CN106895272A - Use the light-emitting device of organic compound - Google Patents
Use the light-emitting device of organic compound Download PDFInfo
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- CN106895272A CN106895272A CN201611269050.5A CN201611269050A CN106895272A CN 106895272 A CN106895272 A CN 106895272A CN 201611269050 A CN201611269050 A CN 201611269050A CN 106895272 A CN106895272 A CN 106895272A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/003—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V9/00—Elements for modifying spectral properties, polarisation or intensity of the light emitted, e.g. filters
- F21V9/30—Elements containing photoluminescent material distinct from or spaced from the light source
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
- C08K2003/327—Aluminium phosphate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
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- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of light-emitting device of use organic compound, including the string light unit that substrate and substrate surface are connected, string light unit surrounds into accommodation space in substrate surface, the holding section that lamp bar bottom is provided with fastener with substrate surface is provided with is corresponding, lamp bar one end is provided with shackle member, the other end is provided with Access Division, lamp bar is provided with Access Division end and is additionally provided with terminal or connector, string light unit is made up of at least 3 lamp bars, colloid and luminescent wafer are provided with accommodation space, luminescent wafer is distributed on substrate surface, and accommodation space top surface is connected with cover plate.The present invention reaches center uniformly light-emitting and coordinates the illuminating part on lamp bar surface to reach each even angle again and lights using luminescent wafer, and luminosity is high, and the colloid light transmittance of encapsulating light emitting chip is high, and substrate high temperature resistant is unlikely to deform damage.
Description
Technical field
The present invention relates to a kind of light-emitting device, more particularly to a kind of light-emitting device of use organic compound.
Background technology
Light-emitting device, such as light emitting diode（LED）, can be used in packaging or device to provide white light（For example, feel be
White or close white）, and just developing into the substitute products of incandescent lamp, fluorescent lamp or metal halide lamp.
The essential structure of general light-emitting component, is provided with the conducting end of opposed polarity and holds in the inside of a transparent encapsulating body
Load portion, chip is installed with its supporting part, is additionally provided with the connection that conductor constitutes electrode layer and the conducting end of chip, and each conducting end
And extend transparent enclosure colloid outside as power supply contact.Under the energization action of conducting end, the light source produced by its chip
Form illumination effect.If current light-emitting device to be made has more multidirectional lighting angle, certainly will need with design lamps side
Formula makes light-emitting component have the space of larger divergent light source.But, make light-emitting device that there is multi-angle using divergent light source
Problem luminous, that the center brightness of light-emitting device can be caused not enough.In addition, carrying out the light that multi-angle is exhaled using above-mentioned form
Line also has the problem of luminance shortage.
Prior art such as Authorization Notice No.：The B of CN 102878450, the invention on a kind of light-emitting device, comprising substrate,
String light unit, luminescent wafer and colloid.String light unit on substrate around formed accommodation space.Several luminous crystalline substances
Piece is arranged in accommodation space.Luminescent wafer is connected with electrical property of substrate.Colloid is filled in accommodation space and is used to encapsulate those hairs
Light chip.After the light-emitting device of the invention can be lighted using luminescent wafer, the additional light-emitting component for being centered around luminescent wafer periphery
It is luminous, and then light-emitting device entirety is reached while having the luminous and luminosity of multiple angles average, and then can reach highlighted
That spends is luminous, but the translucent effect of colloid and the heat resistance of substrate also have room for promotion.
The content of the invention
The present invention provides a kind of light-emitting device of use organic compound for above-mentioned technical problem, is capable of achieving each angle
Luminosity is uniform, and center is measured moderate, and the colloid light transmittance of encapsulating light emitting chip is high, and substrate high temperature resistant is unlikely to deform damages, luminous
Each angular intensity of device is uniform, and luminosity and light transmittance are high.
