CN106920673B - A method of preparing integrated inductor multiple elements design core layer - Google Patents
A method of preparing integrated inductor multiple elements design core layer Download PDFInfo
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- CN106920673B CN106920673B CN201710238998.2A CN201710238998A CN106920673B CN 106920673 B CN106920673 B CN 106920673B CN 201710238998 A CN201710238998 A CN 201710238998A CN 106920673 B CN106920673 B CN 106920673B
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- 239000012792 core layer Substances 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000008021 deposition Effects 0.000 claims abstract description 24
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 17
- 239000007771 core particle Substances 0.000 claims abstract description 16
- 239000000956 alloy Substances 0.000 claims abstract description 11
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 22
- 239000002131 composite material Substances 0.000 claims description 21
- 238000001994 activation Methods 0.000 claims description 8
- 230000002776 aggregation Effects 0.000 claims description 7
- 229910017052 cobalt Inorganic materials 0.000 claims description 6
- 239000010941 cobalt Substances 0.000 claims description 6
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 6
- 239000003638 chemical reducing agent Substances 0.000 claims description 5
- 239000000243 solution Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 claims description 4
- 230000004913 activation Effects 0.000 claims description 3
- 230000003197 catalytic effect Effects 0.000 claims description 3
- 239000012670 alkaline solution Substances 0.000 claims description 2
- 239000000872 buffer Substances 0.000 claims description 2
- 239000008139 complexing agent Substances 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000011162 core material Substances 0.000 abstract description 36
- 238000000151 deposition Methods 0.000 abstract description 23
- 239000000126 substance Substances 0.000 abstract description 17
- 230000008569 process Effects 0.000 abstract description 7
- 238000004544 sputter deposition Methods 0.000 abstract description 7
- 238000002360 preparation method Methods 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000000975 co-precipitation Methods 0.000 abstract description 4
- 238000003776 cleavage reaction Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract description 3
- 229910021645 metal ion Inorganic materials 0.000 abstract description 3
- 230000007017 scission Effects 0.000 abstract description 3
- 238000004377 microelectronic Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 238000005234 chemical deposition Methods 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- 239000000470 constituent Substances 0.000 description 6
- 238000005238 degreasing Methods 0.000 description 6
- 239000012530 fluid Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 3
- 239000000908 ammonium hydroxide Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 238000004611 spectroscopical analysis Methods 0.000 description 3
- 229910000406 trisodium phosphate Inorganic materials 0.000 description 3
- 238000010792 warming Methods 0.000 description 3
- 229910019586 CoZrTa Inorganic materials 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910020630 Co Ni Inorganic materials 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000005844 autocatalytic reaction Methods 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
Abstract
The invention discloses a kind of methods preparing integrated inductor multiple elements design core layer, are related to microelectronics and printed circuit board field.The present invention can overcome the multicomponent alloy core material that prior art chemical coprecipitation area method is difficult to obtain, and avoid chemical coprecipitation area method and adjust the deposition potential of all metal ions to the defect of similar level performance difficulty；The present invention utilizes the autocatalytic cleavage energy of Ni or Co, the target deposition region that Ni or Co and magnetic core particles are co-deposited to inductance forms the multiple elements design core layer with double structure, it is big that core layer obtained enables to the inductance of inductor to rise in value, simultaneously the present invention preparation method compared to sputtering method have it is simple for process, film forming speed is fast, consume energy few advantage.
Description
Technical field
The present invention relates to microelectronics and printed circuit board field, specially a kind of prepared based on chemical deposition has two-phase
The method of the integrated inductor multiple elements design core layer of structure.
Background technology
As three big important one of passive devices, inductor plays in the circuit modules such as radio frequency, power supply and filtering
Very important effect, thus be indispensable component in electronic product.It is especially portable but with electronic product
Product develops to integration and miniaturization direction, and this requires inductance to be continued to optimize to self performance, reduces volume, reduces
Cost, and with compatibility.
