CN106903073A - Silicon chip automatic separation equipment - Google Patents
Silicon chip automatic separation equipment Download PDFInfo
- Publication number
- CN106903073A CN106903073A CN201710167129.5A CN201710167129A CN106903073A CN 106903073 A CN106903073 A CN 106903073A CN 201710167129 A CN201710167129 A CN 201710167129A CN 106903073 A CN106903073 A CN 106903073A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- casing
- control unit
- separation equipment
- color sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/342—Sorting according to other particular properties according to optical properties, e.g. colour
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/04—Sorting according to size
- B07C5/10—Sorting according to size measured by light-responsive means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/36—Sorting apparatus characterised by the means used for distribution
- B07C5/361—Processing or control devices therefor, e.g. escort memory
- B07C5/362—Separating or distributor mechanisms
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Control Of Conveyors (AREA)
- Feeding Of Articles To Conveyors (AREA)
Abstract
The present invention relates to silicon chip production equipment technical field,More particularly, to a kind of silicon chip automatic separation equipment,Including casing,Control unit and color sensor,The color sensor is arranged on one end of casing,The color sensor is connected with described control unit signal,Some dividing plates are vertically provided with the casing,There is gap between adjacent two dividing plate,Every layer of dividing plate is made up of two support plates,Two support plates are arranged on the both sides in the casing,There is gap along silicon chip conveying direction between two support plates,Silicon chip automatic separation equipment of the present invention is when using,By the signal detected in color sensor,So as to the judgement to silicon chip positive and negative,So that control unit control first driving means and the second drive device,Being capable of quick separating silicon chip,And after silicon chip is separated,Have no effect on down a piece of silicon chip by and detection,Improve operating efficiency,Silicon chip leakage is avoided to turn over or turn over phenomenon by mistake.
Description
Technical field
The present invention relates to silicon chip production equipment technical field, more particularly, to a kind of silicon chip automatic separation equipment.
Background technology
When solar battery sheet circuit prints, it is necessary to cell piece is overturn, the positive reverse-printed of solar battery sheet is realized
Brush, after solar battery sheet front is completed for printing, silicon wafer turnover need to be printed to solar battery sheet reverse side,
It is possible to the phenomenon that leakage is turned over or turned over by mistake occur during silicon wafer turnover, causes solar battery sheet to be repeated in one side, reduces
Operating efficiency, increases production cost.
The content of the invention
The technical problem to be solved in the present invention is：Turn over or turn over by mistake to solve the problems, such as that silicon chip leaks, now there is provided one
Plant silicon chip automatic separation equipment.
The technical solution adopted for the present invention to solve the technical problems is：A kind of silicon chip automatic separation equipment, including casing,
Control unit and color sensor, the color sensor are arranged on one end of casing, the color sensor and the control
Cell signal is connected, and some dividing plates are vertically provided with the casing, has gap, every layer of dividing plate between adjacent two dividing plate
It is made up of two support plates, two support plates are arranged on the both sides in the casing, is conveyed along silicon chip between two support plates
Direction has gap, and the casing is vertically slided and is provided with baffle plate, and the baffle plate is located at casing away from color sensor
One end, the bottom half is provided with the first driving means for driving baffle plate displacement, and the casing is provided with for controlling
The second drive device that casing rises or declines, the first driving means and the second drive device are in control unit signal
Connection.
The present invention is arranged between conveyer belt, and the upper and lower two-layer of conveyer belt point, silicon chip is input into casing one by upper strata conveyer belt
End, and silicon chip surface aberration is detected by color sensor, color sensor transmits a signal to control unit treatment, by silicon
The contrast of piece positive and negative aberration carries out output signal, when detecting that aberration is in the range of, first driving means and the second drive device
Do not perform so that silicon chip is direct by passing through output between two dividing plates on casing on the conveyer belt of upper strata, when detection aberration exceeds
During scope, control unit controls first driving means, first driving means to drive baffle plate and silicon chip is passed through into path to resistance first
Gear so that silicon chip is located on dividing plate, then control the second drive device to drive casing to decline so that the dividing plate with silicon chip declines,
And upper partition alignment upper conveyor belt is caused, because first driving means are located at casing lower section, while casing declines, make
Layer dividing plate is in unobstructed state, and silicon plate on dividing plate is then by contact with conveying belt of lower floor and by silicon chip output casing
Dividing plate, has no effect on down the detection of a piece of silicon chip and passes through, after the completion of casing decline, that is to say, that detection aberration is in the range of
When, silicon chip is directly let pass, and when detecting that aberration overruns, silicon chip takes in the spacer member of casing, and is exported by conveying belt of lower floor,
Repeat above-mentioned action, you can realize the mask work of silicon chip.
