CN106881663A - The manufacture method of glass base plate for magnetic recording carrier - Google Patents
The manufacture method of glass base plate for magnetic recording carrier Download PDFInfo
- Publication number
- CN106881663A CN106881663A CN201510936899.2A CN201510936899A CN106881663A CN 106881663 A CN106881663 A CN 106881663A CN 201510936899 A CN201510936899 A CN 201510936899A CN 106881663 A CN106881663 A CN 106881663A
- Authority
- CN
- China
- Prior art keywords
- main surface
- grinding
- glass substrate
- polishing
- magnetic recording
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
一种磁记录介质用玻璃基板的制造方法,能在对主表面进行研磨的工序中抑制在主表面产生线状损伤。该磁记录介质用玻璃基板的制造方法具有对磁记录介质用玻璃基板的主表面进行研磨的主表面研磨工序,所述主表面研磨工序依次包括:第一主表面研磨步骤,在该第一主表面研磨步骤中,将研磨片压紧于磁记录介质用玻璃基板的主表面,一边供给研磨液,一边使所述磁记录介质用玻璃基板及所述研磨片旋转,以对所述主表面进行研磨;第一动态水清洗步骤,在该第一动态水清洗步骤中,供给水以代替研磨液,并使所述磁记录介质用玻璃基板及所述研磨片旋转以进行清洗;以及第二主表面研磨步骤,在该第二主表面研磨步骤中,供给研磨液以代替水,并使所述磁记录介质用玻璃基板及所述研磨片旋转,以对所述主表面进行研磨。
A method of manufacturing a glass substrate for a magnetic recording medium capable of suppressing the occurrence of linear damage on a main surface in a step of polishing the main surface. This method of manufacturing a glass substrate for a magnetic recording medium includes a main surface grinding step of grinding the main surface of the glass substrate for a magnetic recording medium, and the main surface grinding step sequentially includes a first main surface grinding step in which In the surface grinding step, the grinding sheet is pressed against the main surface of the glass substrate for magnetic recording media, and while the polishing liquid is supplied, the glass substrate for magnetic recording medium and the grinding sheet are rotated to perform polishing on the main surface. Grinding; a first dynamic water cleaning step in which water is supplied instead of the grinding liquid, and the glass substrate for magnetic recording medium and the grinding sheet are rotated to clean; and the second main In the surface polishing step, in the second main surface polishing step, a polishing liquid is supplied instead of water, and the glass substrate for magnetic recording media and the polishing sheet are rotated to polish the main surface.
Description
技术领域technical field
本发明涉及磁记录介质用玻璃基板的制造方法。This invention relates to the manufacturing method of the glass substrate for magnetic recording media.
背景技术Background technique
作为在磁盘记录装置等中使用的磁记录介质用基板,目前使用铝合金基板。然而,近年来,伴随着高记录密度化的要求,与铝合金基板相比,较硬、且平坦性、平滑性优异的玻璃基板成为了主流。As a substrate for a magnetic recording medium used in a magnetic disk recording device or the like, an aluminum alloy substrate is currently used. However, in recent years, glass substrates which are harder than aluminum alloy substrates and have excellent flatness and smoothness have become mainstream in response to demands for higher recording densities.
磁记录介质用玻璃基板呈在中央部具有同心圆状的开口部的圆板形状,其通过进行加工成上述形状的工序、研磨主表面的工序、研磨端面的工序等而制造出。The glass substrate for a magnetic recording medium has a disk shape having a concentric opening in the center, and is manufactured by performing the process of processing into the above-mentioned shape, the process of grinding the main surface, the process of grinding the end surface, and the like.
磁记录介质用基板的主表面是记录面,因此,一直以来对研磨主表面的工序进行了各种研究,以能获得期望的特性的主表面。Since the main surface of the substrate for magnetic recording media is the recording surface, various studies have been made on the process of polishing the main surface in order to obtain the main surface with desired characteristics.
关于研磨磁记录介质用玻璃基板的主表面的方法,在例如专利文献1中公开了一种磁记录介质用基板的制造方法,该制造方法具有一边供给包含磨粒的浆料一边研磨基板的表面的基板研磨工序。具体而言,公开了一种磁记录介质用玻璃基板的制造方法,基板研磨工序包括:在对基板的表面施加了与磨粒的电动电位相同符号的电位的状态下,供给浆料并研磨基板的表面的浆料研磨工序;以及在对基板的表面施加了电位的状态下供给清洗液以代替浆料,以对基板的表面进行清洗研磨的清洗研磨工序。根据专利文献1公开的磁记录介质用玻璃基板的制造方法,能降低研磨后的磨粒残渣。Regarding the method of grinding the main surface of a glass substrate for magnetic recording media, for example, Patent Document 1 discloses a method for manufacturing a substrate for magnetic recording media, which includes grinding the surface of the substrate while supplying a slurry containing abrasive grains. substrate grinding process. Specifically, it discloses a method of manufacturing a glass substrate for magnetic recording media. The substrate polishing step includes supplying a slurry and polishing the substrate in a state where a potential having the same sign as the zeta potential of abrasive grains is applied to the surface of the substrate. A slurry polishing process for the surface of the substrate; and a cleaning and polishing process for cleaning and polishing the surface of the substrate by supplying a cleaning liquid instead of the slurry in a state where a potential is applied to the surface of the substrate. According to the manufacturing method of the glass substrate for magnetic recording media disclosed in patent document 1, the abrasive residue after grinding|polishing can be reduced.
但是,在专利文献1记载的磁记录介质用玻璃基板的制造方法中,作为研磨对象的基板限于至少在表面具有导电性的基板,作为磁记录介质用玻璃基板,无法适用于成为近年主流的磁记录介质用玻璃基板。However, in the method for manufacturing a glass substrate for magnetic recording media described in Patent Document 1, the substrate to be polished is limited to a substrate having conductivity at least on the surface, and as a glass substrate for magnetic recording media, it cannot be applied to the magnetic field that has become mainstream in recent years. Glass substrate for recording media.
例如使用双面研磨装置,将研磨片压紧于磁记录介质用玻璃基板的主表面,一边供给研磨液,一边使磁记录介质用玻璃基板及研磨片旋转,从而能实施研磨磁记录介质用玻璃基板的主表面的工序。For example, using a double-sided grinding device, the grinding sheet is pressed against the main surface of the glass substrate for magnetic recording media, and while the polishing liquid is supplied, the glass substrate for magnetic recording media and the grinding sheet are rotated, so that the glass for magnetic recording media can be polished. Process for the main surface of the substrate.
通过如上所述对磁记录介质用玻璃基板的主表面进行研磨,能将磁记录介质用玻璃基板的主表面的平坦度、起伏、表面粗糙度设为期望的范围,此外,还能将磁记录介质用玻璃基板设为期望的板厚。By grinding the main surface of the glass substrate for magnetic recording media as described above, the flatness, waviness, and surface roughness of the main surface of the glass substrate for magnetic recording media can be set to a desired range. The dielectric glass substrate is set to a desired plate thickness.
现有技术文献prior art literature
专利文献patent documents
专利文献1:日本专利特开2006-53965号公报Patent Document 1: Japanese Patent Laid-Open No. 2006-53965
然而,在研磨磁记录介质用玻璃基板的主表面的工序中,可能会在主表面产生线状损伤。近年来,要求磁记录介质的高记录密度化,尤其对作为记录面的主表面要求降低损伤。However, in the step of polishing the main surface of the glass substrate for magnetic recording media, linear damage may occur on the main surface. In recent years, higher recording densities of magnetic recording media have been demanded, and reduction in damage to the main surface, which is the recording surface, has been particularly demanded.
因此,在研磨主表面的工序中,要求抑制磁记录介质用玻璃基板的主表面产生线状损伤。Therefore, in the step of polishing the main surface, it is required to suppress generation of linear damage on the main surface of the glass substrate for magnetic recording media.
发明内容Contents of the invention
因此,本发明鉴于上述现有技术所具有的问题而作,其目的在于提供一种能在对主表面进行研磨的工序中抑制在主表面产生线状损伤的磁记录介质用玻璃基板的制造方法。Therefore, the present invention is made in view of the above-mentioned problems of the prior art, and an object of the present invention is to provide a method of manufacturing a glass substrate for a magnetic recording medium capable of suppressing the generation of linear damage on the main surface in the process of polishing the main surface. .
为了解决上述技术问题,本发明的磁记录介质用玻璃基板的制造方法具有对磁记录介质用玻璃基板的主表面进行研磨的主表面研磨工序,所述主表面研磨工序依次包括:第一主表面研磨步骤,在该第一主表面研磨步骤中,将研磨片压紧于磁记录介质用玻璃基板的主表面,一边供给研磨液,一边使所述磁记录介质用玻璃基板及所述研磨片旋转,以对所述主表面进行研磨;第一动态水清洗步骤,在该第一动态水清洗步骤中,供给水以代替研磨液,并使所述磁记录介质用玻璃基板及所述研磨片旋转以进行清洗;以及第二主表面研磨步骤,在该第二主表面研磨步骤中,供给研磨液以代替水,并使所述磁记录介质用玻璃基板及所述研磨片旋转,以对所述主表面进行研磨。In order to solve the above-mentioned technical problems, the manufacturing method of the glass substrate for magnetic recording medium of the present invention has the main surface grinding process that the main surface of the glass substrate for magnetic recording medium is ground, and the main surface grinding process includes in sequence: the first main surface In the grinding step, in the first main surface grinding step, the grinding sheet is pressed against the main surface of the glass substrate for magnetic recording medium, and the glass substrate for magnetic recording medium and the grinding sheet are rotated while supplying the polishing liquid. , to grind the main surface; the first dynamic water cleaning step, in the first dynamic water cleaning step, water is supplied to replace the grinding liquid, and the glass substrate for the magnetic recording medium and the grinding sheet are rotated and a second main surface grinding step, in which a grinding liquid is supplied instead of water, and the glass substrate for magnetic recording medium and the grinding sheet are rotated to grind the The main surface is ground.
根据本发明的磁记录介质用玻璃基板的制造方法,能提供一种在对主表面进行研磨的工序中能抑制在主表面产生线状损伤的磁记录介质用玻璃基板的制造方法。According to the manufacturing method of the glass substrate for magnetic recording media of this invention, the manufacturing method of the glass substrate for magnetic recording media which can suppress generation|occurrence|production of linear damage in a main surface in the process of grinding|polishing a main surface can be provided.
附图说明Description of drawings
图1是双面研磨装置的结构例的说明图。FIG. 1 is an explanatory diagram of a configuration example of a double-side polishing device.
