CN106847779A - Lead welding structure, hydrid integrated circuit and lead welding procedure - Google Patents
Lead welding structure, hydrid integrated circuit and lead welding procedure Download PDFInfo
- Publication number
- CN106847779A CN106847779A CN201510896610.9A CN201510896610A CN106847779A CN 106847779 A CN106847779 A CN 106847779A CN 201510896610 A CN201510896610 A CN 201510896610A CN 106847779 A CN106847779 A CN 106847779A
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- Prior art keywords
- linkage section
- lead
- pad
- bending segment
- substrate
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/492—Bases or plates or solder therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Abstract
A kind of lead welding structure, is suitable to hydrid integrated circuit, and it includes lead, pad and anti-pad solder drawing crack component, and lead includes first end and the second end, and its first end is connected with the transformer of hydrid integrated circuit；Pad is on the substrate of hydrid integrated circuit；Anti- pad solder drawing crack component includes the first linkage section and spaced second linkage section of the first linkage section and connection both the first linkage section and the second linkage section to buffer the buffering changeover portion of the active force for being transmitted to second linkage section by first linkage section, on pad, the second linkage section is welded to connect first linkage section with the second end of lead.By the setting of anti-pad solder drawing crack component, when the second end of lead and the second linkage section are welded to connect, the thermal stress for being transmitted to the generation of the second linkage section by the first linkage section in welding can be buffered abatement by buffering changeover portion, it is to avoid lead is because of the effect of thermal stress to the reciprocal extension of pad, the problem pullled and cause pad drawing crack occur.
Description
Technical field
The present invention relates to the technical field of hydrid integrated circuit, more particularly to a kind of hydrid integrated circuit that is suitable to
Lead welding structure, with the welded hydrid integrated circuit of the lead and lead welding procedure.
Background technology
When certain thick film hybrid integrated circuit is prepared, it is necessary to by the transformer of the thick film hybrid integrated circuit/
The lead-out wire of inductor winding is welded on the pad of substrate.
Used solder technology, usually using electric iron manual welding mode or welding robot automatic welding
Mode is connect, the lead-out wire of transformer/inductor winding is directly welded on the pad of substrate.Although will draw
Outlet is directly welded on the pad of substrate and can obtain that not introduce extra process materials, production efficiency higher etc.
Benefit, but, because the line footpath of lead-out wire is relatively thick (generally in more than 0.5mm), or even multi cord is coiled into one
Stock, if lead-out wire is welded direct on the pad of substrate, can make the thermally stressed influence of pad larger,
Meanwhile, because of no buffering between pad and lead-out wire, and lead-out wire is inconsistent with the pad coefficient of expansion, thus,
Lead-out wire can because of the effect of thermal stress to the reciprocal extension of pad, pull, cause pad the problem of drawing crack occur.
Therefore, it is necessary to provide a kind of technological means to solve drawbacks described above.
The content of the invention
Defect it is an object of the invention to overcome prior art, there is provided a kind of lead welding structure, to solve
Lead-out wire is welded direct to the problem on the pad of substrate easily making pad drawing crack occur in the prior art.
The present invention is achieved in that lead welding structure, is suitable to hydrid integrated circuit, the hybrid integrated
Circuit includes substrate and the transformer on the substrate, and the lead welding structure includes：
Lead, the lead includes first end and the second end, and the first end of the lead connects with the transformer
Connect；
Pad, the pad is on the substrate；
Anti- pad solder drawing crack component, the anti-pad solder drawing crack component includes the first linkage section and described
Spaced second linkage section of first linkage section and connection first linkage section and second linkage section
Both are buffering the buffering changeover portion of the active force that second linkage section is transmitted to by first linkage section, institute
The first linkage section is stated on the pad, second linkage section is welded with the second end of the lead and connected
Connect.
Specifically, the buffering changeover portion is bending structure.
Further, the buffering changeover portion includes the first bending segment and the one end in first bending segment
Second bending segment of bending, first bending segment is connected to first linkage section, and described second is curved
Trisection is connected to second linkage section.
Specifically, second linkage section is provided with the welding to be welded to connect with the second end of the lead
Groove.
Specifically, be provided with to make between first linkage section and the pad first linkage section with
The adhesives that the pad is connected.
Further, the adhesives is solder(ing) paste.