In order to prevent silicon chip multi-disc from overlaping, further, also including first laser distance measuring sensor, described first
Laser range sensor is located at casing near one end of color sensor, and the first laser distance measuring sensor is single with the control
First signal connection.Silicon chip is found range by first laser distance measuring sensor, first laser distance measuring sensor will be detected
Signal is sent to control unit treatment, and when detection signal is in the range of, first driving means and the second drive device are not performed
Work, when detection signal goes beyond the scope, control first driving means drive baffle plate to decline, and silicon chip is intercepted, and then control
Second drive device drives casing to decline.
In order that obtaining silicon chip can more smoothly pass over dividing plate, further, the support plate is provided with roller.In dividing plate
Upper setting roller so that silicon chip rubs with the face of dividing plate, is changed to existing rolling friction, you can to prevent silicon chip from wearing and tearing, and energy
Enough so that silicon chip more smoothly passes over the dividing plate of casing.
In order to simply and easily realize that dividing plate is slided on casing, further, on the casing vertically
Chute is offered, the chute matches with the baffle plate, and the barrier slides are arranged in the chute.By on casing
Chute is opened up, the slip of dividing plate is realized, while also having certain position-limiting action to dividing plate.
For the ease of regular maintenance, it is preferable that the first driving means and the second drive device are cylinder.Due to
One drive device and the second drive device are cylinder, and air cylinder structure is simple, it is easy to install and safeguard, strong adaptability.
Silicon chip is separated in order to can continue to rise after casing declines completely, further, top in the casing
End is provided with second laser distance measuring sensor, and the second laser distance measuring sensor is connected with described control unit signal.By
Top sets second laser distance measuring sensor in casing, and second laser distance measuring sensor sends the signal to control unit, works as inspection
The distance of survey at one end scope when, any action is not performed, when detecting distance overruns, control unit control second drive
Device drives casing to rise, and causes that the dividing plate of casing lower end aligns with upper strata conveyer belt.
The beneficial effects of the invention are as follows：Silicon chip automatic separation equipment of the present invention is examined when using by color sensor
The signal for measuring, so as to the judgement to silicon chip positive and negative so that control unit controls first driving means and the second drive device,
So that to the mask work of silicon chip, can quick separating silicon chip, and after silicon chip is separated, have no effect on down a piece of silicon chip
By and detection, improve operating efficiency, it is to avoid the phenomenon that silicon chip leakage is turned over or turned over by mistake.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the front view of silicon chip automatic separation equipment of the present invention；
Fig. 2 is the schematic cross-section of casing in silicon chip automatic separation equipment of the present invention.
In figure：1st, casing, 101, chute, 2, control unit, 3, color sensor, 4, dividing plate, 401, support plate, 5, first drives
Dynamic device, the 6, second drive device, 7, first laser distance measuring sensor, 8, second laser distance measuring sensor, 9, upper strata conveyer belt,
10th, conveying belt of lower floor, 11, roller, 12, baffle plate.
Specific embodiment
Presently in connection with accompanying drawing, the present invention will be further described in detail.These accompanying drawings are simplified schematic diagram, only with
Illustration illustrates basic structure of the invention, therefore it only shows the composition relevant with the present invention.
