CN106957620A - A kind of high temperature resistant paper based adhesive tape and its preparation technology - Google Patents
A kind of high temperature resistant paper based adhesive tape and its preparation technology Download PDFInfo
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- CN106957620A CN106957620A CN201710234267.0A CN201710234267A CN106957620A CN 106957620 A CN106957620 A CN 106957620A CN 201710234267 A CN201710234267 A CN 201710234267A CN 106957620 A CN106957620 A CN 106957620A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/28—Presence of paper
- C09J2400/283—Presence of paper in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Abstract
The present invention provides a kind of high temperature resistant paper based adhesive tape and its preparation technology, 20 100 parts of organic pressure-sensitive gels, the siloxanes no more than 80 parts, 0.1 3.5 parts of polymethyl hydrogen siloxanes, 0.02 1.0 parts of alkynols or conjugated enynes are added into stirred tank first, then 0.8 4.0 parts of peroxide initiators are added among 30 300 parts of solvent, until peroxide is completely dissolved, and stand 5 10min, treat that moisture is precipitated, supernatant is added in stirred tank and stirs 5 10min；Then 0.1 3.0 parts of platinum series catalyst is added during stirring, until stirring to form glue；It is last then by glue application on paper substrate, 60 120s are dried under 80 100 DEG C of environment, 150 180 DEG C are then warming up to again, the 120s of glue curing cross-linking reaction 90, finally cooling winding is allowed.The high temperature resistant paper based adhesive tape possess peeling force scope can be adjusted flexibly, high temperature resistant low temperature and the characteristics of excellent anti-ultraviolet property.
Description
Technical field
The present invention relates to adhesive and adhesive product technical field, more particularly to a kind of high temperature resistant paper based adhesive tape and its system
Standby technique.
Background technology
With economic and science and technology progressively development, industry, agricultural, traffic, medical treatment, national defence and civil area are to pressure-sensitive
The demand of adhesive increasingly increases, requirement also more and more higher.Country 125 planning also clearly propose research high-performance,
High-quality pressure sensitive adhesive and product.
Pressure-sensitive dose used at present mainly has acrylic pressure sensitive agent and natural rubber pressure sensitive glue.Although wherein acrylic pressure sensitive
Adhesive can be used directly to the bonding of some materials and article, but all be to be coated with pressure-sensitive adhesive agent in most cases
In on plastic sheeting, fabric, paper, tinsel or porous sheet material, the acrylic pressure sensitive such as sticking tape and gluing label is made
Gluing product is used.It is glutinous easy that these products have, and that takes off is not difficult, and stripping is without damaging, and glue-line will not in a long time
Dry the characteristics of.This feature of acrylic pressure sensitive gluing agent is also generally referred to as adhesive sticker.Just because of this, acrylate pressure sensitive adhesive
Product are sticked with application field widely, the sticking tape such as handled official business and be packed for；Application and the masking tape of etching；Electrician
With the insulating tape of electrical equipment；The protection band of various minute surfaces and various pressure-sensitive labels etc..
Acrylic pressure sensitive agent is coated with strong adaptability, and rate of drying is fast, and strong to base material adhesive force, levelability and the transparency are good
It is good；Solvent-type acrylic pressure-sensitive adhesive agent water-tolerant, and durability, weak acid resistant weak base performance are also good；Performance is adjustable, can basis
User needs, appropriate regulation formula, is realized；Emulsion acrylic pressure-sensitive adhesive agent solids content is high, and viscosity is relatively low, and
Environmental protection.But solvent-type acrylic pressure-sensitive adhesive agent environmental pollution is serious, it should try to reclaim；Emulsion acrylic pressure sensitive adhesive is resistance to
Aqueous difference, moisture-proof is bad, is coated with slow drying speed, although that is, acrylate pressure sensitive adhesive can provide enough cohesive forces,
Its heat resistance is poor, and peeling force is too high and peeling force scope is difficult to be adjusted flexibly, therefore cull occurs at high temperature, it is difficult to
The phenomenon of stripping, sees ultraviolet poor-performing, easy aging in addition.
Therefore, for the defect of above-mentioned prior art, it is badly in need of developing a kind of High temperature-resistanadhesive adhesive tape of excellent performance.
The content of the invention
It is an object of the invention to provide a kind of high temperature resistant paper based adhesive tape and its preparation technology, high temperature resistant paper based adhesive tape tool
Standby peeling force scope can be adjusted flexibly, high temperature resistant low temperature and the characteristics of excellent anti-ultraviolet property.
