CN106847779B - Lead welding structure, hydrid integrated circuit and lead welding procedure - Google Patents
Lead welding structure, hydrid integrated circuit and lead welding procedure Download PDFInfo
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- CN106847779B CN106847779B CN201510896610.9A CN201510896610A CN106847779B CN 106847779 B CN106847779 B CN 106847779B CN 201510896610 A CN201510896610 A CN 201510896610A CN 106847779 B CN106847779 B CN 106847779B
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- linkage section
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- bending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Abstract
A kind of lead welding structure is suitable for hydrid integrated circuit comprising lead, pad and anti-pad solder drawing crack component, lead include first end and second end, the transformer connection of first end and hydrid integrated circuit；Pad is set on the substrate of hydrid integrated circuit；Anti- pad solder drawing crack component include the first linkage section, with spaced second linkage section of the first linkage section and connect both the first linkage section and the second linkage section to buffer the buffering changeover portion for the active force for being transmitted to by first linkage section second linkage section, first linkage section is set on pad, and the second end of the second linkage section and lead is welded to connect.By the setting of anti-pad solder drawing crack component, when the second end of lead and the second linkage section are welded to connect, buffering changeover portion can will be transmitted to the thermal stress buffering abatement of the second linkage section generation in welding by the first linkage section, avoid the problem that lead is back and forth upheld pad because of the effect of thermal stress, pullled and pad is caused drawing crack occur.
Description
Technical field
The present invention relates to the technical field of hydrid integrated circuit more particularly to a kind of lead welderings suitable for hydrid integrated circuit
Binding structure has the welded hydrid integrated circuit of the lead and lead welding procedure.
Background technique
When preparing certain thick film hybrid integrated circuit, need by transformer/inductance of the thick film hybrid integrated circuit around
The lead-out wire of group is welded on the pad of substrate.
Used welding technique usually uses electric iron manual welding mode or welding robot automatic welding mode,
Transformer/inductor winding lead-out wire is directly welded on the pad of substrate.Although lead-out wire is directly welded at substrate
It can be obtained on pad and not introduce the benefits such as additional process materials, production efficiency is higher, still, because the line footpath of lead-out wire is thicker
(it usually is coiled into one in 0.5mm or more) or even multi cord, if lead-out wire is welded direct on the pad of substrate, weldering can be made
Disk is thermally stressed to be affected, meanwhile, because not buffering between pad and lead-out wire, and lead-out wire and the pad coefficient of expansion are not
Unanimously, lead-out wire can back and forth uphold pad because of the effect of thermal stress, pull as a result, and pad is caused the problem of drawing crack occur.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
Summary of the invention
It is an object of the invention to overcome the defect of the prior art, a kind of lead welding structure is provided, to solve existing skill
Lead-out wire is welded direct in art and is easy that pad is made the problem of drawing crack occur on the pad of substrate.
The invention is realized in this way lead welding structure, is suitable for hydrid integrated circuit, the hydrid integrated circuit includes
Substrate and the transformer on the substrate, the lead welding structure include:
Lead, the lead include first end and second end, and the first end of the lead is connect with the transformer；
Pad, the pad are set on the substrate；
Anti- pad solder drawing crack component, the anti-pad solder drawing crack component include that the first linkage section and described first connect
Spaced second linkage section of section and both connection first linkage section and second linkage section are connect to buffer by described
First linkage section is transmitted to the buffering changeover portion of the active force of second linkage section, and first linkage section is set to the pad
On, the second end of second linkage section and the lead is welded to connect.
Specifically, the buffering changeover portion is bending structure.
Further, it is described buffering changeover portion include the first bending segment and in first bending segment one end bending and
At the second bending segment, first bending segment is connected to first linkage section, and second bending segment is connected to described
Two linkage sections.
Specifically, second linkage section is equipped with to the welding groove with the second end of lead welded connecting.
Specifically, it is equipped between the first linkage section of Yu Suoshu and the pad to make first linkage section and the weldering
The adhesives that disk is connected.
Further, the adhesives is solder(ing) paste.
The welded technical effect of lead of the invention are as follows: by the setting of anti-pad solder drawing crack component, will draw
When the second end of line and the second linkage section are welded to connect, buffering changeover portion can will be transmitted to the second company by the first linkage section in welding
The thermal stress buffering abatement for connecing section generation, avoids lead from back and forth upholding, pull to pad because of the effect of thermal stress and causes to weld
There is the problem of drawing crack in disk.