The welded technique effect of lead of the invention is：By the setting of anti-pad solder drawing crack component,
When the second end of lead and the second linkage section are welded to connect, buffering changeover portion can by welding by first
Linkage section is transmitted to the thermal stress buffering abatement of the second linkage section generation, it is to avoid lead is right because of the effect of thermal stress
The problem that pad is back and forth upheld, pulls and cause pad drawing crack occur.
The present invention also provides hydrid integrated circuit, including substrate and the transformer on the substrate, also wraps
Include above-mentioned lead welding structure.Because the hydrid integrated circuit has above-mentioned lead welding structure, then,
By the setting of anti-pad solder drawing crack component, it is welded to connect by the second end of lead and the second linkage section
When, buffering changeover portion can buffer the thermal stress for being transmitted to the generation of the second linkage section by the first linkage section in welding
Abatement, it is to avoid lead because of the effect of thermal stress to the reciprocal extension of pad, pull and cause pad drawing crack occur
Problem；Simultaneously, also it is greatly improved the reliability of hydrid integrated circuit.
The present invention also provides lead welding procedure, including：
Preparation is provided with substrate, lead, pad and the anti-pad solder drawing crack component of transformer, makes institute
Stating lead definition has first end and the second end, and sets the anti-pad solder drawing crack component and include the first connection
Section and spaced second linkage section of first linkage section and connect first linkage section with it is described
Both second linkage sections with buffer by first linkage section be transmitted to second linkage section active force it is slow
Rush changeover portion；
The pad is set to be located on the substrate；
First linkage section is set to be located on the pad；
Second linkage section is set to be welded to connect with the second end of the lead.
Further, it is bending structure to set the buffering changeover portion.
Further, setting the buffering changeover portion includes the first bending segment and in first bending segment
Second bending segment of one end bending, makes first bending segment be connected to first linkage section, makes institute
State the second bending segment and be connected to second linkage section.
The technique effect of lead welding procedure of the invention is：By the setting of anti-pad solder drawing crack component,
When the second end of lead and the second linkage section are welded to connect, buffering changeover portion can by welding by first
Linkage section is transmitted to the thermal stress buffering abatement of the second linkage section generation, it is to avoid lead is right because of the effect of thermal stress
The problem that pad is back and forth upheld, pulls and cause pad drawing crack occur；Simultaneously, welded by using the lead
Technique is connect, the pass rate of product is greatly improved.
Brief description of the drawings
Fig. 1 is the welded schematic diagram of lead of the invention；
Fig. 2 is the structural representation of the welded anti-pad solder drawing crack component 30 of lead of the invention；
Fig. 3 is the signal of another angle of the welded anti-pad solder drawing crack component 30 of lead of Fig. 2
Figure.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with accompanying drawing and reality
Example is applied, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
Only it is used to explain the present invention, is not intended to limit the present invention.
The welded embodiment of lead：
Fig. 1 and Fig. 2 is referred to, the welded embodiment of lead of the invention is illustrated below.
The lead welding structure 100 of the present embodiment, is suitable to thick film hybrid integrated circuit, wherein, thick film mixing
Integrated circuit includes substrate 200 and the transformer 300 on substrate 200, and substrate 200 is usually and aoxidizes
Aluminium base or aluminium nitride substrate, it plays a supporting role as carrier；Transformer 300 by coiled wire-wound coil and
Ferrite magnetic tank is assembled, play a part of to change in circuit voltage ratio or electric current than.And the present embodiment draws
Wire bonding structure 100 include support lead 10, pad 20 and anti-pad solder drawing crack component 30, below it is right
Each part of lead welding structure 100 is further described：
Lead 10 includes the end 12 of first end 11 and second, first end 11 and the transformer 300 of lead 10
Connection, it is preferable that lead 10 be copper core, to ensure while conductance, price is not prohibitively expensive and cause
Increase production cost；
Pad 20 is palladium-silver or silver soldering disk, wherein, pad 20 on the substrate 200, it is preferred that pad
20 are located on substrate 200 by printing, drying and sintering processing；
Anti- pad solder drawing crack component 30 includes the first linkage section 31 and the interval setting of the first linkage section 31
The second linkage section 32 and both the first linkage section 31 of connection and the second linkage section 32 buffering by first
Linkage section 31 is transmitted to the buffering changeover portion 33 of the active force of the second linkage section 32, and the first linkage section 31 is located at
On pad 20, the second linkage section 32 is welded to connect with the second end 12 of lead 10.
