CN106911308B - 应用于hifu设备的功率放大器及其温度补偿方法 - Google Patents
应用于hifu设备的功率放大器及其温度补偿方法 Download PDFInfo
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- CN106911308B CN106911308B CN201510979709.5A CN201510979709A CN106911308B CN 106911308 B CN106911308 B CN 106911308B CN 201510979709 A CN201510979709 A CN 201510979709A CN 106911308 B CN106911308 B CN 106911308B
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- temperature
- power amplifier
- module
- field
- effect tube
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/30—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
- H03F1/301—Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in MOSFET amplifiers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/20—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers
- H03F3/21—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only
- H03F3/213—Power amplifiers, e.g. Class B amplifiers, Class C amplifiers with semiconductor devices only in integrated circuits
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Amplifiers (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510979709.5A CN106911308B (zh) | 2015-12-23 | 2015-12-23 | 应用于hifu设备的功率放大器及其温度补偿方法 |
Applications Claiming Priority (1)
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CN201510979709.5A CN106911308B (zh) | 2015-12-23 | 2015-12-23 | 应用于hifu设备的功率放大器及其温度补偿方法 |
Publications (2)
Publication Number | Publication Date |
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CN106911308A CN106911308A (zh) | 2017-06-30 |
CN106911308B true CN106911308B (zh) | 2019-04-05 |
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CN201510979709.5A Active CN106911308B (zh) | 2015-12-23 | 2015-12-23 | 应用于hifu设备的功率放大器及其温度补偿方法 |
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CN (1) | CN106911308B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101299595A (zh) * | 2008-06-24 | 2008-11-05 | 芯通科技(成都)有限公司 | 一种功率放大器温度补偿方法及装置系统 |
CN201393203Y (zh) * | 2009-03-20 | 2010-01-27 | 深圳市博海通讯技术有限公司 | 一种功率放大器温度补偿装置 |
CN102355206A (zh) * | 2011-08-01 | 2012-02-15 | 中兴通讯股份有限公司 | 功率放大器及功率放大器的增益补偿方法 |
CN103208970A (zh) * | 2012-01-17 | 2013-07-17 | 深圳国人通信有限公司 | 射频功率放大器的栅压温度补偿电路及方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010074407A (ja) * | 2008-09-17 | 2010-04-02 | Toshiba Corp | バイアス制御装置 |
CN103856172B (zh) * | 2012-11-30 | 2017-02-08 | 环旭电子股份有限公司 | 电子系统、射频功率放大器及其温度补偿方法 |
CN103312273B (zh) * | 2013-06-06 | 2016-12-28 | 三维通信股份有限公司 | 一种ldmos功率放大器温度效应抑制的电路装置 |
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2015
- 2015-12-23 CN CN201510979709.5A patent/CN106911308B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101299595A (zh) * | 2008-06-24 | 2008-11-05 | 芯通科技(成都)有限公司 | 一种功率放大器温度补偿方法及装置系统 |
CN201393203Y (zh) * | 2009-03-20 | 2010-01-27 | 深圳市博海通讯技术有限公司 | 一种功率放大器温度补偿装置 |
CN102355206A (zh) * | 2011-08-01 | 2012-02-15 | 中兴通讯股份有限公司 | 功率放大器及功率放大器的增益补偿方法 |
CN103208970A (zh) * | 2012-01-17 | 2013-07-17 | 深圳国人通信有限公司 | 射频功率放大器的栅压温度补偿电路及方法 |
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Publication number | Publication date |
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CN106911308A (zh) | 2017-06-30 |
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Inventor after: Zheng Hairong Inventor after: Meng De Inventor after: Liu Xin Inventor after: Zou Chao Inventor after: Zhou Juan Inventor after: Tie Changjun Inventor before: Meng De Inventor before: Zheng Hairong Inventor before: Liu Xin Inventor before: Zou Chao Inventor before: Zhou Juan Inventor before: Tie Changjun |
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