For achieving the above object, the invention provides：
A kind of preparation technology of high temperature resistant paper based adhesive tape, specifically includes following steps：
A, by 20-100 parts of organic pressure-sensitive gels, the siloxanes no more than 80 parts, 0.1-3.5 parts of polymethyl hydrogen siloxanes,
0.02-1.0 parts of alkynols or conjugated enynes add stirred tank,
B, 0.8-4.0 parts of peroxide initiators are added among 30-300 part of solvent, up to peroxide is completely molten
Solution, and 5-10min is stood, treat that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 0.1-3.0 part of platinum series catalyst is added during stirring, up to stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 1~6:100, the ratio between mass fraction of Part I and Part II is
1:100-100:1。
As a further improvement on the present invention, Part I in the siloxanes, 1000≤a+b≤8000, Part II
1000≤n≤10000。
As a further improvement on the present invention, the platinum series catalyst includes platinum-ethene base complex or chloroplatinic acid-different
One or two in propanol solution.
As a further improvement on the present invention, the peroxide initiator includes benzoyl peroxide, 2,4- dichloro mistakes
BP, peroxidized t-butyl perbenzoate, di-t-butyl peroxide, cumyl peroxide, 2,5- dimethyl -2,5- bis-
One or more in tert-butyl hydroperoxide hexane.
Present invention also offers a kind of high temperature resistant paper based adhesive tape, including paper substrate and the glue that is coated on paper substrate, it is described
Each component is matched as follows by mass fraction in glue formula：
20-100 parts of organic pressure-sensitive gels
Siloxanes no more than 80 parts
0.1-3.5 parts of polymethyl hydrogen siloxanes
0.02-1.0 parts of alkynols or conjugated enynes
0.1-3.0 parts of catalyst
0.8-4.0 parts of peroxide initiator
30-300 parts of solvent,
Part I molecular formula is ViMe in the siloxanes2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, 1000≤a
+ b≤8000, Part II molecular formula is Me3SiO(Me2SiO)nSiMe3, mole of 1000≤n≤10000, wherein Vi chain links
The ratio between number and Si molal quantity is 1~6:100, the ratio between mass fraction of Part I and Part II is 1:100-100:1.
As a further improvement on the present invention, the paper base material includes U.S. line paper.
As a further improvement on the present invention, the peeling force adjustable extent of the high temperature resistant paper based adhesive tape is 100-
1500gf/inch。
As a further improvement on the present invention, the temperature resistant range of the high temperature resistant paper based adhesive tape is -60-180 DEG C.
As a further improvement on the present invention, the integral thickness of the high temperature resistant paper based adhesive tape is 80-120 μm, and glue-line is thick
Spend for 10-50 μm.
High temperature resistant paper based adhesive tape of the present invention also provides a kind of purposes in uvioresistant.
Compared with prior art, the beneficial effects of the invention are as follows：
In the present invention high temperature resistant paper based adhesive tape by add can response type siloxanes and other auxiliary agents, make it can basis
Peeling force size is adjusted flexibly in use demand in preparation technology, and embodies excellent low temperature resistant and high temperature resistant and anti-purple
The excellent properties of outside line.
Embodiment
Below by embodiment, the present invention will be further elaborated：
Glue embodiment
Embodiment one：
A, by 88 parts of organic pressure-sensitive gels, 12 parts of siloxanes, 0.95 part of polymethyl hydrogen siloxane, 0.23 part of alkynol or altogether
Yoke eneyne adds stirred tank,
B, 1.6 parts of peroxide initiators are added among 64 parts of solvent, until peroxide is completely dissolved, and stood
5-10min, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 0.8 part of platinum series catalyst is added during stirring, until stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 2:100, the ratio between mass fraction of Part I and Part II is 35:
65,1000≤a+b≤2000, Part II 1000≤n≤2000.
Embodiment two
A, by 55 parts of organic pressure-sensitive gels, 45 parts of siloxanes, 0.25 part of polymethyl hydrogen siloxane, 0.05 part of alkynol or altogether
Yoke eneyne adds stirred tank,
B, 2.0 parts of peroxide initiators are added among 100 parts of solvent, until peroxide is completely dissolved, and it is quiet
5-10min is put, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 0.18 part of platinum series catalyst is added during stirring, until stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 2.4:100, the ratio between mass fraction of Part I and Part II is
80:20,2000≤a+b≤4000, Part II 5000≤n≤7000.
