CN106862779B - A kind of laser cutting device and laser cutting method - Google Patents
A kind of laser cutting device and laser cutting method Download PDFInfo
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- CN106862779B CN106862779B CN201710225293.7A CN201710225293A CN106862779B CN 106862779 B CN106862779 B CN 106862779B CN 201710225293 A CN201710225293 A CN 201710225293A CN 106862779 B CN106862779 B CN 106862779B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- Optics & Photonics (AREA)
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Abstract
The present invention provides a kind of laser cutting device and laser cutting methods, comprising: laser light source and laser focus pack；The laser light source is used for shoot laser；The laser focus pack includes the collective optics of negative spherical aberration and the translucent element of positive spherical aberration；The collective optics and the translucent element are successively set in the light optical path out of the laser light source；The laser focus pack is used to focus on the laser same point in the region to be processed of sample to be processed.Since laser focus pack includes the collective optics of negative spherical aberration and the translucent element of positive spherical aberration, and collective optics and translucent element are successively set in the light optical path out of laser light source, therefore, after the positive spherical aberration of translucent element and the negative spherical aberration of collective optics are cancelled out each other, laser aberrationless can be made to focus in the same point in sample to be processed region to be processed, it is more concentrated so that laser focuses energy, so that the cutting effect of laser is more preferable.
Description
Technical field
The present invention relates to technical field of laser processing, more specifically to a kind of laser cutting device and laser cutting
Method.
Background technique
Generally use in the prior art laser inner focusing cutting processing method, to glass, semiconductor crystal wafer, sapphire and
The high hard brittle material such as crystalline ceramics is processed.The cutting of laser inner focusing is to be swashed parallel using collector lens such as object lens
Light focuses on sample interior formation to be processed internal action area and applies then by external force or heat treatment etc. along internal action area
Add influence, realizes the final cutting separation of sample to be processed.
As shown in Figure 1, enter sample 11 to be processed from air after parallel laser beam is assembled by object lens 10, due to
The difference of incident angle, therefore, the incidence angle for entering the light of sample 11 to be processed far from optical axis o is larger, refraction is stronger, in light
It is focused at the point A1 of 11 upper surface of sample to be processed on axis o；And close optical axis o enters entering for the light of sample 11 to be processed
Firing angle is smaller, refraction is weaker, focuses at the point A2 on optical axis o far from 11 upper surface of sample to be processed, this results in laser light
Beam less than in same point, that is, produces aberration effect in 11 internal focus of sample to be processed, so that laser focuses energy point
It dissipates, influences to process cutting effect.
Summary of the invention
In view of this, the present invention provides a kind of laser cutting device and laser cutting method, to solve in the prior art
Laser beam after being focused by object lens cannot focus on the problem in same point in sample interior to be processed.
To achieve the above object, the invention provides the following technical scheme:
A kind of laser cutting device, comprising: laser light source and laser focus pack；
The laser light source is used for shoot laser；
The laser focus pack includes the collective optics of negative spherical aberration and the translucent element of positive spherical aberration；The collective optics and
The translucent element is successively set in the light optical path out of the laser light source；
The laser focus pack is used to focus on the laser same point in the region to be processed of sample to be processed.
Preferably, in above-mentioned laser cutting device, the translucent element is the transparent optical element of sheet.
Preferably, in above-mentioned laser cutting device, the actual height of the translucent element and the base of benchmark translucent element
Quasi- height and a difference in height are at a preset relation；
The height of plane where the difference in height is equal to the height of the sample to be processed and the focus point of the laser
Difference.
Preferably, in above-mentioned laser cutting device, the preset relation is n1× c=n1×a-n2×b；
Wherein, a is the altitude datum of the benchmark translucent element, and b is the difference in height, and c is the reality of the translucent element
Border height, n1For the refractive index of the translucent element and the benchmark translucent element, n2For the refractive index of the sample to be processed.
Preferably, in above-mentioned laser cutting device, n1=n2。
Preferably, in above-mentioned laser cutting device, the collective optics include at least one collector lens.
