CN106949955A - A kind of MEMS platform based on optical detection - Google Patents
A kind of MEMS platform based on optical detection Download PDFInfo
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- 238000007689 inspection Methods 0.000 claims description 9
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
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Abstract
The present invention discloses a kind of MEMS platform based on optical detection, including：Main platform body, optical de-tection means and outer enclosure plate；Main platform body includes shaking platform；Main platform body and optical de-tection means are encapsulated in inside confined space by outer enclosure plate shape into confined space；Optical de-tection means include laser, speculum, diode array；Speculum is horizontally fixed at the top of shaking platform, and minute surface is towards the top of outer enclosure plate；Laser and the externally-located package board inside top of diode array, diode array include multiple photodiodes；Diode array is centered around around laser；The illumination that laser is sent is mapped on speculum, and the reflected light formed after the reflection of reflected mirror is irradiated on diode array；The light intensity of Diode Array Detector reflected light.MEMS platform disclosed by the invention, improves the linearity of measurement result, improves accuracy of detection.
Description
Technical Field
The invention relates to the field of micro electro mechanical systems, in particular to a micro electro mechanical system platform based on optical detection.
Background
A Micro-Electro-Mechanical System (MEMS) platform is a Micro-scale platform that is supported by a special support structure. The micro electro mechanical system platform can realize multi-axis motion including vibration, translation and the like under the drive control of MEMS drive technologies such as electrostatic drive, electromagnetic drive, piezoelectric drive and the like, and can be applied to positioning and moving of MEMS small-sized devices.
The MEMS piezoelectric actuator for realizing drive control by utilizing the piezoelectric drive technology has the advantages of small volume, light weight, low price, high displacement resolution, large output force, large bearing load, high response speed, large instantaneous acceleration and the like, is widely concerned, and is a device suitable for providing high-resolution positioning and high-dynamic motion characteristics for a micro-electro-mechanical system platform.
However, the piezoelectric material used in the MEMS piezoelectric actuator is prone to creep, and the positioning accuracy and displacement accuracy of the MEMS piezoelectric actuator are greatly reduced under the influence of the creep. Creep is the phenomenon that strain of a fixing material increases with time under the condition of keeping the stress unchanged. Therefore, implementing feedback control for this type of mems platform is an effective way to precisely control the vibrational state of the mems platform.
The feedback control is also called closed-loop control, that is, a control mode for controlling the vibration state of the mems platform according to the output signal of the mems platform, that is, comparing the deviation between the output vibration and the expected vibration, and eliminating the deviation to obtain the expected vibration output. Therefore, to apply feedback control to the MEMS platform, the vibration state of the MEMS platform must be monitored.
In the prior art, the technical means for monitoring the vibration state of the mems platform mostly adopts the technical means of integrating a capacitor detection structure on the back of the mems platform to detect the vibration state of the mems platform, that is, a flat capacitor structure is integrated on the lower surface of the mems platform and the upper surface of the base, and the acceleration value of the vibration generated by the mems platform can be measured by measuring the output current of the flat capacitor.
However, the biggest problem of using the plate capacitor to measure the vibration is that the capacitance value is not linear with the displacement change of the mems platform in the vibration process, and needs to be corrected additionally, and because the capacitance value is small, the requirement on the input impedance of the measurement circuit is high, and the influence of factors such as parasitic capacitance and the like makes the signal processing difficult, the linearity of the measurement result of the technical means of integrating the capacitance detection structure on the mems platform is poor, and the detection precision is not high enough.
Disclosure of Invention
The invention aims to provide an optical detection micro electro mechanical system platform, which improves the linearity of a measurement result and improves the detection precision.
In order to achieve the purpose, the invention provides the following scheme:
an optical inspection-based mems platform, comprising: the optical detection device comprises a platform main body, an optical detection mechanism and an external packaging plate; the platform body comprises a vibration platform; the external packaging plate forms a closed space, and the platform main body and the optical detection mechanism are packaged in the closed space; the optical detection mechanism comprises a laser, a reflector and a diode array; the reflector is horizontally fixed on the top of the vibration platform, and the mirror surface faces the top of the external packaging plate; the laser and the diode array are located inside the top of the outer package plate, the diode array comprising a plurality of photodiodes; the diode array surrounding the laser; the light emitted by the laser irradiates the reflecting mirror, and reflected light formed after the light is reflected by the reflecting mirror irradiates the diode array; the diode array detects the intensity of the reflected light.
Optionally, the diode array comprises a first array and a second array; the first array is positioned at the periphery of the laser; the second array is located at the periphery of the first array; the number and arrangement of the photodiodes in the first array is the same as the number and arrangement of the photodiodes in the second array.