图2是本发明实施方式的主表面研磨工序的流程图。FIG. 2 is a flowchart of a main surface polishing step according to an embodiment of the present invention.
图3是本发明实施方式的主表面研磨工序的研磨压力、定盘的转速的历时变化的示意图。FIG. 3 is a schematic diagram showing temporal changes in polishing pressure and rotation speed of a fixed plate in a main surface polishing step according to an embodiment of the present invention.
图4是本发明实施方式的主表面研磨工序的流程图。Fig. 4 is a flow chart of a main surface polishing step according to the embodiment of the present invention.
图5是本发明实施方式的主表面研磨工序的研磨压力、定盘的转速的历时变化的示意图。FIG. 5 is a schematic diagram showing temporal changes in the polishing pressure and the rotational speed of the fixed plate in the main surface polishing step according to the embodiment of the present invention.
图6是比较例1的主表面研磨工序的研磨压力、定盘的转速的历时变化的示意图。FIG. 6 is a schematic diagram showing temporal changes in polishing pressure and rotation speed of a fixed plate in a main surface polishing step of Comparative Example 1. FIG.
图7是表示实施例、比较例中的具有线状损伤的磁记录介质用玻璃基板的比例的图。7 is a graph showing the ratio of glass substrates for magnetic recording media having linear damage in Examples and Comparative Examples.
(符号说明)(Symbol Description)
16、18 研磨片16, 18 grinding disc
具体实施方式detailed description
以下,参照附图说明用于实施本发明的方式,但本发明并不限于下述实施方式,只要不脱离本发明的范围,也能在下述实施方式中加入各种变形及置换。Hereinafter, modes for implementing the present invention will be described with reference to the drawings, but the present invention is not limited to the following embodiments, and various modifications and substitutions can be added to the following embodiments without departing from the scope of the present invention.
对本实施方式的磁记录介质用玻璃基板的制造方法的一结构例进行说明。One structural example of the manufacturing method of the glass substrate for magnetic recording media of this embodiment is demonstrated.
本实施方式的磁记录介质用玻璃基板的制造方法具有对磁记录介质用玻璃基板的主表面进行研磨的主表面研磨工序。The manufacturing method of the glass substrate for magnetic recording media of this embodiment has the main surface grinding|polishing process of grinding|polishing the main surface of the glass substrate for magnetic recording media.
然后,主表面研磨工序能依次具有以下步骤。Then, the main surface polishing process can have the following steps in order.
第一主表面研磨步骤:将研磨片压紧于磁记录介质用玻璃基板的主表面,一边供给研磨液,一边使磁记录介质用玻璃基板及研磨片旋转,以进行主表面的研磨。The first main surface polishing step: press the polishing sheet against the main surface of the glass substrate for magnetic recording media, and rotate the glass substrate for magnetic recording media and the polishing sheet while supplying the polishing liquid to polish the main surface.
第一动态水清洗步骤:供给水以替换研磨液,并使磁记录介质用玻璃基板及研磨片旋转以进行清洗。The first dynamic water cleaning step: supplying water to replace the polishing solution, and rotating the glass substrate for magnetic recording media and the polishing sheet for cleaning.
第二主表面研磨步骤:供给研磨液以替换水,并使磁记录介质用玻璃基板及研磨片旋转以进行主表面的研磨。The second main surface polishing step: supplying a polishing liquid to replace water, and rotating the glass substrate for magnetic recording media and the polishing sheet to polish the main surface.
本发明的发明人对在主表面研磨工序中产生线状损伤的原因进行了深刻研究。其结果是,发现因在开始主表面研磨工序之前混入双面研磨装置内的异物、在研磨主表面的过程中产生的研磨残渣、研磨液的浆料的凝聚体、研磨中保持磁记录介质用玻璃基板(以下也记载为“玻璃基板”)的支座产生的扬尘等异物,产生了上述损伤。The inventors of the present invention have intensively studied the cause of the linear damage generated in the main surface polishing step. As a result, it was found that due to the foreign matter mixed in the double-sided grinding device before starting the main surface grinding process, the grinding residue generated in the process of grinding the main surface, the agglomeration of the slurry of the grinding liquid, the magnetic recording medium was kept in the grinding process. The aforementioned damage was caused by foreign matter such as flying dust generated on the holder of the glass substrate (hereinafter also referred to as "glass substrate").
因此,本实施方式的磁记录介质用玻璃基板的制造方法能在主表面研磨工序中设置动态水清洗步骤,该动态水清洗步骤在利用研磨液研磨主表面的两个步骤之间供给水以替换研磨液,并使研磨片及玻璃基板旋转。Therefore, the manufacturing method of the glass substrate for magnetic recording media of this embodiment can provide the dynamic water cleaning step which supplies water between two steps of polishing the main surface with a polishing liquid to replace the main surface grinding process. Grinding liquid, and make the grinding sheet and glass substrate rotate.
根据上述主表面研磨工序,在使用研磨液研磨主表面的第一主表面研磨步骤之后,能通过第一动态水清洗步骤降低、去除双面研磨装置内含有的异物等。然后,通过在降低、去除了双面研磨装置内的异物的环境下,实施第二主表面研磨步骤,能防止产生新的损伤,且即便在第一主表面研磨工序中产生了线状损伤,也能降低、去除上述损伤。因此,在主表面研磨工序中,能抑制在主表面产生线状损伤。According to the above-mentioned main surface polishing step, after the first main surface polishing step of polishing the main surface with the polishing liquid, the first dynamic water washing step can reduce and remove foreign substances contained in the double-sided polishing device. Then, by performing the second main surface grinding step in an environment in which foreign matter in the double-sided grinding device is reduced and removed, new damage can be prevented, and even if linear damage occurs in the first main surface grinding process, It can also reduce and remove the above-mentioned damage. Therefore, in the main surface polishing step, it is possible to suppress the occurrence of linear damage on the main surface.
以下,对各步骤进行说明。Each step will be described below.
(第一主表面研磨步骤)(first main surface grinding step)
在第一主表面研磨步骤中,将进行主表面研磨的磁记录介质用玻璃基板固定于双面研磨装置,一边供给研磨液,一边使玻璃基板及研磨片旋转,以研磨磁记录介质用玻璃基板的主表面。In the first main surface polishing step, the glass substrate for magnetic recording media whose main surface is polished is fixed to a double-sided polishing device, and the glass substrate and the polishing sheet are rotated while supplying the polishing liquid to polish the glass substrate for magnetic recording media. main surface.
此处,使用图1对双面研磨装置的结构例进行说明。Here, a configuration example of a double-side polishing device will be described using FIG. 1 .
图1(A)示出了在进行主表面研磨步骤时使用的支座的结构例,图1(B)示出了双面研磨装置的示意图。FIG. 1(A) shows a structural example of a holder used in the main surface polishing step, and FIG. 1(B) shows a schematic diagram of a double-side polishing device.
当研磨玻璃基板的主表面时,在图1(A)所示的具有能保持玻璃基板的玻璃基板保持孔11的支座(主表面研磨用夹具)10上设置多个玻璃基板。另外,在图中,例示出了设有圆形的玻璃基板保持孔11的支座10,但并不限定于上述实施方式,还能形成与研磨的玻璃基板的形状相配合的玻璃基板保持孔11。例如,在对形状成形前的玻璃基板进行研磨的情况下,能使用具有四边形的玻璃基板保持孔11的支座10。When grinding the main surface of a glass substrate, a plurality of glass substrates are set on a support (main surface grinding jig) 10 having a glass substrate holding hole 11 capable of holding a glass substrate shown in FIG. In addition, in the figure, the holder 10 provided with the circular glass substrate holding hole 11 is shown as an example, but it is not limited to the above-mentioned embodiment, and the glass substrate holding hole matching the shape of the polished glass substrate can also be formed. 11. For example, when polishing a glass substrate before shape forming, the holder 10 having the rectangular glass substrate holding hole 11 can be used.
将设置有玻璃基板的支座10固定于图1(B)所示的双面研磨装置12,并驱动太阳齿轮13、小齿轮14以规定的旋转比率旋转。藉此,使支座10自转,并使支座10以绕着太阳齿轮13公转的方式移动。另外,能使上定盘15及下定盘17旋转,藉此,固定于上定盘15、下定盘17的研磨片16、18也旋转。The holder 10 provided with the glass substrate is fixed to the double-side polishing device 12 shown in FIG. 1(B), and the sun gear 13 and the pinion gear 14 are driven to rotate at a predetermined rotation ratio. Thereby, the carrier 10 is rotated, and the carrier 10 is moved so as to revolve around the sun gear 13 . In addition, the upper fixed plate 15 and the lower fixed plate 17 can be rotated, whereby the polishing sheets 16 and 18 fixed to the upper fixed plate 15 and the lower fixed plate 17 are also rotated.
此时,保持于支座10的玻璃基板的两主表面夹持、按压于在与玻璃基板相对的面分别安装有研磨片16、18的上定盘15与下定盘17之间,因此,玻璃基板的两主表面被同时研磨。另外,当进行研磨时,能朝研磨面与玻璃基板之间供给研磨液。At this time, the two main surfaces of the glass substrate held by the holder 10 are clamped and pressed between the upper fixed disk 15 and the lower fixed disk 17, which are respectively equipped with grinding sheets 16, 18 on the surfaces opposite to the glass substrate. Both main surfaces of the substrate are ground simultaneously. In addition, when polishing, a polishing liquid can be supplied between the polishing surface and the glass substrate.
本实施方式的磁记录介质用玻璃基板的制造方法中使用的玻璃基板只要是磁记录介质用的玻璃基板即可,并未被特别限定。例如,玻璃的种类也可以是非晶玻璃、结晶化玻璃,还可以是在玻璃基板的表层具有强化层的强化玻璃。另外,用于主表面研磨工序的玻璃基板也可以是在中央具有圆形的开口部的圆板形状的玻璃基板,还可以是加工成该圆板形状之前的、即进行形状成形工序之前的四边形的玻璃基板。玻璃基板例如能使用通过浮法、熔融法、下拉法、或者冲压成形法等成形的玻璃基板。The glass substrate used for the manufacturing method of the glass substrate for magnetic recording media of this embodiment is not specifically limited if it is a glass substrate for magnetic recording media. For example, the type of glass may be amorphous glass, crystallized glass, or strengthened glass having a strengthening layer on the surface of the glass substrate. In addition, the glass substrate used in the main surface grinding step may be a disc-shaped glass substrate having a circular opening in the center, or may be a quadrangular glass substrate before processing into the disc shape, that is, before performing the shape forming step. glass substrate. As the glass substrate, for example, a glass substrate formed by a float method, a fusion method, a down-draw method, or a press molding method can be used.