Embodiment three：
A, by 25 parts of organic pressure-sensitive gels, 75 parts of siloxanes, 2.6 parts of polymethyl hydrogen siloxanes, 0.8 part of alkynol or conjugation
Eneyne adds stirred tank,
B, 0.5 part of peroxide initiator added among 250 parts of solvent, until peroxide is completely dissolved, and it is quiet
5-10min is put, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 1.9 parts of platinum series catalyst is added during stirring, until stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 4.0:100, the ratio between mass fraction of Part I and Part II is
5:95,6000≤a+b≤8000, Part II 1000≤n≤3000.
Example IV：
A, by 70 parts of organic pressure-sensitive gels, 30 parts of siloxanes, 0.6 part of polymethyl hydrogen siloxane, 0.02 part of alkynol or altogether
Yoke eneyne adds stirred tank,
B, 1.2 parts of peroxide initiators are added among 120 parts of solvent, until peroxide is completely dissolved, and it is quiet
5-10min is put, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 0.37 part of platinum series catalyst is added during stirring, until stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 1.8:100, the ratio between mass fraction of Part I and Part II is
50:50,7000≤a+b≤8000, Part II 8000≤n≤10000.
Embodiment five
A, by 10 parts of organic pressure-sensitive gels, 90 parts of siloxanes, 2.4 parts of polymethyl hydrogen siloxanes, 0.65 part of alkynol or altogether
Yoke eneyne adds stirred tank,
B, 2.1 parts of peroxide initiators are added among 280 parts of solvent, until peroxide is completely dissolved, and it is quiet
5-10min is put, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 2.2 parts of platinum series catalyst is added during stirring, until stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 2.4:100, the ratio between mass fraction of Part I and Part II is
42:58,3000≤a+b≤5000, Part II 5000≤n≤7500.
Embodiment six：
A, by 62 parts of organic pressure-sensitive gels, 38 parts of siloxanes, 0.5 part of polymethyl hydrogen siloxane, 0.02 part of alkynol or altogether
Yoke eneyne adds stirred tank,
B, 1.1 parts of peroxide initiators are added among 150 parts of solvent, until peroxide is completely dissolved, and it is quiet
5-10min is put, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 0.34 part of platinum series catalyst is added during stirring, until stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 2.4:100, the ratio between mass fraction of Part I and Part II is
65:35,2000≤a+b≤3500, Part II 3000≤n≤4000.
Embodiment seven：
A, by 50 parts of organic pressure-sensitive gels, 50 parts of siloxanes, 1.66 parts of polymethyl hydrogen siloxanes, 0.15 part of alkynol or altogether
Yoke eneyne adds stirred tank,
B, 1.3 parts of peroxide initiators are added among 150 parts of solvent, until peroxide is completely dissolved, and it is quiet
5-10min is put, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 1.0 parts of platinum series catalyst is added during stirring, until stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150- is then warming up to again
180 DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I in the siloxanes
For ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, its
The ratio between the molal quantity of middle Vi chain links and Si molal quantity are 1.8:100, the ratio between mass fraction of Part I and Part II is
30:70,6000≤a+b≤7500, Part II 8500≤n≤10000.
In order to preferably embody the excellent specific property of the present invention, below by the high temperature resistant prepared to above-described embodiment one to seven
Paper based adhesive tape is tested
Peel test force：
180 ° of peel strengths of high temperature resistant paper based adhesive tape in the present invention are determined using country GB/T 2792-1998 first.Method
It is as follows：
(1) experimental rig
Pressure roller is diameter (not including rubber layer) about 84mm of rubber coated, width about 45mm steel wheel；It is rubber-coated
Hardness is (80 ± 5) °, thickness about 6mm；The quality of pressure roller is 2000g ± 50g.
(2) testing machine
Tensile testing machine should make the breaking load of sample between the 15%-85% of full scale load.The force value error of indication is not
It should be greater than 1%.Testing machine is continuously peeled off with decrease speed 300mm/min ± 10mm/min.Tensile testing machine should be automatic with energy
Record the plotting unit of peel load.
(3) sample
1. adhesive tape：Gluing bandwidth, which has in two kinds of 20mm ± 1mm, 25 ± 1mm, the length about 200mm present invention, to be used
20mm ± 1mm, the adhesive tape of length 200mm specifications.