Preferably, in above-mentioned laser cutting device, further includes:
Support the supporting table of the sample to be processed；
Control the supporting table platform courses component mobile in the first plane and/or first direction；
The first direction is parallel to the light direction of the laser light source, and the first direction is perpendicular to described first
Plane.
The present invention also provides a kind of laser cutting method has been given, it is applied to described in any item laser cutting devices as above,
The laser cutting method includes:
Laser light source shoot laser；
Laser focus pack focuses on the laser in the same point in sample to be processed region to be processed, so that described swash
Light cuts the region to be processed along the default cutting line of the sample to be processed.
Preferably, in above-mentioned laser cutting method, the laser is focused on sample to be processed by the laser focus pack
Include: in the same point in product region to be processed
The laser is focused on by sample to be processed using the laser focus pack of the translucent element with the actual height
In the same point in product region to be processed.
Preferably, poly- in the laser using the translucent element with the actual height in above-mentioned laser cutting method
Before burnt component focuses on the laser in the same point in sample to be processed region to be processed, further includes:
The laser focused on using the laser focus pack of the benchmark translucent element with the altitude datum same
Point on；
The practical height of the translucent element is calculated according to the altitude datum of the benchmark translucent element and the difference in height
Degree, the difference of the height of plane where the difference in height is equal to the height of the sample to be processed and the focus point of the laser.
Compared with prior art, the technical scheme provided by the invention has the following advantages:
Laser cutting device and laser cutting method provided by the present invention, since laser focus pack includes negative spherical aberration
The translucent element of collective optics and positive spherical aberration, and collective optics and translucent element are successively set on the light optical path out of laser light source
On, therefore, after the positive spherical aberration of translucent element and the negative spherical aberration of collective optics are cancelled out each other, laser aberrationless can be made to focus on
In the same point in sample region to be processed to be processed, more concentrated so that laser focuses energy, so that laser is cut
It is more preferable to cut effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the laser focusing effect schematic diagram of existing laser cutting device；
Fig. 2 is the structural schematic diagram of laser cutting device provided in an embodiment of the present invention；
Fig. 3 is the focusing effect schematic diagram of the sample to be processed of different-thickness provided in an embodiment of the present invention；
Fig. 4 is the flow chart of the cutting method of laser cutting device provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the invention provides a kind of laser cutting devices, as shown in Fig. 2, the laser cutting device includes laser light
Source 20 and laser focus pack 21.
Wherein, laser light source 20 is used for shoot laser, which is parallel or approximately parallel light beam.Laser focus pack
21 include the collective optics 210 of negative spherical aberration and the translucent element 211 of positive spherical aberration, and the collective optics 210 and translucent element 211 are successively
Going out in light optical path for laser light source 20 is set, and the laser focus pack 21 is for focusing on the laser that laser light source 20 is emitted
On the same point B in the region to be processed of sample 22 to be processed.
After being cancelled out each other due to the positive spherical aberration of translucent element 211 and the negative spherical aberration of collective optics 210, enable to laser without
Aberration focuses on the same point B in sample 22 to be processed region to be processed, so that the focusing energy of laser more collects
In, so that the cutting effect of laser is better.
Although disclosing the aberration that can adjust laser using spatial light modulator in the prior art, with spatial light
Modulator is compared, and laser focus pack provided by the invention has the advantages that at low cost, optical path is simple and easy to adjust.
In the present embodiment, collective optics 210 include at least one collector lens.When collective optics 210 have multiple optically focused
When lens, all collector lens optical axis coincidences, and the laser beam face being emitted with laser light source 20 is arranged.Wherein, the optically focused
Lens are convex lens.Optionally, which is object lens, which is made of multiple convex lens.Also, the object lens
Whole spherical aberration is negative spherical aberration.
In addition, translucent element 211 is preferably the transparent optical element of sheet, the lid that material is glass or silicon wafer can be
Slide, certainly, the present invention is not limited to this, and in other embodiments, translucent element 211 can also be the recessed of positive spherical aberration
Mirror etc..When the translucent element 211 is the transparent optical element of sheet, transparent optical element 211 is emitted in laser light source 20
The thickness in the direction of laser is uniform.
