CN106893521A - A kind of high temperature resistant paper based adhesive tape and its preparation technology - Google Patents

A kind of high temperature resistant paper based adhesive tape and its preparation technology Download PDF

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Publication number
CN106893521A
CN106893521A CN201710234263.2A CN201710234263A CN106893521A CN 106893521 A CN106893521 A CN 106893521A CN 201710234263 A CN201710234263 A CN 201710234263A CN 106893521 A CN106893521 A CN 106893521A
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high temperature
temperature resistant
adhesive tape
based adhesive
parts
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Inventor
张道武
周晓南
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Shanghai Smith Adhesive New Material Co Ltd
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Shanghai Smith Adhesive New Material Co Ltd
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Priority to CN201710234263.2A priority Critical patent/CN106893521A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21Paper; Textile fabrics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/08Stabilised against heat, light or radiation or oxydation
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/20Presence of organic materials
    • C09J2400/28Presence of paper
    • C09J2400/283Presence of paper in the substrate
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00Presence of polysiloxane

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)

Abstract

The present invention provides a kind of high temperature resistant paper based adhesive tape and its preparation technology, first by 20 100 parts of organic pressure-sensitive gels, the siloxanes addition stirred tank no more than 80 parts;Next adds 1.2 4.0 parts of peroxide initiators among 30 300 parts of solvent, until peroxide is completely dissolved, and stands 5 10min, treats that moisture is precipitated, and by supernatant addition stirred tank, removes moisture, and be stirred until homogeneous to form glue;Then by glue application on paper substrate, 60 120s are dried under 80 100 DEG C of environment, 150 180 DEG C is then warming up to again, allow the 120s of glue curing cross-linking reaction 90, finally cooling winding.The high temperature resistant paper based adhesive tape possess peeling force scope can be adjusted flexibly, high temperature resistant low temperature and the characteristics of excellent anti-ultraviolet property.

