CN106929124A - A kind of viscosity modifier, its preparation method and its application - Google Patents
A kind of viscosity modifier, its preparation method and its application Download PDFInfo
- Publication number
- CN106929124A CN106929124A CN201710176520.1A CN201710176520A CN106929124A CN 106929124 A CN106929124 A CN 106929124A CN 201710176520 A CN201710176520 A CN 201710176520A CN 106929124 A CN106929124 A CN 106929124A
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- Prior art keywords
- viscosity modifier
- viscosity
- auxiliary
- preparation
- main
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Classifications
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- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M161/00—Lubricating compositions characterised by the additive being a mixture of a macromolecular compound and a non-macromolecular compound, each of these compounds being essential
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2201/00—Inorganic compounds or elements as ingredients in lubricant compositions
- C10M2201/10—Compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2207/00—Organic non-macromolecular hydrocarbon compounds containing hydrogen, carbon and oxygen as ingredients in lubricant compositions
- C10M2207/04—Ethers; Acetals; Ortho-esters; Ortho-carbonates
- C10M2207/046—Hydroxy ethers
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10M—LUBRICATING COMPOSITIONS; USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATING INGREDIENTS IN A LUBRICATING COMPOSITION
- C10M2209/00—Organic macromolecular compounds containing oxygen as ingredients in lubricant compositions
- C10M2209/10—Macromolecular compoundss obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C10M2209/103—Polyethers, i.e. containing di- or higher polyoxyalkylene groups
- C10M2209/104—Polyethers, i.e. containing di- or higher polyoxyalkylene groups of alkylene oxides containing two carbon atoms only
-
- C—CHEMISTRY; METALLURGY
- C10—PETROLEUM, GAS OR COKE INDUSTRIES; TECHNICAL GASES CONTAINING CARBON MONOXIDE; FUELS; LUBRICANTS; PEAT
- C10N—INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATING COMPOSITIONS
- C10N2020/00—Specified physical or chemical properties or characteristics, i.e. function, of component of lubricating compositions
- C10N2020/01—Physico-chemical properties
- C10N2020/02—Viscosity; Viscosity index
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Medicinal Preparation (AREA)
- Detergent Compositions (AREA)
Abstract
A kind of viscosity modifier, its preparation method and its application, using new formulation, by the viscosity of diethylene glycol (DEG) reduction polyethylene glycol, obtain new mixing viscosity modifier, the reduction of mortar fluid viscosity is may be such that after mixing with carborundum, the overall viscosity of mortar generated in silicon chip cutting is also decreased, and can so be reduced silicon chip and largely be risen piece, bonding die and card line phenomenon, reduces silicon chip loss and fragment.
Description
Technical field
The present invention relates to a kind of viscosity modifier, its preparation method and its application.
Background technology
In cutting, the principle cut to silicon ingot using steel wire appendix mortar is operated silicon chip.The sand for being used at present
Starch as carborundum is formulated by a certain percentage with PEG, carborundum plays dissection, PEG plays suspended carbon SiClx and cooling effect,
Mortar viscosity is controlled mainly by PEG viscosity.PEG is used also known as polyethylene glycol, PEG as mortar viscosity modifier, silicon chip cutting
PEG viscosity between 50-60 mPa.s;Because the viscosity of PEG is higher, thus silicon chip cut used mortar also generally compared with
Height, once mortar viscosity is too high, will produce the substantial amounts of piece that rises, bonding die and card line phenomenon, so as to cause silicon chip during cutting silicon chip
Loss and fragment.
The content of the invention
It is an object of the invention to overcome the too high technical problem of mortar viscosity modifier in the prior art, there is provided one kind is viscous
Degree conditioning agent, its preparation method and its application, it is possible to decrease mortar uses viscosity, improve cutting efficiency.
To solve problem above scheme of the present invention:
The present invention provides a kind of viscosity modifier, it is characterised in that its composition constitutes as follows by weight proportion:
Main viscosity modifier 1.25 --- 4.25
Auxiliary viscosity modifier 1.
A kind of above-mentioned viscosity modifier, its preparation method and its application, it is characterised in that the main viscosity modifier is poly-
Ethylene glycol(PEG).
A kind of above-mentioned viscosity modifier, its preparation method and its application, it is characterised in that the auxiliary viscosity modifier is
Diethylene glycol (DEG)(DEG).
A kind of preparation method of viscosity modifier, it is characterised in that its preparation process is as follows:
(1)Main viscosity modifier is weighed, the main viscosity modifier of constant weight is weighed;
(2)Auxiliary viscosity modifier is weighed, auxiliary viscosity is weighed with main viscosity modifier part by weight by auxiliary viscosity modifier
Conditioning agent;
(3)Main viscosity modifier is mixed with auxiliary viscosity modifier.
