CN106906430A - 一种Cu70Zr20Ti10/Cu/Ni‑P非晶合金复合粉末及其制备工艺 - Google Patents
一种Cu70Zr20Ti10/Cu/Ni‑P非晶合金复合粉末及其制备工艺 Download PDFInfo
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Abstract
本发明公开了一种Cu70Zr20Ti10/Cu/Ni‑P非晶合金复合粉末及其制备工艺。该复合粉末是通过球磨与化学镀方法联动制备,其形状为片状,平均厚度为300nm,由平均尺寸为20nm的Cu晶粒、Cu70Zr20Ti10非晶合金基体和Ni‑P非晶合金镀层组成,其分布方式为Cu晶粒均匀分布于Cu70Zr20Ti10非晶合金基体中,而Ni‑P非晶合金镀层均匀包裹在Cu70Zr20Ti10非晶合金基体上。其制备工艺为:将球形Cu70Zr20Ti10晶态合金粉末用盐酸、硝酸和氢氟酸混合溶液进行活化,放入充满化学镀液的球磨罐中,进行球磨而合成。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10‑3Ω·mm。
Description
技术领域
本发明涉及一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺。
背景技术
铜基非晶合金由于强度高、耐腐蚀、耐磨损、低温塑性、催化性以及马氏体相变,在结构与功能材料领域具有十分广阔的应用前景,然而,其室温脆性、低的导热导电系数和高温抗氧化性,限制了其应用范围。因此,本发明旨在提高铜基非晶合金的室温塑性、导电导热和高温抗氧化性,具有重要的意义。
发明内容
本发明的目的在于提供一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺。
本发明的目的是通过下述技术方案实现的:一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末,其特征在于:所述复合粉末是通过球磨与化学镀方法联动合成,其形状为片状,平均厚度为300nm,由平均尺寸为20nm的Cu晶粒、Cu70Zr20Ti10非晶合金基体和Ni-P非晶合金镀层组成,Cu晶粒均匀分布于Cu70Zr20Ti10非晶合金基体中,而Ni-P非晶合金镀层均匀包裹在Cu70Zr20Ti10非晶合金基体上。
本发明所得非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
本发明所述Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的制备工艺,其特征在于,包括如下步骤:(1)将适量的Cu70Zr20Ti10球形晶态合金粉末放入烧杯中,加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时;(2)然后用去离子水将Cu70Zr20Ti10球形晶态合金粉末清洗干净;(3)再将清洗干净的Cu70Zr20Ti10球形晶态合金粉末放入球磨罐中,然后将球磨罐充满PH值为8.0的化学镀液,在球料比为30:1、球磨速度为500转/分钟的条件下,球磨1小时后即可获得片状非晶合金粉末。
本发明所述一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末及其制备工艺与现有相关技术相比,具有如下显著的不同特征:(1)将球磨和化学镀两种技术联合一步合成Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末;(2)利用球磨过程所产生的热量保证化学镀所需的温度;(3)利用钢质磨球作为化学镀的引渡源,激发化学镀;(4)采用本发明的球磨化学镀联动技术,克服了传统化学镀方法由于化学镀液的蒸发而引起的化学镀液PH值的变化,在化学镀过程中要随时添加酸液或碱液调整PH值保证化学镀的稳定进行的缺陷。
本发明制成的产品分别用球磨罐球磨,XRD检测Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的非晶态结构,扫描电子显微镜观察Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的形貌,透射电子显微镜观察Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末中Cu晶粒的形貌、分布和大小,EDS分析Cu晶粒的成分,激光闪光仪测量导热系数,四电极法测量电阻率。
本发明一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末是片状的,其导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
具体实施方式
下面根据具体实施例对本发明作进一步说明:
实施例1
用天平称取Cu70Zr20Ti10球形非晶粉末5g,放入烧杯中,加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时,然后用去离子水将Cu70Zr20Ti10球形非晶合金粉末清洗干净,再将清洗干净的Cu70Zr20Ti10球形非晶合金粉末放入球磨罐中,然后将球磨罐充满PH值为8.0的化学镀液,在球料比为30:1、球磨速度为500转/分钟的条件下,球磨1小时后即可获得片状非晶合金粉末。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
实施例2
用天平称取Cu70Zr20Ti10球形非晶粉末10g,放入烧杯中,加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时,然后用去离子水将Cu70Zr20Ti10球形非晶合金粉末清洗干净,再将清洗干净的Cu70Zr20Ti10球形非晶合金粉末放入球磨罐中,然后将球磨罐充满PH值为8.0的化学镀液,在球料比为30:1、球磨速度为500转/分钟的条件下,球磨1小时后即可获得片状非晶合金粉末。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
实施例3
用天平称取Cu70Zr20Ti10球形非晶粉末15g,放入烧杯中,加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时,然后用去离子水将Cu70Zr20Ti10球形非晶合金粉末清洗干净,再将清洗干净的Cu70Zr20Ti10球形非晶合金粉末放入球磨罐中,然后将球磨罐充满PH值为8.0的化学镀液,在球料比为30:1、球磨速度为500转/分钟的条件下,球磨1小时后即可获得片状非晶合金粉末。该非晶合金复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
Claims (3)
1.一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末,其特征在于:所述复合粉末是通过球磨与化学镀方法联动合成,其形状为片状,平均厚度为300nm,由平均尺寸为20nm的Cu晶粒、Cu70Zr20Ti10非晶合金基体和Ni-P非晶合金镀层组成,Cu晶粒均匀分布于Cu70Zr20Ti10非晶合金基体中,而Ni-P非晶合金镀层均匀包裹在Cu70Zr20Ti10非晶合金基体上。
2.权利要求1所述的一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末,其特征在于:所述复合粉末的导热系数为15.4W/m·K、电阻率为1.45×10-3Ω·mm。
3.权利要求1所述的一种Cu70Zr20Ti10/Cu/Ni-P非晶合金复合粉末的制备工艺,其特征在于,包括如下步骤:(1)将适量的Cu70Zr20Ti10球形晶态合金粉末放入烧杯中,加入浓度2%的盐酸、1%的硝酸和0.5%的氢氟酸混合溶液进行活化处理1小时;(2)然后用去离子水将Cu70Zr20Ti10球形晶态合金粉末清洗干净;(3)再将清洗干净的Cu70Zr20Ti10球形晶态合金粉末放入球磨罐中,然后将球磨罐充满PH值为8.0的化学镀液,在球料比为30:1、球磨速度为500转/分钟的条件下,球磨1小时后即可获得片状非晶合金粉末。
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