CN112510028A - Temperature sensing LED filament that discolours and filament lamp - Google Patents
Temperature sensing LED filament that discolours and filament lamp Download PDFInfo
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- CN112510028A CN112510028A CN202011499111.3A CN202011499111A CN112510028A CN 112510028 A CN112510028 A CN 112510028A CN 202011499111 A CN202011499111 A CN 202011499111A CN 112510028 A CN112510028 A CN 112510028A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Abstract
The invention belongs to the technical field of semiconductor lighting, and discloses a thermochromic LED filament and a filament lamp, wherein the thermochromic LED filament comprises a filament substrate, the filament substrate is provided with an electrode lead terminal, an LED chip is arranged on the surface of the filament substrate, the LED chip realizes the electrical connection between the chip and the electrical connection between the chip and the electrode lead terminal through a metal wire, and a thermochromic packaging colloid is coated on the surface of the LED chip and the back surface of the filament substrate and consists of 100 parts by weight of a colloid material, 0-70 parts by weight of a fluorescent powder material and 0.01-20 parts by weight of a thermochromic powder material. Compared with conventional filament packaging, by adding the temperature-variable powder material into the colloid material, when the filament is not lightened, the appearance color of the filament presents the color of the temperature-variable powder, and can become rich and colorful, but after the filament is lightened by electrifying, the temperature rises, and the color of the temperature-variable powder becomes colorless, so that the luminous color and brightness of the chip and the fluorescent powder are not influenced.
Description
Technical Field
The invention belongs to the technical field of semiconductor lighting, and particularly relates to a thermochromic LED filament and a filament lamp using the same.
Background
In recent years, an LED filament lamp can exhibit a 360-degree light emitting angle and excellent illumination brightness, and when the LED filament lamp is assembled in a bulb lamp or a candle lamp, a light emitting effect similar to that of an incandescent lamp can be obtained, and the LED filament lamp is receiving more and more attention.
Because the existing LED filament packaging realizes white light emission by adopting the principle that a blue light chip excites yellow fluorescent powder to compositely emit light, the yellow fluorescent powder layer is coated on the LED chip during the filament packaging, and the appearance color of the LED filament is yellow. Along with the popularization of products, the market puts forward various demands such as grey or black to the outward appearance colour of LED filament, requires simultaneously when the lamp is lighted, can not influence the luminous colour and the luminance of filament itself again, does not have the product that can satisfy this kind of demand in the existing market.
Disclosure of Invention
Therefore, the invention provides a thermochromic LED filament and a filament lamp using the same, which aim to solve the above technical problems.
In order to solve the technical problems, the technical scheme of the invention is as follows:
the invention provides a thermochromic LED filament which comprises a filament substrate, wherein the filament substrate is provided with an electrode lead terminal, an LED chip is arranged on the surface of the filament substrate, the LED chip is electrically connected with the chip through a metal wire and the chip is electrically connected with the electrode lead terminal, a thermochromic packaging colloid is coated on the surface of the LED chip and the back surface of the filament substrate, and the thermochromic packaging colloid is composed of 100 parts by weight of a colloid material, 0-70 parts by weight of a fluorescent powder material and 0.01-20 parts by weight of a thermochromic powder material.
Preferably, the filament substrate is one of a ceramic substrate, a glass substrate, a metal substrate, and a flexible wiring substrate.
Preferably, the LED chip is at least one of a violet chip, a blue chip, a green chip, a yellow chip, and a red chip.
Preferably, the colloid material is one of organic silica gel, organic silicon resin, epoxy resin, polyurethane and UV resin.
Preferably, the phosphor is at least one of yttrium aluminum garnet phosphor, silicate phosphor, fluoride phosphor, nitride phosphor, and oxynitride phosphor.
Preferably, the temperature-sensitive powder material is a reversible temperature-sensitive color-changing material, and the color-changing temperature is set to be 30-80 ℃.
Preferably, the temperature-variable powder realizes color state transition when reaching a color-variable temperature, and changes from a color development state to a color hiding state.
