CN106936431A - A kind of high performance low noise chip and its manufacture method - Google Patents
A kind of high performance low noise chip and its manufacture method Download PDFInfo
- Publication number
- CN106936431A CN106936431A CN201511024646.4A CN201511024646A CN106936431A CN 106936431 A CN106936431 A CN 106936431A CN 201511024646 A CN201511024646 A CN 201511024646A CN 106936431 A CN106936431 A CN 106936431A
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- Prior art keywords
- solder joint
- analog
- stitch
- digital converter
- draws
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
- H03M1/06—Continuously compensating for, or preventing, undesired influence of physical parameters
- H03M1/08—Continuously compensating for, or preventing, undesired influence of physical parameters of noise
- H03M1/0845—Continuously compensating for, or preventing, undesired influence of physical parameters of noise of power supply variations, e.g. ripple
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Analogue/Digital Conversion (AREA)
Abstract
The invention discloses a kind of high performance low noise chip, have reference voltage module, analog-digital converter and the signal processing module being connected with analog-digital converter：First draws solder joint, and first draws solder joint is connected with the reference voltage output end of reference voltage module；First stitch, the first stitch draws solder joint and is connected by lead with first；Second draws solder joint, and second draws solder joint is connected with the first stitch by lead, and the second solder joint is connected with the normal phase input end of analog-digital converter；3rd draws solder joint, and the 3rd solder joint is connected with the earth terminal of the earth terminal of reference voltage module, the earth terminal of analog-digital converter and signal processing module；Second stitch, the second stitch draws solder joint and is connected by lead with the 3rd；4th draws solder joint, and the 4th draws solder joint is connected with the second stitch by lead, and the 4th draws solder joint is connected with the reverse input end of analog-digital converter.The present invention also provides a kind of preparation method of high performance low noise chip.
Description
Technical field
The present invention relates to a kind of high performance low noise chip and its manufacture method, more particularly to one kind
The method for packing of high performance low noise chip.
Background technology
Now with integrated circuit development, many modules are all integrated, but these modules
Core be essentially all analog-digital converter, therefore analog-digital converter performance requirement also increasingly
It is high.At present, in chip system, as the requirement performance to analog-digital converter is uprised, to reach
To this high performance requirement, the reference voltage of analog-digital converter includes analog-digital converter requirement
Earth signal as feedback is also critically important.Many at present is all to consider not for this 2 points design
Many, reference voltage is all that the reference voltage module generation for having inside directly feeds analog-digital converter mould
Block, the ground of feedback signal is also that the ground inside directly utilizing directly is connected.Fig. 1 is existing chip
The connection method of middle digital analog converter, reference voltage module 1 in chip remember that voltage is defeated
Go out to hold VREF to be directly connected to the forward reference voltage input end VREFP of analog-digital converter, mould
The earth terminal of number converter, reverse reference voltage input VREFN, reference voltage module connect
Ground terminal and other earth terminals monarch are connected to the stitch of ground connection.This connection is exactly analog-to-digital conversion
The system feedback signal of device and the ground of internal system are lumped together, the entirety of such analog-digital converter
Performance comparision is low, and noise ratio is larger.
The content of the invention
To solve the above problems, the present invention provides a kind of high performance low noise chip, tool benchmark electricity
Die block, analog-digital converter and the signal processing module being connected with the analog-digital converter,
It is also equipped with：
First draws solder joint, and described first to draw solder joint defeated with the reference voltage of the reference voltage module
Go out end to be connected；
First stitch, first stitch draws solder joint and is connected by lead with described first；
Second draws solder joint, and described second draws solder joint is connected with first stitch by lead, institute
The second solder joint is stated to be connected with the normal phase input end of the analog-digital converter；
3rd draws solder joint, the earth terminal of the 3rd solder joint and the reference voltage module, described
The earth terminal of the earth terminal of analog-digital converter and the signal processing module is connected；
Second stitch, second stitch draws solder joint and is connected by lead with the described 3rd；
4th draws solder joint, and the described 4th draws solder joint is connected with second stitch by lead, institute
State the 4th and draw solder joint and be connected with the reverse input end of the analog-digital converter.
