CN106883791A - A kind of high temperature resistant stamp circuit board adhesive - Google Patents
A kind of high temperature resistant stamp circuit board adhesive Download PDFInfo
- Publication number
- CN106883791A CN106883791A CN201510927861.9A CN201510927861A CN106883791A CN 106883791 A CN106883791 A CN 106883791A CN 201510927861 A CN201510927861 A CN 201510927861A CN 106883791 A CN106883791 A CN 106883791A
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- Prior art keywords
- circuit board
- adhesive
- resin
- coupling agent
- high temperature
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- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
It is a kind of high temperature resistant stamp circuit board adhesive the invention belongs to field of adhesive technology, it is made up of following weight parts raw material：Nitrile rubber 10-30, epoxy resin 0.5-2, phenolic resin 5-20, double maleic amide imide resin 2-10, coupling agent 0.2-1, antioxidant 0.2-1.5, acetone in proper；During preparation, double maleic amide imide resins are first applied to nitrile rubber and are kneaded, while adding antioxidant, complete acrylonitrile butadiene rubber modified, pull into and shred after thin slice dissolving in organic solvent, until completely dissolved, add epoxy resin, phenolic resin, coupling agent, deployed obtain final product；Adhesive low production cost of the present invention, preparation method is simple, stable performance, and with good resistance to tin-welding and folding resistance, peel strength is high, widely used.
Description
Technical field
The invention belongs to field of adhesive technology, specifically a kind of high temperature resistant stamp circuit board adhesive.
Background technology
With continuing to develop for science and technology, the continuous renewal of high-tech product, people are less and less to the volume requirement of equipment, this means that the area of circuit circuit board is less and less, the structure of metal component is also less and less, for the performance requirement more and more higher of stamp circuit board adhesive, under the premise of such, the compression of production cost should be met, product quality is met again, new adhesive can only be researched and developed, improve its heat-resisting quantity, folding resistance and chemical-resistant resistance, improve its peel strength, and it is easy to use, the Novel adhesive of small toxicity turns into the important prerequisite of current electronic product development, therefore, research and develop a kind of resistance to elevated temperatures good, toxicity is low, adhesive property is good, the novel fire resistant stamp circuit board adhesive of convenient printing is particularly significant.
The content of the invention
The purpose of the present invention is poor aiming at current common printed circuit board adhesive resistance to elevated temperatures, and bonding is insecure, and toxicity is high, and peel strength is low, causes it to adapt to current electronic equipment development problem, and provides a kind of high temperature resistant stamp circuit board adhesive.
A kind of high temperature resistant stamp circuit board adhesive of the invention, is made up of following weight parts raw material：
Nitrile rubber 10-30 epoxy resin 0.5-2
The double maleic amide imide resin 2-10 of phenolic resin 5-20
Coupling agent 0.2-1 antioxidants 0.2-1.5
Acetone in proper；
During preparation, double maleic amide imide resins are first applied to nitrile rubber and are kneaded, while adding antioxidant, complete acrylonitrile butadiene rubber modified, pull into and shred after thin slice dissolving in organic solvent, until completely dissolved, add epoxy resin, phenolic resin, coupling agent, deployed obtain final product.
Adhesive of the present invention can be used for bonding between various ambroin films and metal foil, it is adaptable to manufacture flexible print circuit base material.Adhesive low production cost of the present invention, preparation method is simple, stable performance, and with good resistance to tin-welding and folding resistance, chemical-resistant resistance, peel strength is high, widely used, easy to use, and solidification temperature is low, and small toxicity is safe and reliable, is adapted to be widely popularized and uses.
Specific embodiment
Embodiment 1
A kind of high temperature resistant stamp circuit board adhesive of the present embodiment, is made up of following weight parts raw material：
The epoxy resin 1 of nitrile rubber 20
10 pairs of maleic amide imide resins 5 of phenolic resin
The antioxidant 1.0 of coupling agent 0.5
Acetone in proper；
During preparation, double maleic amide imide resins are first applied to nitrile rubber and are kneaded, while adding antioxidant, complete acrylonitrile butadiene rubber modified, pull into and shred after thin slice dissolving in organic solvent, until completely dissolved, add epoxy resin, phenolic resin, coupling agent, deployed obtain final product.Similarly hereinafter.
Embodiment 2
A kind of high temperature resistant stamp circuit board adhesive of the present embodiment, is made up of following weight parts raw material：
The epoxy resin 1.5 of nitrile rubber 15
15 pairs of maleic amide imide resins 8 of phenolic resin
The antioxidant 0.8 of coupling agent 0.8
Acetone in proper.
Claims (1)
1. a kind of high temperature resistant stamp circuit board adhesive, it is characterised in that be made up of following weight parts raw material：
Nitrile rubber 10-30 epoxy resin 0.5-2
The double maleic amide imide resin 2-10 of phenolic resin 5-20
Coupling agent 0.2-1 antioxidants 0.2-1.5
Acetone in proper；
During preparation, double maleic amide imide resins are first applied to nitrile rubber and are kneaded, while adding antioxidant, complete acrylonitrile butadiene rubber modified, pull into and shred after thin slice dissolving in organic solvent, until completely dissolved, add epoxy resin, phenolic resin, coupling agent, deployed obtain final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510927861.9A CN106883791A (en) | 2015-12-15 | 2015-12-15 | A kind of high temperature resistant stamp circuit board adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510927861.9A CN106883791A (en) | 2015-12-15 | 2015-12-15 | A kind of high temperature resistant stamp circuit board adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106883791A true CN106883791A (en) | 2017-06-23 |
Family
ID=59174454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510927861.9A Pending CN106883791A (en) | 2015-12-15 | 2015-12-15 | A kind of high temperature resistant stamp circuit board adhesive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106883791A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115073858A (en) * | 2022-06-15 | 2022-09-20 | 西安天和嘉膜工业材料有限责任公司 | Bismaleimide modified olefin resin glue solution and adhesive tape for high-frequency board, and preparation method and application thereof |
-
2015
- 2015-12-15 CN CN201510927861.9A patent/CN106883791A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115073858A (en) * | 2022-06-15 | 2022-09-20 | 西安天和嘉膜工业材料有限责任公司 | Bismaleimide modified olefin resin glue solution and adhesive tape for high-frequency board, and preparation method and application thereof |
| CN115073858B (en) * | 2022-06-15 | 2023-11-14 | 西安天和嘉膜工业材料有限责任公司 | Bi-horse modified olefin resin glue solution and adhesive tape for high-frequency plate, and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170623 |