luminous flux ratio of the first white light, a luminous flux ratio of the second white light, and a luminous flux ratio of the green light are represented as W1, W2, and G, respectively, W1+ W2+ G is 100%, and each of W1 and W2 is changed in a complementary manner within a range of 0 to (100-G)%,
wherein the luminous flux ratio G of green light is changed in the range of 0 to 10%,
wherein the color rendering index of the finally emitted white light is 80 or more,
wherein the white light emitting module satisfies at least one of the following conditions:
the first white LED package includes a first plurality of white LED packages selected from a first plurality of candidate white LED packages for emitting the first white light, and the first plurality of candidate white LED packages are divided into a plurality of first bins corresponding to a plurality of first color coordinate regions, respectively, a color coordinate of each candidate white LED package of the first plurality of candidate white LED packages is located in a respective color coordinate region of the plurality of first color coordinate regions, wherein the plurality of first color coordinate regions are quadrangles in a CIE1931 chromaticity diagram, respectively, and two adjacent quadrangles have a common side, the first plurality of white LED packages are selected from different bins of the first plurality of bins, respectively, and
the second white LED package includes a second plurality of white LED packages selected from a second plurality of candidate white LED packages for emitting the second white light, and the second plurality of candidate white LED packages are divided into a plurality of second bins corresponding to a second plurality of color coordinate regions, respectively, the color coordinates of each of the second plurality of candidate white LED packages being located in a respective color coordinate region of the second plurality of color coordinate regions, wherein the second plurality of color coordinate regions are quadrangles in a CIE1931 chromaticity diagram, respectively, and two adjacent quadrangles have a common side, the second plurality of white LED packages being selected from different bins of the second plurality of bins, respectively.
2. The LED luminaire of claim 1, wherein the color temperature of the finally emitted white light varies over a range of color temperatures from 2700K to 6500K.
3. The LED luminaire of claim 1, wherein the color coordinates of the resulting emitted white light substantially vary according to the blackbody locus.
4. The LED lighting device of claim 1, wherein a half-peak width of green light emitted by the green LED package is 10 to 50 nm.
5. The LED lighting device of claim 1, wherein at least one of the first and second white LED packages comprises a plurality of white LED packages.
6. The LED lighting apparatus of claim 5, wherein at least a portion of the plurality of white LED packages emit light corresponding to different color coordinates in the CIE1931 chromaticity diagram, and
different types of light emitted by the plurality of white LED packages are mixed to allow the first white light or the second white light to be emitted.
7. The LED lighting device according to claim 1, wherein the first and second white LED packages respectively include a plurality of white LED packages and are alternately arranged.
8. The LED luminaire of claim 7, wherein the green LED packages comprise a plurality of green LED packages.
9. The LED lighting device of claim 8, wherein the first and second white LED packages and the green LED package are arranged bilaterally symmetrical to each other or rotationally symmetrical to each other.
10. The LED luminaire of claim 1, further comprising: a light detector that detects and analyzes the white light ultimately emitted,
wherein the driving controller receives the analyzed information on the white light and controls a luminous flux of at least one of the first and second white LED packages and the green LED package based on the received information.
11. The LED luminaire of claim 1, further comprising: a light diffuser arranged in the exit direction of the final white light.