第一主表面研磨步骤中的具体的研磨条件并未被特别限定,能根据研磨的玻璃基板所要求的研磨量等任意地选择研磨时间、双面研磨装置的上定盘及下定盘的转速等。根据定盘的大小等不同研磨条件也是不同的,但例如能将研磨时间设为10分钟以上60分钟以下,另外,还能将上定盘及下定盘的转速设为0.1rpm以上100rpm以下。The specific grinding conditions in the first main surface grinding step are not particularly limited, and the grinding time, the rotating speed of the upper fixed plate and the lower fixed plate of the double-sided grinding device, etc. can be arbitrarily selected according to the amount of grinding required for the glass substrate to be ground. . Grinding conditions vary depending on the size of the plate, but for example, the grinding time can be set to 10 minutes to 60 minutes, and the rotation speed of the upper and lower plate can be set to 0.1 rpm to 100 rpm.
也能任意地选择研磨压力,但为了生产率较高地实施主表面的研磨,因此,研磨压力处于80g/cm2以上是较为理想的。但是,当研磨压力过高时,玻璃基板可能会破损等,因此,研磨压力处于140g/cm2以下是较为理想的。另外,研磨压力是指在图1(B)所示的双面研磨装置中利用上定盘15和下定盘17按压玻璃基板的压力,其是换算为工件上的单位面积的压力后的值。以下说明也相同。The grinding pressure can also be selected arbitrarily, but in order to perform grinding of the main surface with high productivity, the grinding pressure is preferably 80 g/cm 2 or more. However, when the grinding pressure is too high, the glass substrate may be damaged, etc. Therefore, the grinding pressure is preferably 140 g/cm 2 or less. In addition, the polishing pressure refers to the pressure of pressing the glass substrate by the upper fixed plate 15 and the lower fixed plate 17 in the double-sided grinding device shown in FIG. The following description is also the same.
另外,在第一主表面研磨步骤中使用的研磨液也未被特别限定,能根据研磨的玻璃基板所要求的研磨量等进行选择。例如,能使用作为研磨液含有氧化铈磨粒的研磨液、胶体二氧化硅等。但是,根据本文说明的主表面研磨工序,其能抑制线状损伤的产生,因此,在具有多个研磨主表面的工序的情况下,较为理想的是,主表面研磨工序是研磨主表面的工序中的最后的工序。因此,作为研磨液,特别优选使用胶体二氧化硅。In addition, the polishing liquid used in the first main surface polishing step is not particularly limited, and can be selected according to the amount of polishing required for the glass substrate to be polished. For example, a polishing liquid containing cerium oxide abrasive grains, colloidal silica, and the like can be used as the polishing liquid. However, according to the main surface polishing step described herein, the occurrence of linear damage can be suppressed. Therefore, when there are a plurality of steps for polishing the main surface, it is preferable that the main surface polishing step is a step of polishing the main surface. The final process in. Therefore, colloidal silica is particularly preferably used as the polishing liquid.
(第一动态水清洗步骤)(first dynamic water cleaning step)
在第一动态水清洗步骤中,供给水以替换研磨液,并使玻璃基板及研磨片旋转以进行清洗。In the first dynamic water cleaning step, water is supplied to replace the polishing solution, and the glass substrate and the polishing sheet are rotated for cleaning.
如上所述,通过实施第一动态水清洗步骤,能降低、去除双面研磨装置内的在第一主表面研磨步骤中产生的异物、在第一主表面研磨步骤之前混入的异物等。然后,通过在异物被降低、去除了的环境下实施后述的第二主表面研磨步骤,即便通过第一主表面研磨步骤在玻璃基板的主表面上产生了线状损伤,也能降低、去除上述损伤。As described above, by performing the first dynamic water cleaning step, foreign matter generated in the first main surface polishing step and foreign matter mixed before the first main surface polishing step in the double-sided polishing device can be reduced and removed. Then, by performing the second main surface polishing step described later in an environment in which foreign matter is reduced and removed, even if linear damage occurs on the main surface of the glass substrate in the first main surface polishing step, it can be reduced and removed. above damage.
作为第一动态水清洗步骤中使用的水并未被特别限定,但如上所述,是为了去除双面研磨装置内的异物而供给的水,所以,使用含有异物较少的水是较为理想的,这样不会混入新的异物。能优选使用例如经由逆渗透膜过滤后的初级纯净水,尤其更优选使用经由过滤器降低、去除了异物后的初级纯净水。The water used in the first dynamic water cleaning step is not particularly limited, but as described above, it is water supplied to remove foreign matter in the double-sided polishing device, so it is desirable to use water containing less foreign matter. , so that no new foreign matter is mixed. For example, primary purified water filtered through a reverse osmosis membrane can be preferably used, and primary purified water obtained by reducing and removing foreign matter through a filter is more preferably used.
在第一动态水清洗步骤中,水的流量(供给速度)并未被特别限定,但第一动态水清洗步骤是使水流遍双面研磨装置内来降低、去除双面研磨装置内的异物的步骤,因此,以足够的流量供给水,这是较为理想的。因此,关于水的流量,工件单位面积的流量例如为1.5ml/cm2·min以上是较为理想的,为2.0ml/cm2·min以上是更为理想的。但是,即便过度增大水的流量,也几乎无法看到去除异物的效果提高,因此,工件单位面积的流量为5.0ml/cm2·min以下是较为理想的,为4.0ml/cm2·min以下是更为理想的。In the first dynamic water cleaning step, the flow rate (supply speed) of water is not particularly limited, but the first dynamic water cleaning step is to make water flow through the double-sided grinding device to reduce and remove foreign matter in the double-sided grinding device Steps, therefore, supply water at a sufficient flow rate, which is more desirable. Therefore, regarding the flow rate of water, the flow rate per unit area of the workpiece is preferably 1.5 ml/cm 2 ·min or more, and more preferably 2.0 ml/cm 2 ·min or more. However, even if the flow rate of water is excessively increased, the effect of removing foreign matter is hardly improved. Therefore, the flow rate per unit area of the workpiece is preferably 5.0ml/cm 2 ·min or less, which is 4.0ml/cm 2 ·min The following is more ideal.
第一动态水清洗步骤中的研磨压力并未被特别限定,但通过导入水能使摩擦力提高得比研磨时高,因此,当研磨压力过高时,双面研磨装置的负荷可能会升高。但是,当研磨压力过低时,双面研磨装置的定盘的旋转可能会不稳定。因此,研磨压力例如为20g/cm2以上80g/cm2以下是较为理想的,为30g/cm2以上50g/cm2以下是更为理想的。The grinding pressure in the first dynamic water cleaning step is not particularly limited, but the friction force can be increased higher than that during grinding by introducing water, so when the grinding pressure is too high, the load on the double-sided grinding device may increase . However, when the grinding pressure is too low, the rotation of the fixed plate of the double-sided grinding device may become unstable. Therefore, the grinding pressure is preferably not less than 20 g/ cm2 and not more than 80 g/ cm2 , and more preferably not less than 30 g/cm2 and not more than 50 g/cm2.
另外,尽管在第一动态水清洗步骤中并不进行研磨,但由于一般将利用上定盘和下定盘按压玻璃基板的压力称为研磨压力,因此,作为研磨压力进行了说明。In addition, although polishing is not performed in the first dynamic water cleaning step, the pressure for pressing the glass substrate by the upper and lower platens is generally called the polishing pressure, and thus will be described as the polishing pressure.
另外,第一动态水清洗步骤中的定盘的转速并未被特别限定,但由于通过导入水会使摩擦力提高得比研磨时高,因此,最好使转速比第一主表面研磨步骤时的转速小。但是,由于第一动态水清洗步骤是使水流遍双面研磨装置内来降低、去除双面研磨装置内的异物的步骤,因此,当转速过小时,为了使水流遍双面研磨装置内而需要时间,这不是理想的。In addition, the rotation speed of the fixed plate in the first dynamic water cleaning step is not particularly limited, but since the frictional force is increased higher than that during grinding by introducing water, it is preferable to make the rotation speed higher than that during the first main surface grinding step. The speed is small. But because the first dynamic water cleaning step is to make water flow through the double-sided grinding device to reduce and remove the foreign matter in the double-sided grinding device, therefore, when the rotating speed is too small, it is necessary to make the water flow through the double-sided grinding device. time, this is not ideal.
因此,第一动态水清洗步骤中的定盘的转速为第一主表面研磨步骤时的定盘的转速的20%以上60%以下是较为理想的,为30%以上50%以下是更为理想的。另外,在第一主表面研磨步骤中,在上定盘的转速与下定盘的转速不同的情况下,对应的各定盘的转速在上述范围内是较为理想的。Therefore, the rotational speed of the fixed plate in the first dynamic water cleaning step is preferably 20% to 60% of the rotational speed of the fixed plate in the first main surface grinding step, and more preferably 30% to 50% of. In addition, in the first main surface grinding step, if the rotation speed of the upper fixed disk is different from that of the lower fixed disk, it is more ideal that the rotation speeds of the corresponding fixed disks are within the above range.
实施第一动态水清洗步骤的时间未被特别限定,选择实施第一动态水清洗步骤的时间,以能使水流遍双面研磨装置内来去除异物,是较为理想的。例如选择实施第一动态水清洗步骤的时间,以在第一动态水清洗步骤期间至少使上定盘旋转0.5周以上,是较为理想的。特别地,选择实施第一动态水清洗步骤的时间,以在第一动态水清洗步骤期间至少使上定盘旋转一周以上,是更为理想的。The time for implementing the first dynamic water cleaning step is not particularly limited, and it is ideal to select the time for implementing the first dynamic water cleaning step so that water can flow through the double-sided grinding device to remove foreign matter. For example, it is ideal to select the time for implementing the first dynamic water cleaning step so that the upper fixed plate rotates at least 0.5 times during the first dynamic water cleaning step. In particular, it is more ideal to select the time for implementing the first dynamic water cleaning step so that at least the upper fixed plate can rotate more than one revolution during the first dynamic water cleaning step.
另外,此处,对以上定盘的转速为基准实施第一动态水清洗步骤的时间进行了说明,但其原因是:通常从设于上定盘的供给口朝双面研磨装置内供给水。In addition, here, the time for performing the first dynamic water cleaning step is described based on the rotation speed of the upper fixed plate, but the reason is that water is usually supplied into the double-sided polishing device from the supply port provided on the upper fixed plate.