Currently, there are mainly two types of structures for inductor：One is spiral-shaped structures, another is plane winding-type structure
(it can refer to the article that R.K.Ulrich et al. is delivered《Integrated passive component technology》(《Collection
At passive element technology》)).Before core inductance appearance, air core inductor is studied by numerous scholars always.Air core inductor technique
Relatively easy much self-resonant frequency is relatively high, quality factor also relative ideal, but since the inductance value of unit area is low, occupies
Valuable Resources on Chip.And the appearance of core inductance solves the problems, such as this, the increase of core layer can improve inductor
Performance (including inductance value and quality factor).According to physical electromagnetic theory it is found that the inductance value and magnetic core of spiral-shaped structure core inductance
Magnetic conductivity, the magnetic core size of material etc. are directly proportional.The production method of conventional cores layer is sputtered in specific region by mask method
Core material.Although the performances such as material anisotropy, the magnetic conductivity of the core layer that are obtained by sputtering method are more excellent,
After sputtering reaches certain thickness (usually >=4 μm after), the material of core layer is also easy to produce stress and is opened so as to cause its correlated performance
Begin to deteriorate and (can refer to the article that L.Li et al. is delivered《High-frequency responses of granular CoFeHfO
and amorphous CoZrTa magnetic materials》(《The CoFeHfO particles and noncrystalline of high frequency response
CoZrTa magnetic materials》)).And for plane winding-type core inductance, typically in the upper and lower surface of inductance coil point
Not Zhi Zuo core layer form " sandwich " structure, and detached using insulating materials between coil and core material, to reduce it
Eddy-current loss.For the production method of the core layer of the structure, traditional method is also to use sputtering method.So same screw type
Structured core inductance, sputtering method make plane winding-type core inductance and also there is its defect.In addition, due to plane winding-type magnetic core
There are insulating layers between the coil and core layer of inductance, to construct a micro- capacitance so that the structure inductance is in high frequency
The perception for being also easy to produce parasitic capacitance and influencing device requires.In order to overcome sputtering method make inductance magnetic core (including screw type and
Plane winding-type) present in deficiency, based on chemical deposition make inductance core become important method.Particularly with
Spiral-shaped structure core inductance, since chemical deposition belongs to self-catalysis process so that magnetic core alloy prepared by chemical deposition
Material property is stablized, thus can efficiently solve screw type inductance core and make and there is a problem of thickening core layer difficulty.It is existing
In technology, application No. is 201510375350.0 Chinese patents《A kind of preparation method of printed circuit board potting core inductance》
A kind of method that core inductance is prepared by chemical deposition is disclosed, is efficiently solved existing for plane winding-type core inductance
Parasitic capacitance problems.However, to realize the co-deposition between Ni or Co and other metals, it is necessary to by the precipitation of all metal ions
Current potential is adjusted to similar level, and actual implementation is very difficult, therefore it is difficult passing through to cause part multicomponent alloy core material to be
It learns to be co-deposited and realize.
Invention content
For overcome the deficiencies in the prior art, the present invention provides a kind of sides preparing integrated inductor multiple elements design core layer
Method, this method can overcome the multicomponent alloy core material that prior art chemical coprecipitation area method is difficult to obtain, utilize Ni's or Co
Ni or Co and magnetic core particles are co-deposited to the target deposition region of inductance by autocatalytic cleavage energy.
To achieve the above object, the present invention provides the following technical solutions：
A method of preparing integrated inductor multiple elements design core layer：The integrated inductor leaching in target deposition region will be preset with
It steeps in Composite electroless deposit liquid, the Composite electroless deposit liquid is soluble-salt, the second phase material for including the first phase material
The alkaline solution of material, reducing agent, complexing agent and buffer, wherein：First phase material is any in nickel and cobalt or two
Kind, second phase material is magnetic core particles, and the first phase material in Composite electroless deposit liquid acts on similarly hereinafter second in reducing agent
Phase material composite deposition is in integrated inductor surface, to which the integrated inductor multiple elements design core layer with double structure be made.
According to common sense well known to those skilled in the art, if if the target deposition region of integrated inductor does not have catalytic activation
Performance, the invention also includes activation process step, concrete operations are：Integrated inductor is soaked in activated water solutions so that living
Change the active ion in liquid and be reduced into active atomic, and the aggregation of chemical deposition is formed in the target deposition region of integrated inductor
Center.
In the present invention chemical composition of the integrated inductor multiple elements design magnetic core layer material of double structure be nickel and magnetic core particles,
Nickel cobalt (alloy) and magnetic core particles or cobalt and magnetic core particles.
Further, the type of the second phase material (i.e. magnetic core particles) in the present invention is more than one.
The forming process of core layer is the process that nucleus forms then growth, and target deposition region is due to catalytic activation
Performance, so becoming the aggregation center (being reaction center) of chemical deposition, the present invention is suitable by adding in the solution
Reducing agent so that the ion of the first phase material is restored under the autocatalysis in target deposition region, is reduced agent reduction
The first phase material be to be nucleated at aggregation center first, and compound second phase (i.e. at least one magnetic core particles), then constantly
It is grown to all directions, forms the continuously multiple elements design core layer with double structure.
