CN106847731A - Silicon wafer turnover device - Google Patents
Silicon wafer turnover device Download PDFInfo
- Publication number
- CN106847731A CN106847731A CN201710166701.6A CN201710166701A CN106847731A CN 106847731 A CN106847731 A CN 106847731A CN 201710166701 A CN201710166701 A CN 201710166701A CN 106847731 A CN106847731 A CN 106847731A
- Authority
- CN
- China
- Prior art keywords
- conveying roller
- conveying
- carriage
- silicon chip
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 100
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 100
- 239000010703 silicon Substances 0.000 title claims abstract description 100
- 230000007306 turnover Effects 0.000 title claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims abstract description 54
- 230000010355 oscillation Effects 0.000 claims description 8
- 230000007723 transport mechanism Effects 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 230000004075 alteration Effects 0.000 abstract description 7
- 238000001514 detection method Methods 0.000 abstract description 5
- 230000003139 buffering effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to silicon chip production equipment technical field,More particularly, to a kind of silicon wafer turnover device,Including control unit,Color sensor and front end conveying mechanism and rear end conveying mechanism for conveying silicon chip,The front end conveying mechanism and rear end conveying mechanism mutually stagger along silicon chip conveying direction and set and join end to end,Silicon wafer turnover device of the present invention is when in use,First conveying roller is set into curl mechanism along silicon chip conveying direction,And second conveying roller the helical form being oppositely arranged with the first conveying roller is set along silicon chip conveying direction,And silicon chip aberration is detected by color sensor,When aberration is in detection range,Be delivered to silicon chip on first conveying roller on the second conveying roller by turnover panel,When aberration exceeds detection range,Be delivered to silicon chip on the 4th conveying roller by push pedal upset,Its simple structure,Can quickly by silicon wafer turnover,It is easy to safeguard,Avoid existing silicon wafer turnover mechanism structure complicated,Safeguard inconvenient problem.
Description
Technical field
The present invention relates to silicon chip production equipment technical field, more particularly, to a kind of silicon wafer turnover device.
Background technology
The printing of solar battery sheet is broadly divided into three steps, is first the printing to backplate, next to that the back side
The printing of electric field, the 3rd is that will print front electrode after silicon chip turn-over.In three steps, it is necessary to silicon wafer turnover is come to be printed
Brush, and existing silicon wafer turnover mechanism structure is complicated, safeguards inconvenient.
The content of the invention
The technical problem to be solved in the present invention is：It is complicated in order to solve existing silicon wafer turnover mechanism structure, safeguard inconvenient
Problem, now there is provided a kind of silicon wafer turnover device.
The technical solution adopted for the present invention to solve the technical problems is：A kind of silicon wafer turnover device, including control unit,
Color sensor and front end conveying mechanism and rear end conveying mechanism for conveying silicon chip, the front end conveying mechanism and rear end are defeated
Send mechanism mutually to stagger along silicon chip conveying direction to set and join end to end, the front end conveying mechanism includes the first carriage and turns
Dynamic the first conveying roller being located on the first carriage, first carriage be provided with for drive the first conveying roller to rotate the
One motor, the central axis of first conveying roller is gradually inclined upwardly by oscillation center of one end, the rear end conveying mechanism
The second conveying roller on the second carriage is located at including the second carriage and rotation, second carriage is provided with for driving
The second motor that second conveying roller is rotated, the central axis of second conveying roller is with one end as oscillation center and gradually to updip
Tiltedly, first conveying roller and the second conveying roller are oppositely arranged, and first conveying roller and the second conveying roller are along silicon chip conveying side
To from two ends, gradually to intermediate projections, first carriage is hinged with push pedal, described first near one end of the second carriage
Carriage is provided with the first cylinder, and first cylinder is rotated away from one end of its pin joint with the push pedal and is connected, described to push away
Rotated on plate and be provided with the 3rd conveying roller, turnover panel is hinged with the push pedal, the push pedal is provided with for driving turnover panel to swing
The second cylinder, the 3rd conveying roller is provided with driven pulley, and it is defeated that the output end of the front end conveying mechanism is provided with separation
Mechanism is sent, the separating transport mechanism includes the 4th conveying roller that the 3rd carriage and rotation are located on the 3rd carriage, described
3rd carriage is provided with the 3rd motor for driving the 4th conveying roller to rotate, and is rotated on the 3rd carriage and is provided with master
Dynamic friction wheel, the active friction wheel is corresponding with the driven pulley, is provided with for driving on the 3rd carriage
The 4th motor that active friction wheel is rotated, the color sensor is arranged on the front end conveying mechanism top, first gas
Cylinder, the second cylinder and color sensor are connected with control unit signal.