The present invention also provides hydrid integrated circuits, and the transformer including substrate and on the substrate, further includes above-mentioned
Lead welding structure.Since the hydrid integrated circuit has above-mentioned lead welding structure, then, it is drawn by anti-pad solder
The setting for splitting component, when the second end of lead and the second linkage section are welded to connect, buffering changeover portion can will in welding by
First linkage section is transmitted to the thermal stress buffering abatement of the second linkage section generation, avoids lead past to pad because of the effect of thermal stress
It upholds again, pull and pad is caused the problem of drawing crack occur；Simultaneously, also it is greatly improved the reliability of hydrid integrated circuit.
The present invention also provides lead welding procedures, comprising:
Prepare the substrate, lead, pad and the anti-pad solder drawing crack component that are provided with transformer, keeps the lead fixed
Justice has first end and second end, and the anti-pad solder drawing crack component is arranged and connect including the first linkage section, with described first
Spaced second linkage section of section and connection both first linkage section and second linkage section are with buffering by described the
One linkage section is transmitted to the buffering changeover portion of the active force of second linkage section；
It is set to the pad on the substrate；
It is set to first linkage section on the pad；
It is welded to connect the second end of second linkage section and the lead.
Further, it is bending structure that the buffering changeover portion, which is arranged,.
Further, it includes the first bending segment and curved in one end of first bending segment that the buffering changeover portion, which is arranged,
Second bending segment made of folding makes first bending segment be connected to first linkage section, connects second bending segment
In second linkage section.
The technical effect of lead welding procedure of the invention are as follows: by the setting of anti-pad solder drawing crack component, will draw
When the second end of line and the second linkage section are welded to connect, buffering changeover portion can will be transmitted to the second company by the first linkage section in welding
The thermal stress buffering abatement for connecing section generation, avoids lead from back and forth upholding, pull to pad because of the effect of thermal stress and causes to weld
There is the problem of drawing crack in disk；Simultaneously, by using the lead welding procedure, it is greatly improved the pass rate of product.
Detailed description of the invention
Fig. 1 is the welded schematic diagram of lead of the invention；
Fig. 2 is the structural schematic diagram of the welded anti-pad solder drawing crack component 30 of lead of the invention；
Fig. 3 is the schematic diagram of another angle of the welded anti-pad solder drawing crack component 30 of lead of Fig. 2.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The welded embodiment of lead:
Fig. 1 and Fig. 2 are please referred to, the welded embodiment of lead of the invention is illustrated below.
The lead welding structure 100 of the present embodiment is suitable for thick film hybrid integrated circuit, wherein thick film hybrid integrated circuit
Transformer 300 including substrate 200 and on substrate 200, substrate 200 be usually aluminum oxide substrate or aluminium nitride substrate,
As carrier, play a supporting role；Transformer 300 is assembled by coiled wire-wound coil and ferrite magnetic tank, plays change electricity in circuit
The effect of pressure ratio or electric current ratio.And the lead welding structure 100 of the present embodiment includes support lead 10, pad 20 and the weldering of anti-pad
Drawing crack component 30 is connect, each component of lead welding structure 100 is further described below:
Lead 10 includes first end 11 and second end 12, and the first end 11 of lead 10 is connect with transformer 300, it is preferable that
Lead 10 is copper core, and while to guarantee conductivity, price is not prohibitively expensive and causes to increase production cost；
Pad 20 be palladium-silver or silver soldering disk, wherein pad 20 be set to substrate 200 on, preferably, pad 20 by printing,
Drying and sintering processing and be set to substrate 200 on；
Anti- pad solder drawing crack component 30 is connect including the first linkage section 31, with the first linkage section 31 spaced second
Both section 32 and the first linkage section 31 of connection and the second linkage section 32 are transmitted to the second linkage section 32 by the first linkage section 31 to buffer
Active force buffering changeover portion 33, the first linkage section 31 is set on pad 20, the second end of the second linkage section 32 and lead 10
12 are welded to connect.
By the setting of anti-pad solder drawing crack component 30, welded by the second end 12 of lead 10 and the second linkage section 32
When connection, buffering changeover portion 33 can be buffered the thermal stress that the second linkage section 32 generates is transmitted to by the first linkage section 31 in welding
Abatement, avoids lead 10 from back and forth upholding, pull to pad 20 because of the effect of thermal stress and causes pad 20 drawing crack occur and ask
Topic.