Optionally, the connecting lines of all adjacent photodiodes in the first array form an equilateral polygon; and the connecting lines of all the adjacent photodiodes in the second array form an equilateral polygon.
Optionally, a connection line between the position of the photodiode in any corner of the equilateral polygon in the second array and the corresponding position of the photodiode in the first array passes through the position of the laser.
Optionally, the optical detection mechanism further comprises a bias electrode; the bias electrode is installed on the external packaging plate, the laser and the diode array are electrically connected with an external device through the bias electrode, and the external device comprises a power supply for providing electric energy for the laser and a data processing device for analyzing electric signals of the diode array.
Optionally, the data processing device calculates the optical path of the light emitted by the laser according to the light intensity of the reflected light detected by the diode array; and determining the vibration state of the vibration platform according to the change of the optical path.
Optionally, the platform main body further comprises a driving structure, and the driving structure is located at the bottom and around the vibration platform and drives the vibration platform to vibrate.
Optionally, the driving structure includes a horizontal driving structure and a vertical driving structure; the horizontal driving structure is positioned at the periphery of the vibration platform and drives the vibration platform to generate horizontal vibration; the vertical driving structure is positioned at the bottom of the vibration platform and drives the vibration platform to generate vertical vibration.
Optionally, the platform body further comprises a support structure; the support structure is used for supporting the vibration platform and the driving structure.
According to the specific embodiment provided by the invention, the invention discloses the following technical effects: the optical detection mechanism is integrated on the platform main body, the reflecting mirror of the optical detection mechanism is arranged on the vibration platform, and the reflecting mirror can generate corresponding displacement along with the vibration of the vibration platform, so that the light intensity of reflected light irradiating on the diode is changed, and the vibration state of the vibration platform can be analyzed by detecting the change of the light intensity. The detection device can ensure that the displacement generated by the vibration platform in the vibration process has a linear relation with the detected light intensity, improves the linearity of the measurement result and improves the detection precision. Meanwhile, the optical detection mechanism and the platform main body are mutually independent, so that the independence of the production process is ensured, and the assembly and disassembly are convenient. The optical detection mechanism can be applied to various micro-electro-mechanical systems and has universality because the arrangement of the optical detection mechanism does not influence the motion state of the platform main body and has no great correlation on the physical structure.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a block diagram of an apparatus for an optical inspection-based MEMS platform according to a first embodiment of the present invention;
FIG. 2 is a block diagram of an optical inspection mechanism according to a first embodiment of the present invention;
FIG. 3 is a block diagram of an optical inspection mechanism of a MEMS stage according to a second embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
FIG. 1 is a block diagram of an exemplary MEMS platform based on optical inspection.
Referring to fig. 1, the mems platform based on optical detection includes: the device comprises a platform main body 1, an optical detection mechanism 2 and an external packaging plate 3;
the platform body 1 comprises a vibration platform 101, a driving structure 102 and a supporting structure 103; the driving structures 102 are located at the bottom and the periphery of the vibration platform 101 and drive the vibration platform 101 to vibrate; the supporting structure 103 is used for supporting the vibration platform 101 and the driving structure 102; the driving structure 102 includes a horizontal driving structure 1021 and a vertical driving structure 1022; the horizontal driving structure 1021 is positioned around the vibration platform 101 and drives the vibration platform 101 to generate horizontal vibration; the vertical driving structure 1022 is located at the bottom of the vibration platform 101, and drives the vibration platform 101 to generate vertical vibration;
the external packaging plate 3 forms a closed space, and the platform main body 1 and the optical detection mechanism 2 are packaged in the closed space; the external packaging plate 3 is made of silicon material and is processed by a deep silicon etching method.
The optical detection mechanism 2 comprises a laser 201, a reflector 202, a diode array 203 and a bias electrode 204; the reflector 202 is horizontally fixed on the top of the vibrating platform 101, and the mirror surface faces to the top of the external packaging plate 3; the Laser 201 is a Vertical Cavity Surface Emitting Laser (VCSEL), the Laser 201 and the diode array 203 are located on the inner side of the top of the external package board 3, and the diode array 203 includes a plurality of photodiodes; the diode array 203 surrounds the laser 201; the light emitted by the laser 201 is irradiated onto the reflecting mirror 202, and the reflected light formed after the reflection of the reflecting mirror 202 is irradiated onto the diode array 203; the diode array 203 detects the intensity of the reflected light. The bias electrode 204 is mounted on the external packaging plate 3, the laser 201 and the diode array 203 are electrically connected with an external device through the bias electrode 204, and the external device comprises a power supply for providing electric energy for the laser and a data processing device for analyzing electric signals of the diode array; the bias electrode 204 is a lead-out wire on the laser 201 and the diode array 203, and the bias electrode 204 passes through a lead-out through hole on the external packaging plate 3; the lead-out Through hole is processed by a Through Silicon Via (TSV) technology; the laser 201 and the diode array 203 are flip-chip mounted on top of the external package board 3.