Compared with prior art, the invention has the advantages that：
The present invention utilizes the autocatalytic cleavage energy of Ni or Co, and Ni or Co and magnetic core particles are co-deposited to the target deposition of inductance
Region forms the multiple elements design core layer with double structure, and multiple elements design core layer obtained enables to the inductance of inductor
Increment is big, and this method overcomes the deficiencies in the prior art, and chemical coprecipitation area method can be avoided the analysis of all metal ions
Go out current potential to adjust to the defect of similar level performance difficulty；The preparation method of the present invention has technique letter compared to sputtering method simultaneously
List, film forming speed are fast, and consume energy few advantage.
Description of the drawings
Fig. 1 is the typical structure schematic diagram of screw type core inductance of the present invention, wherein：101 be core layer；102 be spiral
Coil；
Fig. 2 is the typical structure schematic diagram of plane winding-type core inductance of the present invention, wherein figure (a) is outside drawing, is schemed (b)
For sectional view, in figure：201 be coiled wire-wound coil；202 be circuit board；203 be core layer；
Fig. 3 is the structural schematic diagram of core material provided by the present invention, wherein：1 is nickel, cobalt or nickel cobalt (alloy)；2 be magnetic
Slug particle.
Fig. 4 is the SEM result figures of core material provided by the present invention.
Specific implementation mode
Below by way of specific embodiment combination Figure of description, the present invention is described in detail：
Two kinds of primary structures of core inductor are the typical structure of screw type core inductance, solenoid type as shown in Figure 1
Core inductance device by upper and lower two layers of conductor around intermediate core material, conductor (i.e. spiral winding 102) and core layer 101 it
Between by insulating materials insulation separate；It is illustrated in figure 2 the typical structure of plane winding-type core inductance, plane winding-type magnetic core
Inductance component is that metallic conductor is formed into a loop in a spiral manner in circuit board 202, forms coiled wire-wound coil 201, and in coiling
201 upper and lower surface of coil make respectively core layer 203 formed " sandwich " structure, wherein inductance coiled wire-wound coil 201 with
It is detached using insulating materials between core layer 203.Spiral coil type coil can realize planar structure, be effectively reduced the dimension of inductance
Number, since coil winding is close, in addition to the self-induction generated from itself coil, a bigger part comes between each circle coil inductance
Mutual inductance, therefore, have big inductance quantity, the advantage of high-energy density.
Fig. 3 is the structural schematic diagram for the multiple elements design magnetic core layer material that the present invention has double structure, wherein：First phase material
Material is nickel, cobalt or nickel cobalt (alloy), and the second phase material is at least one magnetic core particles.
Embodiment 1：
The present embodiment makes printed circuit board integrated inductor copper wire using the single-side coated copper plate of the raw beneficial copper foil of thickness containing 0.4mm
Circle tests printed circuit board integrated inductor copper wire by automatic component analyzer (Automatic Component Analyzer)
The inductance value of circle, it is 0.79 μ H@1kHz to measure inductance value.
A kind of preparation method of multicomponent alloy core layer, includes the following steps：
Step A：Integrated inductor coil pre-processes；
The present embodiment further includes being pre-processed to integrated inductor coil before chemical deposition core layer, and concrete operations are such as
Under：Integrated inductor coil is soaked in degreasing fluid, is warming up to 50 DEG C, at this temperature oil removing 10 minutes, to remove integrated electricity
Feel the impurity and oxide on copper coil, after oil removal treatment, coil is cleaned using deionized water, to remove remaining oil removing
Liquid.
This implementation uses chemical constituent for 25g/L NaOH, 30g/L Na2CO3、50g/L Na3PO4Degreasing fluid.
Step B：Prepare Composite electroless deposit liquid；
The chemical constituent for the Composite electroless deposit liquid that the present embodiment uses is as follows：
Composite electroless deposit liquid made from the present embodiment uses ammonium hydroxide to adjust pH as 9；
Step C：Prepare core layer；
The aggregation center that the integrated inductor coil first choice cleaned up is formed to chemical deposition by activation process, then sets
Chemical deposition is carried out in the Composite electroless deposit liquid made from step B, depositing temperature is 70 DEG C so that compound heavy on inductance coil
It is Ni, B and Fe that product, which obtains chemical composition,3O4Core layer, then will deposition there is the integrated inductor coil of core layer to clean,
And it is dried up using inert gas.
