CN106887514A - 一种具有散热片基板的led - Google Patents
一种具有散热片基板的led Download PDFInfo
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- CN106887514A CN106887514A CN201510942482.7A CN201510942482A CN106887514A CN 106887514 A CN106887514 A CN 106887514A CN 201510942482 A CN201510942482 A CN 201510942482A CN 106887514 A CN106887514 A CN 106887514A
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- heat spreader
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- 239000000758 substrate Substances 0.000 title claims abstract description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000741 silica gel Substances 0.000 claims abstract description 9
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 2
- 239000007769 metal material Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
本发明公开了一种具有散热片基板的led，包括硅胶、引线、芯片、电极、散热片基板和导热绝缘层，其特征在于：所述的导热绝缘层包裹在散热片基板外，所述的电极在导热绝缘层两端，所述的芯片在导热绝缘层中间、所述的引线连接在芯片和电极之间，所述的硅胶中掺有纳米导光粒子，在导热绝缘层上，将芯片和引线包裹在内。本发明公开的一种具有散热片基板的led，通过将基板设计为导热的金属材料外包裹导热绝缘层，并且将导热的材料形状做成片状，以增大散热面积，提高散热效率，有效将芯片所产生的热量传递给散热片基板，再通过散热片基板将热量迅速传递出去，起到了非常好的散热效果，降低芯片的温度，保持了芯片的稳定性以及反光效率的稳定性。
Description
技术领域
本发明涉及一种发光二极管的封装技术，尤其涉及一种具有散热片基板的led。
背景技术
随着 LED 技术迅速发展，LED 几乎在各个行业都有应用，并逐步取代传统光源，LED 封装技术也在不断进步，原有技术的 LED 封装以陶瓷为载体，晶片长时间工作温度升高，散热程度不佳，进一步使 LED 发光消弱，减弱发光效率。
发明内容
针对以上问题，本发明公开了一种具有散热片基板的led，过将基板设计为导热的金属材料外包裹导热绝缘层，并且将导热的材料形状做成片状，以增大散热面积，提高散热效率，有效将芯片所产生的热量传递给散热片基板，再通过散热片基板将热量迅速传递出去，起到了非常好的散热效果，降低芯片的温度，保持了芯片的稳定性以及反光效率的稳定性。
本发明公开的一种具有散热片基板的led，包括硅胶、引线、芯片、电极、散热片基板和导热绝缘层，其特征在于：所述的导热绝缘层包裹在散热片基板外，所述的电极在导热绝缘层两端，所述的芯片在导热绝缘层中间、所述的引线连接在芯片和电极之间，所述的硅胶中掺有纳米导光粒子，在导热绝缘层上，将芯片和引线包裹在内。
本发明公开的一种具有散热片基板的led，通过将散热元件设计成片状，增大散热面积，利于快速将芯片的热量及时散去。
附图说明
图1位本发明的结构示意图。
1、硅胶 2、引线 3、芯片 4、电极 5、散热片基板 6、导热绝缘层。
具体实施方式
下面结合附图和具体实施方式，进一步阐明本发明，应理解下述具体实施方式仅用于说明本发明而不用于限制本发明的范围，在阅读了本发明之后，本领域技术人员对发明的各种等价形式的修改均落于本申请所附权利要求所限定的范围。
如图1所示，本发明公开了一种具有散热片基板的led，包括硅胶、引线、芯片、电极、散热片基板和导热绝缘层，其特征在于：所述的导热绝缘层包裹在散热片基板外，所述的电极在导热绝缘层两端，所述的芯片在导热绝缘层中间、所述的引线连接在芯片和电极之间，所述的硅胶中掺有纳米导光粒子，在导热绝缘层上，将芯片和引线包裹在内。
作为一种优选，所述的散热片基板形状为片状，增大面积。
作为一种优选，所述的散热片基板每片的厚度至少为0.3mm。
作为一种优选，所述的散热片基板两片的间隙至少为0.3mm。
作为一种优选，所述的散热片基板材料为铜、铝或者合金。
Claims (5)
1.一种具有散热片基板的led，包括硅胶、引线、芯片、电极、散热片基板和导热绝缘层，其特征在于：所述的导热绝缘层包裹在散热片基板外，所述的电极在导热绝缘层两端，所述的芯片在导热绝缘层中间、所述的引线连接在芯片和电极之间，所述的硅胶中掺有纳米导光粒子，在导热绝缘层上，将芯片和引线包裹在内。
2.根据权利要求1所述的一种具有散热片基板的led，其特征在于：所述的散热片基板形状为片状，增大面积。
3.根据权利要求1所述的一种具有散热片基板的led，其特征在于：所述的散热片基板每片的厚度至少为0.3mm。
4.根据权利要求1所述的一种具有散热片基板的led，其特征在于：所述的散热片基板两片的间隙至少为0.3mm。
5.根据权利要求1所述的一种具有散热片基板的led，其特征在于：所述的散热片基板材料为铜、铝或者合金。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510942482.7A CN106887514A (zh) | 2015-12-16 | 2015-12-16 | 一种具有散热片基板的led |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510942482.7A CN106887514A (zh) | 2015-12-16 | 2015-12-16 | 一种具有散热片基板的led |
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| Publication Number | Publication Date |
|---|---|
| CN106887514A true CN106887514A (zh) | 2017-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510942482.7A Pending CN106887514A (zh) | 2015-12-16 | 2015-12-16 | 一种具有散热片基板的led |
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| CN (1) | CN106887514A (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323321A (zh) * | 2019-06-28 | 2019-10-11 | 厦门多彩光电子科技有限公司 | 一种led灯珠和led灯具 |
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2015
- 2015-12-16 CN CN201510942482.7A patent/CN106887514A/zh active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110323321A (zh) * | 2019-06-28 | 2019-10-11 | 厦门多彩光电子科技有限公司 | 一种led灯珠和led灯具 |
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Application publication date: 20170623 |