It is of the invention to be for the technical scheme that above-mentioned technical problem is adopted：Using the light-emitting device of organic compound, including
Substrate and the string light unit of substrate surface connection, string light unit surround into accommodation space, strip hair in substrate surface
Light unit is made up of at least 3 lamp bars, and colloid and luminescent wafer are provided with accommodation space, and luminescent wafer is distributed on substrate surface,
Accommodation space top surface is connected with cover plate.The present invention reaches center uniformly light-emitting and coordinates the luminous of lamp bar surface again using luminescent wafer
Part reaches each even angle and lights, and luminosity is high, and the colloid light transmittance of encapsulating light emitting chip is high, and substrate high temperature resistant is difficult
Deformed damaged.
Preferably, the holding section that lamp bar bottom is provided with fastener with substrate surface is provided with is corresponding, can effectively by lamp bar
With substrate connection, lamp bar is difficult for drop-off, fall apart.
Preferably, lamp bar one end is provided with shackle member, the other end is provided with Access Division, and lamp bar is provided with Access Division end and is additionally provided with end
Son or connector, can make lamp bar be interconnected to accommodation space, and connection fastening is effective.
Preferably, colloid is printing opacity silicon rubber, translucent silica gel rubber surface is less than accommodation space top surface, printing opacity silicon rubber
It is made up of following component and weight portion：80 ~ 150 parts of high viscosity selfing xenyl organic silicon rubber, kopol 0.001 ~ 0.002
Part, 0.002 ~ 0.003 part of polyphenylene sulfide, 1 ~ 3 part of fluorescent material, 0.001 ~ 0.005 part of catalyst, inhibitor 0.002 ~
0.005 part, 3 ~ 9 parts of reinforcing agent.Colloid is contained within fluorescent material, when the light source that luminescent wafer is produced passes through the colloid containing fluorescent material
When, excited through fluorescent material after the original light wavelength transmitting of light source and produce the optical wavelength of specific hue, colloid have high transparency,
High refractive index, hardness are moderate, be difficult melt, good stability the features such as.
Preferably, cover plate is glass cover-plate or printing opacity rubber cover plate or light-passing plastic cover plate, prevent colloid from coming off and thoroughly
The excellent heat that can also to a certain extent reduce light of light effect.
Preferably, the spacing of luminescent wafer is the 1/5 ~ 2/5 of lamp bar length, make the luminosity at light-emitting device center equal
In even and regular, lamp bar makes luminescent wafer light angle vertical in cover plate, makes luminosity vertical transmission.
Preferably, lamp bar surface is provided with illuminating part, illuminating part is solid semiconductor illuminating element or light-emittingdiode, is reached
To the effect that light-emitting device surrounding lights, make the luminosity of light-emitting device surrounding uniform.
Preferably, substrate surface is provided with heatproof coating, heatproof coating is likend to being grouped into by following weight：Biphosphate
Aluminium：ASa resins：Magnesia：Aluminum oxide：Silicon metal=12.6 ~ 18：0.1~0.2：0.5~1.5：0.7~1：80 ~ 86, length can be avoided
Time causes damage and the influence of mechanical property to substrate using the heat sent in luminosity of middle illuminating part, extends making for substrate
Use the life-span.
Compared with prior art, beneficial effects of the present invention are：It is additional to enclose after light-emitting device can be lighted using luminescent wafer
The light-emitting component for being wound on luminescent wafer periphery lights, and then it is overall while having the luminous of multiple angles, envelope to reach light-emitting device
Fill the colloid of luminescent wafer and have that high transparency, high refractive index, hardness are moderate, be difficult to melt, good stability the features such as, when luminous
When the light source that chip is produced is through the colloid for containing fluorescent material, is excited through fluorescent material and produce spy after the original light wavelength transmitting of light source
The optical wavelength of fixation degree, the center brightness when luminescent wafer of light-emitting device is luminous will not lose, substrate because multi-angle is luminous
Surface is provided with heatproof coating can avoid the heat sent in luminosity of illuminating part in long-time use from causing to damage and power to substrate
The influence of performance is learned, extends the service life of substrate, light-emitting device of the invention can make overall luminous and luminous with multi-angle
Brightness is average, and then can reach the luminous of high brightness.