Embodiment
As illustrated in fig. 1 and 2, a kind of silicon chip automatic separation equipment, including casing 1, control unit 2 and color sensor 3, institute
One end that color sensor 3 is arranged on casing 1 is stated, the color sensor 3 is connected with the signal of described control unit 2, the case
Some dividing plates 4 are vertically provided with body 1, there is gap between adjacent two dividing plate 4, every layer of dividing plate 4 has 401 groups of two support plate
Roller 11 is provided with into, the support plate 401, two support plates 401 are arranged on the both sides in the casing 1, two branch
There is gap along silicon chip conveying direction between plate 401, the casing 1 is vertically slided and is provided with baffle plate 12, the baffle plate
12 one end for being located remotely from color sensor 3, the bottom of the casing 1 is provided with the first driving means for driving the displacement of baffle plate 12
5, the casing 1 is provided with the second drive device 6 for controlling casing 1 to rise or decline, the He of the first driving means 5
Second drive device 6 is connected in the signal of control unit 2.
Also include first laser distance measuring sensor 7, the first laser distance measuring sensor 7 is located at casing 1 and is passed near color
One end of sensor 3, the first laser distance measuring sensor 7 is connected with the signal of described control unit 2.
Chute 101 is vertically offered on the casing 1, the chute 101 matches with the baffle plate 12, described
Baffle plate 12 is slidably arranged in the chute 101.
The drive device 6 of the first driving means 5 and second is cylinder.
Top is provided with second laser distance measuring sensor 8 in the casing 1, the second laser distance measuring sensor 8 with it is described
The signal of control unit 2 is connected.
When using, color sensor 3 and first laser distance measuring sensor 7 first is to set to above-mentioned silicon chip automatic separation equipment
Put above the input of upper strata conveyer belt 9, and the output end of upper strata conveyer belt 9 is also equipped with another section of conveyer belt, upper
The lower section of layer conveyer belt 9 is provided with conveying belt of lower floor 10, and conveying belt of lower floor 10 is used to convey the silicon chip after separating, upper strata conveyer belt
9 one end that the silicon chip after upset is input to casing 1, are detected by color sensor 3, while first laser range finding sensing
Device 7 is detected, launched to control unit 2, control when color sensor 3 and first laser distance measuring sensor 7 detect signal
Unit 2 is processed the signal of color sensor 3, and control unit 2 is carried out to the signal of first laser distance measuring sensor 7
Treatment, when above-mentioned aberration and distance are in the range of, the cylinder at the drive device 6 of first driving means 5 and second is not performed,
Silicon chip will directly by the dividing plate 4 on casing 1, and silicon chip is passed through due to inertia, and under roller 11 on the dividing plate 4 of casing 1 is acted on
The dividing plate 4 of casing 1 reaches the conveyer belt of the other end of casing 1；As long as when having one not in the range of in both aberration and distance, controlling
Unit processed 2 starts the cylinder at first driving means 5 first so that baffle plate 12 is slided in the chute 101 of casing 1, and by case
The silicon chip of body 1 is blocked by path, and control unit 2 is provided with time-delay relay can time delay several seconds so that silicon chip is completely into arriving
In the dividing plate 4 of casing 1, control unit 2 is controlling the cylinder at the second drive device 6, drives casing 1 to decline so that with silicon
The dividing plate 4 of piece declines and staggers with upper strata conveyer belt 9, while so that the upper partition 4 of silicon chip is alignd with upper strata conveyer belt 9, it is right
Under a piece of silicon chip carry out color and distance detection, directly let pass when qualified, the current of silicon chip is had no effect on, when color and distance
As long as there is one unqualified, then silicon chip is placed on dividing plate 4, the silicon chip that will be separated successively as procedure described above is put successively
Put on dividing plate 4, one end of conveying belt of lower floor 10 is located between two support plates 401, when silicon chip is contacted with conveying belt of lower floor 10,
And the silicon chip that will be in contact with it directly is exported, overruned when the second laser distance measuring sensor 8 in casing 1 detects distance
When, the cylinder at the second drive device 6 of control, and drive casing 1 to rise.
Above-mentioned is enlightenment according to desirable embodiment of the invention, and by above-mentioned description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention'.This invention it is technical
Scope is not limited to the content on specification, it is necessary to its technical scope is determined according to right.