In a specific embodiment, collective optics 210 include lens barrel and at least one optically focused being arranged in lens barrel
Lens, translucent element 211 also include the transparent optical element of lens barrel and the sheet being arranged in lens barrel.It is not shown in Fig. 2 described
The lens barrel of the lens barrel of collective optics 210 and the translucent element 211.Also, the lens barrel and collective optics of translucent element 211
210 lens barrel can be fixed together by spiral position.Certainly, the present invention is not limited to this, in other embodiments, thoroughly
Optical element 211 and collective optics 210 can also be releasably secured together by other means.
It should be noted that translucent element 211 need to be arranged between collective optics 210 and sample to be processed 22, and poly-
Defocused laser can be radiated at the region to be processed of sample 22 to be processed, in the present invention not to translucent element 211 with
The distance between collective optics 210 and the distance between translucent element 211 and sample 22 to be processed are defined.Wherein, to
The region to be processed of processed sample 22 can be surface, inside or the bottom etc. of sample 22 to be processed, and details are not described herein.
Since translucent element 211 is the translucent element of sheet, translucent element 211 and collective optics 210 is fixed
When, the focus point B of laser is not required to consider that the deviation between the two optical axis imitates focusing on the optical axis o of collective optics 210
The influence of fruit, compared with by way of installing multiple lens and adjusting aberration, the mode of adjusting aberration of the invention is not only installed
It is convenient, and optical path is simple, focusing effect is good.
On the basis of the above embodiments, laser cutting device provided in an embodiment of the present invention, further includes: support is to be processed
The supporting table of sample 22；Control the supporting table platform courses component mobile in the first plane and/or first direction Z.Wherein, first
Direction Z is parallel to the light direction of laser light source 20, and first direction Z, perpendicular to the first plane, which is X-axis and Y
Plane where axis.Certainly, laser cutting device provided in an embodiment of the present invention further includes controlling 20 power of laser light source etc.
Light source controller etc., details are not described herein.
Laser cutting device provided in an embodiment of the present invention not only can eliminate laser light source by laser focus pack 21
The aberration of the laser of 20 outgoing, so that laser focuses in same point, moreover, for different-thickness or the sample to be processed of height
22, it can be by replacement different-thickness or the translucent element 211 of height, so that the position of the focusing of laser remains unchanged, that is, make
The focal position for obtaining laser does not change because of the variation of 22 thickness of sample to be processed or height.
It, can be first using with benchmark when being cut by laser using laser cutting device provided in an embodiment of the present invention
The benchmark translucent element 212 of height a carries out the tune-up of laser focus position.As shown in figure 3, in the school for carrying out laser focus position
Timing is mounted on laser concentrating element 21 by height or with a thickness of the benchmark translucent element 212 of altitude datum a, is then turned on
On the point B1 that laser light source 20 focuses on laser in datum plane.
Later, according to the altitude datum a and a difference in height of the actual height c of translucent element 211 and benchmark translucent element 212
The preset relation of b calculates the value of actual height c.That is, in the present embodiment, the actual height c and base of translucent element 211
The altitude datum a of quasi- translucent element 212 and a difference in height b are at a preset relation.Wherein, difference in height b=e-f, e are sample to be processed
The height of product 22, f are the height of plane where the focus point of laser.It specifically, can be by the way that laser be focused on thickness or height
The surface for the sample that degree is f is the value of the height f of plane where obtaining focus point, alternatively, laser can also be focused on to support
On the supporting plane of platform, at this point, f=0, b=e.
Then, the translucent element 211 that height is actual height c is mounted on laser concentrating element 21, is e's by height
Sample 22 to be processed is placed on the corresponding position of supporting table, so that laser focuses on the same of sample 22 to be processed region to be processed
On point B2.Wherein, the position of the position of the focus point B2 in sample 22 to be processed region to be processed and datum plane cohesion focus B1
Identical, i.e. the two is in same level, so as to remain to protect in the case where 22 thickness of sample to be processed or different height
The focal position for demonstrate,proving laser is constant.