(第二主表面研磨步骤)(Second main surface grinding step)
在第二主表面研磨步骤中,能供给研磨液以替换水,并使玻璃基板及研磨片旋转以对玻璃基板的主表面进行研磨。In the second main surface polishing step, a polishing liquid may be supplied instead of water, and the glass substrate and the polishing sheet may be rotated to polish the main surface of the glass substrate.
第二主表面研磨步骤中的具体的研磨条件并未被特别限定,能根据研磨的玻璃基板所要求的研磨量等任意地选择研磨时间、双面研磨装置的转速等。The specific polishing conditions in the second main surface polishing step are not particularly limited, and the polishing time, the rotational speed of the double-sided polishing apparatus, etc. can be arbitrarily selected according to the amount of polishing required for the glass substrate to be polished.
但是,第二主表面研磨步骤在通过第一动态水清洗步骤降低、去除了双面研磨装置内的异物的环境下进行主表面的研磨,即便在通过第一主表面研磨步骤在玻璃基板的主表面产生了线状损伤的情况下,也能降低、去除上述损伤。因此,将研磨时间确保为能降低、去除第一主表面研磨步骤中产生的线状损伤的程度是较为理想的,例如第二主表面研磨步骤的时间、即研磨时间为30秒以上是较为理想的,为60秒以上是更为理想的。However, in the second main surface grinding step, the main surface is polished in an environment in which the foreign matter in the double-sided polishing device is reduced and removed by the first dynamic water cleaning step, even if the main surface of the glass substrate is damaged by the first main surface grinding step. Even when linear damage has occurred on the surface, the above damage can be reduced and removed. Therefore, it is desirable to ensure the polishing time to such an extent that the linear damage generated in the first main surface polishing step can be reduced and removed. For example, the time for the second main surface polishing step, that is, the polishing time is preferably 30 seconds or more. , more than 60 seconds is more ideal.
另一方面,当第二主表面研磨步骤的时间(研磨时间)过长时,可能会重新产生异物,重新产生线状损伤。因此,研磨时间为八分钟以下是较为理想的,为五分钟以下是更为理想的,为三分钟以下是进一步理想的。On the other hand, when the time of the second main surface polishing step (polishing time) is too long, foreign matter may regenerate and linear damage may regenerate. Therefore, the grinding time is preferably eight minutes or less, more preferably five minutes or less, and still more preferably three minutes or less.
也能任意地选择研磨压力,但为了生产率较高地实施主表面的研磨,因此,研磨压力处于80g/cm2以上是较为理想的。但是,当研磨压力过高时,玻璃基板可能会破损等,因此,研磨压力处于140g/cm2以上是较为理想的。The grinding pressure can also be selected arbitrarily, but in order to perform grinding of the main surface with high productivity, the grinding pressure is preferably 80 g/cm 2 or more. However, if the grinding pressure is too high, the glass substrate may be damaged, etc. Therefore, the grinding pressure is preferably 140 g/cm 2 or more.
另外,在第二主表面研磨步骤中使用的研磨液也未被特别限定,能根据研磨的玻璃基板所要求的研磨量等进行选择。例如,能使用作为研磨液含有氧化铈磨粒的研磨液、胶体二氧化硅等。但是,根据本文说明的主表面研磨工序,能抑制线状损伤的产生,因此,在具有多个研磨主表面的工序的情况下,较为理想的是,主表面研磨工序是研磨主表面的工序中的最后的工序。因此,作为研磨液,特别优选使用胶体二氧化硅。In addition, the polishing liquid used in the second main surface polishing step is not particularly limited, and can be selected according to the amount of polishing required for the glass substrate to be polished. For example, a polishing liquid containing cerium oxide abrasive grains, colloidal silica, and the like can be used as the polishing liquid. However, according to the main surface polishing step described herein, the occurrence of linear damage can be suppressed. Therefore, when there are a plurality of steps for polishing the main surface, it is preferable that the main surface polishing step is one of the steps for polishing the main surface. the final process. Therefore, colloidal silica is particularly preferably used as the polishing liquid.
以上说明的主表面研磨工序如图2的流程图所示的那样,能依次实施上述第一主表面研磨步骤S1、第一动态水清洗步骤S2、第二主表面研磨步骤S3。另外,较为理想的是,为了防止步骤间的异物混入,连续地、即以不打开双面研磨装置的方式实施上述三个步骤。The above-described main surface polishing process can be performed sequentially as shown in the flow chart of FIG. In addition, it is preferable to carry out the above-mentioned three steps continuously, that is, without opening the double-sided polishing device, in order to prevent foreign matter from being mixed between the steps.
此外,在第二主表面研磨步骤结束之后,进行在使玻璃基板及研磨片的旋转停止的状态下朝双面研磨装置内供给水的静态水清洗步骤S4,以降低、去除双面研磨装置内的研磨液。在静态水清洗步骤S4之后,能从双面研磨装置中取出研磨后的玻璃基板。In addition, after the second main surface grinding step is completed, the static water cleaning step S4 of supplying water to the double-sided grinding device in a state where the rotation of the glass substrate and the grinding sheet is stopped is performed to reduce and remove the impurities in the double-sided grinding device. of grinding liquid. After the static water washing step S4, the ground glass substrate can be taken out from the double-side grinding device.
能在静态水清洗步骤中优选使用的水、其流量的优选范围与第一动态水清洗步骤的情况相同,因此,此处省略说明。The preferred range of the flow rate of water that can be preferably used in the static water washing step is the same as that in the first dynamic water washing step, and therefore description thereof will be omitted here.
实施静态水清洗步骤的时间未被特别限定,但例如为10秒以上120秒以下是较为理想的。The time for performing the static water washing step is not particularly limited, but is preferably not less than 10 seconds and not more than 120 seconds, for example.
在图3中示意地示出了至此说明的主表面研磨工序中的研磨压力、定盘的转速及研磨液、水的供给的变化。在图3中,直线表示研磨压力,虚线表示定盘的转速。另外,图表中下部所示的带斜线的块箭头是指供给研磨液的期间,空心的块箭头是指供给水的期间。FIG. 3 schematically shows changes in the polishing pressure, the rotation speed of the fixed plate, and the supply of polishing liquid and water in the main surface polishing step described so far. In FIG. 3, the straight line represents the grinding pressure, and the dotted line represents the rotational speed of the fixed plate. In addition, the hatched block arrows shown in the lower part of the graph indicate the period during which the polishing liquid is supplied, and the hollow block arrows indicate the period during which water is supplied.
如图3所示,在主表面研磨工序刚开始之后,供给研磨液,并提高研磨压力、定盘的转速,从而能实施第一主表面研磨步骤(S1)。然后,在第一主表面研磨步骤(S1)结束之后,供给水以替代研磨液,或者降低研磨压力及定盘的转速,从而能实施第一动态水清洗步骤(S2)。接着,供给研磨液以代替水,并提高研磨压力、定盘的转速,从而能实施第二主表面研磨步骤(S3)。在第二主表面研磨步骤结束之后,供给水以代替研磨液,并停止定盘的旋转,从而能实施静态水清洗步骤(S4)。As shown in FIG. 3 , the first main surface polishing step ( S1 ) can be carried out by supplying a polishing liquid and increasing the polishing pressure and the rotational speed of the fixed plate immediately after the main surface polishing step starts. Then, after the first main surface grinding step (S1), the first dynamic water cleaning step (S2) can be implemented by supplying water instead of the grinding liquid, or reducing the grinding pressure and the rotation speed of the fixed plate. Next, the polishing liquid is supplied instead of water, and the polishing pressure and the rotational speed of the fixed plate are increased, so that the second main surface polishing step ( S3 ) can be performed. After the second main surface polishing step is completed, water is supplied instead of the polishing liquid, and the rotation of the fixed plate is stopped, so that the static water washing step (S4) can be performed.
另外,还可以与第一动态水清洗步骤相同地,供给水并使玻璃基板及研磨片旋转而进行清洗,以替换在停止玻璃基板及研磨片的旋转的状态下朝双面研磨装置内供给水的静态水清洗步骤S4。In addition, in the same manner as the first dynamic water cleaning step, the glass substrate and the polishing sheet may be cleaned by supplying water and rotating it, instead of supplying water into the double-sided polishing device while the rotation of the glass substrate and the polishing sheet is stopped. static water washing step S4.
即,主表面研磨工序还可以具有第二动态水清洗步骤,以代替静态水清洗步骤S4,该第二动态水清洗步骤在第二主表面研磨步骤结束之后,供给水以代替研磨液,并使磁记录介质用玻璃基板及研磨片旋转以进行清洗。在该情况下,如图4所示,在第二主表面研磨步骤S3之后,能实施第二动态水清洗步骤S5。That is, the main surface grinding process may also have a second dynamic water washing step instead of the static water washing step S4. In this second dynamic water washing step, after the second main surface grinding step is completed, water is supplied instead of the grinding liquid, and the The magnetic recording medium is cleaned by rotating the glass substrate and the abrasive sheet. In this case, as shown in FIG. 4 , after the second main surface grinding step S3 , the second dynamic water washing step S5 can be implemented.
这样,通过供给水,并使玻璃基板及研磨片旋转,能将冲洗水流遍双面研磨装置内。因此,尤其能降低、去除附着于双面研磨装置内的研磨液的磨粒等,另外,尤其能抑制接着利用相同的装置研磨玻璃基板的主表面时在主表面产生的损伤。In this manner, by supplying water and rotating the glass substrate and the polishing sheet, rinse water can flow through the double-sided polishing apparatus. Therefore, it is possible to reduce and remove especially the abrasive particles adhering to the polishing liquid in the double-side polishing device, and it is particularly possible to suppress damage to the main surface of the glass substrate when the main surface of the glass substrate is subsequently polished by the same device.
能在第二动态水清洗步骤中优选使用的水、其流量、研磨压力、转速的优选范围与第一动态水清洗步骤的情况相同,因此,此处省略说明。The water that can be preferably used in the second dynamic water cleaning step, the preferred ranges of its flow rate, grinding pressure, and rotational speed are the same as those in the first dynamic water cleaning step, and therefore, description thereof is omitted here.