There is the print of core layer using automatic component analyzer (Automatic Component Analyzer) test deposition
The inductance value of circuit board integrated inductor copper coil processed, it is 1.02 μ H@1kHz to measure inductance value.
If Fig. 3 is the SEM result figures that core layer is made in the embodiment of the present invention, as can be seen from the figure：Fe3O4Magnetic core particles
Composite deposition has occurred with W metal, magnetic core is analyzed using energy disperse spectroscopy (Energy Dispersive Spectrometer, EDS)
The chemical composition of layer obtains the content that result is B：The content of 7.61wt%, Ni：The content of 91.18wt% and Fe：
1.22wt%.
Embodiment 2：
The present embodiment makes printed circuit board integrated inductor copper wire using the single-side coated copper plate of the raw beneficial copper foil of thickness containing 0.4mm
Circle tests printed circuit board integrated inductor copper wire by automatic component analyzer (Automatic Component Analyzer)
The inductance value of circle, it is 0.79 μ H@1kHz to measure inductance value.
A kind of preparation method of multicomponent alloy core layer, includes the following steps：
Step A：Integrated inductor coil pre-processes；
The present embodiment further includes being pre-processed to integrated inductor coil before chemical deposition core layer, and concrete operations are such as
Under：Integrated inductor coil is soaked in degreasing fluid, is warming up to 50 DEG C, at this temperature oil removing 10 minutes, to remove integrated electricity
Feel the impurity and oxide on copper coil, after oil removal treatment, coil is cleaned using deionized water, to remove remaining oil removing
Liquid.
This implementation uses chemical constituent for 25g/L NaOH, 30g/L Na2CO3、50g/L Na3PO4Degreasing fluid.
Step B：Prepare Composite electroless deposit liquid；
The chemical constituent for the Composite electroless deposit liquid that the present embodiment uses is as follows：
Composite electroless deposit liquid made from the present embodiment uses ammonium hydroxide to adjust pH as 9；
Step C：Prepare core layer；
The aggregation center that the integrated inductor coil first choice cleaned up is formed to chemical deposition by activation process, then sets
Chemical deposition is carried out in the Composite electroless deposit liquid made from step B, depositing temperature is 70 DEG C so that multiple on integrated inductor coil
It is Ni, Co, B and Fe to close deposition and obtain chemical composition3O4Core layer, then by deposition have the integrated inductor coil of core layer into
Row cleaning, and dried up using inert gas.
There is the print of core layer using automatic component analyzer (Automatic Component Analyzer) test deposition
The inductance value of circuit board integrated inductor copper coil processed, it is 1.15 μ H@1kHz to measure inductance value.
The chemical composition that core layer is analyzed using energy disperse spectroscopy (Energy Dispersive Spectrometer, EDS), is obtained
To the content that result is B：The content of 7.98wt%, Ni：The content of 27.85wt%, Co：The content of 55.98wt% and Fe：
8.19wt%.
Embodiment 3：
The present embodiment makes printed circuit board integrated inductor copper wire using the single-side coated copper plate of the raw beneficial copper foil of thickness containing 0.4mm
Circle tests printed circuit board integrated inductor copper wire by automatic component analyzer (Automatic Component Analyzer)
The inductance value of circle, it is 0.79 μ H@1kHz to measure inductance value.
A kind of preparation method of multicomponent alloy core layer, includes the following steps：
Step A：Integrated inductor coil pre-processes；
The present embodiment further includes being pre-processed to integrated inductor coil before chemical deposition core layer, and concrete operations are such as
Under：Integrated inductor coil is soaked in degreasing fluid, is warming up to 50 DEG C, at this temperature oil removing 10 minutes, to remove integrated electricity
Feel the impurity and oxide on copper coil, after oil removal treatment, coil is cleaned using deionized water, to remove remaining oil removing
Liquid.
This implementation uses chemical constituent for 25g/L NaOH, 30g/L Na2CO3、50g/L Na3PO4Degreasing fluid.