The invention also provides a filament lamp, which comprises a sealed light-transmitting bulb shell, an LED filament arranged in the light-transmitting bulb shell, and a high-thermal-conductivity gas medium filled in the light-transmitting bulb shell, and is characterized in that the LED filament adopts the temperature-sensing color-changing LED filament.
Compared with the prior art, the technical scheme of the invention has the following advantages:
(1) compared with the conventional yellow-appearance lamp filament, the temperature-change powder material is added into the colloid material, so that the color of the temperature-change powder is various, the color shielding property is strong, the color of the temperature-change powder can cover the color of the fluorescent powder, and when the lamp filament is not lightened, the appearance color of the lamp filament presents the color of the temperature-change powder, so that the appearance color of the LED lamp filament becomes rich and colorful, and the LED lamp filament with black appearance or gray appearance can be manufactured;
(2) the temperature-variable powder material is a reversible temperature-sensitive color-variable material, so that color conversion can be realized at a specific temperature, and color state changes of 'color-variable colorless' and 'colorless-variable colored' can be realized. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED filament is changed back to the original color of the temperature-variable powder.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference is now made to the following detailed description of the embodiments of the present disclosure taken in conjunction with the accompanying drawings, in which
Fig. 1 is a schematic diagram of a thermochromic LED filament according to an embodiment of the present invention;
the reference numbers in the figures denote: 1-a filament substrate; 2-electrode lead terminal; 3-an LED chip; 4-a metal wire; 5-temperature sensing color changing encapsulation colloid; 51-colloidal material; 52-a phosphor material; 53-temperature change powder material.
Detailed Description
Example 1
The embodiment provides a temperature sensing LED filament that discolours, see attached figure 1, temperature sensing LED filament that discolours includes filament base plate 1, and the filament base plate is provided with electrode lead terminal 2, is provided with LED chip 3 on filament base plate surface, and the LED chip passes through metal wire 4 and realizes the electricity between chip and the electricity between chip and the electrode lead terminal is connected, coats temperature sensing encapsulation colloid 5 that discolours on LED chip surface and filament base plate back, temperature sensing discolours the encapsulation colloid, by weight, by 100 parts of colloidal material 51, 0 ~ 70 parts of phosphor powder material 52 and 0.01 ~ 10 parts of temperature discolour powder material 53 and constitute. In this embodiment, the filament substrate 1 is a ceramic substrate, the LED chip 3 is a blue chip, and the thermochromic encapsulant 5 is composed of 100 parts of organic silica gel, 20 parts of yttrium aluminum garnet phosphor, 2 parts of nitride phosphor, and 5 parts of gray temperature-sensitive powder. The color change temperature of the temperature change powder material used in the embodiment is set to be 50 ℃, the temperature reaches 50 ℃ or above, the color of the temperature change powder is changed from gray to hidden color, the prepared filament shows gray at normal temperature, the temperature is increased after the filament is lightened, the color of the temperature change powder is changed from gray to hidden color, and the light emitting color and the brightness of the chip and the fluorescent powder are not influenced. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED filament is changed back to the gray of the original temperature-variable powder.
Example 2
In this embodiment, the filament substrate 1 is a flexible circuit substrate, the LED chip 3 is a blue light chip, and the thermochromic encapsulant 5 is composed of 100 parts of organic silica gel, 10 parts of silicate phosphor, 1 part of oxynitride phosphor, and 1 part of black thermochromic phosphor. The color change temperature of the temperature change powder material used in the embodiment is set to be 60 ℃, the temperature reaches 60 ℃ or above, the color of the temperature change powder is changed from black to colorless, the prepared filament shows black at normal temperature, the temperature is increased after the filament is lightened, the color of the temperature change powder is changed from black to leuco, and the light emitting color and the brightness of the chip and the fluorescent powder are not influenced. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED filament is changed back to the black color of the original temperature-changing powder.