12. A white light emitting module comprising:
a first white LED package configured to emit a first white light corresponding to a quadrangular region defined by color coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388) and (0.3179,0.3282) in a CIE1931 chromaticity diagram,
a second white LED package configured to emit a second white light corresponding to a quadrangular region defined by color coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207) and (0.4589,0.4021) in a CIE1931 chromaticity diagram,
a green LED package configured to emit green light having a peak wavelength of 520nm to 545nm, and
a driving controller which controls levels of luminous fluxes of the first and second white lights to select a desired color temperature of the white light, and controls a luminous flux of the green LED package to reduce a difference between a color coordinate corresponding to the selected color temperature of the white light and a black body locus in a CIE1931 chromaticity diagram,
wherein when a luminous flux ratio of the first white light, a luminous flux ratio of the second white light, and a luminous flux ratio of the green light are represented as W1, W2, and G, respectively, W1+ W2+ G is 100%, and each of W1 and W2 is changed in a complementary manner within a range of 0 to (100-G)%,
wherein the luminous flux ratio G of green light is changed in the range of 0 to 10%, and
wherein the color rendering index of the finally emitted white light is 80 or more,
wherein the white light emitting module satisfies at least one of the following conditions:
the first white LED package includes a first plurality of white LED packages selected from a first plurality of candidate white LED packages for emitting the first white light, and the first plurality of candidate white LED packages are divided into a plurality of first bins corresponding to a plurality of first color coordinate regions, respectively, a color coordinate of each candidate white LED package of the first plurality of candidate white LED packages is located in a respective color coordinate region of the plurality of first color coordinate regions, wherein the plurality of first color coordinate regions are quadrangles in a CIE1931 chromaticity diagram, respectively, and two adjacent quadrangles have a common side, the first plurality of white LED packages are selected from different bins of the first plurality of bins, respectively, and
the second white LED package includes a second plurality of white LED packages selected from a second plurality of candidate white LED packages for emitting the second white light, and the second plurality of candidate white LED packages are divided into a plurality of second bins corresponding to a second plurality of color coordinate regions, respectively, the color coordinates of each of the second plurality of candidate white LED packages being located in a respective color coordinate region of the second plurality of color coordinate regions, wherein the second plurality of color coordinate regions are quadrangles in a CIE1931 chromaticity diagram, respectively, and two adjacent quadrangles have a common side, the second plurality of white LED packages being selected from different bins of the second plurality of bins, respectively.
13. The white light emitting module of claim 12,
at least a portion of the first plurality of white LED packages emit light corresponding to different color coordinates in a CIE1931 chromaticity diagram, and
different types of light emitted by the first plurality of white LED packages are mixed to allow emission of a first white light.
14. The white light emitting module of claim 12,
at least a portion of the second plurality of white LED packages emit light corresponding to different color coordinates in a CIE1931 chromaticity diagram, and
the different types of light emitted by the second plurality of white LED packages are mixed to allow emission of a second white light.
15. A white light emitting module comprising:
a plurality of first white LED packages configured to emit first white light corresponding to a quadrangular region defined by color coordinates (0.3100,0.3203), (0.3082,0.3301), (0.3168,0.3388) and (0.3179,0.3282) in a CIE1931 chromaticity diagram,
a plurality of second white LED packages configured to emit second white light corresponding to quadrangular regions defined by color coordinates (0.4475,0.3994), (0.4571,0.4173), (0.4695,0.4207) and (0.4589,0.4021) in a CIE1931 chromaticity diagram,
at least one green LED package configured to emit green light, an
A driving controller which individually controls the levels of luminous fluxes of the first and second white lights and the luminous flux of the green light in such a manner that a color temperature of the final white light substantially varies along a black body locus in a CIE1931 chromaticity diagram,
wherein when a luminous flux ratio of the first white light, a luminous flux ratio of the second white light, and a luminous flux ratio of the green light are represented as W1, W2, and G, respectively, W1+ W2+ G is 100%, and each of W1 and W2 is changed in a complementary manner within a range of 0 to (100-G)%,
wherein the luminous flux ratio G of green light is changed in the range of 0 to 10%, and
wherein the color rendering index of the finally emitted white light is 80 or more,
wherein the white light emitting module satisfies at least one of the following conditions:
the plurality of first white LED packages are selected from a plurality of first candidate white LED packages for emitting the first white light, and the plurality of first candidate white LED packages are divided into a plurality of first bins corresponding to a plurality of first color coordinate regions, respectively, a color coordinate of each candidate white LED package of the plurality of first candidate white LED packages is located in a corresponding color coordinate region of the plurality of first color coordinate regions, wherein the plurality of first color coordinate regions are quadrangles in a CIE1931 chromaticity diagram, respectively, and adjacent two quadrangles have a common side, the plurality of first white LED packages are selected from different bins of the plurality of first bins, respectively, and
the plurality of second white LED packages are selected from a plurality of second candidate white LED packages for emitting the second white light, and the plurality of second candidate white LED packages are divided into a plurality of second bins corresponding to a plurality of second color coordinate regions, respectively, color coordinates of each of the plurality of second candidate white LED packages are located in a respective color coordinate region of the plurality of second color coordinate regions, wherein the plurality of second color coordinate regions are quadrangles in a CIE1931 chromaticity diagram, respectively, and adjacent two quadrangles have a common side, and the plurality of second white LED packages are selected from different bins of the plurality of second bins, respectively.
