CN106941123A - Solar chip method for packing for solar telephone - Google Patents
Solar chip method for packing for solar telephone Download PDFInfo
- Publication number
- CN106941123A CN106941123A CN201710174887.XA CN201710174887A CN106941123A CN 106941123 A CN106941123 A CN 106941123A CN 201710174887 A CN201710174887 A CN 201710174887A CN 106941123 A CN106941123 A CN 106941123A
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- CN
- China
- Prior art keywords
- solar
- solar chip
- packing
- telephone
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 63
- 238000012856 packing Methods 0.000 title claims abstract description 40
- 239000003292 glue Substances 0.000 claims abstract description 24
- 230000001681 protective effect Effects 0.000 claims abstract description 12
- 239000007921 spray Substances 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 7
- 239000002519 antifouling agent Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 6
- 230000008023 solidification Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims 2
- 238000006748 scratching Methods 0.000 abstract description 4
- 238000004140 cleaning Methods 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000037237 body shape Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000003678 scratch resistant effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/03—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
- B60R16/033—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for characterised by the use of electrical cells or batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The invention discloses a kind of solar chip method for packing for solar telephone, including：Spray treatment, by glue even application at the back side of solar chip；Side of the solar chip with glue is bonded on car body top cover；Curing process is carried out to the solar chip；Cover plate is covered in the front of the solar chip；Protective treatment is carried out above the cover plate.Glue formed on solar chip by spray treatment provided by the present invention for the solar chip method for packing of solar telephone, solar chip is bonded on car body top cover and after curing process again, cover plate is covered on solar chip again to form encapsulating structure, protective treatment is finally carried out on the cover plate of encapsulating structure, waterproof, the purpose of Anti-scratching are realized, the encapsulating structure for having carried out protective treatment is also easy to cleaning.Operation and control are also easy to provided by the present invention for the solar chip method for packing of solar telephone.
Description
Technical field
The present invention relates to the encapsulation technology of solar chip, more particularly to a kind of solar chip for solar telephone
Method for packing.
Background technology
Solar chip is the important component of solar telephone, for converting light energy into electric energy, so as to be automobile
Power is provided.
In order to protect solar chip not damaged, solar chip of the prior art can all pass through encapsulation process, existing
Have in technology and encapsulated in sealing mode, under its major defect is foregoing sealing long-time use, because for a long time exposed to air and
By ultraviolet irradiation, and produce aging, yellow or rotten so that light transmittance declines, and causes entering for solar chip
Deficiency in light quantity and illuminance quality be not good, and method for packing of the prior art its complex process, and efficiency is low.
The content of the invention
It is an object of the invention to provide a kind of solar chip method for packing for solar telephone, to solve existing skill
The problem of in art, the light-inletting quantity of solar chip is improved, simplify technique, improve packaging efficiency.
The invention provides a kind of solar chip method for packing for solar telephone, wherein, including：
Spray treatment, by glue even application at the back side of solar chip；
Side of the solar chip with glue is bonded on car body top cover；
Curing process is carried out to the solar chip；
Cover plate is covered in the front of the solar chip；
Protective treatment is carried out above the cover plate.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, methods described is also
Including：Groove is opened up on car body top cover；
After side of the solar chip with glue is bonded on car body top cover, methods described also includes：Will
Bypass diode is arranged in the trench.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, covered by cover plate
Cover after the front of the solar chip, methods described also includes：The cover plate and the solar chip are formed
Packaging body carries out vacuum pumping, and the packaging body is sealed after vacuum pumping.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, the glue is
One class, two or more different glue are mixed according to set proportion.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, at the spraying
Manage to carry out using the one way in which sprayed, be coated with, brush or scraped.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, at the solidification
Reason is specifically included：Using the one way in which of hot bakings, uviol lamp, infrared ray or natural drying, make the solar chip with
The bypass diode solidification.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, at the solidification
While reason, pressure is applied to the front of the solar chip, the solar chip is pasted on the car body top cover.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, at the protection
Reason is specifically included：One layer of light transmission protecting film of one layer of protective paint or patch is sprayed above the cover plate.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, the cover plate by
A kind of material in PC or acrylic or glass is made.