2. breadboard：Breadboard length is 125mm ± 1mm, and width is 50mm ± 1mm, thickness 1.5-2.0mm.Breadboard
Material is 0Cr as defined in GB/T 328018Ni9Or 1Cr18Ni9Ti.Test plate surface is with granularity as defined in JB/T7499-1994
P280 water-proof abrasive paper, first transversely gently polishes, slight vestige is ground in whole plate face, then along longitudinal uniform grinding, remove
Remove these vestiges.Breadboard access times should again polish and use frequently and after long-term not use.Experiment plate surface has permanently
When pollution or scar, it should change in time.
(4) result of the test is calculated
180 ° of peel strength σ (KN/m) of pressure-sensitive tape are calculated as follows：
σ=S/Lb × C
In formula, the area in S- recording curves in span, unit mm2
Length in L- recording curves in span, unit mm
B- adhesive tape developed widths, unit mm
The load of C- recording sheet unit heights, unit K N/m.
In the span of stripping, 1 number is read every 20mm, 4 numbers are read altogether, its average value is sought, result of the test is to shell
Arithmetic mean of instantaneous value from intensity is represented.
Obtained high temperature resistant 180 ° of peel strengths of paper based adhesive tape in glue embodiment 1~7 are tested by above method, it is tied
Fruit is as shown in table 1：
Table 1 is high temperature resistant paper based adhesive tape testing experiment result of the present invention
From the experimental data of table 1 can be seen that the present invention by adjusting siloxane molecule structure in a, b and n ratio, can
So that the peeling force scope of adhesive tape is adjusted flexibly.
Experiment one：Heatproof is tested
(1) high temperature resistant paper based adhesive tape of the present invention is fitted on base material, in this experiment, chooses 8 blocks of steel plates to be fitted
Planning has 1 10cm*10cm test zone on base material, each block of steel plate, and the test zone, which is averaged, is divided into the small of 10*10
Cage, chooses the high temperature resistant paper based adhesive tape prepared by above-mentioned 7 groups of glue embodiments and existing sample as glue to be measured
Band, the square that adhesive tape to be measured is cut into 10cm*10cm is fitted in above steel plate, 8 groups altogether；
(2) each block of steel plate is positioned in temperature control box, temperature control the temperature inside the box is risen into 180 DEG C, heating for 20 DEG C by normal temperature
Speed is 0~-100 DEG C/h, then keeps ambient humidity 180% ± 5%1 hour；
(3) -60 DEG C are cooled to and then, rate of temperature fall is 0~-100 DEG C/h, is kept for -40 DEG C at least 1 hour, then heating
To 180 DEG C, heating rate is 0~100 DEG C/h, keeps 180 DEG C of at least 10min, -60 DEG C is then cooled to again, rate of temperature fall is 0
~-100 DEG C/h, -60 DEG C of at least 10min are kept, 180 DEG C are then warming up to again, heating rate is 0~100 DEG C/h, keeps 180
DEG C at least 10min, so circulates 6h；
(4) steel plate is taken out out of temperature control box, after steel plate recovers room temperature, the adhesive tape of surface of steel plate peeled off, after stripping
The adhesive tape for remaining in surface of steel plate by observation estimates residual gum content, gained test result such as table 2.
Table 2
| Group | Residual gum content % |
| 1 | 0 |
| 2 | 0 |
| 3 | 0 |
| 4 | 0 |
| 5 | 0 |
| 6 | 0 |
| 7 | 0 |
| Sample adhesive product | >0 |
By the data of table 2 can be seen that in the present invention high temperature resistant paper based adhesive tape by add can response type siloxanes with
And other auxiliary agents, make it that peeling force size can be adjusted flexibly in preparation technology according to use demand, and embody excellent
Low temperature resistant and high temperature resistant and anti-ultraviolet excellent properties.
It should be understood that, although the present specification is described in terms of embodiments, but not each embodiment only includes one
Individual independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art will should say
Bright book is as an entirety, and technical scheme in each embodiment can also be through appropriately combined, and forming those skilled in the art can
With the other embodiment of understanding.
Those listed above is a series of to be described in detail only for feasibility embodiment of the invention specifically
Bright, they simultaneously are not used to limit the scope of the invention, all equivalent implementations made without departing from skill spirit of the present invention
Or change should be included within the scope of the present invention.