Fig. 1 and Fig. 2 are please referred to, the buffering changeover portion 33 in the present embodiment is bending structure, so as to generated when welding
Thermal stress is during being transmitted to the second linkage section 32 from the first linkage section 31, the buffering changeover portion 33 of opposite linear structure setting
With relatively long distance, cut down hereby it is possible to be buffered by the long range of bending structure to thermal stress.
Also selectively, which is tortuous shape structure, and effect is and circuitous as bending structure setting
Curved structure is preferably that S-shaped, wave are concavo-convex etc..
And when to buffer changeover portion 33 be bending structure, the preferred embodiment of the buffering changeover portion 33 is comprising the
One bending segment 331 and second bending segment 332 made of the bending of one end of the first bending segment 331, the connection of the first bending segment 331
In the first linkage section 31, the second bending segment 332 is connected to the second linkage section 32, and the first bending segment 331, the second bending segment 332
Setting, not only structure is simple, and easy to process, as long as by apparatus for bending by buffer 33 bending of changeover portion go out the first bending
The 331, second bending segment 332 of section.
Referring to Fig. 3, and combine Fig. 1, the second linkage section 32 in the present embodiment is equipped with to second with lead 10
The welding groove 321 that end 12 is welded to connect, and by the setting of the welding groove 321, it is welded by the second end 12 of lead 10
It, can be by the of lead 10 as long as first the second end 12 of lead 10 is placed on welding groove 321 when on the second linkage section 32
The positioning of two ends 12, later can be by electric iron manual welding mode or welding robot automatic welding mode by the of lead 10
Two ends 12 are welded on the second linkage section 32, greatly facilitate the welding operation of operating personnel；Moreover, also preferably guaranteeing lead
10 second end 12 is welded and fixed, and reduces the problem of loosening after lead 10 welds.
Referring to Fig. 1, in the present embodiment, being equipped between the first linkage section 31 and pad 20 to make the first linkage section
31 adhesives being connected with pad 20, wherein the adhesives is solder(ing) paste, then, the first linkage section 31 and pad 20
Between attended operation specifically, first on pad 20 printed solder paste then the first linkage section 31 is attached on pad 20
Solder(ing) paste so that its can by solder(ing) paste be pre-positioned on pad 20, later, hot plate reflow soldering or Reflow Soldering side can be passed through
First linkage section 31 is weldingly fixed on pad 20 by formula.
The embodiment of hydrid integrated circuit:
It please refers to Fig.1 to Fig.3, the embodiment of hydrid integrated circuit of the invention is illustrated below.
The hydrid integrated circuit of the present embodiment, specially thick film hybrid integrated circuit comprising substrate 200 is set to substrate
Transformer 300 and above-mentioned lead welding structure 100 on 200, substrate 200 be usually aluminum oxide substrate or aluminium nitride substrate,
It plays a supporting role as carrier；Transformer 300 is assembled by coiled wire-wound coil and ferrite magnetic tank, plays change in circuit
The effect of voltage ratio or electric current ratio.
Since the hydrid integrated circuit has above-mentioned lead welding structure 100, then, by anti-pad solder drawing crack structure
The setting of part 30, when by the second end 12 of lead 10 and the second linkage section 32 welded connecting, buffering changeover portion 33 can will welded
The thermal stress buffering abatement that the second linkage section 32 generates is transmitted to by the first linkage section 31 when connecing, avoids lead 10 because of the work of thermal stress
It back and forth upholds with and to pad 20, pull and pad 20 is caused the problem of drawing crack occur；Simultaneously, also it is greatly improved mixing collection
At the reliability of circuit.
The embodiment of lead welding procedure:
Fig. 1 and Fig. 2 are please referred to, the embodiment of hydrid integrated circuit of the invention is illustrated below.
The present invention also provides lead welding procedures, applied to the technical field of thick film hybrid integrated circuit, including following step
It is rapid:
S101, preparation are provided with substrate 200, lead 10, pad 20 and the anti-pad solder drawing crack of transformer 300
30, so that the definition of lead 10 is had first end 11 and second end 12, and it includes the first linkage section that anti-pad solder drawing crack component 30, which is arranged,
31, with spaced second linkage section 32 of the first linkage section 31 and both connect the first linkage section 31 and the second linkage section 32
To buffer the buffering changeover portion 33 for the active force for being transmitted to the second linkage section 32 by the first linkage section 31；
S102, it is set to pad 20 on substrate 200；
S103, it is set to the first linkage section 31 on pad 20；
S104, it is welded to connect the second linkage section 32 and the second end 12 of lead 10.