Step B：Prepare Composite electroless deposit liquid；
The chemical constituent for the Composite electroless deposit liquid that the present embodiment uses is as follows：
Composite electroless deposit liquid made from the present embodiment uses ammonium hydroxide to adjust pH as 9；
Step C：Prepare core layer；
The aggregation center that the integrated inductor coil first choice cleaned up is formed to chemical deposition by activation process, then sets
Chemical deposition is carried out in the Composite electroless deposit liquid made from step B, depositing temperature is 70 DEG C so that multiple on integrated inductor coil
It is Ni, Co, B and Fe to close deposition and obtain chemical composition3O4Core layer, then by deposition have the integrated inductor coil of core layer into
Row cleaning, and dried up using inert gas.
There is the print of core layer using automatic component analyzer (Automatic Component Analyzer) test deposition
The inductance value of circuit board integrated inductor copper coil processed, it is 1.13 μ H@1kHz to measure inductance value.
The chemical composition that core layer is analyzed using energy disperse spectroscopy (Energy Dispersive Spectrometer, EDS), is obtained
To the content that result is B：The content of 5.93wt%, Ni：The content of 42.04wt%, Co：The content of 41.25wt% and Fe：
10.78wt%.
The embodiment of the present invention is expounded above in association with attached drawing, but the invention is not limited in above-mentioned specific
Embodiment, above-mentioned specific implementation mode is only schematical, rather than restrictive, and those skilled in the art exist
Under the enlightenment of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, many shapes can be also made
Formula, all of these belong to the protection of the present invention.
Claims (4)
1. a kind of method preparing integrated inductor multiple elements design core layer, which is characterized in that target deposition region will be preset with
Integrated inductor is soaked in Composite electroless deposit liquid, and the Composite electroless deposit liquid is the solubility for including the first phase material
The alkaline solution of salt, the second phase material, reducing agent, complexing agent and buffer, wherein：First phase material is to appoint in nickel and cobalt
One or two kinds of, second phase material is magnetic core particles, and the first phase material in Composite electroless deposit liquid is made in reducing agent
With similarly hereinafter the second phase material composite deposition in integrated inductor surface, to which the integrated inductor multiple elements design with double structure be made
Core layer.
2. a kind of method preparing integrated inductor multiple elements design core layer according to claim 1, which is characterized in that also wrap
Include activation process step：The integrated inductor that goal-selling deposition region is not had to catalytic activation performance is soaked in activated water solutions
In so that the active ion in activating solution is reduced into active atomic, and forms chemistry in the target deposition region of integrated inductor
The aggregation center of deposition.
3. a kind of method preparing integrated inductor multiple elements design core layer according to claim 1 or 2, which is characterized in that
The type of the magnetic core particles is more than one.
4. a kind of method preparing integrated inductor multiple elements design core layer according to claim 3, which is characterized in that two-phase
The material group of the integrated inductor multiple elements design core layer of structure becomes nickel and magnetic core particles, nickel cobalt (alloy) and magnetic core particles or cobalt
With magnetic core particles.
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|---|---|---|---|---|
| US5082536A (en) * | 1987-12-29 | 1992-01-21 | Nippon Steel Corporation | Method of producing a high corrosion resistant plated composite steel strip |
| JPH04155795A (en) * | 1990-10-19 | 1992-05-28 | Nec Corp | Organic thin film el element |
| CN1981348A (en) * | 2004-07-15 | 2007-06-13 | 积水化学工业株式会社 | Conductive microparticle, process for producing the same, and anisotropic conductive material |
| CN103918042A (en) * | 2011-08-16 | 2014-07-09 | 乔治亚技术研究公司 | Magnetic devices utilizing nanocomposite films layered with adhesives |
| CN104936379A (en) * | 2015-07-01 | 2015-09-23 | 电子科技大学 | Fabrication method for embedding magnetic core induction of printed circuit board |
-
2017
- 2017-04-13 CN CN201710238998.2A patent/CN106920673B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5082536A (en) * | 1987-12-29 | 1992-01-21 | Nippon Steel Corporation | Method of producing a high corrosion resistant plated composite steel strip |
| JPH04155795A (en) * | 1990-10-19 | 1992-05-28 | Nec Corp | Organic thin film el element |
| CN1981348A (en) * | 2004-07-15 | 2007-06-13 | 积水化学工业株式会社 | Conductive microparticle, process for producing the same, and anisotropic conductive material |
| CN103918042A (en) * | 2011-08-16 | 2014-07-09 | 乔治亚技术研究公司 | Magnetic devices utilizing nanocomposite films layered with adhesives |
| CN104936379A (en) * | 2015-07-01 | 2015-09-23 | 电子科技大学 | Fabrication method for embedding magnetic core induction of printed circuit board |
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