实施第二动态水清洗步骤的时间未被特别限定,选择实施第二动态水清洗步骤的时间,以能使水流遍双面研磨装置内来去除异物,是较为理想的。例如选择实施第二动态水清洗步骤的时间,以在第二动态水清洗步骤期间至少使上定盘旋转0.2周以上,是较为理想的。特别更为理想的是,选择实施第二动态水清洗步骤的时间,以在第二动态水清洗步骤期间至少使上定盘旋转0.5周以上。The time for implementing the second dynamic water cleaning step is not particularly limited, and it is ideal to select the time for implementing the second dynamic water cleaning step so that water can flow through the double-sided grinding device to remove foreign matter. For example, it is ideal to select the time for implementing the second dynamic water cleaning step so that the upper fixed plate rotates at least 0.2 times during the second dynamic water cleaning step. Particularly more ideally, the time for implementing the second dynamic water cleaning step is selected so that the upper fixed plate rotates at least 0.5 times during the second dynamic water cleaning step.
实施第二动态水清洗步骤的时间的上限并未被特别限定,但从不重新产生异物的观点出发,选择实施第二动态水清洗步骤的时间,以使第二动态水清洗步骤期间的上定盘的转速为三周以下,是较为理想的。The upper limit of the time for implementing the second dynamic water cleaning step is not particularly limited, but from the viewpoint of not reproducing foreign matter, the time for implementing the second dynamic water cleaning step is selected so that the upper limit during the second dynamic water cleaning step The rotational speed of the disk is less than three revolutions, which is ideal.
也可在第二动态水清洗步骤结束之后,打开双面研磨装置以取出玻璃基板,但还能如图4所示进一步实施上述静态水清洗步骤S4,在该静态水清洗步骤S4中,在停止玻璃基板及研磨片的旋转的状态下继续供给水。It is also possible to open the double-sided grinding device to take out the glass substrate after the second dynamic water cleaning step is finished, but the above-mentioned static water cleaning step S4 can also be further implemented as shown in Figure 4. In this static water cleaning step S4, after stopping Water was continuously supplied while the glass substrate and the polishing sheet were rotating.
在第二动态水清洗步骤结束之后,还实施静态水清洗步骤,从而能进一步降低残留于双面研磨装置内的磨粒,因此,是较为理想的。After the second dynamic water cleaning step is completed, the static water cleaning step is also implemented, so as to further reduce the abrasive particles remaining in the double-sided grinding device, so it is more ideal.
如上所述,通过实施第二动态水清洗步骤,能降低、去除双面研磨装置内的研磨磨粒,但仅通过第二动态水清洗步骤可能无法充分地进行去除。另外,若长时间地进行第二动态水清洗步骤,还存在产生新的异物的危险性,因此,实施在停止玻璃基板及研磨片的旋转的状态下继续供给水的静态水清洗步骤是较为理想的。As mentioned above, by performing the second dynamic water cleaning step, the abrasive grains in the double-sided polishing device can be reduced and removed, but the removal may not be sufficiently performed only by the second dynamic water cleaning step. In addition, if the second dynamic water cleaning step is carried out for a long time, there is a risk of new foreign matter being generated. Therefore, it is more desirable to implement a static water cleaning step in which water is continuously supplied while the rotation of the glass substrate and the polishing sheet is stopped. of.
对于能在静态水清洗步骤中优选使用的水、其供给量等已经进行了说明,因此,此处省略说明。The water that can be preferably used in the static water washing step, the supply amount thereof, and the like have already been described, and therefore, description thereof will be omitted here.
图5中示意地示出了在第二主表面研磨步骤之后实施第二动态水清洗步骤及静态水清洗步骤的情况下的、主表面研磨工序中的研磨压力、定盘的转速及研磨液、水的供给变化。与图3相同,直线表示研磨压力,虚线表示定盘的转速。另外,图表中下部所示的带斜线的块箭头是指供给研磨液的期间,空心的块箭头是指供给水的期间。Fig. 5 schematically shows the grinding pressure in the main surface grinding process, the rotating speed of the fixed disk and the grinding liquid, Water supply changes. Same as in Fig. 3, the straight line represents the grinding pressure, and the dotted line represents the rotation speed of the fixed plate. In addition, the hatched block arrows shown in the lower part of the graph indicate the period during which the polishing liquid is supplied, and the hollow block arrows indicate the period during which water is supplied.
直至第二主表面研磨步骤(S3)为止,与图3的情况相同。然后,在第二主表面研磨步骤结束之后,供给水以替代研磨液,降低研磨压力及定盘的转速,从而能实施第二动态水清洗步骤(S5)。接着,停止定盘的旋转,以实施静态水清洗步骤(S4)。It is the same as the case of FIG. 3 up to the 2nd main surface grinding|polishing process (S3). Then, after the second main surface grinding step is completed, water is supplied to replace the grinding liquid, and the grinding pressure and the rotation speed of the fixed plate are reduced, so that the second dynamic water cleaning step ( S5 ) can be implemented. Next, the rotation of the fixed plate is stopped to implement the static water washing step (S4).
至此,对主表面研磨工序进行了说明,但实施上述主表面研磨工序的时间点并未被特别限定,能在任意的时间点进行实施。So far, the main surface polishing step has been described, but the timing at which the above main surface polishing step is performed is not particularly limited, and can be performed at any desired timing.
在磁记录介质用玻璃基板的制造方法中,能具有多个对磁记录介质用玻璃基板的主表面进行研磨的工序。在具有多个对磁记录介质用玻璃基板的主表面进行研磨的工序的情况下,在研磨磁记录介质用玻璃基板的主表面的工序中的最后的工序中,实施至此为止说明了的主表面研磨工序是较为理想的。In the manufacturing method of the glass substrate for magnetic recording media, the process of grinding|polishing the main surface of the glass substrate for magnetic recording media can be comprised severally. In the case where there are a plurality of steps of polishing the main surface of the glass substrate for magnetic recording media, the main surface described so far is implemented in the last step of the steps of polishing the main surface of the glass substrate for magnetic recording media. A grinding process is ideal.
在具有多个研磨玻璃基板的主表面的工序的情况下,通常为了在初始的工序中确保足够的研磨量,利用含有较大粒径的研磨磨粒的研磨液进行研磨。然后,在后期的工序中,进行精密研磨,以使玻璃基板的主表面变为期望的形状。In the case of having a plurality of steps of polishing the main surface of the glass substrate, usually, polishing is performed with a polishing liquid containing relatively large abrasive grains in order to secure a sufficient amount of polishing in the initial step. Then, in a later step, precision polishing is performed so that the main surface of the glass substrate has a desired shape.
因此,在后期的工序中,特别要求从玻璃基板的主表面去除损伤。此外,根据至此为止说明了的主表面研磨工序,能降低、去除因异物等而产生的线状损伤,因此,优选适用于特别要求去除损伤的后期的工序,尤其适用于最终的工序。Therefore, it is particularly required to remove damage from the main surface of the glass substrate in a later step. In addition, according to the main surface polishing step described so far, linear damage caused by foreign matter and the like can be reduced and removed, so it is preferably applied to a later step in which removal of damage is particularly required, and is especially suitable for the final step.
特别地,近年来,伴随着提高磁记录介质的记录密度的要求,对于作为记录面的主表面,即使是深度1nm左右较浅的损伤,也要求降低、去除该损伤。此外,在至此为止说明了的主表面研磨工序中,能降低、去除上述较浅的损伤,因此,优选适用于研磨玻璃基板的主表面的多个工序中的最后的工序,对于上述细微的损伤,也能去除。In particular, in recent years, along with the need to increase the recording density of magnetic recording media, it is required to reduce and remove even shallow damage with a depth of about 1 nm on the main surface as the recording surface. In addition, in the main surface grinding process described so far, the above-mentioned relatively shallow damage can be reduced and removed. Therefore, it is preferably applied to the last process of a plurality of processes for grinding the main surface of the glass substrate. , can also be removed.
至此,对本实施方式的磁记录介质用玻璃基板所具有的主表面研磨工序进行了说明,但本实施方式的磁记录介质用玻璃基板除了主表面研磨工序之外还能具有各种工序。The main surface grinding process of the glass substrate for magnetic recording media of this embodiment has been described so far, but the glass substrate for magnetic recording media of this embodiment may have various processes other than the main surface grinding process.
本实施方式的磁记录介质用玻璃基板的制造方法例如能包括以下的工序1~5。The manufacturing method of the glass substrate for magnetic recording media of this embodiment can include the following process 1-5, for example.
(工序1)从玻璃类基板加工成在中央部具有圆孔的圆板形状的玻璃基板的形状成形工序。(Step 1) A shape forming step of processing a glass substrate into a disk-shaped glass substrate having a hole in the center from a glass substrate.
(工序2)对玻璃基板的内周和外周的端面部分进行倒角的倒角工序。(Process 2) The chamfering process of chamfering the end surface part of the inner periphery and outer periphery of a glass substrate.
(工序3)对玻璃基板的端面(内周端面及外周端面)进行研磨的端面研磨工序。(Process 3) An end surface grinding process of grinding|polishing the end surface (inner peripheral end surface and outer peripheral end surface) of a glass substrate.
(工序4)对玻璃基板的主表面进行研磨的工序。(Process 4) The process of grinding|polishing the main surface of a glass substrate.
(工序5)将玻璃基板清洗并加以干燥的清洗、干燥工序。(Step 5) A washing and drying step of washing and drying the glass substrate.
上述工序无需按上述记载的顺序进行,例如,也可在形状成形工序之前进行研磨主表面的工序。另外,各工序未被限定为一次,能根据所要求的玻璃基板的规格等实施任意次数。例如,能在形状成形工序之后进行研磨主表面的工序,然后,还能在进行完倒角工序和端面研磨工序之后,再次实施研磨主表面的工序。The above steps do not need to be performed in the order described above, for example, the step of grinding the main surface may be performed before the shape forming step. In addition, each step is not limited to one time, and can be performed any number of times according to the specifications of the required glass substrate and the like. For example, the process of grinding the main surface can be performed after the shape forming process, and then the process of grinding the main surface can be performed again after the chamfering process and the end face grinding process.
此处,(工序1)的形状成形工序将通过浮法、熔融法、冲压成形法、下拉法或者再曳引法成形的玻璃类基板加工成在中央部具有圆孔的圆板形状的玻璃基板。另外,所使用的玻璃类基板也可以是非晶玻璃、结晶化玻璃,还可以是在玻璃基板的表层具有强化层的强化玻璃。Here, in the shape forming step of (Step 1), a glass substrate formed by a float method, a fusion method, a press molding method, a down-draw method, or a redraw method is processed into a disk-shaped glass substrate having a round hole in the center. . In addition, the glass-based substrate used may be amorphous glass, crystallized glass, or tempered glass having a strengthening layer on the surface of the glass substrate.