Claims (6)
1. a kind of silicon chip automatic separation equipment, it is characterised in that：Including casing (1), control unit (2) and color sensor (3),
The color sensor (3) is arranged on one end of casing (1), and the color sensor (3) connects with described control unit (2) signal
Connect, some dividing plates (4) are vertically provided with the casing (1), there is gap, every layer of dividing plate between adjacent two dividing plate (4)
(4) it is made up of two support plates (401), two support plates (401) are arranged on the both sides in the casing (1), two branch
There is gap along silicon chip conveying direction between plate (401), the casing (1) is vertically slided and is provided with baffle plate (12), institute
State baffle plate (12) positioned at casing (1) away from color sensor (3) one end, casing (1) bottom is provided with for driving baffle plate
(12) first driving means (5) of displacement, the casing (1) is provided with second for controlling casing (1) rising or decline
Drive device (6), the first driving means (5) and the second drive device (6) are connected in control unit (2) signal.
2. silicon chip automatic separation equipment according to claim 1, it is characterised in that：Also include first laser distance measuring sensor
(7), the first laser distance measuring sensor (7) is close to one end of color sensor (3), the first laser positioned at casing (1)
Distance measuring sensor (7) is connected with described control unit (2) signal.
3. silicon chip automatic separation equipment according to claim 1, it is characterised in that：The support plate (401) is provided with roller
(11)。
4. silicon chip automatic separation equipment according to claim 1, it is characterised in that：On the casing (1) vertically
Chute (101) is offered, the chute (101) matches with the baffle plate (12), the baffle plate (12) is slidably arranged in described
In chute (101).
5. silicon chip automatic separation equipment according to claim 1, it is characterised in that：The first driving means (5) and
Two drive devices (6) are cylinder.
6. silicon chip automatic separation equipment according to claim 1, it is characterised in that：The interior top of the casing (1) is provided with
Dual-laser distance measuring sensor (8), the second laser distance measuring sensor (8) is connected with described control unit (2) signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710167129.5A CN106903073B (en) | 2017-03-20 | 2017-03-20 | Automatic silicon wafer separation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710167129.5A CN106903073B (en) | 2017-03-20 | 2017-03-20 | Automatic silicon wafer separation equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106903073A true CN106903073A (en) | 2017-06-30 |
| CN106903073B CN106903073B (en) | 2022-08-12 |
Family
ID=59195699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710167129.5A Active CN106903073B (en) | 2017-03-20 | 2017-03-20 | Automatic silicon wafer separation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106903073B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110817384A (en) * | 2019-11-21 | 2020-02-21 | 东台市高科技术创业园有限公司 | PCB detects with platform of plugging into |
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| CN205194661U (en) * | 2015-11-17 | 2016-04-27 | 深圳市捷佳伟创新能源装备股份有限公司 | Silicon chip positive and negative colour difference detection device |
| CN106044246A (en) * | 2016-07-29 | 2016-10-26 | 佛山市南海今博自动化设备有限公司 | Automatic dish feeding machine system and automatic dish feeding method |
| CN206622346U (en) * | 2017-03-20 | 2017-11-10 | 常州亿晶光电科技有限公司 | Silicon chip automatic separation equipment |
-
2017
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Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH05193731A (en) * | 1992-01-21 | 1993-08-03 | Tdk Corp | Circuit board stock apparatus |
| US5865990A (en) * | 1996-09-13 | 1999-02-02 | Uncle Ben's, Inc. | Method and apparatus for sorting grain |
| CN101409245A (en) * | 2008-11-20 | 2009-04-15 | 陈百捷 | Automatic control silicon chip check system |
| CN102253047A (en) * | 2011-04-27 | 2011-11-23 | 3i系统公司 | Solar silicon wafer photoluminescence on-line sampling detection system and its detection method |
| JP2013010630A (en) * | 2011-06-30 | 2013-01-17 | Tsubakimoto Chain Co | Article conveying-sorting apparatus |
| CN103323466A (en) * | 2012-03-20 | 2013-09-25 | 苏州中导光电设备有限公司 | High-accuracy detection system for line trace of solar silicon wafer |
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| CN102873035A (en) * | 2012-10-19 | 2013-01-16 | 张家港市超声电气有限公司 | On-line automatic detection device for silicon wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110817384A (en) * | 2019-11-21 | 2020-02-21 | 东台市高科技术创业园有限公司 | PCB detects with platform of plugging into |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106903073B (en) | 2022-08-12 |
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