In the present embodiment, by the setting of anti-pad solder drawing crack component 30, by the second end 12 of lead 10 and
When two linkage sections 32 are welded to connect, buffering changeover portion 33 can will be transmitted to the second linkage section 32 by the first linkage section 31 in welding and produce
Raw thermal stress buffers abatement, avoids lead 10 from back and forth upholding, pull to pad 20 because of the effect of thermal stress and causes pad
20 there is the problem of drawing crack；Simultaneously, by using the lead welding procedure, it is greatly improved the pass rate of product.
Fig. 1 and Fig. 2 are please referred to, in the present embodiment, setting buffering changeover portion 33 is bending structure, so as to produce when welding
Raw thermal stress is during being transmitted to the second linkage section 32 from the first linkage section 31, the buffering transition of opposite linear structure setting
Section 33 has relatively long distance, cuts down hereby it is possible to buffer by the long range of bending structure to thermal stress.
Also selectively, be arranged the buffering changeover portion 33 be tortuous shape structure, effect as bending structure setting,
And tortuous shape structure is preferably that S-shaped, wave are concavo-convex etc..
Preferably, setting buffering changeover portion 33 includes the first bending segment 331 and bends in one end of the first bending segment 331
Made of the second bending segment 332, so that the first bending segment 331 is connected to the first linkage section 31, the second bending segment 332 made to be connected to
Two linkage sections 32, and the setting of the first bending segment 331, the second bending segment 332, not only structure is simple, and easy to process, as long as
Go out the first bending segment 331, the second bending segment 332 for 33 bending of changeover portion is buffered by apparatus for bending.
Referring to Fig. 3, and combine Fig. 1, in the present embodiment, be equipped with the second linkage section 32 to the with lead 10
The welding groove 321 that two ends 12 are welded to connect, and by the setting of the welding groove 321, it is welded by the second end 12 of lead 10
It connects when on the second linkage section 32, it, can be by lead 10 as long as first the second end 12 of lead 10 is placed on welding groove 321
Second end 12 positions, later can be by electric iron manual welding mode or welding robot automatic welding mode by lead 10
Second end 12 is welded on the second linkage section 32, greatly facilitates the welding operation of operating personnel；Moreover, also preferably guaranteeing to draw
The second end 12 of line 10 is welded and fixed, and reduces the problem of loosening after lead 10 welds.
Referring to Fig. 1, in the present embodiment, making to be equipped between the first linkage section 31 and pad 20 to make the first connection
The adhesives that section 31 is connected with pad 20, wherein make the adhesives solder(ing) paste, then, the first linkage section 31 and weldering
Attended operation between disk 20 is specifically, first first linkage section 31 is then attached at pad by printed solder paste on pad 20
Solder(ing) paste on 20 later, passes through hot plate reflow soldering or Reflow Soldering side so that it can be pre-positioned on pad 20 by solder(ing) paste
First linkage section 31 is weldingly fixed on pad 20 by formula.
The foregoing is merely preferred embodiments of the present invention, structure is not limited to the above-mentioned shape enumerated, it is all
Made any modifications, equivalent replacements, and improvements etc. within the spirit and principles in the present invention, should be included in protection of the invention
Within the scope of.
Claims (5)
1. lead welding structure, is suitable for hydrid integrated circuit, the hydrid integrated circuit includes substrate and is set on the substrate
Transformer, which is characterized in that the lead welding structure includes:
Lead, the lead include first end and second end, and the first end of the lead is connect with the transformer；
Pad, the pad are set on the substrate；
Anti- pad solder drawing crack component, the anti-pad solder drawing crack component include the first linkage section and first linkage section
Spaced second linkage section and connection both first linkage section and second linkage section are to buffer by described first
Linkage section is transmitted to the buffering changeover portion of the active force of second linkage section, and first linkage section is set on the pad, institute
The second end for stating the second linkage section and the lead is welded to connect；
The buffering changeover portion is bending structure；
The buffering changeover portion includes the first bending segment and the second bending made of the bending of one end of first bending segment
Section, first bending segment are connected to first linkage section, and second bending segment is connected to second linkage section；
Second linkage section is equipped with to the welding groove with the second end of lead welded connecting.