在(工序2)的倒角工序中,能对玻璃基板的内周、外周的端面部分进行倒角。In the chamfering process of (process 2), it is possible to chamfer the inner circumference of the glass substrate and the end face portion of the outer circumference.
(工序3)的端面研磨工序能对玻璃基板的端面(侧面部和倒角部)进行研磨。The end surface grinding process of (process 3) can grind the end surface (side surface part and chamfer part) of a glass substrate.
在(工序4)的研磨主表面的工序中,能使用例如图1(B)所示的双面研磨装置对玻璃基板的主表面进行研磨。In the step of polishing the main surface of (step 4), the main surface of the glass substrate can be polished using, for example, a double-sided polishing apparatus shown in FIG. 1(B) .
另外,当研磨玻璃基板的主表面时,并不限定于如至此说明的那样使用研磨液等的游离磨粒进行研磨的方法,也能使用固定磨粒进行研磨。在使用固定磨粒进行研磨的情况下,在图1(B)所示的双面研磨装置12中,能将研磨片16、18替换成固定磨粒工序进行实施。In addition, when polishing the main surface of the glass substrate, it is not limited to the method of polishing using free abrasives such as polishing liquid as described so far, and it is also possible to polish using fixed abrasives. In the case of polishing using fixed abrasive grains, in the double-sided polishing apparatus 12 shown in FIG. 1(B), it is possible to replace the polishing sheets 16 and 18 with the fixed abrasive grain step.
在实施多次研磨主表面的工序的情况下,实施至少一次已述的主表面研磨工序是较为理想的,在最后的研磨主表面的工序中,实施已述的主表面研磨工序是更为理想的。In the case of carrying out the process of grinding the main surface multiple times, it is more desirable to implement the above-mentioned main surface grinding process at least once, and it is more desirable to implement the above-mentioned main surface grinding process in the last process of grinding the main surface. of.
(工序5)的清洗、干燥工序是对研磨后的玻璃基板进行清洗并进行干燥的工序。具体的清洗方法并未被特别限定。例如,能通过使用清洗剂的擦洗清洗、浸渍在清洗剂溶液中的状态下的超声波清洗、浸渍在纯净水中的状态下的超声波清洗等进行清洗。另外,干燥方法也未被特别限定,例如能利用异丙醇蒸气进行干燥。The washing and drying step of (step 5) is a step of washing and drying the polished glass substrate. A specific cleaning method is not particularly limited. For example, cleaning can be performed by scrub cleaning using a cleaning agent, ultrasonic cleaning in a state of being immersed in a cleaning agent solution, ultrasonic cleaning in a state of being immersed in purified water, or the like. In addition, the drying method is not particularly limited, and, for example, it can be dried with isopropanol vapor.
此外,也可在上述各工序间进行玻璃基板的清洗(工序间清洗)、玻璃基板表面的蚀刻(工序间蚀刻)。另外,在对玻璃基板要求较高的机械强度的情况下,也可在工序3、4中例举出的研磨工序前、或研磨工序后、或研磨工序间,实施在玻璃基板的表层形成强化层的强化工序(例如化学强化工序)。In addition, cleaning of the glass substrate (cleaning between processes) and etching of the surface of the glass substrate (etching between processes) may be performed between each of the above-mentioned processes. In addition, when a high mechanical strength is required for the glass substrate, the surface layer of the glass substrate may be strengthened before, after, or between the polishing steps exemplified in steps 3 and 4. Layer strengthening process (such as chemical strengthening process).
此外,对通过包括上述各工序的制造方法获得的玻璃基板还进行在主表面上形成磁性层等的薄膜的工序,从而成为磁记录介质。Moreover, the process of forming a thin film, such as a magnetic layer, on the main surface is further performed on the glass substrate obtained by the manufacturing method including each process mentioned above, and it becomes a magnetic recording medium.
以上说明的本实施方式的磁记录介质用玻璃基板的制造方法在主表面研磨工序中,较为理想的是在最后的主表面研磨工序中,在第一主表面研磨步骤与第二主表面研磨步骤之间具有第一动态水清洗步骤。此外,能通过第一动态水清洗步骤降低、去除在第一主表面研磨步骤中在双面研磨装置内产生的异物等,并能通过第二主表面研磨步骤在降低、去除了异物的环境下实施主表面的研磨。In the method for manufacturing a glass substrate for a magnetic recording medium according to the present embodiment described above, in the main surface grinding step, preferably in the last main surface grinding step, the first main surface grinding step and the second main surface grinding step with a first dynamic water wash step in between. In addition, it is possible to reduce and remove foreign substances generated in the double-sided polishing device in the first main surface grinding step by the first dynamic water cleaning step, and to reduce and remove foreign substances by the second main surface grinding step. Grinding of the main surface is carried out.
因此,在主表面研磨工序中,能抑制在磁记录介质用玻璃基板的主表面产生线状损伤。Therefore, in the main surface grinding process, generation|occurrence|production of linear damage on the main surface of the glass substrate for magnetic recording media can be suppressed.
[实施例][Example]
以下举例说明具体的实施例,但本发明并不限定于上述实施例。Although specific examples are illustrated below, the present invention is not limited to the above examples.
(实施例1)(Example 1)
通过以下步骤制造出磁记录介质用玻璃基板。The glass substrate for magnetic recording media was manufactured by the following procedure.
首先,由通过浮法成形的以SiO2为主要成分的铝硅酸盐玻璃基板,加工成圆板形状玻璃基板,以获得呈同心圆状地具有直径为20mm的圆孔的、直径65mm的磁记录介质用玻璃基板(形状成形工序)。First, a disc-shaped glass substrate was processed from an aluminosilicate glass substrate mainly composed of SiO2 formed by the float process to obtain a magnetic disk with a diameter of 65 mm and a concentric hole with a diameter of 20 mm. Glass substrate for recording media (shape shaping process).
然后,对玻璃基板的内周、外周的端面部分进行倒角(倒角工序)。Then, the inner periphery and the end face portion of the outer periphery of the glass substrate are chamfered (chamfering process).
接着,使用氧化铝磨粒,对玻璃基板的上下的主表面进行磨削(一次磨削工序)。在一次磨削工序中,作为研磨工具使用铸铁定盘和含有氧化铝磨粒的磨削液,利用双面研磨装置(创技电子机械(公司名:speedfam)制、产品名:DSM-16B-5PV-4MH)对玻璃基板的上下的主表面进行磨削(一次切削)。一次磨削工序结束后,清洗玻璃基板,以去除研磨液及其它污垢。Next, the upper and lower main surfaces of the glass substrate are ground using alumina abrasive grains (primary grinding process). In one grinding process, a double-sided grinding device (manufactured by Sotech Denshiki (company name: speedfam), product name: DSM-16B- 5PV-4MH) grinds (primary cutting) the upper and lower main surfaces of the glass substrate. After a grinding process, clean the glass substrate to remove the grinding liquid and other dirt.
接着,使用研磨刷和氧化铈磨粒对外周侧面和外周倒角部进行研磨,去除外周侧面及外周倒角部的伤痕,以形成镜面的方式对外周端面进行研磨加工。然后,对外周端面研磨后的玻璃基板的磨粒进行清洗去除(外周端面研磨工序)。Next, the peripheral side surface and the peripheral chamfer are polished using a polishing brush and cerium oxide abrasive grains to remove scratches on the peripheral side surface and the peripheral chamfer, and the peripheral end surface is polished to form a mirror surface. Then, the abrasive grains of the glass substrate after grinding|polishing the outer peripheral end surface are cleaned and removed (outer peripheral end surface grinding process).
接着,使用研磨刷和氧化铈磨粒对玻璃基板的内周侧面和内周倒角部进行研磨,去除内周侧面及内周倒角部的伤痕,以形成镜面的方式对内周端面进行研磨加工,清洗去除磨粒(内周端面研磨工序)。Next, use a polishing brush and cerium oxide abrasive grains to polish the inner peripheral side and inner peripheral chamfer of the glass substrate, remove scratches on the inner peripheral side and inner peripheral chamfer, and polish the inner peripheral end surface to form a mirror surface Processing, cleaning and removal of abrasive grains (inner peripheral end face grinding process).
接着,作为研磨工具使用含有平均粒径为4μm的金刚石粒子的固定磨粒工具和含有表面活性剂的磨削液,利用双面研磨装置(创技电子机械(公司名:speedfam)制、产品名:DSM-16B-5PV-4MH)对上下的主表面进行了磨削(二次切削)(二次磨削工序)。在二次磨削工序结束后,清洗玻璃基板,以去除研磨液及其它污垢。Next, using a fixed abrasive tool containing diamond particles with an average particle diameter of 4 μm and a grinding fluid containing a surfactant as a grinding tool, a double-sided grinding device (manufactured by Chuangji Denshiki (company name: speedfam), product name : DSM-16B-5PV-4MH) The upper and lower main surfaces are ground (secondary cutting) (secondary grinding process). After the secondary grinding process, the glass substrate is cleaned to remove grinding fluid and other dirt.
然后,通过研磨该玻璃基板的主表面,制作出外径为65m、内径为20mm、板厚为0.8mm的磁盘用玻璃基板。Then, by polishing the main surface of this glass substrate, the glass substrate for magnetic discs with an outer diameter of 65 m, an inner diameter of 20 mm, and a board thickness of 0.8 mm was produced.
在主表面研磨工序中,最初进行了一次研磨。具体而言,作为研磨工具使用软质聚氨酯制的研磨片(皮革类研磨片)和含有氧化铈磨粒的磨削液,利用16B型的双面研磨装置(创技电子机械(公司名:speedfam)制、产品名:DSM-16B-5PV-4MH)对玻璃基板的上下的主表面进行一次研磨。另外,作为含有氧化铝磨粒的研磨液,使用了以平均粒子直径(以下简称为平均粒径)为约1.0μm的氧化铝为主成分的研磨液组成物。另外,一次研磨的主要的研磨加工压力为120g/cm2,下定盘转速为30rpm,上定盘转速为与下定盘相反方向的10rpm,研磨支座公转速为10rpm,自转速为3rpm,在板厚方向上对上下两主平面研磨了合计30μm。在一次研磨结束后,清洗玻璃基板以去除氧化铈。(一次研磨工序)In the main surface grinding step, grinding is first performed once. Specifically, a soft polyurethane abrasive sheet (leather abrasive sheet) and a grinding liquid containing cerium oxide abrasive grains were used as the abrasive tool, and a 16B type double-sided polishing device (Chuangji Electronics (company name: speedfam) was used. ) manufactured, product name: DSM-16B-5PV-4MH) The upper and lower main surfaces of the glass substrate were polished once. In addition, as a polishing liquid containing alumina abrasive grains, a polishing liquid composition mainly composed of alumina having an average particle diameter (hereinafter simply referred to as the average particle diameter) of about 1.0 μm was used. In addition, the main grinding pressure for one grinding is 120g/cm 2 , the speed of the lower fixed plate is 30rpm, the rotational speed of the upper fixed plate is 10rpm in the opposite direction to that of the lower fixed plate, the revolution speed of the grinding support is 10rpm, and the self-rotation speed is 3rpm. Both the upper and lower main planes were polished to a total of 30 μm in the thickness direction. After one grinding session, the glass substrate was cleaned to remove cerium oxide. (one grinding process)
接着,通过以下步骤对玻璃基板的上下的主表面进行二次研磨(二次研磨工序)。Next, the upper and lower main surfaces of the glass substrate are subjected to secondary polishing in the following procedure (secondary polishing process).