Example 3
In this embodiment, the filament substrate 1 is a glass substrate, the LED chip 3 is a violet chip, and the thermochromic encapsulant 5 is composed of 100 parts of organic silica gel, 30 parts of silicate phosphor, 30 parts of fluoride phosphor, 10 parts of oxynitride phosphor, and 5 parts of black thermochromic phosphor. The color change temperature of the temperature change powder material used in the embodiment is set to be 80 ℃, the temperature reaches 80 ℃ or above, the color of the temperature change powder is changed from black to colorless, the prepared filament shows black at normal temperature, the temperature is increased after the filament is lightened, the color of the temperature change powder is changed from black to leuco, and the light emitting color and the brightness of the chip and the fluorescent powder are not influenced at the moment. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED filament is changed back to the black color of the original temperature-changing powder.
Example 4
In this embodiment, the filament substrate 1 is a metal substrate, the LED chip 3 is a green chip, and the thermochromic encapsulant 5 is composed of 100 parts of silicone resin and 0.01 part of gray thermochromic powder. The color change temperature of the temperature change powder material used in the embodiment is set to be 30 ℃, the temperature reaches 30 ℃ or above, the color of the temperature change powder is changed from gray to colorless, the prepared filament shows gray at normal temperature, the temperature is increased after the filament is lightened, the color of the temperature change powder is changed from gray to leuco, and the luminous color and the brightness of the chip are not influenced at the moment. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED filament is changed back to the gray of the original temperature-variable powder.
Example 5
In this embodiment, the filament substrate 1 is a ceramic substrate, the LED chip 3 is a red light chip, and the thermochromic encapsulant 5 is composed of 100 parts of polyurethane and 20 parts of blue thermochromic powder. The color change temperature of the temperature change powder material used in the embodiment is set to be 40 ℃, the temperature reaches 40 ℃ or above, the color of the temperature change powder is changed from blue to colorless, the prepared filament shows blue color at normal temperature, the temperature is increased after the filament is lightened, the color of the temperature change powder is changed from blue to leuco, and the light emitting color and the brightness of the chip are not influenced at the moment. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED filament is changed back to the original blue color of the temperature-variable powder.
Example 6
In this embodiment, the filament substrate 1 is a ceramic substrate, the LED chip 3 is a yellow chip, and the thermochromic encapsulant 5 is composed of 100 parts of UV resin and 10 parts of red thermochromic powder. The color change temperature of the temperature change powder material used in the embodiment is set to be 70 ℃, the temperature reaches 70 ℃ or above, the color of the temperature change powder is changed from red to colorless, the prepared filament shows red at normal temperature, the temperature is increased after the filament is lightened, the color of the temperature change powder is changed from red to leuco, and the light emitting color and the brightness of the chip are not influenced at the moment. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED filament is changed back to the original red color of the temperature-variable powder.
Example 7
In this embodiment, the filament substrate 1 is a ceramic substrate, the LED chip 3 is a blue chip, and the thermochromic encapsulant 5 is composed of 100 parts of epoxy resin and 0.5 part of green thermochromic powder. The color change temperature of the temperature change powder material used in the embodiment is set to be 45 ℃, the temperature reaches 45 ℃ or above, the color of the temperature change powder is changed from green to colorless, the prepared filament is green under the normal temperature state, the temperature is increased after the filament is lightened, the color of the temperature change powder is changed from green to leuco, and the light emitting color and the brightness of the chip are not influenced at the moment. After the lamp is turned off, the temperature is reduced, and the appearance color of the LED lamp filament is changed back to the original green color of the temperature-variable powder.