Brief description of the drawings
Fig. 1 is structural representation of the present invention using the light-emitting device of organic compound；
Fig. 2 is 2-2 ' sectional view of the present invention using the light-emitting device of organic compound.
Description of reference numerals：101 accommodation spaces；102 cover plates；110 substrates；112 holding sections；120 string light units；
122 lamp bars；122a fasteners；122b shackle members；122c Access Divisions；124 illuminating parts；124a exiting surface normals；130 luminous crystalline substances
Piece；130a top surface normals；140 colloids.
Specific embodiment
It is described in further detail with accompanying drawing with reference to embodiments：
Embodiment 1：
As shown in Figure 1 and 2, using the light-emitting device of organic compound, the string light of substrate 110 and the connection of the surface of substrate 110
Unit 120, string light unit 120 surrounds into accommodation space 101 on the surface of substrate 110, and string light unit 120 is by least 3
Individual lamp bar 122 is constituted, and colloid 140 and luminescent wafer 130 are provided with accommodation space 101, and luminescent wafer 130 is distributed on substrate 110
Surface, accommodation space top surface is connected with cover plate 102.The present invention reaches center uniformly light-emitting and coordinates lamp again using luminescent wafer 130
The illuminating part 124 on the surface of bar 122 reaches each even angle and lights, and luminosity is high, the colloid 140 of encapsulating light emitting chip 130
Light transmittance is high, the high temperature resistant of substrate 110, is unlikely to deform damage.
The holding section 112 that the bottom of lamp bar 122 is provided with fastener 122a with the surface of substrate 110 is provided with is corresponding, can effectively by
Lamp bar 122 is connected with substrate 110, and lamp bar 122 is difficult for drop-off, fall apart.
The one end of lamp bar 122 is provided with shackle member 122b, and the other end is provided with Access Division 122c, and lamp bar 122 is provided with Access Division 122c
End is additionally provided with terminal or connector, and lamp bar 122 can be made to be interconnected to accommodation space 101, and connection fastening is effective.
Colloid 140 be printing opacity silicon rubber, translucent silica gel rubber surface be less than the top surface of accommodation space 101, printing opacity silicon rubber by
Following component and preferred weight part composition：It is 100 parts of high viscosity selfing xenyl organic silicon rubber, 0.0015 part of kopol, poly-
0.0028 part of phenylene sulfide, 2 parts of fluorescent material, 0.004 part of catalyst, 0.003 part of inhibitor, 5 parts of reinforcing agent.In colloid 140
Containing fluorescent material, during when the light source that luminescent wafer 130 is produced through the colloid 140 containing fluorescent material, the original optical wavelength of light source
Excited through fluorescent material after transmitting and produce the optical wavelength of specific hue, there is colloid 140 high transparency, high refractive index, hardness to fit
In, be difficult melt, good stability the features such as.
High viscosity selfing xenyl organic silicon rubber is that molecular backbone is hydrogeneous, phenyl organosilicon rubber of the end group containing vinyl
Glue, viscosity is 15000 ~ 30000 mPa s, and wherein hydrogen content is 1 .75 × 10-4~3 .75 × 10-4mol/g, ethene
Base content is 1 .35 × 10-4~3 .55 × 10-4mol/g；
The cooperation of platinum and tetramethyl divinyl disiloxane that catalyst is provided for Shanghai Hua Gui new chemical materialses Co., Ltd
The complex of thing or platinum and t etram-ethyltetravinylcyclotetrasiloxane；Inhibitor is 3- methyl isophthalic acids-butine -3- alcohol, 3- phenyl -1-
The mixture that butine -3- alcohol or 3- methyl isophthalic acids-butine -3- alcohol are constituted with 3-Phenyl-1-butyn-3-ol；Reinforcing agent is obtained for Guangzhou
The Vinyl MQ silicon resin of your tower organosilicon technological development Co., Ltd.