It is as described above to be used for the solar chip method for packing of solar telephone, these, it is preferred to, in the spraying
Before processing, methods described also includes：Insulation processing is carried out to car body top cover.
Provided by the present invention for the solar chip method for packing of solar telephone, by spray treatment in solar energy core
Glue is formed on piece, then solar chip is bonded on car body top cover and after curing process, then the covering lid on solar chip
Plate finally carries out protective treatment to form encapsulating structure on the cover plate of encapsulating structure, realizes waterproof, the mesh of Anti-scratching
, the encapsulating structure for having carried out protective treatment is also easy to cleaning.Provided by the present invention for the solar chip of solar telephone
Method for packing is also easy to operation and control.
Brief description of the drawings
Fig. 1 is the flow chart for the solar chip method for packing for solar telephone that the embodiment of the present invention one is provided；
Fig. 2 is the structure section figure after solar chip is encapsulated；
Fig. 3 is the flow chart for the solar chip method for packing for solar telephone that the embodiment of the present invention two is provided.
Description of reference numerals：
Gusset 2- solar chip 3- car body top cover 4- cover plates on the right side of 1-
Embodiment
Embodiments of the invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning to end
Same or similar label represents same or similar element or the element with same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not construed as limiting the claims.
Embodiment one
Fig. 1 is the flow chart for the solar chip method for packing for solar telephone that the embodiment of the present invention one is provided,
Fig. 2 is the structure section figure after solar chip is encapsulated.As shown in figure 1, being used for solar energy the embodiments of the invention provide one kind
The solar chip method for packing of automobile, incorporated by reference to Fig. 2, the solar chip 2 is used for the vehicle body top for being fixed on solar telephone
On lid 3, solar energy is absorbed, and convert solar energy into electric energy to drive automobile or power for automobile.The edge of car body top cover 3 with
Gusset is fixedly connected, in Fig. 2 by taking right side gusset 1 as an example, and car body top cover 3 has sink structures, is provided by the embodiment of the present invention
Method for packing solar chip 2 is fixed in the sink structures of above-mentioned car body top cover 3.It the following specifically describes implementation of the present invention
The solar chip method for packing for solar telephone that example is provided.
The method for packing comprises the following steps：
Step S100, spray treatment, by glue even application at the back side of solar chip 2.
As a kind of perferred technical scheme, the spray treatment can be to utilize the one of which side for spraying, being coated with, brush or scraping
Formula is carried out.Wherein, glue can according to set proportion mix for a class, two or more different glue.For example, can be with
Mixed using the 90% industrial glue (technicoll 9145) of model 9145 and 10% industrial glue (technicoll)
Close.
Preferably,, can also be to vehicle body in order to ensure the normal work of solar chip 2 before step S100
Top cover 3 carries out insulation processing, such as setting resin bed or insulated paint on car body top cover 3, can be selected according to entire vehicle design
The material of suitable color and color and luster.
Step S200, the side that the solar chip 2 is carried into glue are bonded on car body top cover 3.
Solar chip 2, can first be placed on the setting position in the sink structures of car body top cover 3, then carry out by reference picture 2
Bonding.
Preferably, in order to arrange bypass diode, this method also includes：Groove is opened up on car body top cover.The step
It can be carried out in any suitable procedures, for example, can be carried out before step S100.
After step S200, the method for packing also includes：Bypass diode is arranged in above-mentioned groove.Specifically may be used
With the design arranged according to vehicle body, bypass diode is arranged in the suitable grooved position of car body top cover 3, makes its precise positioning.
Step S300, to the solar chip 2 carry out curing process.
After by solar chip 2 and bypass diode positioning, solar chip 2 (and bypass diode) is consolidated
Change is handled.
The curing process may particularly include：Using the one way in which of hot baking, uviol lamp, infrared ray or natural drying,
Solidify the solar chip 2 and the bypass diode.