Based on above-mentioned thermochromic LED filament preparation LED filament lamp that provides, including a sealed light-transmitting bulb casing, set up LED filament in the light-transmitting bulb casing to and be filled with high heat conductivity helium gas medium in the light-transmitting bulb casing, wherein the LED filament adopts the thermochromic LED filament that the aforesaid made. The appearance structure of the LED filament lamp can be set as an A bulb, a C bulb, an ST bulb, a T bulb, a G bulb and other special-shaped structures, the lamp cap adopts E12, E14, E26, E27, B22, E40 and the like, and a driving power supply is arranged in the lamp cap and is electrically connected with the LED filament in the bulb shell.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (8)
1. The utility model provides a temperature sensing LED filament that discolours, its characterized in that, temperature sensing LED filament that discolours includes the filament base plate, and the filament base plate is connected with the electrode lead terminal, filament base plate surface is provided with the LED chip, the LED chip pass through metal wire realize between chip and the chip electricity be connected and the chip with electricity between the electrode lead terminal is connected, LED chip surface and filament base plate back coating have temperature sensing to discolour the encapsulation colloid, temperature sensing discolours the encapsulation colloid by weight portion, by 100 parts of colloidal material, 0 ~ 70 parts of phosphor powder material and 0.01 ~ 20 parts of temperature change powder material constitution.
2. The thermochromic LED filament of claim 1, wherein the filament substrate is one of a ceramic substrate, a glass substrate, a metal substrate, and a flexible wiring substrate.
3. The thermochromic LED filament of claim 1, wherein the LED chip is at least one of a violet chip, a blue chip, a green chip, a yellow chip, and a red chip.
4. The thermochromic LED filament according to claim 1, wherein the colloidal material is one of silicone, silicone resin, epoxy resin, polyurethane, and UV resin.
5. The thermochromic LED filament of claim 1, wherein the phosphor is at least one of an yttrium aluminum garnet phosphor, a silicate phosphor, a fluoride phosphor, a nitride phosphor, and an oxynitride phosphor.
6. The thermochromic LED filament according to claim 1, wherein the thermochromic powder material is a reversible thermochromic material, and the color change temperature is 30-80 ℃.
7. The thermochromic LED filament according to claim 6, wherein the thermochromic powder material is used to achieve a color state transition from a colored state to a leuco state when a color change temperature is reached.
8. A filament lamp comprising a sealed light-transmitting bulb housing, an LED filament disposed in the light-transmitting bulb housing, the light-transmitting bulb housing being filled with a high thermal conductivity gas medium, wherein the LED filament is the thermochromic LED filament according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011499111.3A CN112510028A (en) | 2020-12-03 | 2020-12-03 | Temperature sensing LED filament that discolours and filament lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011499111.3A CN112510028A (en) | 2020-12-03 | 2020-12-03 | Temperature sensing LED filament that discolours and filament lamp |
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| Publication Number | Publication Date |
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| CN112510028A true CN112510028A (en) | 2021-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011499111.3A Pending CN112510028A (en) | 2020-12-03 | 2020-12-03 | Temperature sensing LED filament that discolours and filament lamp |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023051698A1 (en) * | 2021-09-29 | 2023-04-06 | 嘉兴山蒲照明电器有限公司 | Led filament and bulb lamp applying same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820414A (en) * | 2012-09-06 | 2012-12-12 | 广东深莱特科技股份有限公司 | Fluorescent powder mixture and LED (Light-Emitting Diode) packaging device with color conversion function |
| CN105927950A (en) * | 2016-06-01 | 2016-09-07 | 山东晶泰星光电科技有限公司 | LED filament with thermal radiation material and LED filament bulb |
| CN206786562U (en) * | 2017-01-11 | 2017-12-22 | 上海查尔斯光电科技有限公司 | A kind of LED illumination lamp |
-
2020
- 2020-12-03 CN CN202011499111.3A patent/CN112510028A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102820414A (en) * | 2012-09-06 | 2012-12-12 | 广东深莱特科技股份有限公司 | Fluorescent powder mixture and LED (Light-Emitting Diode) packaging device with color conversion function |
| CN105927950A (en) * | 2016-06-01 | 2016-09-07 | 山东晶泰星光电科技有限公司 | LED filament with thermal radiation material and LED filament bulb |
| CN206786562U (en) * | 2017-01-11 | 2017-12-22 | 上海查尔斯光电科技有限公司 | A kind of LED illumination lamp |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023051698A1 (en) * | 2021-09-29 | 2023-04-06 | 嘉兴山蒲照明电器有限公司 | Led filament and bulb lamp applying same |
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Application publication date: 20210316 |
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