Cover plate 102 is glass cover-plate or printing opacity rubber cover plate or light-passing plastic cover plate, prevents colloid 140 from coming off and printing opacity effect
The really excellent heat that can also to a certain extent reduce light.
The spacing of luminescent wafer 130 is the 3/10 of lamp bar length, makes the luminosity at light-emitting device center uniformly moderate, lamp
Bar 122 makes the light angle vertical of luminescent wafer 130 in cover plate 102, makes luminosity vertical transmission.
The spacing of luminescent wafer 130 is not limited only to the 1/5 ~ 2/5 of lamp bar length, should also include 20/100,21/100,22/
100、23/100、24/100……38/100、39/100、40/100。
Lamp bar surface is provided with illuminating part 124, and illuminating part 124 is solid semiconductor illuminating element or light-emittingdiode, is reached
The luminous effect of light-emitting device surrounding, makes the luminosity of light-emitting device surrounding uniform.
The surface of substrate 110 is provided with heatproof coating, and heatproof coating is likend to being grouped into by following preferred weight：Biphosphate
Aluminium：ASa resins：Magnesia：Aluminum oxide：Silicon metal=14：0.15：1：0.8：84, illuminating part 124 in long-time use can be avoided
The heat sent in luminosity to substrate 110 cause damage and mechanical property influence, extend substrate 110 service life.
Embodiment 2：
As shown in Figure 1 and 2, string light unit 120 be by several lamp bars 122 be on substrate 110 be connected with each other constitute, bar
Shape luminescence unit 120 forms accommodation space 101, and colloid 140 is filled in accommodation space 101 and will not leak, accommodation space
101 tops are provided with cover plate 102, are further ensured that colloid 140 cannot come off, and uniform luminescent wafer is set in accommodation space 101
130, luminescent wafer 130 is electrically connected with and can launch light source with substrate 110, and colloid 140 is filled in accommodation space 101
To encapsulate those luminescent wafers 130, colloid 140 is the silicon rubber containing fluorescent material, when the light source that luminescent wafer 130 is produced is passed through
Silicon rubber containing fluorescent material, excites through fluorescent material after the original light wavelength transmitting of light source and produces the optical wavelength of specific hue.
In other embodiment, colloid 140 is alternatively transparent colloid, is only purely by way of the packing colloid that encapsulating light emitting chip is used.
String light unit 120 is made up of at least 3 lamp bars 122.Wherein, the bottom of each lamp bar 122 has
Have fastener 122a, at substrate 110 and being provided with holding section 112 corresponding to fastener 122a, fastener 122a with engage
Portion 112 mutually fastens, and each lamp bar 122 of string light unit 120 is fixed on substrate 110, each
The one end of root lamp bar 122 is provided with shackle member 122b, and opposite other end portion is provided with Access Division 122c.Each lamp bar 122
Shackle member 122b can be engaged each other with the Access Division 122c of adjacent lamp bar 122.Therefore, blocked mutually using 4 lamp bars 122
Connect and form an accommodation space 101, luminescent wafer 130 can be housed and colloid 140 is inserted in the inner, string light unit 120
System is connected by least 3 lamp bars 122 and is constituted.In other embodiments, string light unit can also be bent by single lamp bar and
Formed.
Each string light unit 120 includes at least one light-emitting component 124.Each set lamp bar 122
On be provided with a light-emitting component 124, string light unit 120 is fixed on substrate 110 and electrically connects with substrate 110
After connecing, light-emitting component 124 can be powered and launch light, the light directive that the string light unit 120 is sent this house
Outside space 101.Light-emitting component 124 can be solid semiconductor illuminating element.For example, light-emitting component 124 can be luminous
Diode.In other embodiments, light-emitting component 124 or other monomers that can be lighted.