2. lead welding structure as described in claim 1, it is characterised in that: between the first linkage section of Yu Suoshu and the pad
Equipped with the adhesives to make first linkage section be connected with the pad.
3. lead welding structure as claimed in claim 2, it is characterised in that: the adhesives is solder(ing) paste.
4. hydrid integrated circuit, the transformer including substrate and on the substrate, it is characterised in that: further include claim
The described in any item lead welding structures of 1-3.
5. lead welding procedure characterized by comprising
Prepare the substrate, lead, pad and the anti-pad solder drawing crack component that are provided with transformer, there is the lead definition
First end and second end, and it includes between the first linkage section and first linkage section that the anti-pad solder drawing crack component, which is arranged,
Connected with buffering by described first every the second linkage section and both connection first linkage section and second linkage section of setting
Connect the buffering changeover portion that section is transmitted to the active force of second linkage section；
It is bending structure that the buffering changeover portion, which is arranged,；
Be arranged the buffering changeover portion include the first bending segment and made of the bending of one end of first bending segment it is second curved
Trisection makes first bending segment be connected to first linkage section, and second bending segment is made to be connected to second connection
Section；
Second linkage section is equipped with to the welding groove with the second end of lead welded connecting；
It is set to the pad on the substrate；
It is set to first linkage section on the pad；
It is welded to connect the second end of second linkage section and the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510896610.9A CN106847779B (en) | 2015-12-07 | 2015-12-07 | Lead welding structure, hydrid integrated circuit and lead welding procedure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510896610.9A CN106847779B (en) | 2015-12-07 | 2015-12-07 | Lead welding structure, hydrid integrated circuit and lead welding procedure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106847779A CN106847779A (en) | 2017-06-13 |
| CN106847779B true CN106847779B (en) | 2019-08-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510896610.9A Active CN106847779B (en) | 2015-12-07 | 2015-12-07 | Lead welding structure, hydrid integrated circuit and lead welding procedure |
Country Status (1)
| Country | Link |
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| CN (1) | CN106847779B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202007A (en) * | 1997-05-26 | 1998-12-16 | 精工爱普生株式会社 | Film carrier type, integrated circuit device and method of making same and electronic device |
| CN204316264U (en) * | 2014-12-25 | 2015-05-06 | 成都南车电机有限公司 | A kind of locomotive brushless excitation generator draws on line |
| CN204706976U (en) * | 2015-06-30 | 2015-10-14 | 成都南车电机有限公司 | Optimizing structure of a kind of AC traction motor stator lead-out wire |
| CN205211738U (en) * | 2015-12-07 | 2016-05-04 | 深圳市振华微电子有限公司 | Lead welding structure and hybrid integrated circuit |
-
2015
- 2015-12-07 CN CN201510896610.9A patent/CN106847779B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202007A (en) * | 1997-05-26 | 1998-12-16 | 精工爱普生株式会社 | Film carrier type, integrated circuit device and method of making same and electronic device |
| CN204316264U (en) * | 2014-12-25 | 2015-05-06 | 成都南车电机有限公司 | A kind of locomotive brushless excitation generator draws on line |
| CN204706976U (en) * | 2015-06-30 | 2015-10-14 | 成都南车电机有限公司 | Optimizing structure of a kind of AC traction motor stator lead-out wire |
| CN205211738U (en) * | 2015-12-07 | 2016-05-04 | 深圳市振华微电子有限公司 | Lead welding structure and hybrid integrated circuit |
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| Publication number | Publication date |
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| CN106847779A (en) | 2017-06-13 |
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Effective date of registration: 20190719 Address after: 518000, Nanshan District W1 hi tech Industrial Village, Guangdong, Shenzhen, building 3, B1, 2, B1 District Applicant after: Shenzhen Zhenhua Microelectronics Co., Ltd. Applicant after: China Zhenhua (Group) Science & Technology Co., Ltd. Address before: 518000, Nanshan District W1 hi tech Industrial Village, Guangdong, Shenzhen, building 3, B1, 2, B1 District Applicant before: Shenzhen Zhenhua Microelectronics Co., Ltd. |
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