Description

A kind of high temperature resistant paper based adhesive tape and its preparation technology
Technical field
The present invention relates to adhesive and adhesive product technical field, more particularly to a kind of high temperature resistant paper based adhesive tape and its system Standby technique.
Background technology
With economic and science and technology progressively development, industry, agricultural, traffic, medical treatment, national defence and civil area are to pressure-sensitive The demand of adhesive increasingly increases, requirement also more and more higher.Country 125 planning also clearly propose research high-performance, High-quality pressure sensitive adhesive and product.
Pressure-sensitive dose for using at present mainly has acrylic pressure sensitive agent and natural rubber pressure sensitive glue.Although wherein acrylic pressure sensitive Adhesive can be used directly to the bonding of some materials and article, but all be in most cases by pressure-sensitive adhesive agent coating In on plastic sheeting, fabric, paper, tinsel or porous sheet material, the acrylic pressure sensitive such as sticking tape and gluing label is made Gluing product is used.It is glutinous easy that these products have, and that takes off is not difficult, and stripping is without damaging, and glue-line will not in a long time Dry the characteristics of.This feature of acrylic pressure sensitive gluing agent is also generally referred to as adhesive sticker.Just because of this, acrylate pressure sensitive adhesive Product are sticked with application field widely, the sticking tape such as handled official business and be packed for;Application and the masking tape of etching;Electrician With the insulating tape of electrical equipment;The protection band of various minute surfaces and various pressure-sensitive labels etc..
Acrylic pressure sensitive agent is coated with strong adaptability, and rate of drying is fast, and strong to base material adhesive force, levelability and the transparency are good It is good;Solvent-type acrylic pressure-sensitive adhesive agent water-tolerant, and durability, weak acid resistant weak base performance are also good;Performance is adjustable, can basis User needs, appropriate regulation formula, is realized;Emulsion acrylic pressure-sensitive adhesive agent solids content is high, and viscosity is relatively low, and Environmental protection.But solvent-type acrylic pressure-sensitive adhesive agent environmental pollution is serious, should try to reclaim;Emulsion acrylic pressure sensitive adhesive is resistance to Aqueous difference, moisture-proof is bad, is coated with slow drying speed, although that is, acrylate pressure sensitive adhesive can provide enough cohesive forces, Its heat resistance is poor, and peeling force is too high and peeling force scope is difficult to be adjusted flexibly, therefore cull occurs at high temperature, it is difficult to The phenomenon of stripping, sees ultraviolet poor-performing in addition, easily aging.
Therefore, for the defect of above-mentioned prior art, it is badly in need of developing a kind of High temperature-resistanadhesive adhesive tape of excellent performance.
The content of the invention
It is an object of the invention to provide a kind of high temperature resistant paper based adhesive tape and its preparation technology, high temperature resistant paper based adhesive tape tool Standby peeling force scope can be adjusted flexibly, high temperature resistant low temperature and the characteristics of excellent anti-ultraviolet property.
For achieving the above object, the invention provides:
A kind of preparation technology of high temperature resistant paper based adhesive tape, specifically includes following steps:
A, 20-100 parts of organic pressure-sensitive gel, siloxanes no more than 80 parts add stirred tank;
B, 1.2-4.0 parts of peroxide initiator is added among 30-300 parts of solvent, until peroxide is completely molten Solution, and 5-10min is stood, treat that moisture is precipitated, by supernatant addition stirred tank, moisture is removed, and be stirred until homogeneous to form glue Water;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3Or ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi。
As a further improvement on the present invention, 1000≤n≤10000 in the siloxane molecule formula, 1000≤a+b≤ 8000。
As a further improvement on the present invention, the peroxide initiator includes benzoyl peroxide, 2,4- dichloro mistakes BP, peroxidized t-butyl perbenzoate, di-t-butyl peroxide, cumyl peroxide, 2,5- dimethyl -2,5- bis- One or more in tert-butyl hydroperoxide hexane.
The present invention also provides a kind of high temperature resistant paper based adhesive tape, including paper substrate and coats glue on paper substrate, the glue Water formula in each component press mass fraction match it is as follows:
20-100 parts of organic pressure-sensitive gel
Siloxanes no more than 80 parts
1.2-4.0 parts of peroxide initiator
30-300 parts of solvent,
The molecular formula of the siloxanes is Me3SiO(Me2SiO)nSiMe3, 1000≤n≤10000 or ViMe2SiO (Me2SiO)a(MeViSiO)bSiMe2Vi, 1000≤a+b≤8000.
As a further improvement on the present invention, the paper base material includes U.S. line paper.
As a further improvement on the present invention, the peeling force adjustable extent of the high temperature resistant paper based adhesive tape is 100- 1500gf/inch。
As a further improvement on the present invention, the temperature resistant range of the high temperature resistant paper based adhesive tape is -60-180 DEG C.