By the setting of anti-pad solder drawing crack component 30, connect by the second end 12 and second of lead 10
When connecing section 32 and being welded to connect, buffering changeover portion 33 can be transmitted to second in welding by the first linkage section 31
The thermal stress buffering abatement that linkage section 32 is produced, it is to avoid lead 10 is because of the effect of thermal stress to pad 20
Back and forth uphold, pull and cause pad 20 problem of drawing crack occur.
Fig. 1 and Fig. 2 is referred to, the buffering changeover portion 33 in the present embodiment is bending structure, so that weldering
The thermal stress produced when connecing during the second linkage section 32 is transmitted to from the first linkage section 31, with respect to line style
The buffering changeover portion 33 of structure setting have relatively long distance, hereby it is possible to by bending structure length away from
Cut down from being buffered to thermal stress.
Also selectively, the buffering changeover portion 33 is tortuous shape structure, its effect and bending structure setting
Equally, to be preferably S-shaped, wave concavo-convex etc. for tortuous shape structure.
And when buffering changeover portion 33 for bending structure, the preferred embodiment of the buffering changeover portion 33 is,
It includes the first bending segment 331 and the second bending segment bent in one end of the first bending segment 331
332, the first bending segment 331 is connected to the first linkage section 31, and the second bending segment 332 is connected to the second connection
Section 32, and the first bending segment 331, the setting of the second bending segment 332, not only simple structure, and processing
It is convenient, bent as long as will buffer the bending of changeover portion 33 by apparatus for bending and go out the first bending segment 331, second
Section 332.
Fig. 3 is referred to, and combines Fig. 1, the second linkage section 32 in the present embodiment is provided with and is used to and lead
The welding groove 321 that 10 the second end 12 is welded to connect, and by the setting of the welding groove 321,
Second end 12 of lead 10 is welded on when on the second linkage section 32, as long as first by the second end of lead 10
12 are placed on welding groove 321, just can position the second end 12 of lead 10, afterwards just can be by electricity
Second end 12 of lead 10 is welded on by flatiron manual welding mode or welding robot automatic welding mode
On two linkage sections 32, the welding operation of operating personnel is greatly facilitated；And, also preferably ensure lead
Being welded and fixed for 10 the second end 12, reduces after lead 10 is welded and the problem for releasing occurs.
Fig. 1 is referred to, in the present embodiment, is provided with to make between the first linkage section 31 and pad 20
The adhesives that first linkage section 31 is connected with pad 20, wherein, the adhesives is solder(ing) paste, that
, the attended operation between the first linkage section 31 and pad 20 on pad 20 specifically, first print weldering
Tin cream, then, the first linkage section 31 is attached at the solder(ing) paste on pad 20, so that it can be by scolding tin
Cream pre-determined bit afterwards, just can be connected by hot plate reflow soldering or Reflow Soldering mode on pad 20 by first
Section 31 is weldingly fixed on pad 20.
The embodiment of hydrid integrated circuit：
Fig. 1 to Fig. 3 is referred to, the embodiment to hydrid integrated circuit of the invention is illustrated below.
The hydrid integrated circuit of the present embodiment, specially thick film hybrid integrated circuit, it include substrate 200,
Transformer 300 and above-mentioned lead welding structure 100 on substrate 200, substrate 200 are usually
Aluminum oxide substrate or aluminium nitride substrate, it plays a supporting role as carrier；Transformer 300 is by coiling line
Circle and ferrite magnetic tank assembling, play a part of to change in circuit voltage ratio or electric current than.
Because the hydrid integrated circuit has above-mentioned lead welding structure 100, then, welded by anti-pad
The setting of drawing crack component 30 is connect, when the second end 12 of lead 10 and the second linkage section 32 are welded to connect,
Buffering changeover portion 33 can will be transmitted to heat that the second linkage section 32 produces in welding by the first linkage section 31 should
Power buffering abatement, it is to avoid lead 10 is back and forth upheld to pad 20 because of the effect of thermal stress, pullled and causes
There is the problem of drawing crack in pad 20；Simultaneously, also it is greatly improved the reliability of hydrid integrated circuit.
The embodiment of lead welding procedure：
Fig. 1 and Fig. 2 is referred to, the embodiment to hydrid integrated circuit of the invention is illustrated below.