In a specific embodiment, the benchmark of the actual height c of translucent element 211 and benchmark translucent element 212 is high
The preset relation for spending an a and difference in height b is n1× c=n1×a-n2×b；Wherein, a is the altitude datum of translucent element 211, and b is
Difference in height, c are the actual height of translucent element 211, n1For the refractive index of translucent element 211 and benchmark translucent element 212, n2For
The refractive index of sample 22 to be processed.
After guaranteeing to replace different-thickness or the element to be processed 22 of height, laser can focus on same level
It is interior, it need to guarantee the path of translucent element 211 and to be processed sample 22 of the laser between collective optics 210 and focus point B1 and swash
Translucent element 211 of the light between collective optics 210 and focus point B2 is identical with the path of sample 22 to be processed, i.e. n1× a=n1
×c+n2×b.It, can be according to this relationship n based on this1× a=n1×c+n2× b calculates replacement different-thickness or height
The actual (real) thickness or actual height c of the translucent element 211 needed to change after element 22 to be processed.
In a specific embodiment, translucent element 211 is identical as the refractive index of benchmark translucent element 212, light transmission member
The refractive index n of part 2111With the refractive index n of sample 22 to be processed2Also identical, that is, the material of translucent element 211 and benchmark light transmission
Element 212 is identical with the material of sample 22 to be processed.For example, sample 22 to be processed, translucent element 211 and benchmark translucent element
212 material is all silicon wafer, so as to directly calculate the actual height c of translucent element 211 according to formula c=a-b.
Certainly, the present invention is not limited to this, in other embodiments, the refractive index n of translucent element 2111With it is to be processed
The refractive index n of sample 222It can also be different, that is, the material of the material of translucent element 211 and sample 22 to be processed can not also
Together.At this time, it is necessary in conjunction with the refractive index n of sample 22 to be processed2With the refractive index n of translucent element 2111, i.e., according to n1× c=
n1×a-n2× b, to calculate the actual (real) thickness or actual height c of translucent element 211.Wherein, sample 22 to be processed and light transmission member
The material of part 211 can be semiconductor crystal wafer, glass or sapphire etc..Optionally, the altitude datum a of benchmark translucent element 212
About 2mm.
In addition, in one embodiment of the present of invention supporting table and sample to be processed can also be adjusted by platform courses component
22 move up and down along Z axis to adjust the focal position of laser, and still, which needs the refraction according to sample 22 to be processed
Rate n2, translucent element 211 refractive index n1Positional relationship etc. between sample 22 to be processed and laser focus pack 21 calculates
Then the moving distance of supporting table controls supporting table again and moves up and down along Z axis.Compared with this regulative mode, different thickness are replaced
The regulative mode of degree or the translucent element 211 of height is more simple and convenient.
Laser cutting device provided by the embodiment of the present invention, since laser focus pack includes the collective optics of negative spherical aberration
With the translucent element of positive spherical aberration, and collective optics and translucent element be successively set on laser light source go out light optical path on, therefore, thoroughly
After the positive spherical aberration of optical element and the negative spherical aberration of collective optics are cancelled out each other, laser aberrationless can be made to focus on sample to be processed
In the same point in region to be processed, more concentrated so that laser focuses energy, so that the cutting effect of laser is more
Well.Also, laser cutting device optical path provided in an embodiment of the present invention is simple, at low cost, easy to adjust.
The embodiment of the invention provides a kind of laser cutting method, the laser cutting provided applied to any of the above-described embodiment
Device, as shown in figure 4, the laser cutting method includes:
S401: laser light source shoot laser；
S402: laser focus pack focuses on the laser in the same point in sample to be processed region to be processed, so that
The laser cuts the region to be processed along the default cutting line of the sample to be processed.
Since laser focus pack includes the collective optics of negative spherical aberration and the translucent element of positive spherical aberration, and collective optics and thoroughly
Optical element is successively set in the light optical path out of laser light source, therefore, the positive spherical aberration of translucent element and the negative spherical aberration of collective optics
After cancelling out each other, laser aberrationless can be made to focus in the same point in sample to be processed region to be processed, so that swashing
Light focuses energy and more concentrates, so that the cutting effect of laser is better.