As a further improvement on the present invention, the integral thickness of the high temperature resistant paper based adhesive tape is 80-120 μm, and glue-line is thick Spend is 10-50 μm.
High temperature resistant paper based adhesive tape of the present invention also provides a kind of purposes in uvioresistant.
Compared with prior art, the beneficial effects of the invention are as follows:
In the present invention high temperature resistant paper based adhesive tape by addition can response type siloxanes and other auxiliary agents, make it can basis Use demand is adjusted flexibly peeling force size in preparation technology, and embodies excellent low temperature resistant and high temperature resistant and anti-purple The excellent properties of outside line.
Specific embodiment
Below by specific embodiment, the present invention will be further elaborated:
Present embodiments provide for a kind of preparation technology of high temperature resistant paper based adhesive tape, following steps are specifically included:
A, 20-100 parts of organic pressure-sensitive gel, siloxanes no more than 80 parts add stirred tank;
B, 1.2-4.0 parts of peroxide initiator is added among 30-300 parts of solvent, until peroxide is completely molten Solution, and 5-10min is stood, treat that moisture is precipitated, by supernatant addition stirred tank, moisture is removed, and be stirred until homogeneous to form glue Water;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3, or ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, 1000≤n in the siloxane molecule formula≤ 10000,1000≤a+b≤8000.The peroxide initiator includes benzoyl peroxide, 2,4- dichloro benzoyl peroxide first Acyl, peroxidized t-butyl perbenzoate, di-t-butyl peroxide, cumyl peroxide, 2,5- dimethyl -2,5- di-t-butyl mistakes One or more in oxidation hexane.
Further illustrated below by several groups of glue embodiments:
Embodiment one:
A, by 77 parts of organic pressure-sensitive gels, 23 parts siloxanes add stirred tank in;
B, 2.8 parts of peroxide initiators are added among 90 parts of solvents, until peroxide is completely dissolved, and stood 5-10min, treats that moisture is precipitated, and by supernatant addition stirred tank, removes moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3, 1000≤n≤3000 in the siloxane molecule formula.
Embodiment two
A, by 25 parts of organic pressure-sensitive gels, 75 parts siloxanes add stirred tank in;
B, 1.2 parts of peroxide initiators are added among 230 parts of solvents, until peroxide is completely dissolved, and it is quiet 5-10min is put, treats that moisture is precipitated, by supernatant addition stirred tank, remove moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3, 3000≤n≤4000 in the siloxane molecule formula.
Embodiment three:
A, by 95 parts of organic pressure-sensitive gels, 5 parts siloxanes add stirred tank in;
B, 2.0 parts of peroxide initiators are added among 50 parts of solvents, until peroxide is completely dissolved, and stood 5-10min, treats that moisture is precipitated, and by supernatant addition stirred tank, removes moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is ViMe2SiO (Me2SiO)a(MeViSiO)bSiMe2Vi, a=6000, b=1000 in the siloxane molecule formula.
Example IV:
A, by 35 parts of organic pressure-sensitive gels, 65 parts siloxanes add stirred tank in;
B, 3.2 parts of peroxide initiators are added among 240 parts of solvents, until peroxide is completely dissolved, and it is quiet 5-10min is put, treats that moisture is precipitated, by supernatant addition stirred tank, remove moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3, 4500≤n≤6000 in the siloxane molecule formula.
Embodiment five
A, by 42 parts of organic pressure-sensitive gels, 58 parts siloxanes add stirred tank in;
B, 2.3 parts of peroxide initiators are added among 200 parts of solvents, until peroxide is completely dissolved, and it is quiet 5-10min is put, treats that moisture is precipitated, by supernatant addition stirred tank, remove moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3, 6000≤n≤7000 in the siloxane molecule formula.
Embodiment six:
A, by 70 parts of organic pressure-sensitive gels, 30 parts siloxanes add stirred tank in;
B, 1.5 parts of peroxide initiators are added among 120 parts of solvents, until peroxide is completely dissolved, and it is quiet 5-10min is put, treats that moisture is precipitated, by supernatant addition stirred tank, remove moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is ViMe2SiO (Me2SiO)a(MeViSiO)bSiMe2Vi, a=4800, b=1500 in the siloxane molecule formula.
Embodiment seven:
A, by 82 parts of organic pressure-sensitive gels, 18 parts siloxanes add stirred tank in;
B, 3.5 parts of peroxide initiators are added among 110 parts of solvents, until peroxide is completely dissolved, and it is quiet 5-10min is put, treats that moisture is precipitated, by supernatant addition stirred tank, remove moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150- is then warming up to again 180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3, 8000≤n≤9000 in the siloxane molecule formula.
In order to preferably embody excellent specific property of the invention, below by the high temperature resistant prepared to above-described embodiment one to seven Paper based adhesive tape is tested
Peel test force:
First using 180 ° of peel strengths of high temperature resistant paper based adhesive tape in the country GB/T 2792-1998 measure present invention.Method It is as follows:
(1) experimental rig
Pressure roller is steel wheel of diameter (not including rubber layer) about 84mm of rubber coated, width about 45mm;It is rubber-coated Hardness is (80 ± 5) °, thickness about 6mm;The quality of pressure roller is 2000g ± 50g.
(2) testing machine
Tensile testing machine should make the breaking load of sample between the 15%-85% of full scale load.The force value error of indication is not Should be greater than 1%.Testing machine is continuously peeled off with decrease speed 300mm/min ± 10mm/min.Tensile testing machine should be automatic with energy Record the plotting unit of peel load.
(3) sample
1. adhesive tape:Gluing bandwidth has two kinds of 20mm ± 1mm, 25 ± 1mm, is used in the length about 200mm present invention 20mm ± 1mm, the adhesive tape of length 200mm specifications.
2. breadboard:Breadboard length is 125mm ± 1mm, and width is 50mm ± 1mm, thickness 1.5-2.0mm.Breadboard Material is the 0Cr of the regulations of GB/T 328018Ni9Or 1Cr18Ni9Ti.The experiment granularities that specify of plate surface JB/T7499-1994 are The water-proof abrasive paper of P280, first transversely gently polishes, and slight vestige is ground in whole plate face, then along longitudinal uniform grinding, remove Remove these vestiges.Breadboard access times should again polish and use frequently and after long-term not use.Experiment plate surface has permanently When pollution or scar, should change in time.
(4) result of the test is calculated
180 ° of peel strength σ (KN/m) of pressure-sensitive tape are calculated as follows:
σ=S/Lb × C
In formula, the area in S- recording curves in span, unit mm2
Length in L- recording curves in span, unit mm
B- adhesive tape developed widths, unit mm
The load of C- recording sheet unit heights, unit K N/m.
In the span peeled off, 1 number is read every 20mm, 4 numbers are read altogether, seek its average value, result of the test is shelling Arithmetic mean of instantaneous value from intensity is represented.
180 ° of peel strengths of obtained high temperature resistant paper based adhesive tape in glue embodiment 1~7 are tested by above method, its knot Fruit is as shown in table 1:
Table 1 is high temperature resistant paper based adhesive tape testing experiment result of the present invention
From the experimental data of table 1 can be seen that the present invention by adjusting siloxane molecule structure in n ratios, can be flexible Adjust the peeling force scope of adhesive tape.
Experiment one:Heatproof is tested
(1) high temperature resistant paper based adhesive tape of the present invention is fitted on base material, in this experiment, it is to be fitted to choose 8 blocks of steel plates Base material, planning has 1 test zone of 10cm*10cm on each block of steel plate, and the test zone is averaged and is divided into the small of 10*10 Cage, chooses the high temperature resistant paper based adhesive tape and existing sample that are prepared by above-mentioned 7 groups of glue embodiments as glue to be measured Band, the square that adhesive tape to be measured is cut into 10cm*10cm is fitted in above steel plate, 8 groups altogether;
(2) each block of steel plate is positioned in temperature control box, temperature control the temperature inside the box is risen to 180 DEG C for 20 DEG C by normal temperature, heated up Speed is 0~-100 DEG C/h, then keeps ambient humidity 180% ± 5%1 hour;
(3) -60 DEG C are cooled to and then, rate of temperature fall is 0~-100 DEG C/h, is kept for -40 DEG C at least 1 hour, is then heated up To 180 DEG C, heating rate is 0~100 DEG C/h, keeps 180 DEG C of at least 10min, and -60 DEG C are then cooled to again, and rate of temperature fall is 0 ~-100 DEG C/h, -60 DEG C of at least 10min are kept, 180 DEG C are then warming up to again, heating rate is 0~100 DEG C/h, keeps 180 DEG C at least 10min, so circulates 6h;
(4) steel plate is taken out from temperature control box, after steel plate recovers room temperature, the adhesive tape of surface of steel plate is peeled off, after stripping The adhesive tape for remaining in surface of steel plate by observation estimates residual gum content, gained test result such as table 2.
Table 2
Group Residual gum content %
1 0
2 0
3 0
4 0
5 0
6 0
7 0
Sample adhesive product >0
By the data of table 2 can be seen that in the present invention high temperature resistant paper based adhesive tape by addition can response type siloxanes with And other auxiliary agents, make it peeling force size can be adjusted flexibly in preparation technology according to use demand, and embody excellent Low temperature resistant and high temperature resistant and anti-ultraviolet excellent properties.
It should be understood that, although the present specification is described in terms of embodiments, but not each implementation method only includes one Individual independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art will should say Used as an entirety, technical scheme in each implementation method can also be through appropriately combined, and forming those skilled in the art can for bright book With the other embodiment for understanding.
Those listed above is a series of to be described in detail only for feasibility implementation method of the invention specifically Bright, they simultaneously are not used to limit the scope of the invention, all equivalent implementations made without departing from skill spirit of the present invention Or change should be included within the scope of the present invention.