The present invention is lighted using the uniform luminescent wafer 130 set on substrate 110, makes the light can be from accommodation space 101
Top surface send；The light-emitting component 124 set on the string light unit 120 of accommodation space 101 is formed, accommodation space can be made
Lateral divergently lighting makes light-emitting device 100 overall luminous with multi-angle around 101, to increase overall illuminance,
The exiting surface normal 124a of string light unit 120 is orthogonal with the normal 130a of the top surface of accommodation space 101.At it
In his embodiment, the normal 130a of the exiting surface normal 124a of string light unit 120 and the top surface of accommodation space 101
Non-perpendicular special angle can be kept.
Uniform luminescent wafer 130 is arranged on substrate 110 and is electrically connected with substrate 110, and luminescent wafer 130 is saturating
Cross the effect that transmitting light source is can reach after being electrically connected with substrate 110 and is illuminated.The luminescent wafer 130 that the present invention is used is
Luminescent wafer 130 is fixed on substrate 110 in the mode that chip directly encapsulates (Chip On Board, COB).At other
In embodiment, luminescent wafer 130 can also other connected modes be electrically connected with substrate 110.In certain embodiments, substrate
The surface of 110 carrying luminescent wafers 130 can also be coated with reflectorized material.For example, the surface of substrate 110 can be coated with one layer
The silver or aluminium or other materials of tool mirror effect can make the light that Refl-Luminous chip 130 is exhaled, and strengthen from accommodating sky
Between 101 the intensity of light source launched of top surface.
After lamp bar 122 can utilize fastener 122a to be fixed with the holding section 112 of substrate 110, the end of lamp bar 122
Son is electrically connected with substrate 110, light-emitting component 124 is powered by terminal and is lighted, and the terminal of lamp bar 122 is blade ends
Son.In other embodiments, terminal can be the terminal of other shapes.In certain embodiments, single lamp bar 122 is with bent
Elastomeric material make, after being bent into the string light unit of a polygon or circle using single lamp bar 122, via list
The initial two ends of one lamp bar 122 interconnect fixed and form an accommodation space, and luminescent wafer is set in accommodation space.
And in other embodiments, string light unit 120 can also be used some connections of lamp bar 122 and be formed.
After lamp bar 122 can be electrically connected with using connector with substrate 110, light-emitting component 124 is set to light.In some implementations
In example, can be used some lamp bars 122 to be combined with each other to form a string light unit.Wherein, the one end of each lamp bar 122 tool
There is shackle member 122b and opposite other end portion has Access Division 122c, the shackle member 122b of each lamp bar 122 can be with adjacent lamps
The Access Division 122c of bar 122 engages each other.
In the prior art of the routine techniques dawn known to those skilled in the art in embodiment 1,2, do not make to chat in detail herein
State.
It should be appreciated that the purposes of these case study on implementation is merely to illustrate the present invention and is not intended to limit protection model of the invention
Enclose.Additionally, it will also be appreciated that after technology contents of the invention have been read, those skilled in the art can make each to the present invention
Plant and change, change and modification, all these equivalent form of value equally falls within the protection that the application appended claims are limited
Within the scope of.
Claims (8)
1. the light-emitting device of organic compound, including substrate are used（110）And substrate（110）The string light list of surface connection
Unit（120）, it is characterised in that：The string light unit（120）In substrate（110）Surface surrounds into accommodation space（101）, institute
State string light unit（120）By at least 3 lamp bars（122）Composition, the accommodation space（101）Inside it is provided with colloid（140）With
Luminescent wafer（130）, the luminescent wafer（130）It is distributed on substrate（110）Surface, the accommodation space top surface is connected with cover plate
（102）.
2. the light-emitting device of use organic compound according to claim 1, it is characterised in that：The lamp bar（122）Bottom
Portion is provided with fastener（122a）With substrate（110）The holding section that surface is provided with（112）Correspondence.
3. the light-emitting device of use organic compound according to claim 1, it is characterised in that：The lamp bar（122）One
End is provided with shackle member（122b）, the other end is provided with Access Division（122c）, the lamp bar（122）It is provided with Access Division（122c）End also sets
There are terminal or connector.