16. The white light emitting module of claim 15, wherein a difference between color coordinates of the white light having the changed color temperature and a black body locus in a CIE1931 chromaticity diagram remains within 0.005.
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Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10893587B2 (en) 2016-09-23 2021-01-12 Feit Electric Company, Inc. Light emitting diode (LED) lighting device or lamp with configurable light qualities
US9801250B1 (en) 2016-09-23 2017-10-24 Feit Electric Company, Inc. Light emitting diode (LED) lighting device or lamp with configurable light qualities
US10334678B2 (en) * 2016-10-07 2019-06-25 Eaton Intelligent Power Limited Single control LED dimming and white tuning
US10085320B1 (en) * 2016-10-21 2018-09-25 Peter Sussman Pre-calibrated light box
US10813197B2 (en) * 2017-04-10 2020-10-20 Ideal Industries Lighting Llc Wireless solid state lighting controller
US10158626B1 (en) * 2017-06-16 2018-12-18 International Business Machines Corporation Token-based access control
CN109150306B (en) * 2017-06-16 2020-06-30 深圳清华大学研究院 Visible light communication system and method
CN117352630A (en) 2017-07-13 2024-01-05 索尼公司 Light emitting device, display device, and lighting device
CN107359936B (en) * 2017-07-13 2020-01-03 山东大学 Novel light source based on visible light communication and power distribution method thereof
CN108048079A (en) * 2017-11-27 2018-05-18 广东晶科电子股份有限公司 A kind of red fluorescence powder, white light emitting diode and backlight module
EP3503687B1 (en) * 2017-12-20 2020-08-05 OSRAM GmbH A lighting device and corresponding method for chromatic compensation
JP6658787B2 (en) * 2017-12-22 2020-03-04 日亜化学工業株式会社 Light emitting device
US20190198709A1 (en) 2017-12-22 2019-06-27 Lumileds Llc Iii-nitride multi-color on wafer micro-led enabled by tunnel junctions
KR102078862B1 (en) 2018-01-26 2020-04-07 영남대학교 산학협력단 Apparatus and method for optimizing led lighting
KR102613239B1 (en) * 2018-06-04 2023-12-14 삼성전자주식회사 White light emitting diode module and lighting apparatus
KR102532426B1 (en) * 2018-06-25 2023-05-15 삼성전자주식회사 Electronic device for providing visual effect based on location of user by using light emitting element and method thereof
US10863599B2 (en) * 2018-11-07 2020-12-08 Signify Holding B.V. White light tuning
US20210402210A1 (en) * 2018-11-08 2021-12-30 Ecosense Lighting Inc. Multi-channel bioactive lighting
CN109673078B (en) * 2018-12-14 2021-03-30 深圳和而泰智能照明有限公司 Color temperature adjusting method and device and white light LED
CN109827089B (en) * 2019-02-15 2020-09-11 福建省中科生物股份有限公司 LED vegetation lamp spectrum
CN114128403A (en) * 2019-05-17 2022-03-01 亮锐有限责任公司 User control modality for LED color adjustment
CN110167242B (en) * 2019-06-05 2021-07-13 深圳市光擎光电有限公司 Mixed light adjusting method, device, system and storage medium
CN112206422B (en) * 2019-07-12 2022-07-01 周卓煇 Method for suppressing melatonin secretion by light source and lighting device
US11264530B2 (en) 2019-12-19 2022-03-01 Lumileds Llc Light emitting diode (LED) devices with nucleation layer
US11211527B2 (en) 2019-12-19 2021-12-28 Lumileds Llc Light emitting diode (LED) devices with high density textures
CN111065183B (en) * 2019-12-31 2023-07-25 广东晶科电子股份有限公司 Method and system for controlling illumination intensity of LED table lamp
US20230358370A1 (en) * 2020-01-06 2023-11-09 Optimum Semiconductor Technologies Inc. Improving color rendering accuracy of led lighting device by adding monochromatic light elements