Claims (9)

1. a kind of preparation technology of high temperature resistant paper based adhesive tape, it is characterised in that specifically include following steps:
A, 20-100 parts of organic pressure-sensitive gel, siloxanes no more than 80 parts add stirred tank;
B, 1.2-4.0 parts of peroxide initiator is added among 30-300 parts of solvent, until peroxide is completely dissolved, and 5-10min is stood, treats that moisture is precipitated, by supernatant addition stirred tank, remove moisture, and be stirred until homogeneous to form glue;
C then by glue application on paper substrate, 60-120s is dried under 80-100 DEG C of environment, 150-180 is then warming up to again DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of the siloxanes is Me3SiO (Me2SiO)nSiMe3
2. the preparation technology of high temperature resistant paper based adhesive tape according to claim 1, it is characterised in that:The siloxane molecule formula In 1000≤n≤10000.
3. the preparation technology of high temperature resistant paper based adhesive tape according to claim 1, it is characterised in that:The peroxide triggers Agent includes benzoyl peroxide, 2,4- dichlorobenzoperoxides, peroxidized t-butyl perbenzoate, di-t-butyl peroxide, mistake Oxidation diisopropylbenzene (DIPB), 2,5- dimethyl -2, one or more in 5- di-t-butyl hexane peroxides.
4. the high temperature resistant paper based adhesive tape that a kind of preparation technology of high temperature resistant paper based adhesive tape as claimed in claim 1 is prepared, its It is characterised by including paper substrate and coats glue on paper substrate, each component presses mass fraction with such as in the glue formula Under:
20-100 parts of organic pressure-sensitive gel
Siloxanes no more than 80 parts
1.2-4.0 parts of peroxide initiator
30-300 parts of solvent,
The molecular formula of the siloxanes is Me3SiO(Me2SiO)nSiMe3Or ViMe2SiO(Me2SiO)a(MeViSiO) bSiMe2Vi, 1000≤a+b≤8000,1000≤n≤10000.
5. high temperature resistant paper based adhesive tape according to claim 4, it is characterised in that:The paper base material includes U.S. line paper.
6. high temperature resistant paper based adhesive tape according to claim 4, it is characterised in that:The peeling force of the high temperature resistant paper based adhesive tape Adjustable extent is 100-1500gf/inch.
7. high temperature resistant paper based adhesive tape according to claim 4, it is characterised in that:The heatproof model of the high temperature resistant paper based adhesive tape Enclose is -60-180 DEG C.
8. high temperature resistant paper based adhesive tape according to claim 4, it is characterised in that:The overall thickness of the high temperature resistant paper based adhesive tape It is 80-120 μm to spend, and bondline thickness is 10-50 μm.
9. purposes of a kind of high temperature resistant paper based adhesive tape as claimed in claim 5 in uvioresistant.
CN201710234263.2A 2017-04-11 2017-04-11 A kind of high temperature resistant paper based adhesive tape and its preparation technology Pending CN106893521A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1918256A (en) * 2003-12-23 2007-02-21 Ge拜尔硅股份有限公司 Curable siloxane composition with modified surface properties
CN101457128A (en) * 2007-12-14 2009-06-17 3M创新有限公司 Composite high temperature gummed tape and method for producing the same
CN102816538A (en) * 2012-08-03 2012-12-12 深圳市摩码科技有限公司 Heavy-release force release film having surface microviscosity and preparation method thereof
CN103305179A (en) * 2013-06-28 2013-09-18 黑龙江省科学院石油化学研究院 Preparation method of hydrosilylation/free radical dual-crosslinking organic silicon pressure-sensitive adhesive
CN104130739A (en) * 2014-06-29 2014-11-05 惠州市永卓科技有限公司 Low stripping force PET (polyethylene terephthalate) protective film pressure sensitive adhesive and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1918256A (en) * 2003-12-23 2007-02-21 Ge拜尔硅股份有限公司 Curable siloxane composition with modified surface properties
CN101457128A (en) * 2007-12-14 2009-06-17 3M创新有限公司 Composite high temperature gummed tape and method for producing the same
CN102816538A (en) * 2012-08-03 2012-12-12 深圳市摩码科技有限公司 Heavy-release force release film having surface microviscosity and preparation method thereof
CN103305179A (en) * 2013-06-28 2013-09-18 黑龙江省科学院石油化学研究院 Preparation method of hydrosilylation/free radical dual-crosslinking organic silicon pressure-sensitive adhesive
CN104130739A (en) * 2014-06-29 2014-11-05 惠州市永卓科技有限公司 Low stripping force PET (polyethylene terephthalate) protective film pressure sensitive adhesive and preparation method thereof

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