根据图2所示的流程图实施二次研磨工序。另外,使双面研磨装置的研磨压力、定盘的转速及研磨液、水的供给如图3所示地变化来进行实施。The secondary polishing process was carried out according to the flowchart shown in FIG. 2 . In addition, the polishing pressure of the double-sided polishing apparatus, the rotation speed of the fixed disk, and the supply of polishing liquid and water were changed as shown in FIG. 3 and implemented.
利用图1所示的16B型的双面研磨装置12(创技电子机械(公司名:speedfam)制、产品名:DSM-16B-5PV-4MH)进行了主表面的二次研磨。双面研磨装置12包括:在与玻璃基板相对的面上安装有研磨片16、18的上定盘15;以及下定盘17。The secondary polishing of the main surface was performed by a 16B-type double-side polishing device 12 (manufactured by Sotech Denshiki (company name: speedfam), product name: DSM-16B-5PV-4MH) shown in FIG. 1 . The double-sided grinding device 12 includes: an upper fixed plate 15 on which grinding sheets 16 and 18 are installed on a surface opposite to the glass substrate; and a lower fixed plate 17 .
接着,将结束了一次研磨工序后的圆板形状玻璃基板固定于支座10,并按每批100块的量将玻璃基板固定于双面研磨装置以进行研磨。Next, the disk-shaped glass substrates after one lapping process were fixed to the holder 10, and the glass substrates were fixed to a double-sided lapping apparatus in batches of 100 to polish.
在主表面的二次研磨工序中,首先,实施第一主表面研磨步骤S1。In the secondary polishing step of the main surface, first, the first main surface polishing step S1 is implemented.
在第一主表面研磨步骤中,利用上定盘15和下定盘17以研磨压力达到100g/cm2的方式按压玻璃基板,并以上定盘15的转速为7rpm、下定盘的转速为21rpm的方式进行驱动,研磨了三十分钟。另外,此时,驱动太阳齿轮13、小齿轮14旋转,使支座10一边自转一边以绕着太阳齿轮13公转的方式移动,从而也使玻璃基板旋转。In the first main surface grinding step, the glass substrate was pressed with the upper platen 15 and the lower platen 17 so that the grinding pressure was 100 g/cm 2 , and the rotational speed of the upper platen 15 was 7 rpm and the rotational speed of the lower platen was 21 rpm. Driven and milled for thirty minutes. In addition, at this time, the sun gear 13 and the pinion gear 14 are driven to rotate, and the holder 10 is moved so as to revolve around the sun gear 13 while rotating on its own, thereby also rotating the glass substrate.
另外,在研磨的期间,朝研磨片的研磨面和玻璃基板的主表面之间供给平均粒径为大约20nm的胶体二氧化硅研磨液以作为研磨液。In addition, during polishing, a colloidal silica polishing liquid having an average particle diameter of about 20 nm was supplied as a polishing liquid between the polishing surface of the polishing sheet and the main surface of the glass substrate.
在第一主表面研磨步骤结束之后,实施第一动态水清洗步骤S2。After the first main surface grinding step is finished, a first dynamic water cleaning step S2 is implemented.
第一动态水清洗步骤在第一主表面研磨步骤结束后,在不打开双面研磨装置的情况下连续地实施了30秒钟。The first dynamic water cleaning step was continuously performed for 30 seconds after the first main surface grinding step was completed without opening the double-side grinding device.
在第一动态水清洗步骤中,将研磨机的研磨压力改变为40g/cm2,将上定盘的转速改变为3rpm,将下定盘的转速改变为9rpm。另外,供给经由过滤器过滤后的初级纯净水,以代替研磨液。以单位工件面积的流量为2.4ml/cm2·min的方式供给上述初级纯净水。In the first dynamic water cleaning step, the grinding pressure of the grinder was changed to 40 g/cm 2 , the rotation speed of the upper fixed plate was changed to 3 rpm, and the rotation speed of the lower fixed plate was changed to 9 rpm. In addition, primary purified water filtered through a filter is supplied instead of polishing liquid. The above-mentioned primary purified water was supplied so that the flow rate per workpiece area was 2.4 ml/cm 2 ·min.
在第一动态水清洗步骤结束之后,实施第二主表面研磨步骤S3。After the first dynamic water cleaning step is finished, the second main surface grinding step S3 is carried out.
第二主表面研磨步骤在第一动态水清洗步骤结束后,在不打开双面研磨装置的情况下连续地实施了5分钟。The second main surface grinding step was carried out continuously for 5 minutes after the first dynamic water washing step was completed without opening the double-side grinding device.
除了研磨时间之外,与第一主表面研磨步骤相同地实施了第二主表面研磨步骤。The second main surface grinding step was carried out in the same manner as the first main surface grinding step except for the grinding time.
在第二主表面研磨步骤结束之后,停止玻璃基板及定盘的旋转,也停止研磨液的供给。接着,朝双面研磨装置内供给经由过滤器过滤之后的初级纯净水,在不打开双面研磨装置的情况下连续地实施了40秒钟静态水清洗步骤S4。在静态水清洗步骤中,以单位工件面积的流量为2.4ml/cm2·min的方式供给上述初级纯净水。After the second main surface polishing step is completed, the rotation of the glass substrate and the surface plate is stopped, and the supply of the polishing liquid is also stopped. Next, the primary purified water filtered through the filter was supplied into the double-sided polishing device, and the static water washing step S4 was continuously performed for 40 seconds without opening the double-sided polishing device. In the static water washing step, the above-mentioned primary pure water was supplied so that the flow rate per unit area of the workpiece was 2.4 ml/cm 2 ·min.
在静态水清洗步骤之后,打开双面研磨装置,并取出磁记录介质用玻璃基板。After the static water washing step, the double-side grinding device was opened, and the glass substrate for magnetic recording medium was taken out.
以上说明的二次研磨工序之后,进行擦洗清洗、浸渍在纯净水中的状态下的超声波清洗的清洗,并利用异丙醇蒸气干燥(清洗、干燥工序)之后,用于评价。After the above-described secondary polishing step, scrub cleaning and ultrasonic cleaning in a state of immersion in purified water were performed, and drying with isopropanol vapor (washing and drying steps) was used for evaluation.
下面说明评价方法及评价结果。The evaluation method and evaluation results will be described below.
使用光散射方式表面观察机(公司名:KLA Tencor公司制,OSACandela7100)对在磁记录介质用玻璃基板的表面是否形成有线状损伤进行评价。此外,算出具有线状损伤的磁记录介质用玻璃基板的比例,结果确认为2.1%。The presence or absence of linear damage formed on the surface of the glass substrate for magnetic recording media was evaluated using a light scattering method surface observation machine (company name: KLA Tencor company make, OSACandela7100). Moreover, as a result of calculating the ratio of the glass substrate for magnetic recording media which has linear damage, it was confirmed to be 2.1%.
另外,使用光散射方式表面观察机对附着于所获得的磁记录介质用玻璃基板的表面的颗粒的数量进行了评价,结果确认OSA计数的中位数为19。另外,OSA计数的数值越小,则意味着附着的颗粒的数量越少。In addition, when the number of particles adhering to the surface of the obtained glass substrate for magnetic recording media was evaluated using a light-scattering type surface observer, it was confirmed that the median number of OSA counts was 19. In addition, the smaller the numerical value of the OSA count, the smaller the number of attached particles.
(实施例2)(Example 2)
在实施例2中,根据图4所示的流程图实施主表面的二次研磨工序。另外,使双面研磨装置的研磨压力、定盘的转速及研磨液、水的供给如图5所示地变化来进行实施。In Example 2, the secondary polishing process of the main surface was implemented according to the flowchart shown in FIG. 4 . In addition, the polishing pressure of the double-sided polishing apparatus, the rotation speed of the fixed disk, and the supply of polishing liquid and water were changed as shown in FIG. 5 and implemented.
即,在第二主表面研磨步骤S3结束后、静态水清洗步骤S4之前,除了实施第二动态水清洗步骤S5这点以及将静态水清洗步骤的时间设为30秒钟这点之外,均与实施例1相同地制造出磁记录介质用玻璃基板。That is, after the second main surface grinding step S3 and before the static water cleaning step S4, except for the point of implementing the second dynamic water cleaning step S5 and setting the time of the static water cleaning step to 30 seconds, all A glass substrate for a magnetic recording medium was produced in the same manner as in Example 1.
第二动态水清洗步骤S5在第二主表面研磨步骤结束后,在不打开双面研磨装置的情况下,连续地实施了10秒钟。The second dynamic water cleaning step S5 was continuously implemented for 10 seconds after the second main surface grinding step was completed without turning on the double-side grinding device.
在第二动态水清洗步骤中,在第二主表面研磨步骤结束后,将研磨机的压力改变为40g/cm2,另外,还将上定盘的转速改变为3rpm,将下定盘的转速改变为9rpm。另外,供给经由过滤器过滤后的初级纯净水,以代替研磨液。在第二动态水清洗步骤S5中,以工件单位面积的流量为2.4ml/cm2·min的方式供给上述初级纯净水。In the second dynamic water cleaning step, after the second main surface grinding step, the pressure of the grinder was changed to 40g/cm 2 , in addition, the speed of the upper plate was changed to 3rpm, and the speed of the lower plate was changed to 9rpm. In addition, primary purified water filtered through a filter is supplied instead of polishing liquid. In the second dynamic water washing step S5, the above-mentioned primary pure water was supplied so that the flow rate per unit area of the workpiece was 2.4 ml/cm 2 ·min.