A kind of application of viscosity modifier, it is characterised in that its applying step is as follows:
(1)The viscosity modifier that will have been configured is stirred in being added to carborundum, prepares whipping temp at 20-25 degrees Celsius, stirring
Time is more than 6 hours, and stir speed (S.S.) is 45-60r/min, and humidity is less than 50% during stirring, and stirring is completed.
The application of above-mentioned a kind of viscosity modifier, it is characterised in that the viscosity modifier is with the weight ratio of carborundum
1:1.1。
Beneficial effect:
Using new formulation, by the viscosity of diethylene glycol (DEG) reduction polyethylene glycol, new mixing viscosity modifier is obtained, with carborundum
The reduction of mortar fluid viscosity is may be such that after mixing, the overall viscosity of mortar generated in silicon chip cutting is also decreased, and it is big so to reduce silicon chip
Rise piece, bonding die and card line phenomenon are measured, silicon chip loss and fragment is reduced.
Specific embodiment
Specific embodiment of the invention is described in further detail below by way of specific embodiment.
Following examples are used to illustrate the present invention, but are not limited to the scope of the present invention.
The polyethylene glycol that embodiment is used in the present invention(PEG)Viscosity is 52mPa.s, the diethylene glycol (DEG) for being used(DEG)
Viscosity is 30mPa.s.Humidity is stirring ambient humidity indoor at that time during stirring mentioned in the present embodiment.
Embodiment 1:
A kind of preparation method of viscosity modifier, it is characterised in that its preparation process is as follows:
(1)Main viscosity modifier is weighed, main viscosity modifier is polyethylene glycol, weighs the polyethylene glycol of constant weight;
(2)Auxiliary viscosity modifier is weighed, auxiliary viscosity modifier is diethylene glycol (DEG), is adjusted with main viscosity by auxiliary viscosity modifier
Agent weight compares 1:1.25 ratio weighs diethylene glycol (DEG);
(3)The polyethylene glycol that completion will be weighed is mixed with diethylene glycol (DEG), mixing rate 45r/min, is well mixed.
Viscosity modifier obtained above, in 25 DEG C of normal temperature, its viscosity performance is 38.8mPa.s.
Above-mentioned viscosity modifier is applied in mortar preparation, its step is as follows:The viscosity modifier that will have been configured is added
Stirred in carborundum, viscosity modifier is 1 with the weight ratio of carborundum:1.1, whipping temp is prepared in 20 DEG C, mixing time
It it is 6 hours, stir speed (S.S.) is 45r/min, humidity 50% during stirring, stirring is completed.
Experimental example 2
A kind of preparation method of viscosity modifier, it is characterised in that its preparation process is as follows:
(1)Main viscosity modifier is weighed, main viscosity modifier is polyethylene glycol, weighs the polyethylene glycol of constant weight;
(2)Auxiliary viscosity modifier is weighed, auxiliary viscosity modifier is diethylene glycol (DEG), is adjusted with main viscosity by auxiliary viscosity modifier
Agent weight compares 1:4.25 ratio weighs diethylene glycol (DEG);
(3)The polyethylene glycol that completion will be weighed is mixed with diethylene glycol (DEG), mixing rate 60r/min, is well mixed.
Viscosity modifier obtained above, in 25 DEG C of normal temperature, its viscosity performance is 46.2mPa.s.
Above-mentioned viscosity modifier is applied in mortar preparation, its step is as follows:The viscosity modifier that will have been configured is added
Stirred in carborundum, viscosity modifier is 1 with the weight ratio of carborundum:1.1, whipping temp is prepared in 25 DEG C, mixing time
It it is 8 hours, stir speed (S.S.) is 60r/min, humidity 40% during stirring, stirring is completed.
Experimental example 3
A kind of preparation method of viscosity modifier, it is characterised in that its preparation process is as follows:
(1)Main viscosity modifier is weighed, main viscosity modifier is polyethylene glycol, weighs the polyethylene glycol of constant weight;
(2)Auxiliary viscosity modifier is weighed, auxiliary viscosity modifier is diethylene glycol (DEG), is adjusted with main viscosity by auxiliary viscosity modifier
Agent weight compares 1:2.5 ratio weighs diethylene glycol (DEG);
(3)The polyethylene glycol that completion will be weighed is mixed with diethylene glycol (DEG), mixing rate 55r/min, is well mixed.
Viscosity modifier obtained above, in 25 DEG C of normal temperature, its viscosity performance is 42.5mPa.s.
Above-mentioned viscosity modifier is applied in mortar preparation, its step is as follows:The viscosity modifier that will have been configured is added
Stirred in carborundum, viscosity modifier is 1 with the weight ratio of carborundum:1.1, whipping temp is prepared in 23 DEG C, mixing time
It it is 7 hours, stir speed (S.S.) is 55r/min, humidity 45% during stirring, stirring is completed.