The present invention detects the positive and negative aberration of silicon chip by color sensor, and controls the first cylinder or the second gas by controller
Cylinder, silicon chip is transmitted on the first conveying roller on the conveying mechanism of front end, and silicon chip is with the slow rear end of the swing of the first conveying roller
Conveying mechanism direction rotates, and when silicon chip reaches push pedal, when silicon chip color is detected in the range of, turnover panel promotes silicon chip to rear end
On second conveying roller of conveying mechanism, silicon chip will slowly be rotated with the conveying of the second conveying roller, finally and be exported silicon wafer horizontal,
The upset work of silicon chip is completed, when detecting silicon chip color and going beyond the scope, push pedal is rotated, and is made driven on the 3rd conveying roller
Friction pulley is contacted with the active friction wheel on the 3rd carriage so that be delivered to silicon chip on the 3rd carriage by the 3rd conveying roller
On 4th conveying roller and export.
In order to prevent being collided between silicon chip and the second conveying roller, further, the outer peripheral face of second conveying roller
It is provided with cushion rubber layer.Cushion rubber layer is set by the second conveying roller so that silicon chip with the second conveying roller when contacting
Buffering effect that can be more specifically, reduces the impulsive force of silicon chip and the second conveying roller.
In order to prevent silicon chip from being slid on the first conveying roller, further, it is spacing that first conveying roller is provided with first
Ring, first spacing ring is located near the side of rear end conveying mechanism.Front end conveying mechanism is close to by the first conveying roller
Side the first spacing ring is set, the first spacing ring effectively stops silicon chip, prevents silicon chip from being slid on the first conveying roller.
In order to prevent silicon chip from being slid on the second conveying roller, further, it is spacing that second conveying roller is provided with second
Ring, second spacing ring is located near the side of front end conveying mechanism.Front end conveying mechanism is close to by the second conveying roller
Side the second spacing ring is set, the second spacing ring effectively stops silicon chip, prevents silicon chip from being slid on the second conveying roller.
In order to prevent silicon chip from being slid on the 3rd conveying roller, further, it is spacing that the 3rd conveying roller is provided with the 3rd
Ring, the 3rd spacing ring is located near the side of rear end conveying mechanism.Rear end conveying mechanism is close to by the 3rd conveying roller
Side the 3rd spacing ring is set, the 3rd spacing ring effectively stops silicon chip, prevents silicon chip from being slid on the 3rd conveying roller.
In order to prevent silicon chip from being dropped in the output end of the first carriage, further, it is defeated that first carriage is located at its
Go out to hold the baffle plate being provided with for spacing silicon chip.Baffle plate is set by the output end in the first carriage, silicon chip is carried out spacing, had
The silicon chip that prevents of effect drops.
The beneficial effects of the invention are as follows：Silicon wafer turnover device of the present invention when in use, by first on the conveying mechanism of front end
Conveying roller sets curl mechanism along silicon chip conveying direction, while the second conveying roller on the conveying mechanism of rear end is conveyed along silicon chip
Direction sets the helical form being oppositely arranged with the first conveying roller, and detects silicon chip aberration by color sensor, when aberration exists
In detection range, be delivered to the silicon chip on the first conveying roller on the second conveying roller by turnover panel, when aberration exceeds detection range, pushes away
Be delivered to silicon chip on the 4th conveying roller by plate upset, its simple structure, can be easy to safeguard quickly by silicon wafer turnover, it is to avoid
Existing silicon wafer turnover mechanism structure is complicated, safeguards inconvenient problem.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the front view of silicon wafer turnover device of the present invention；
Fig. 2 is the top view of silicon wafer turnover device of the present invention；
Fig. 3 is the front view of the first conveying roller in silicon wafer turnover device of the present invention；
Fig. 4 is the schematic cross-section of the second conveying roller in silicon wafer turnover device of the present invention.