静态水清洗步骤S4在第二动态水清洗步骤结束后,在不打开双面研磨装置的情况下,连续地实施了30秒钟。The static water washing step S4 was continuously implemented for 30 seconds without opening the double-sided grinding device after the second dynamic water washing step.
在静态水清洗步骤中,停止玻璃基板及定盘的旋转。然后,朝双面研磨装置内供给经由过滤器过滤后的初级纯净水。在静态水清洗步骤中,以工件单位面积的流量为2.4ml/cm2·min的方式供给上述初级纯净水。In the static water washing step, the rotation of the glass substrate and the fixed plate is stopped. Then, the primary purified water filtered through the filter is supplied into the double-sided polishing device. In the static water washing step, the above-mentioned primary pure water was supplied so that the flow rate per unit area of the workpiece was 2.4 ml/cm 2 ·min.
在静态水清洗步骤结束之后,打开双面研磨装置,取出磁记录介质用玻璃基板,与实施例1同样地,在进行完清洗、干燥之后,用于评价。After the static water cleaning step was completed, the double-sided polishing device was opened, and the glass substrate for magnetic recording media was taken out, and was used for evaluation after cleaning and drying in the same manner as in Example 1.
与实施例1相同地,算出具有线状损伤的磁记录介质用玻璃基板的比例,结果确认为0.9%。As a result of calculating the ratio of the glass substrate for magnetic recording media which has linear damage similarly to Example 1, it confirmed that it was 0.9%.
另外,与实施例1同样地,对附着于获得的磁记录介质用玻璃基板的表面的颗粒的数量进行了评价,结果确认OSA计数的中位数为14。Moreover, as a result of evaluating the number of particles adhering to the surface of the obtained glass substrate for magnetic recording media in the same manner as in Example 1, it was confirmed that the median of OSA counts was 14.
(比较例1)(comparative example 1)
除了不实施第一动态水清洗步骤,将第一主表面研磨步骤的研磨时间设为35分钟,不实施第二主表面研磨步骤这些点之外,与实施例1相同地制造出磁记录介质用玻璃基板。即,将第一主表面研磨步骤和第二主表面研磨步骤作为一个研磨步骤连续地进行实施。Except that the first dynamic water cleaning step is not implemented, the grinding time of the first main surface grinding step is set to 35 minutes, and the second main surface grinding step is not implemented, the magnetic recording medium is manufactured in the same manner as in Example 1. Glass base board. That is, the first main surface polishing step and the second main surface polishing step are continuously performed as one polishing step.
此处,在图6中示意地示出了比较例1中的主表面研磨工序中的研磨压力、定盘的转速及研磨液、水的供给的变化。与图3相同,直线表示研磨压力,虚线表示定盘的转速。另外,图表中下部所示的带斜线的块箭头是指供给研磨液的期间,空心的块箭头是指供给水的期间。Here, FIG. 6 schematically shows changes in the polishing pressure, the rotation speed of the fixed plate, and the supply of polishing liquid and water in the main surface polishing step in Comparative Example 1. In FIG. Same as in Fig. 3, the straight line represents the grinding pressure, and the dotted line represents the rotation speed of the fixed plate. In addition, the hatched block arrows shown in the lower part of the graph indicate the period during which the polishing liquid is supplied, and the hollow block arrows indicate the period during which water is supplied.
在主表面的二次研磨工序刚开始之后,一边供给研磨液,一边提高研磨压力、定盘的转速,从而实施第一主表面研磨步骤(S1')。此外,在第一主表面研磨步骤(S1’)结束之后,供给水以代替研磨液,并停止定盘的旋转,从而实施静态水清洗步骤(S4)。Immediately after the secondary polishing process of the main surface starts, the first main surface polishing step ( S1 ′) is performed by increasing the polishing pressure and the rotation speed of the table while supplying the polishing liquid. In addition, after the first main surface grinding step (S1') is finished, water is supplied instead of the grinding liquid, and the rotation of the table is stopped, thereby performing a static water washing step (S4).
在静态水清洗步骤结束之后,打开双面研磨装置,取出磁记录介质用玻璃基板,与实施例1同样地,在进行完清洗、干燥之后,用于评价。After the static water cleaning step was completed, the double-sided polishing device was opened, and the glass substrate for magnetic recording media was taken out, and was used for evaluation after cleaning and drying in the same manner as in Example 1.
与实施例1相同地,算出具有线状损伤的磁记录介质用玻璃基板的比例,结果确认为7.3%。As a result of calculating the ratio of the glass substrate for magnetic recording media which has linear damage similarly to Example 1, it confirmed that it was 7.3%.
另外,与实施例1相同地,对附着于获得的磁记录介质用玻璃基板的表面的颗粒的数量进行了评价,结果确认OSA计数的中位数为20。In addition, as in Example 1, the number of particles adhering to the surface of the obtained glass substrate for magnetic recording media was evaluated, and as a result, it was confirmed that the median of OSA counts was 20.
图7中示出了将具有线状损伤的磁记录介质用玻璃基板的比例的评价结果图表化后的图。此外,在表1中总结示出了对附着于上述实施例、比较例所获得的磁记录介质用玻璃基板的表面的颗粒的数量进行评价后的OSA计数的中位数的值。FIG. 7 shows a graph of the evaluation results of the ratio of the glass substrate for a magnetic recording medium having linear damage. In addition, in Table 1, the value of the median of the OSA count after evaluating the number of particles adhering to the surface of the glass substrate for magnetic recording media obtained by the said Example and the comparative example is shown collectively.
(表1)(Table 1)
根据图7所示的具有线状损伤的磁记录介质用玻璃基板的比例,能确认出实施了第一动态水清洗步骤之后的实施例1、2与比较例1相比较,具有线状损伤的磁记录介质用玻璃基板的比例大幅降低。这可以认为是以下原因:在实施例1、2中,与比较例1不同,能通过第一动态水清洗步骤降低、去除双面研磨装置内的异物,并能在降低、去除了异物的环境下实施第二主表面研磨步骤。According to the ratio of the glass substrate for magnetic recording media with linear damage shown in FIG. The proportion of glass substrates for magnetic recording media has been significantly reduced. This can be considered to be due to the following reasons: In Examples 1 and 2, unlike Comparative Example 1, the foreign matter in the double-sided grinding device can be reduced and removed by the first dynamic water cleaning step, and the foreign matter in the environment where the foreign matter has been reduced and removed can be reduced. Next, a second major surface grinding step is performed.
另外,关于表1所示的附着于磁记录介质用玻璃基板的表面的颗粒的数量,能确认出实施例2与实施例1、比较例1相比大幅降低了。在实施例1、比较例1中,重复相同条件制造出磁记录介质用玻璃基板,因此,可能在双面研磨装置内残留有研磨磨粒等。但是,在实施例2中,考虑由于实施了第二动态水清洗步骤,因此,尤其能降低残留于双面研磨装置内的研磨磨粒,并能降低附着于磁记录介质用玻璃基板的颗粒。In addition, it was confirmed that the number of particles adhering to the surface of the glass substrate for magnetic recording media shown in Table 1 was significantly lower in Example 2 than in Example 1 and Comparative Example 1. In Example 1 and Comparative Example 1, since the same conditions were repeated to manufacture the glass substrate for magnetic recording media, abrasive grains and the like may remain in the double-sided polishing apparatus. But, in embodiment 2, consider owing to implementing the 2nd dynamic water cleaning step, therefore, can especially reduce the abrasive grain that remains in the double-sided polishing device, and can reduce the particle that adheres to the glass substrate for magnetic recording medium.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510936899.2A CN106881663A (en) | 2015-12-15 | 2015-12-15 | The manufacture method of glass base plate for magnetic recording carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510936899.2A CN106881663A (en) | 2015-12-15 | 2015-12-15 | The manufacture method of glass base plate for magnetic recording carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106881663A true CN106881663A (en) | 2017-06-23 |
Family
ID=59173820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510936899.2A Pending CN106881663A (en) | 2015-12-15 | 2015-12-15 | The manufacture method of glass base plate for magnetic recording carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106881663A (en) |
-
2015
- 2015-12-15 CN CN201510936899.2A patent/CN106881663A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20100247977A1 (en) | Subastrate for a magnetic disk and method of manufacturing the same | |
| JP5542989B2 (en) | Manufacturing method of glass substrate for magnetic disk and manufacturing method of magnetic disk | |
| JP2010257561A (en) | Method for manufacturing substrate for magnetic disk | |
| WO2012029857A1 (en) | Method for producing glass substrate for magnetic disks, and method for producing magnetic disk | |
| JP4905238B2 (en) | Polishing method of glass substrate for magnetic recording medium | |
| JP2006095677A (en) | Polishing method | |
| JP2010079948A (en) | Method of manufacturing glass substrate for magnetic disk | |
| JP5327608B2 (en) | Disc material polishing method and polishing apparatus | |
| JP2009006422A (en) | Manufacturing method of glass substrate for magnetic disc, manufacturing method of magnetic disc, and polishing device | |
| JP6330628B2 (en) | Manufacturing method of glass substrate | |
| CN106881663A (en) | The manufacture method of glass base plate for magnetic recording carrier | |
| JP2007098485A (en) | Glass substrate for magnetic record medium and manufacturing method of magnetic disk | |
| JP5461936B2 (en) | Manufacturing method of glass substrate for magnetic disk | |
| JP5483530B2 (en) | Manufacturing method of magnetic disk substrate | |
| JP6034580B2 (en) | Manufacturing method of glass substrate for HDD | |
| JP2011062781A (en) | Manufacturing method of glass substrate for magnetic disk | |
| WO2013099083A1 (en) | Method for manufacturing glass substrate for hdd | |
| JP5792932B2 (en) | Glass substrate polishing method and glass substrate manufacturing method using the glass substrate polishing method | |
| JP5256091B2 (en) | Manufacturing method of magnetic disk substrate | |
| JP5731245B2 (en) | Manufacturing method of glass substrate for magnetic disk | |
| CN109285565B (en) | Method for manufacturing glass substrate for magnetic disk and method for manufacturing magnetic disk | |
| JP2014175023A (en) | Method for manufacturing glass substrate for magnetic recording medium | |
| JP2010080026A (en) | Method for manufacturing substrate for magnetic disk | |
| JP2012203922A (en) | Manufacturing method for glass substrate for magnetic disk | |
| JP2013140650A (en) | Method for manufacturing glass substrate for magnetic disk and glass substrate for magnetic disk |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170623 |