Claims (10)
1. a kind of preparation technology of high temperature resistant paper based adhesive tape, it is characterised in that specifically include following steps：
A, by 20-100 parts of organic pressure-sensitive gels, the siloxanes no more than 80 parts, 0.1-3.5 parts of polymethyl hydrogen siloxanes, 0.02-
1.0 parts of alkynols or conjugated enynes add stirred tank,
B, 0.8-4.0 parts of peroxide initiators are added among 30-300 part of solvent, up to peroxide is completely dissolved, and
5-10min is stood, treats that moisture is precipitated, supernatant is added in stirred tank and stirs 5-10min；
C, 0.1-3.0 part of platinum series catalyst is added during stirring, up to stirring to form glue；
C then by glue application on paper substrate, under 80-100 DEG C of environment dry 60-120s, 150-180 is then warming up to again
DEG C, allow glue curing cross-linking reaction 90-120s, finally cooling winding,
Each component in step a, b, c is calculated according to the mass fraction, wherein, the molecular formula of Part I is in the siloxanes
ViMe2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, the molecular formula of Part II is Me3SiO(Me2SiO)nSiMe3, wherein
The ratio between the molal quantity of Vi chain links and Si molal quantity are 1~6:100, the ratio between mass fraction of Part I and Part II is 1:
100-100:1。
2. the preparation technology of high temperature resistant paper based adhesive tape according to claim 1：It is characterized in that：First in the siloxanes
Part, 1000≤a+b≤8000, Part II 1000≤n≤10000.
3. the preparation technology of high temperature resistant paper based adhesive tape according to claim 1：It is characterized in that：The platinum series catalyst
Including the one or two in platinum-ethene base complex or chloroplatinic acid-aqueous isopropanol.
4. the preparation technology of high temperature resistant paper based adhesive tape according to claim 1：It is characterized in that：The peroxide triggers
Agent includes benzoyl peroxide, 2,4- dichlorobenzoperoxides, peroxidized t-butyl perbenzoate, di-t-butyl peroxide, mistake
Aoxidize the one or more in diisopropylbenzene (DIPB), 2,5- dimethyl -2,5- di-t-butyl hexane peroxides.
5. the high temperature resistant paper based adhesive tape that a kind of preparation technology of high temperature resistant paper based adhesive tape as claimed in claim 1 is prepared, its
It is characterised by the glue for including paper substrate and being coated on paper substrate, the glue formula that each component is matched somebody with somebody such as by mass fraction
Under：
20-100 parts of organic pressure-sensitive gels
Siloxanes no more than 80 parts
0.1-3.5 parts of polymethyl hydrogen siloxanes
0.02-1.0 parts of alkynols or conjugated enynes
0.1-3.0 parts of catalyst
0.8-4.0 parts of peroxide initiator
30-300 parts of solvent,
Part I molecular formula is ViMe in the siloxanes2SiO(Me2SiO)a(MeViSiO)bSiMe2Vi, 1000≤a+b≤
8000, Part II molecular formula is Me3SiO(Me2SiO)nSiMe3, 1000≤n≤10000, the wherein molal quantity of Vi chain links with
The ratio between Si molal quantity is 1~6:100, the ratio between mass fraction of Part I and Part II is 1:100-100:1.
6. high temperature resistant paper based adhesive tape according to claim 5, it is characterised in that：The paper base material includes U.S. line paper.
7. high temperature resistant paper based adhesive tape according to claim 5, it is characterised in that：The peeling force of the high temperature resistant paper based adhesive tape
Adjustable extent is 100-1500gf/inch.
8. high temperature resistant paper based adhesive tape according to claim 5, it is characterised in that：The heatproof model of the high temperature resistant paper based adhesive tape
Enclose for -60-180 DEG C.
9. high temperature resistant paper based adhesive tape according to claim 5, it is characterised in that：The overall thickness of the high temperature resistant paper based adhesive tape
Spend for 80-120 μm, bondline thickness is 10-50 μm.
10. a kind of purposes of high temperature resistant paper based adhesive tape as claimed in claim 5 in uvioresistant.
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| CN201710234267.0A CN106957620A (en) | 2017-04-11 | 2017-04-11 | A kind of high temperature resistant paper based adhesive tape and its preparation technology |
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| CN106957620A true CN106957620A (en) | 2017-07-18 |
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2017
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