4. the light-emitting device of use organic compound according to claim 1, it is characterised in that：The colloid（140）For
Printing opacity silicon rubber, the translucent silica gel rubber surface is less than accommodation space（101）Top surface, the printing opacity silicon rubber is by following component
And weight portion composition：80 ~ 150 parts of high viscosity selfing xenyl organic silicon rubber, 0.001 ~ 0.002 part of kopol, poly- Asia benzene
0.002 ~ 0.003 part of base thioether, 1 ~ 3 part of fluorescent material, 0.001 ~ 0.005 part of catalyst, 0.002 ~ 0.005 part of inhibitor, reinforcement
3 ~ 9 parts of agent.
5. the light-emitting device of use organic compound according to claim 1, it is characterised in that：The cover plate（102）For
Glass cover-plate or printing opacity rubber cover plate or light-passing plastic cover plate.
6. the light-emitting device of use organic compound according to claim 1, it is characterised in that：The luminescent wafer
（130）Spacing for lamp bar length 1/5 ~ 2/5.
7. the light-emitting device of use organic compound according to claim 1, it is characterised in that：The lamp bar surface is provided with
Illuminating part（124）, the illuminating part（124）It is solid semiconductor illuminating element or light-emittingdiode.
8. the light-emitting device of use organic compound according to claim 1, it is characterised in that：The substrate（110）Table
Face is provided with heatproof coating, and the heatproof coating is likend to being grouped into by following weight：Aluminium dihydrogen phosphate：ASa resins：Magnesia：Oxygen
Change aluminium：Silicon metal=12.6 ~ 18：0.1~0.2：0.5~1.5：0.7~1：80~86.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611269050.5A CN106895272A (en) | 2016-12-31 | 2016-12-31 | Use the light-emitting device of organic compound |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611269050.5A CN106895272A (en) | 2016-12-31 | 2016-12-31 | Use the light-emitting device of organic compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106895272A true CN106895272A (en) | 2017-06-27 |
Family
ID=59197762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611269050.5A Pending CN106895272A (en) | 2016-12-31 | 2016-12-31 | Use the light-emitting device of organic compound |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173727A (en) * | 2010-12-15 | 2011-09-07 | 电子科技大学 | Composite high-temperature-resistant wave-absorbing coating material and preparation method of wave-absorbing coating |
| CN102878450A (en) * | 2012-08-06 | 2013-01-16 | 达亮电子（苏州）有限公司 | Light-emitting device |
| CN104232015A (en) * | 2014-09-16 | 2014-12-24 | 上海应用技术学院 | Single-package organic silicon rubber packaging adhesive for high-power type white LED (light-emitting diode) and preparation method of single-package organic silicon rubber packaging adhesive |
| CN106058020A (en) * | 2016-07-08 | 2016-10-26 | 深圳市兆驰节能照明股份有限公司 | Bowl-shaped structure chip-scale package luminescence apparatus and manufacturing method thereof |
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2016
- 2016-12-31 CN CN201611269050.5A patent/CN106895272A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173727A (en) * | 2010-12-15 | 2011-09-07 | 电子科技大学 | Composite high-temperature-resistant wave-absorbing coating material and preparation method of wave-absorbing coating |
| CN102878450A (en) * | 2012-08-06 | 2013-01-16 | 达亮电子（苏州）有限公司 | Light-emitting device |
| CN104232015A (en) * | 2014-09-16 | 2014-12-24 | 上海应用技术学院 | Single-package organic silicon rubber packaging adhesive for high-power type white LED (light-emitting diode) and preparation method of single-package organic silicon rubber packaging adhesive |
| CN106058020A (en) * | 2016-07-08 | 2016-10-26 | 深圳市兆驰节能照明股份有限公司 | Bowl-shaped structure chip-scale package luminescence apparatus and manufacturing method thereof |
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