Experimental example 4
A kind of preparation method of viscosity modifier, it is characterised in that its preparation process is as follows:
(1)Main viscosity modifier is weighed, main viscosity modifier is polyethylene glycol, weighs the polyethylene glycol of constant weight;
(2)Make auxiliary viscosity modifier, auxiliary viscosity modifier be diethylene glycol (DEG), dodecanol, the mixture of diisocyanate,
Auxiliary adjustment agent is diethylene glycol (DEG), dodecanol, diisocyanate with 5:2:3 part by weight is mixed, and is adjusted by auxiliary viscosity
Section agent compares 1 with main viscosity modifier weight:1.8 ratio weighs auxiliary adjustment agent;
(3)The polyethylene glycol that completion will be weighed is mixed with auxiliary adjustment agent, mixing rate 45r/min, is well mixed.
Viscosity modifier obtained above, in 25 DEG C of normal temperature, its viscosity performance is 35.5mPa.s.
Above-mentioned viscosity modifier is applied in mortar preparation, its step is as follows:The viscosity modifier that will have been configured is added
Stirred in carborundum, viscosity modifier is 1 with the weight ratio of carborundum:1.1, whipping temp is prepared in 22 DEG C, mixing time
It it is 6.5 hours, stir speed (S.S.) is 50r/min, humidity 50% during stirring, stirring is completed.
The only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto, any to be familiar with
Those skilled in the art the invention discloses technical scope in, the change or replacement that can be readily occurred in should all be covered
Within the scope of the present invention.Therefore, the present invention is not limited by the present embodiment, the technology that any use equivalence replacement is obtained
Scheme is in the scope of protection of the invention.
Claims (6)
1. a kind of viscosity modifier, it is characterised in that its composition constitutes as follows by weight proportion:
Main viscosity modifier 1.25 --- 4.25
Auxiliary viscosity modifier 1.
2. a kind of viscosity modifier, its preparation method and its application as claimed in claim 1, it is characterised in that the master glues
Degree conditioning agent is polyethylene glycol(PEG).
3. a kind of viscosity modifier, its preparation method and its application as claimed in claim 1, it is characterised in that the auxiliary
Viscosity modifier is diethylene glycol (DEG)(DEG).
4. a kind of preparation method of viscosity modifier, it is characterised in that its preparation process is as follows:
(1)Main viscosity modifier is weighed, the main viscosity modifier of constant weight is weighed;
(2)Auxiliary viscosity modifier is weighed, auxiliary viscosity is weighed with main viscosity modifier part by weight by auxiliary viscosity modifier
Conditioning agent;
(3)Main viscosity modifier is mixed with auxiliary viscosity modifier.
5. a kind of application of viscosity modifier, it is characterised in that its applying step is as follows:
(1)The viscosity modifier that will have been configured is stirred in being added to carborundum, prepares whipping temp at 20-25 degrees Celsius, stirring
Time is more than 6 hours, and stir speed (S.S.) is 45-60r/min, and humidity is less than 50% during stirring, and stirring is completed.
6. a kind of application of viscosity modifier as claimed in claim 3, it is characterised in that the viscosity modifier and carborundum
Weight ratio be 1:1.1.
Priority Applications (1)
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CN201710176520.1A CN106929124A (en) | 2017-03-23 | 2017-03-23 | A kind of viscosity modifier, its preparation method and its application |
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CN201710176520.1A CN106929124A (en) | 2017-03-23 | 2017-03-23 | A kind of viscosity modifier, its preparation method and its application |
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CN201710176520.1A Pending CN106929124A (en) | 2017-03-23 | 2017-03-23 | A kind of viscosity modifier, its preparation method and its application |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011116956A1 (en) * | 2010-03-23 | 2011-09-29 | Schott Solar Ag | Fluid separating media and use thereof |
CN102433191A (en) * | 2011-10-24 | 2012-05-02 | 江西赛维Ldk太阳能高科技有限公司 | Silicon carbide cutting fluid and using method thereof |
CN104395448A (en) * | 2012-06-29 | 2015-03-04 | 出光兴产株式会社 | Aqueous processing fluid |
CN106635321A (en) * | 2016-11-14 | 2017-05-10 | 武汉宜田科技发展有限公司 | Mortar additive for mortar wire cutting single crystal / polycrystalline silicon wafer |
-
2017
- 2017-03-23 CN CN201710176520.1A patent/CN106929124A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011116956A1 (en) * | 2010-03-23 | 2011-09-29 | Schott Solar Ag | Fluid separating media and use thereof |
CN102433191A (en) * | 2011-10-24 | 2012-05-02 | 江西赛维Ldk太阳能高科技有限公司 | Silicon carbide cutting fluid and using method thereof |
CN104395448A (en) * | 2012-06-29 | 2015-03-04 | 出光兴产株式会社 | Aqueous processing fluid |
CN106635321A (en) * | 2016-11-14 | 2017-05-10 | 武汉宜田科技发展有限公司 | Mortar additive for mortar wire cutting single crystal / polycrystalline silicon wafer |
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Application publication date: 20170707 |