In one embodiment of the invention, laser is focused on sample to be processed region to be processed by laser focus pack
It include: that laser is focused on by sample to be processed using the laser focus pack of the translucent element with actual height c in same point
In the same point in region to be processed.
Wherein, laser is focused on into sample to be processed in the laser focus pack using the translucent element with actual height c
Before in the same point in product region to be processed, further includes:
Laser is focused in same point using the laser focus pack of the benchmark translucent element with altitude datum a；
Translucent element actual height c, difference in height b are calculated according to the altitude datum a of benchmark translucent element and difference in height b
Equal to the difference of the height f of plane where the height e of sample to be processed and the focus point of laser.
That is, can first be adopted when being laser machined using laser cutting device provided in an embodiment of the present invention
The tune-up of laser focus position is carried out with the benchmark translucent element 212 with altitude datum a.As shown in figure 3, poly- carrying out laser
When the tune-up of burnt position, laser concentrating element 21 is mounted on by height or with a thickness of the benchmark translucent element 212 of altitude datum a
On, it is then turned on the point B1 that laser light source 20 focuses on laser in datum plane.
Later, according to the altitude datum a and a difference in height of the actual height c of translucent element 211 and benchmark translucent element 212
The preset relation n of b1× c=n1×a-n2× b calculates the value of actual height c.Wherein, difference in height b=e-f, e are to be processed
The height of sample 22, f are the height of plane where the focus point of laser, n1For translucent element 211 and benchmark translucent element 212
Refractive index, n2For the refractive index of sample 22 to be processed.
Then, the translucent element 211 that height is actual height c is mounted on laser concentrating element 21, is e's by height
Sample 22 to be processed is placed on the corresponding position of supporting table, so that laser focuses on the same of sample 22 to be processed region to be processed
On point B2.Wherein, the position of the position of the focus point B2 in sample 22 to be processed region to be processed and datum plane cohesion focus B1
Identical, i.e. the two is in same level, so as to remain to protect in the case where 22 thickness of sample to be processed or different height
The focal position for demonstrate,proving laser is constant.
In the above-described embodiments, translucent element 211 is identical as the refractive index of benchmark translucent element 212, also, translucent element
211 refractive index n1With the refractive index n of sample 22 to be processed2It may be the same or different.In the present embodiment, sample to be processed
22 and the material of translucent element 211 can be semiconductor crystal wafer, glass or sapphire etc..
Laser cutting method provided by the embodiment of the present invention, since laser focus pack includes the collective optics of negative spherical aberration
With the translucent element of positive spherical aberration, and collective optics and translucent element be successively set on laser light source go out light optical path on, therefore, thoroughly
After the positive spherical aberration of optical element and the negative spherical aberration of collective optics are cancelled out each other, laser aberrationless can be made to focus on sample to be processed
In the same point in region to be processed, more concentrated so that laser focuses energy, so that the cutting effect of laser is more
Well.Also, laser cutting method provided in an embodiment of the present invention can pass through the light transmission member of replacement different-thickness or height
Part guarantees that the focal position of laser is constant, and the method for the adjusting focal position is simply, conveniently.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (8)
1. a kind of laser cutting device characterized by comprising laser light source and laser focus pack；
The laser light source is used for shoot laser；
The laser focus pack includes the collective optics of negative spherical aberration and the translucent element of positive spherical aberration；Collective optics and described
Translucent element is successively set in the light optical path out of the laser light source；
The laser focus pack is used to focus on the laser same point in the region to be processed of sample to be processed；
Wherein, the translucent element is the transparent optical element of sheet, and the transparent optical element is emitted in the laser light source
Thickness on the direction of laser is uniformly distributed, the refractive index phase of the refractive index of the transparent optical element and the sample to be processed
Together, with when in face of the sample to be processed of different-thickness or height, by replacement different-thickness or the translucent element of height, so that
The position of the focusing of laser remains unchanged.
2. laser cutting device according to claim 1, which is characterized in that the actual height and benchmark of the translucent element
The altitude datum of translucent element and a difference in height are at a preset relation；
The difference of the height of plane where the difference in height is equal to the height of the sample to be processed and the focus point of the laser.