As a kind of preferred implementation, while solar chip 2 and bypass diode slowly solidify, to the sun
The front of energy chip 2 applies pressure, solar chip 2 is pasted on car body top cover 3, until solidification completion.
Step S400, the front that cover plate 4 is covered in the solar chip 2.
Cover plate 4 can be made up of a kind of material in PC or acrylic or glass, be adapted to vehicle body shape, be covered in the sun
Above energy chip 2.
Preferably, after step S400, the packaging body of cover plate 4 and the formation of solar chip 2 is vacuumized
Operation, is sealed after vacuum pumping to the packaging body, so as to avoid steam or air from entering cover plate 4 and solar energy
Gap between chip 2, influences the function of solar chip.
It should be noted that above-mentioned cover plate is the cover plate with high transmission rate, so that ensure its translucency, it is as maximum as possible
The conversion ratio of the raising solar energy of change.
Step S500, above the cover plate 4 carry out protective treatment.
Protective treatment can specifically include：One layer of light transmission protecting film of one layer of protective paint or patch is sprayed above the cover plate.
It should be noted that the protective paint is scratch resistant paint, the characteristic with Anti-scratching and anti-chemical corrosion.
Embodiment two
Fig. 3 is the flow chart for the solar chip method for packing for solar telephone that the embodiment of the present invention two is provided,
Reference picture 3, the embodiment of the present invention two is illustrated with a kind of preferred concrete scheme.
The embodiment of the present invention two provides a kind of solar chip method for packing for solar telephone, and this method includes
Following steps：
Step S05, groove is opened up on car body top cover.
Step S10, to car body top cover carry out insulation processing, to ensure the normal work of solar chip.
Step S20, spray treatment, by glue even application at the back side of solar chip.The spray treatment can be profit
Carried out with the one way in which sprayed, be coated with, brush or scraped.Wherein, glue can for a class, two or more different glue according to
The ratio of setting is mixed.
Step S30, the side that the solar chip is carried into glue are bonded on car body top cover.
Step S40, by bypass diode arrangement in the trench.The design that can be specifically arranged according to vehicle body, will bypass two
Pole pipe is arranged in the suitable grooved position of car body top cover, makes its precise positioning.
Step S50, to the solar chip carry out curing process.The curing process may particularly include：Utilize heat baking, purple
Outer lamp, infrared ray or the one way in which of natural drying, solidify the solar chip and the bypass diode.Too
While positive energy chip 2 and bypass diode slowly solidify, pressure is applied to the front of solar chip 2, makes solar chip 2
It is pasted on car body top cover 3, until solidification is completed.
Step S60, the front that cover plate is covered in the solar chip.Cover plate can be by PC or acrylic or glass
In a kind of material be made, be adapted to vehicle body shape, be covered in above solar chip.
Step S70, the packaging body to cover plate and solar chip formation carry out vacuum pumping, right after vacuum pumping
The packaging body is sealed.So as to avoid the gap that steam or air are entered between cover plate and solar chip, influence is too
The function of positive energy chip.
Step S80, protective treatment is carried out above the cover plate.Protective treatment can specifically include：In the cover plate
Above spray one layer of protective paint or patch one layer of light transmission protecting film.
It should be noted that the protective paint is scratch resistant paint, the characteristic with Anti-scratching and anti-chemical corrosion.
Construction, feature and the action effect of the present invention, above institute is described in detail according to the embodiment shown in schema above
Only presently preferred embodiments of the present invention is stated, but the present invention is not to limit practical range shown in drawing, it is every according to structure of the invention
Want made change, or be revised as the Equivalent embodiments of equivalent variations, still without departing from specification with illustrating during covered spirit,
All should be within the scope of the present invention.
Claims (10)
1. a kind of solar chip method for packing for solar telephone, it is characterised in that including：
Spray treatment, by glue even application at the back side of solar chip；
Side of the solar chip with glue is bonded on car body top cover；
Curing process is carried out to the solar chip；
Cover plate is covered in the front of the solar chip；
Protective treatment is carried out above the cover plate.