The present invention also provides lead welding procedure, is applied to the technical field of thick film hybrid integrated circuit, including
Following steps：
S101, preparation are provided with the substrate 200 of transformer 300, lead 10, pad 20 and anti-welding
Disk welds drawing crack 30, and defining lead 10 has the end 12 of first end 11 and second, and sets anti-pad solder
Drawing crack component 30 include the first linkage section 31 and spaced second linkage section 32 of the first linkage section 31,
And both the first linkage section 31 of connection and the second linkage section 32 are transmitted to second to buffer by the first linkage section 31
The buffering changeover portion 33 of the active force of linkage section 32；
S102, make pad 20 on the substrate 200；
S103, make the first linkage section 31 on pad 20；
S104, the second linkage section 32 is set to be welded to connect with the second end 12 of lead 10.
In the present embodiment, by the setting of anti-pad solder drawing crack component 30, by the second of lead 10
When the linkage section 32 of end 12 and second is welded to connect, buffering changeover portion 33 will can be connected in welding by first
Section 31 is transmitted to the thermal stress buffering abatement of the generation of the second linkage section 32, it is to avoid lead 10 is because of the work of thermal stress
Back and forth uphold, pull and cause pad 20 problem of drawing crack occur with and to pad 20；Simultaneously, pass through
Using the lead welding procedure, the pass rate of product is greatly improved.
Fig. 1 and Fig. 2 is referred to, in the present embodiment, it is bending structure to set buffering changeover portion 33,
So that the thermal stress produced during welding from the first linkage section 31 during the second linkage section 32 is transmitted to, phase
There is relatively long distance to the buffering changeover portion 33 that linear structure is set, hereby it is possible to by bending structure
Long range to thermal stress buffer cut down.
Also selectively, it is tortuous shape structure, its effect and bending structure to set the buffering changeover portion 33
Set the same, and tortuous shape structure to be preferably S-shaped, wave concavo-convex etc..
Preferably, setting buffering changeover portion 33 includes the first bending segment 331 and in the first bending segment 331
One end bending the second bending segment 332, the first bending segment 331 is connected to the first linkage section 31,
The second bending segment 332 is set to be connected to the second linkage section 32, and the first bending segment 331, the second bending segment 332
Setting, not only simple structure, and easy to process, as long as changeover portion 33 will be buffered by apparatus for bending
Bending goes out the first bending segment 331, the second bending segment 332.
Refer to Fig. 3, and combine Fig. 1, in the present embodiment, make the second linkage section 32 be provided with to
The welding groove 321 that second end 12 of lead 10 is welded to connect, and by the setting of the welding groove 321,
When the second end 12 of lead 10 is welded on the second linkage section 32, as long as first by the second of lead 10
End 12 is placed on welding groove 321, just can be positioned the second end 12 of lead 10, just can be passed through afterwards
Be welded at second end 12 of lead 10 by electric iron manual welding mode or welding robot automatic welding mode
On second linkage section 32, the welding operation of operating personnel is greatly facilitated；And, also preferably ensure to draw
Being welded and fixed for second end 12 of line 10, reduces after lead 10 is welded and the problem for releasing occurs.
Fig. 1 is referred to, in the present embodiment, is made to be provided between the first linkage section 31 and pad 20 and is used to
The adhesives for making the first linkage section 31 be connected with pad 20, wherein, make the adhesives for solder(ing) paste,
So, between the first linkage section 31 and pad 20 attended operation on pad 20 specifically, first print
Solder(ing) paste, then, the first linkage section 31 is attached at the solder(ing) paste on pad 20, so that it can be by weldering
Tin cream pre-determined bit on pad 20, afterwards, by hot plate reflow soldering or Reflow Soldering mode by the first linkage section
31 are weldingly fixed on pad 20.
Preferred embodiments of the present invention are the foregoing is only, its structure is not limited to the above-mentioned shape enumerated
Shape, all any modification, equivalent and improvement made within the spirit and principles in the present invention etc., all should
It is included within protection scope of the present invention.
Claims (10)
1. lead welding structure, is suitable to hydrid integrated circuit, and the hydrid integrated circuit includes substrate and is located at
Transformer on the substrate, it is characterised in that the lead welding structure includes：
Lead, the lead includes first end and the second end, and the first end of the lead connects with the transformer
Connect；
Pad, the pad is on the substrate；
Anti- pad solder drawing crack component, the anti-pad solder drawing crack component includes the first linkage section and described
Spaced second linkage section of first linkage section and connection first linkage section and second linkage section
Both are buffering the buffering changeover portion of the active force that second linkage section is transmitted to by first linkage section, institute
The first linkage section is stated on the pad, second linkage section is welded with the second end of the lead and connected
Connect.
2. lead welding structure as claimed in claim 1, it is characterised in that：The buffering changeover portion is curved
Folding shape structure.