3. laser cutting device according to claim 2, which is characterized in that the preset relation is c=a-b；
Wherein, a is the altitude datum of the benchmark translucent element, and b is the difference in height, and c is the practical height of the translucent element
Degree, the refractive index of the translucent element are identical with the refractive index of the benchmark translucent element.
4. laser cutting device according to claim 1, which is characterized in that the collective optics include at least one optically focused
Lens.
5. laser cutting device according to claim 1, which is characterized in that further include:
Support the supporting table of the sample to be processed；
Control the supporting table platform courses component mobile in the first plane and/or first direction；
The first direction is parallel to the light direction of the laser light source, and the first direction is flat perpendicular to described first
Face.
6. a kind of laser cutting method, which is characterized in that it is applied to laser cutting device described in any one of claim 1 to 5,
The laser cutting method includes:
Laser light source shoot laser；
Laser focus pack focuses on the laser in the same point in sample to be processed region to be processed, so that the laser edge
The default cutting line of the sample to be processed the region to be processed is cut.
7. laser cutting method according to claim 6, which is characterized in that the laser focus pack gathers the laser
Coke includes: in the same point in sample to be processed region to be processed
It is to be processed that the laser is focused on by sample to be processed using the laser focus pack of the translucent element with actual height
In the same point in region.
8. laser cutting method according to claim 7, which is characterized in that using the translucent element with actual height
Laser focus pack the laser is focused in the same point in sample to be processed region to be processed before, further includes:
The laser is focused in same point using the laser focus pack of the benchmark translucent element with altitude datum；
The actual height of the translucent element, the difference in height are calculated according to the altitude datum of benchmark translucent element and difference in height
Equal to the difference of the height of plane where the height of the sample to be processed and the focus point of the laser.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1773212A (en) * | 2004-11-08 | 2006-05-17 | 松下电器产业株式会社 | Confocal optical device, and spherical-aberration correction method |
| CN101131484A (en) * | 2006-08-25 | 2008-02-27 | 船井电机株式会社 | Spherical-aberration compensating element, fabricating method thereof, and optical pickup device including the same |
| CN101866043A (en) * | 2010-05-27 | 2010-10-20 | 深圳市大族激光科技股份有限公司 | Optical lens for ultraviolet laser |
| CN104175003A (en) * | 2014-09-09 | 2014-12-03 | 深圳市大族激光科技股份有限公司 | Laser machining system and multi-path laser machining device |
| CN105242353A (en) * | 2015-09-18 | 2016-01-13 | 核工业理化工程研究院 | Optical fiber focus lens set |
-
2017
- 2017-04-07 CN CN201710225293.7A patent/CN106862779B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1773212A (en) * | 2004-11-08 | 2006-05-17 | 松下电器产业株式会社 | Confocal optical device, and spherical-aberration correction method |
| CN101131484A (en) * | 2006-08-25 | 2008-02-27 | 船井电机株式会社 | Spherical-aberration compensating element, fabricating method thereof, and optical pickup device including the same |
| CN101866043A (en) * | 2010-05-27 | 2010-10-20 | 深圳市大族激光科技股份有限公司 | Optical lens for ultraviolet laser |
| CN104175003A (en) * | 2014-09-09 | 2014-12-03 | 深圳市大族激光科技股份有限公司 | Laser machining system and multi-path laser machining device |
| CN105242353A (en) * | 2015-09-18 | 2016-01-13 | 核工业理化工程研究院 | Optical fiber focus lens set |
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| CN106862779A (en) | 2017-06-20 |
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Address after: 523770 Second Floor, 3 Kusai Science Park, No. 8 Fumin South Road, Foxin Community, Dalang Town, Dongguan City, Guangdong Province Patentee after: Dongguan Shengxiong Laser Advanced Equipment Co., Ltd. Address before: 523000 First Floor, Building A, 53 Fofu Road, Foziwa Village, Dalang Town, Dongguan City, Guangdong Province Patentee before: Dongguan Strong Laser Co., Ltd. |