The present invention also provides a kind of manufacture method of high performance low noise chip in addition, for manufacturing
Above-mentioned high performance low noise chip, possesses following steps：
The reference voltage output end of the analog-digital converter is connected with first solder joint；Will
Described first draws solder joint draws solder joint and is connected by the lead with described second；By the first pin
Pin is drawn solder joint and is connected by the lead with described second；By described second draw solder joint with it is described
The normal phase input end of analog-digital converter is connected；By the analog-digital converter, the reference voltage
The earth terminal of module and the signal processing module draws solder joint and is connected with the described 3rd；By institute
State the second stitch and draw solder joint with the described 3rd and be connected；Draw solder joint with described second by the described 4th
Stitch is connected by lead；The reverse input for drawing solder joint and the analog-digital converter by the described 4th
End is connected；The chip is packaged.
High performance low noise chip of the invention and its manufacture method, base is produced for chip in itself
Quasi- voltage is filtered so as to the reduction of the burr signal of reference voltage by package lead and external capacitor
To original 1/10th, so as to improve performance；Another voltage is needed to be analog-digital converter
Directly using the ground of outside, the ground of part in opposite chip, burr also drops on zero reference voltage ground
/ 10th of the low ground to chip internal, improve chip performance.
Brief description of the drawings
Fig. 1 is structural representation in existing chip；
Fig. 2 is the structural representation of high performance low noise chip of the invention.
Specific embodiment
Below, with reference to accompanying drawing, structure of the invention and operation principle etc. are made further
It is bright.
As shown in Fig. 2 high performance low noise chip of the invention.Chip internal is by reference voltage
Module and the signal processing module being connected with analog-digital converter are constituted, and analog-digital converter will
Signal is transmitted to signal processing module and carries out corresponding signal transacting.First draws solder joint 1 with benchmark electricity
The reference voltage output end of die block is connected, and the first stitch 3 draws solder joint 1 by lead and first
It is connected, so as to the reference voltage that reference voltage module is exported is guided on the first stitch 3.
Second draws solder joint 2 is connected with the first stitch 3 by lead, and with analog-digital converter just
Phase input is connected, it is achieved thereby that reference voltage is led back analog-to-digital conversion from the first stitch 3
In device.3rd solder joint 6 and the earth terminal of reference voltage module, the earth terminal of analog-digital converter with
And the earth terminal of signal processing module is connected, the second stitch 5 draws solder joint 6 by lead and the 3rd
It is connected, the 4th draws solder joint 4 is connected with the second stitch 5, the anti-phase input of analog-digital converter
Draw solder joint 4 with the 4th and be connected in end.So as to it is zero that analog-digital converter is needed another voltage
Reference voltage ground (inverting input) directly utilization outside ground, part in opposite chip
Ground, burr is also reduced to 1/10th of the ground of chip internal, improves chip performance.
In addition, the present invention also provides a kind of manufacture method of high performance low noise chip, possess with
Lower step：
The reference voltage output end of analog-digital converter is drawn into solder joint 1 with first to be connected；By first
Draw solder joint 1 to be connected with the firstth stitch 3 by lead；First stitch 3 and second are drawn into weldering
Point 2 is connected by lead；The normal phase input end phase for drawing solder joint 2 and analog-digital converter by second
Connection；By analog-digital converter, the earth terminal of reference voltage module and signal processing module and
Three draw solder joint 6 is connected；Second stitch 5 is drawn into solder joint 6 with the 3rd to be connected；4th is drawn
Solder joint 4 is connected with the second stitch 5 by lead；Draw solder joint 4 with analog-digital converter by the 4th
Reverse input end is connected；Then chip is packaged.