The data processing device calculates the optical path of the light emitted by the laser 201 according to the light intensity of the reflected light detected by the diode array 203; and determining the vibration state of the vibration platform 101 according to the change of the optical path.
FIG. 2 is a block diagram of an optical inspection mechanism according to a first embodiment of the present invention.
Referring to fig. 2, the diode array 203 includes a first array 2031 and a second array 2032; the first array 2031 is located at the periphery of the laser 201; the second array 2032 is located at the periphery of the first array 2031; the number and arrangement of the photodiodes in the first array 2031 is the same as the number and arrangement of the photodiodes in the second array 2032. In this embodiment, the number of photodiodes in the first array 2031 and the second array 2032 is 8.
The lines of all adjacent photodiodes in the first array 2031 form an equilateral polygon; the lines connecting all adjacent photodiodes in the second array 2032 form an equilateral polygon. The connection line between the photodiode position of any corner of the equilateral polygon in the second array 2032 and the corresponding photodiode position of the first array 2031 passes through the position of the laser 201, that is, any side of the equilateral polygon of the first array 2031 is parallel to the corresponding side of the equilateral polygon of the second array 2032. In this embodiment, the lines connecting all adjacent photodiodes in the first array 2031 form an equilateral octagon, and the lines connecting all adjacent photodiodes in the second array 2032 form an equilateral octagon.
The detection principle of the vibration state of the vibration platform is as follows: when the vibration platform 101 vibrates, the reflector 202 is driven by the vibration platform 101 to vibrate synchronously, and when light emitted by the laser 201 irradiates the reflector 202, the optical path of the light emitted by the laser 201 changes due to the continuous change of the position of the reflector 202, so that the light intensity reaching the diode array 203 changes; the light intensity of the reflected light detected by the diode array 203 can obtain the change of the optical path of the light emitted from the laser 201, so that the vibration state of the vibration platform 101 can be obtained through analysis according to the change of the optical path.
The detection device can ensure that the displacement generated by the vibration platform in the vibration process has a linear relation with the detected light intensity, improves the linearity of the measurement result and improves the detection precision. Meanwhile, the optical detection mechanism and the platform main body are mutually independent, so that the independence of the production process is ensured, and the assembly and disassembly are convenient. The optical detection mechanism can be applied to various micro-electro-mechanical systems and has universality because the arrangement of the optical detection mechanism does not influence the motion state of the platform main body and has no great correlation on the physical structure.
The method for detecting the motion state of the vibrating platform by utilizing the micro electro mechanical system platform based on optical detection comprises the following steps:
establishing a rectangular coordinate system by taking the laser 201 as an origin and taking the emitting direction of the light emitted by the laser 201 as a z-axis, and acquiring the light intensity of each coordinate position (x, y, z):
wherein I (x, y, z) represents the light intensity at the coordinate position (x, y, z); p represents the total power of the light emitted by the laser; w (z) represents the radius of the light after a z-distance of emission downward, andawindicating the divergence angle of the light emitted by the laser.
Acquiring the optical power detected by each photodiode in the first array;
acquiring the optical power detected by each photodiode in the second array;
calculating the sum of the optical powers detected by all the photodiodes in the first array to obtain the total optical power of the first array;
calculating the sum of the optical power detected by each photodiode in the second array to obtain the total optical power of the second array;
comprehensively analyzing the optical path of the light by the total optical power of the first array, the total optical power of the second array and the light intensity at the coordinate position (x, y, z);
and determining the vibration state of the vibration platform according to the optical path of the light.
Or,
establishing a rectangular coordinate system by taking the laser 201 as an origin and taking the emitting direction of the light emitted by the laser 201 as a z-axis, and acquiring the light intensity of each coordinate position (x, y, z);
calculating the difference values of the optical power detected by all two photodiodes which are symmetrical relative to the center of the origin in the first array to obtain the difference value of the first array;
calculating the difference values of the optical power detected by all the two photodiodes which are symmetrical relative to the center of the origin in the second array to obtain the difference values of the second array;
calculating the difference value of the optical power detected by the photodiodes in the first array and the second array opposite to the direction of the origin to obtain the difference value between the arrays;
comprehensively analyzing the light path of the light by the first array differential value, the second array differential value, the inter-array differential value and the light intensity at the coordinate position (x, y, z);
and determining the vibration state of the vibration platform according to the optical path of the light.