3. lead welding structure as claimed in claim 2, it is characterised in that：The buffering changeover portion includes
First bending segment and the second bending segment bent in one end of first bending segment, described first is curved
Trisection is connected to first linkage section, and second bending segment is connected to second linkage section.
4. lead welding structure as claimed in claim 1, it is characterised in that：Set on second linkage section
There is the welding groove to be welded to connect with the second end of the lead.
5. the lead welding structure as described in claim any one of 1-4, it is characterised in that：In described first
It is provided with to make first linkage section bonding with what the pad was connected between linkage section and the pad
Material.
6. lead welding structure as claimed in claim 5, it is characterised in that：The adhesives is scolding tin
Cream.
7. hydrid integrated circuit, including substrate and the transformer on the substrate, it is characterised in that：Also
Including the lead welding structure described in claim any one of 1-6.
8. lead welding procedure, it is characterised in that including：
Preparation is provided with substrate, lead, pad and the anti-pad solder drawing crack component of transformer, makes institute
Stating lead definition has first end and the second end, and sets the anti-pad solder drawing crack component and include the first connection
Section and spaced second linkage section of first linkage section and connect first linkage section with it is described
Both second linkage sections with buffer by first linkage section be transmitted to second linkage section active force it is slow
Rush changeover portion；
The pad is set to be located on the substrate；
First linkage section is set to be located on the pad；
Second linkage section is set to be welded to connect with the second end of the lead.
9. lead welding procedure as claimed in claim 8, it is characterised in that：The buffering changeover portion is set
It is bending structure.
10. lead welding procedure as claimed in claim 9, it is characterised in that：The buffering transition is set
Section includes the first bending segment and the second bending segment bent in one end of first bending segment, makes institute
State the first bending segment and be connected to first linkage section, second bending segment is connected to second connection
Section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510896610.9A CN106847779B (en) | 2015-12-07 | 2015-12-07 | Lead welding structure, hydrid integrated circuit and lead welding procedure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510896610.9A CN106847779B (en) | 2015-12-07 | 2015-12-07 | Lead welding structure, hydrid integrated circuit and lead welding procedure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106847779A true CN106847779A (en) | 2017-06-13 |
| CN106847779B CN106847779B (en) | 2019-08-20 |
Family
ID=59151614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510896610.9A Active CN106847779B (en) | 2015-12-07 | 2015-12-07 | Lead welding structure, hydrid integrated circuit and lead welding procedure |
Country Status (1)
| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202007A (en) * | 1997-05-26 | 1998-12-16 | 精工爱普生株式会社 | Film carrier type, integrated circuit device and method of making same and electronic device |
| CN204316264U (en) * | 2014-12-25 | 2015-05-06 | 成都南车电机有限公司 | A kind of locomotive brushless excitation generator draws on line |
| CN204706976U (en) * | 2015-06-30 | 2015-10-14 | 成都南车电机有限公司 | Optimizing structure of a kind of AC traction motor stator lead-out wire |
| CN205211738U (en) * | 2015-12-07 | 2016-05-04 | 深圳市振华微电子有限公司 | Lead welding structure and hybrid integrated circuit |
-
2015
- 2015-12-07 CN CN201510896610.9A patent/CN106847779B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1202007A (en) * | 1997-05-26 | 1998-12-16 | 精工爱普生株式会社 | Film carrier type, integrated circuit device and method of making same and electronic device |
| CN204316264U (en) * | 2014-12-25 | 2015-05-06 | 成都南车电机有限公司 | A kind of locomotive brushless excitation generator draws on line |
| CN204706976U (en) * | 2015-06-30 | 2015-10-14 | 成都南车电机有限公司 | Optimizing structure of a kind of AC traction motor stator lead-out wire |
| CN205211738U (en) * | 2015-12-07 | 2016-05-04 | 深圳市振华微电子有限公司 | Lead welding structure and hybrid integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106847779B (en) | 2019-08-20 |
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Effective date of registration: 20190719 Address after: 518000, Nanshan District W1 hi tech Industrial Village, Guangdong, Shenzhen, building 3, B1, 2, B1 District Applicant after: Shenzhen Zhenhua Microelectronics Co., Ltd. Applicant after: China Zhenhua (Group) Science & Technology Co., Ltd. Address before: 518000, Nanshan District W1 hi tech Industrial Village, Guangdong, Shenzhen, building 3, B1, 2, B1 District Applicant before: Shenzhen Zhenhua Microelectronics Co., Ltd. |
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