US11564302B2 (en) 2020-11-20 2023-01-24 Feit Electric Company, Inc. Controllable multiple lighting element fixture
US11147136B1 (en) 2020-12-09 2021-10-12 Feit Electric Company, Inc. Systems and apparatuses for configurable and controllable under cabinet lighting fixtures
CN112802833B (en) * 2021-01-13 2022-07-15 河源市众拓光电科技有限公司 Visible light communication array chip LED lamp pearl
USD1011573S1 (en) 2021-03-18 2024-01-16 Milwaukee Electric Tool Corporation Lighting apparatus
CN113301684B (en) * 2021-05-20 2023-12-08 生迪智慧科技有限公司 LED control circuit
US20230215846A1 (en) * 2021-12-30 2023-07-06 Seoul Viosys Co., Ltd. Light emitting device and light emitting module including the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781140A (en) * 2011-05-12 2012-11-14 里德安吉公司 Apparatus and methods for tuning of emitter with multiple LEDs to a single color bin
CN103782092A (en) * 2011-09-08 2014-05-07 Lg伊诺特有限公司 Lighting device and lighting control method

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1758169A3 (en) 1996-08-27 2007-05-23 Seiko Epson Corporation Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same
USRE38466E1 (en) 1996-11-12 2004-03-16 Seiko Epson Corporation Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device
US7208725B2 (en) 1998-11-25 2007-04-24 Rohm And Haas Electronic Materials Llc Optoelectronic component with encapsulant
JP3906654B2 (en) 2000-07-18 2007-04-18 ソニー株式会社 Semiconductor light emitting device and semiconductor light emitting device
WO2003019678A1 (en) 2001-08-22 2003-03-06 Sony Corporation Nitride semiconductor element and production method for nitride semiconductor element
JP2003218034A (en) 2002-01-17 2003-07-31 Sony Corp Method for selective growth, semiconductor light- emitting element, and its manufacturing method
JP3815335B2 (en) 2002-01-18 2006-08-30 ソニー株式会社 Semiconductor light emitting device and manufacturing method thereof
KR100499129B1 (en) 2002-09-02 2005-07-04 삼성전기주식회사 Light emitting laser diode and fabricatin method thereof
US7002182B2 (en) 2002-09-06 2006-02-21 Sony Corporation Semiconductor light emitting device integral type semiconductor light emitting unit image display unit and illuminating unit
KR100545334B1 (en) 2003-03-18 2006-01-24 우리조명 주식회사 LED Lamp for Controlling Color Temperature and Method for Controlling Color Temperature thereof
KR100714639B1 (en) 2003-10-21 2007-05-07 삼성전기주식회사 light emitting device
KR100506740B1 (en) 2003-12-23 2005-08-08 삼성전기주식회사 Nitride semiconductor light emitting device and method of manufacturing the same
US7256557B2 (en) * 2004-03-11 2007-08-14 Avago Technologies General Ip(Singapore) Pte. Ltd. System and method for producing white light using a combination of phosphor-converted white LEDs and non-phosphor-converted color LEDs
KR100664985B1 (en) 2004-10-26 2007-01-09 삼성전기주식회사 Nitride based semiconductor device
US7893631B2 (en) * 2005-04-06 2011-02-22 Koninklijke Philips Electronics N.V. White light luminaire with adjustable correlated colour temperature
KR100665222B1 (en) 2005-07-26 2007-01-09 삼성전기주식회사 Led package with diffusing material and method of manufacturing the same
KR100661614B1 (en) 2005-10-07 2006-12-26 삼성전기주식회사 Nitride semiconductor light emitting device and method of manufacturing the same
EP2372224A3 (en) * 2005-12-21 2012-08-01 Cree, Inc. Lighting Device and Lighting Method