In the present invention, the distance z between the mirror 202 and the laser 201mDirectly influencing the linearity between the detected optical power and the optical path, in the present invention, the total optical power of the first array and the distance z are usedmAnd a second array sumOptical power and distance zmThe relationship (2) is explained as an example. When the distance between the reflecting mirror 202 and the laser 201 is set to be 1000 μm to 1200 μm or 3900 μm to 4400 μm, a good linear relationship between the detected optical power and the optical path can be ensured, so that the detection accuracy is improved. When the optical path is determined according to the total optical power of the first array, the distance between the reflector 202 and the laser 201 is set to be 1000-1200 μm, so that the detection precision is better than 0.8 μm, and the measurement error is limited within 0.4%; when the optical path is determined by the total optical power of the second array, the distance between the reflecting mirror 202 and the laser 201 is set to be 3900-4400 μm, so that the detection precision is better than 6 μm, and the measurement error is limited within 1.2%.
FIG. 3 is a block diagram of an optical inspection mechanism of a MEMS stage according to a second embodiment of the present invention.
Referring to fig. 3, in this embodiment, the other device is the same as the device of the first embodiment of the mems platform based on optical detection, except that the lines of all the adjacent photodiodes in the first array 2031 of this embodiment form an equilateral quadrilateral, and the lines of all the adjacent photodiodes in the second array 2032 form an equilateral quadrilateral.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The principles and embodiments of the present invention have been described herein using specific examples, which are provided only to help understand the method and the core concept of the present invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (9)
1. An optical inspection-based mems platform, comprising: the optical detection device comprises a platform main body, an optical detection mechanism and an external packaging plate; the platform body comprises a vibration platform; the external packaging plate forms a closed space, and the platform main body and the optical detection mechanism are packaged in the closed space; the optical detection mechanism comprises a laser, a reflector and a diode array; the reflector is horizontally fixed on the top of the vibration platform, and the mirror surface faces the top of the external packaging plate; the laser and the diode array are located inside the top of the outer package plate, the diode array comprising a plurality of photodiodes; the diode array surrounding the laser; the light emitted by the laser irradiates the reflecting mirror, and reflected light formed after the light is reflected by the reflecting mirror irradiates the diode array; the diode array detects the intensity of the reflected light.
2. An optical detection-based mems platform as claimed in claim 1, wherein the diode array includes a first array and a second array; the first array is positioned at the periphery of the laser; the second array is located at the periphery of the first array; the number and arrangement of the photodiodes in the first array is the same as the number and arrangement of the photodiodes in the second array.
3. An optical detection-based mems platform as claimed in claim 2, wherein the connections of all adjacent photodiodes in the first array form an equilateral polygon; and the connecting lines of all the adjacent photodiodes in the second array form an equilateral polygon.
4. An optical detection-based mems platform as claimed in claim 3, wherein the line connecting the position of the photodiode in any corner of the equilateral polygon in the second array with the corresponding position of the photodiode in the first array passes through the position of the laser.
5. An optical detection-based mems platform as claimed in claim 1, wherein the optical detection mechanism further comprises a bias electrode; the bias electrode is installed on the external packaging plate, the laser and the diode array are electrically connected with an external device through the bias electrode, and the external device comprises a power supply for providing electric energy for the laser and a data processing device for analyzing electric signals of the diode array.
6. An optical detection-based mems platform as claimed in claim 5, wherein the data processing device calculates the optical path length of the light emitted from the laser based on the intensity of the reflected light detected by the diode array; and determining the vibration state of the vibration platform according to the change of the optical path.
7. The mems platform of claim 1, wherein the platform body further comprises a driving structure disposed at the bottom and around the vibration platform for driving the vibration platform to vibrate.
8. An optical detection-based mems platform as claimed in claim 7, wherein the driving structure includes a horizontal driving structure and a vertical driving structure; the horizontal driving structure is positioned at the periphery of the vibration platform and drives the vibration platform to generate horizontal vibration; the vertical driving structure is positioned at the bottom of the vibration platform and drives the vibration platform to generate vertical vibration.
9. An optical inspection-based mems platform as claimed in claim 8, wherein the platform body further includes a support structure; the support structure is used for supporting the vibration platform and the driving structure.
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| CN108827448A (en) * | 2018-07-28 | 2018-11-16 | 天津大学 | Vibration and inclination measuring system and method based on plane mirror and photovoltaic array |
| WO2020088535A1 (en) * | 2018-10-30 | 2020-05-07 | 苏州晶方半导体科技股份有限公司 | Chip packaging structure and packaging method |
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