2. the solar chip method for packing according to claim 1 for solar telephone, it is characterised in that the side
Method also includes：Groove is opened up on car body top cover；
After side of the solar chip with glue is bonded on car body top cover, methods described also includes：Will bypass
Diode is arranged in the trench.
3. the solar chip method for packing according to claim 2 for solar telephone, it is characterised in that in Jiang Gai
Plate is covered in after the front of the solar chip, and methods described also includes：To the cover plate and the solar chip shape
Into packaging body carry out vacuum pumping, the packaging body is sealed after vacuum pumping.
4. the solar chip method for packing for solar telephone according to claim any one of 1-3, its feature exists
In the glue is a class, two or more different glue are mixed according to set proportion.
5. the solar chip method for packing for solar telephone according to claim any one of 1-3, its feature exists
In the spray treatment is to be carried out using the one way in which sprayed, be coated with, brush or scraped.
6. the solar chip method for packing according to claim 2 for solar telephone, it is characterised in that described solid
Change processing is specifically included：Using the one way in which of hot baking, uviol lamp, infrared ray or natural drying, make the solar energy core
Piece and bypass diode solidification.
7. the solar chip method for packing according to claim 6 for solar telephone, it is characterised in that described solid
While changing processing, pressure is applied to the front of the solar chip, the solar chip is pasted in the vehicle body top
Cover.
8. the solar chip method for packing for solar telephone according to any one of claim 1-3,6 or 7, it is special
Levy and be, the protective treatment is specifically included：One layer of light transmission protecting film of one layer of protective paint or patch is sprayed above the cover plate.
9. the solar chip method for packing according to claim 8 for solar telephone, it is characterised in that the lid
Plate is made up of a kind of material in PC or acrylic or glass.
10. the solar chip method for packing for solar telephone according to any one of claim 1-3,6 or 7, its
It is characterised by, before the spray treatment, methods described also includes：Insulation processing is carried out to car body top cover.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710112360 | 2017-02-28 | ||
| CN2017101123604 | 2017-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106941123A true CN106941123A (en) | 2017-07-11 |
Family
ID=59464293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710174887.XA Pending CN106941123A (en) | 2017-02-28 | 2017-03-22 | Solar chip method for packing for solar telephone |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106941123A (en) |
| WO (1) | WO2018157577A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018157577A1 (en) * | 2017-02-28 | 2018-09-07 | 东汉新能源汽车技术有限公司 | Solar chip packaging method for solar car |
| CN111746655A (en) * | 2019-03-27 | 2020-10-09 | 东汉新能源汽车技术有限公司 | Automobile top cover and automobile |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112038450B (en) * | 2020-09-03 | 2022-04-19 | 安徽恩吉光电股份有限公司 | Photovoltaic module's processing equipment |
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| CN106941123A (en) * | 2017-02-28 | 2017-07-11 | 东汉新能源汽车技术有限公司 | Solar chip method for packing for solar telephone |
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- 2017-03-22 CN CN201710174887.XA patent/CN106941123A/en active Pending
- 2017-09-13 WO PCT/CN2017/101488 patent/WO2018157577A1/en active Application Filing
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| CN2845175Y (en) * | 2005-05-19 | 2006-12-06 | 武汉日新科技有限公司 | Solar battery assembly against hot pot effect |
| US20130032192A1 (en) * | 2006-08-18 | 2013-02-07 | Nanosolar, Inc. | Methods and devices for large-scale solar installations |
| CN105826414A (en) * | 2016-03-28 | 2016-08-03 | 成都振中电气有限公司 | Solar panel automatic production system |
| CN205736839U (en) * | 2016-05-13 | 2016-11-30 | 成都易思科科技有限公司 | A kind of solar telephone skylight of reinforcing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2018157577A1 (en) * | 2017-02-28 | 2018-09-07 | 东汉新能源汽车技术有限公司 | Solar chip packaging method for solar car |
| CN111746655A (en) * | 2019-03-27 | 2020-10-09 | 东汉新能源汽车技术有限公司 | Automobile top cover and automobile |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018157577A1 (en) | 2018-09-07 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170711 |
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| RJ01 | Rejection of invention patent application after publication |