KR100723247B1 (en) 2006-01-10 2007-05-29 삼성전기주식회사 Chip coating type light emitting diode package and fabrication method thereof
KR100735325B1 (en) 2006-04-17 2007-07-04 삼성전기주식회사 Light emitting diode package and fabrication method thereof
KR100930171B1 (en) 2006-12-05 2009-12-07 삼성전기주식회사 White light emitting device and white light source module using same
KR100855065B1 (en) 2007-04-24 2008-08-29 삼성전기주식회사 Light emitting diode package
KR100982980B1 (en) 2007-05-15 2010-09-17 삼성엘이디 주식회사 Plane light source and lcd backlight unit comprising the same
KR101164026B1 (en) 2007-07-12 2012-07-18 삼성전자주식회사 Nitride semiconductor light emitting device and fabrication method thereof
EP2210036B1 (en) * 2007-10-10 2016-11-23 Cree, Inc. Lighting device and method of making
KR100891761B1 (en) 2007-10-19 2009-04-07 삼성전기주식회사 Semiconductor light emitting device, manufacturing method thereof and semiconductor light emitting device package using the same
KR101332794B1 (en) 2008-08-05 2013-11-25 삼성전자주식회사 Light emitting device, light emitting system comprising the same, and fabricating method of the light emitting device and the light emitting system
KR20100030470A (en) 2008-09-10 2010-03-18 삼성전자주식회사 Light emitting device and system providing white light with various color temperatures
KR101530876B1 (en) 2008-09-16 2015-06-23 삼성전자 주식회사 Light emitting element with increased light emitting amount, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device
US8008683B2 (en) 2008-10-22 2011-08-30 Samsung Led Co., Ltd. Semiconductor light emitting device
US7972028B2 (en) 2008-10-31 2011-07-05 Future Electronics Inc. System, method and tool for optimizing generation of high CRI white light, and an optimized combination of light emitting diodes
US8339029B2 (en) 2009-02-19 2012-12-25 Cree, Inc. Light emitting devices and systems having tunable chromaticity
US8558782B2 (en) * 2009-03-24 2013-10-15 Apple Inc. LED selection for white point control in backlights
US8598793B2 (en) * 2011-05-12 2013-12-03 Ledengin, Inc. Tuning of emitter with multiple LEDs to a single color bin
KR20110030967A (en) 2009-09-18 2011-03-24 주식회사 필룩스 Light emitting apparatus
KR20110102062A (en) * 2010-03-10 2011-09-16 삼성엘이디 주식회사 Led device capable of tuning correlated color temperature
KR101080698B1 (en) 2010-04-10 2011-11-08 엘지이노텍 주식회사 Lighting device and method for controlling the same
US8358089B2 (en) 2010-05-08 2013-01-22 Lightel Technologies Inc. Solid-state lighting of a white light with tunable color temperatures
US8890435B2 (en) * 2011-03-11 2014-11-18 Ilumi Solutions, Inc. Wireless lighting control system
KR20130023841A (en) 2011-08-30 2013-03-08 엘지이노텍 주식회사 Correlated color temperature controllable light emitting diode package controlled
KR20130027741A (en) * 2011-09-08 2013-03-18 엘지이노텍 주식회사 Lighting device and lighting control method
CN202419518U (en) * 2011-12-07 2012-09-05 广州市金莱照明科技有限公司 Healthy sterilization lamp
JP6581500B2 (en) 2012-03-19 2019-09-25 シグニファイ ホールディング ビー ヴィ Apparatus, system and method for a multi-channel white light illumination source
CN203718670U (en) 2014-01-22 2014-07-16 杭州谨德医疗技术有限公司 Full-spectrum LED luminous structure for desk lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102781140A (en) * 2011-05-12 2012-11-14 里德安吉公司 Apparatus and methods for tuning of emitter with multiple LEDs to a single color bin
CN103782092A (en) * 2011-09-08 2014-05-07 Lg伊诺特有限公司 Lighting device and lighting control method

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