High performance low noise chip of the invention and its manufacture method, base is produced for chip in itself
Quasi- voltage is filtered so as to the reduction of the burr signal of reference voltage by package lead and external capacitor
To original 1/10th, so as to improve performance.
More than, schematic description only of the invention, it will be recognized by those skilled in the art that
On the basis of without departing from operation principle of the invention, various improvement can be made to the present invention, this
Belong to protection scope of the present invention.
Claims (2)
1. a kind of high performance low noise chip, tool reference voltage module, analog-digital converter and
The signal processing module being connected with the analog-digital converter, it is characterised in that possess：
First draws solder joint, and described first to draw solder joint defeated with the reference voltage of the reference voltage module
Go out end to be connected；
First stitch, first stitch draws solder joint and is connected by lead with described first；
Second draws solder joint, and described second draws solder joint is connected with first stitch by lead, institute
The second solder joint is stated to be connected with the normal phase input end of the analog-digital converter；
3rd draws solder joint, the earth terminal of the 3rd solder joint and the reference voltage module, described
The earth terminal of the earth terminal of analog-digital converter and the signal processing module is connected；
Second stitch, second stitch draws solder joint and is connected by lead with the described 3rd；
4th draws solder joint, and the described 4th draws solder joint is connected with second stitch by lead, institute
State the 4th and draw solder joint and be connected with the reverse input end of the analog-digital converter.
2. a kind of manufacture method of high performance low noise chip, for manufacturing such as claim 1 institute
The high performance low noise chip stated, it is characterised in that possess following steps：
The reference voltage output end of the analog-digital converter is drawn into solder joint with described first to be connected；
Draw solder joint by described first solder joint is drawn with described second by the lead and be connected；By institute first
Stitch is drawn solder joint and is connected by the lead with described second；Draw solder joint and institute by described second
The normal phase input end for stating analog-digital converter is connected；By the analog-digital converter, benchmark electricity
The earth terminal of die block and the signal processing module draws solder joint and is connected with the described 3rd；Will
Second stitch draws solder joint and is connected with the described 3rd；Draw solder joint with described by the described 4th
Two stitch are connected by lead；Draw solder joint by the described 4th reverse defeated with the analog-digital converter
Enter end to be connected；The chip is packaged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511024646.4A CN106936431B (en) | 2015-12-30 | 2015-12-30 | High-performance low-noise chip and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511024646.4A CN106936431B (en) | 2015-12-30 | 2015-12-30 | High-performance low-noise chip and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106936431A true CN106936431A (en) | 2017-07-07 |
| CN106936431B CN106936431B (en) | 2021-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511024646.4A Active CN106936431B (en) | 2015-12-30 | 2015-12-30 | High-performance low-noise chip and manufacturing method thereof |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1187208A2 (en) * | 2000-08-30 | 2002-03-13 | Hitachi, Ltd. | Semiconductor device |
| CN201681123U (en) * | 2010-05-20 | 2010-12-22 | 威胜集团有限公司 | High-accuracy electric energy metering module |
| CN202195813U (en) * | 2011-09-08 | 2012-04-18 | 杭州电子科技大学 | Underwater multichannel data acquisition circuit |
| CN103985688A (en) * | 2013-02-07 | 2014-08-13 | 扬智科技股份有限公司 | Chip packaging structure |
-
2015
- 2015-12-30 CN CN201511024646.4A patent/CN106936431B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1187208A2 (en) * | 2000-08-30 | 2002-03-13 | Hitachi, Ltd. | Semiconductor device |
| CN201681123U (en) * | 2010-05-20 | 2010-12-22 | 威胜集团有限公司 | High-accuracy electric energy metering module |
| CN202195813U (en) * | 2011-09-08 | 2012-04-18 | 杭州电子科技大学 | Underwater multichannel data acquisition circuit |
| CN103985688A (en) * | 2013-02-07 | 2014-08-13 | 扬智科技股份有限公司 | Chip packaging structure |
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| Publication number | Publication date |
|---|---|
| CN106936431B (en) | 2021-07-20 |
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