In figure：1st, the first carriage, the 2, first conveying roller, the 201, first spacing ring, the 3, first motor, the 4, second conveying
Frame, the 5, second conveying roller, the 501, second spacing ring, the 6, second motor, 7, push pedal, 8, baffle plate, 9, cushion rubber layer, 10, control
Unit, 11, color sensor, the 12, the 3rd conveying roller, 13, turnover panel, the 14, first cylinder, the 15, second cylinder, 16, by dynamic friction
Wheel, 17, active friction wheel, the 18, the 4th motor, the 19, the 3rd spacing ring, the 20, the 3rd carriage, the 21, the 4th conveying roller, 22, the
Three motors.
Specific embodiment
Presently in connection with accompanying drawing, the present invention will be further described in detail.These accompanying drawings are simplified schematic diagram, only with
Illustration illustrates basic structure of the invention, therefore it only shows the composition relevant with the present invention.
Embodiment
As shown in Fig. 1,2,3 and 4, a kind of silicon wafer turnover device, including control unit 10, color sensor 11 and for defeated
The front end conveying mechanism and rear end conveying mechanism of silicon chip are sent, the front end conveying mechanism and rear end conveying mechanism are along silicon chip conveying side
Set and join end to end to mutually staggering, the front end conveying mechanism includes that the first carriage 1 and rotation are located at the first carriage 1
On the first conveying roller 2, first carriage 1 be provided with for drive the first conveying roller 2 rotate the first motor 3, it is described
The central axis of the first conveying roller 2 is gradually inclined upwardly by oscillation center of one end, and the rear end conveying mechanism includes that second is defeated
The second conveying roller 5 that frame 4 and rotation are located on the second carriage 4, second carriage 4 is sent to be provided with defeated for driving second
Send roller 5 rotate the second motor 6, second conveying roller 5 central axis is with one end as oscillation center and is gradually inclined upwardly,
The conveying roller 5 of first conveying roller 2 and second is oppositely arranged, and the conveying roller 5 of first conveying roller 2 and second is along silicon chip conveying side
To from two ends, gradually to intermediate projections, first carriage 1 is hinged with push pedal 7 near one end of the second carriage 4, described the
One carriage 1 is provided with the first cylinder 14, and first cylinder 14 is rotated away from one end of its pin joint with the push pedal 7 and connected
Connect, rotated in the push pedal 7 and be provided with the 3rd conveying roller 12, turnover panel 13 is hinged with the push pedal 7, the push pedal 7 is provided with
For the second cylinder 15 for driving turnover panel 13 to swing, the 3rd conveying roller 12 is provided with driven pulley 16, and the front end is defeated
The output end of mechanism is sent to be provided with separating transport mechanism, the separating transport mechanism includes that the 3rd carriage 20 and rotation are located at the 3rd
The 4th conveying roller 21 on carriage 20, the 3rd carriage 20 is provided with the 3rd for driving the rotation of the 4th conveying roller 21
Motor 22, rotates on the 3rd carriage 20 and is provided with active friction wheel 17, and the active friction wheel 17 passively rubs with described
Wiping wheel 16 is corresponding, and the 4th motor 18 for driving active friction wheel 17 to rotate, institute are provided with the 3rd carriage 20
State color sensor 11 and be arranged on the front end conveying mechanism top, first cylinder 14, the second cylinder 15 and color sensing
Device 11 is connected with the signal of control unit 10.
The outer peripheral face of second conveying roller 5 is provided with cushion rubber layer 9.
First conveying roller 2 is provided with the first spacing ring 201, and first spacing ring 201 is located near rear end conveying
The side of mechanism.
Second conveying roller 5 is provided with the second spacing ring 501, and second spacing ring 501 is located near front end conveying
The side of mechanism.
3rd conveying roller 12 is provided with the 3rd spacing ring 19, and the 3rd spacing ring 19 is located near rear end conveyer
The side of structure.
First carriage 1 is provided with the baffle plate 8 for spacing silicon chip positioned at its output end.
Above-mentioned silicon wafer turnover device starts the first motor 3, the second motor 6, the 3rd motor 22 and the 4th motor when using
18, the first motor 3 drives the first conveying roller 2 on the first carriage 1 to rotate, and the second motor 6 drives the on the second carriage 4
Two conveying rollers 5 are rotated, and the 3rd motor 22 drives the 4th conveying roller 21 to rotate, and the 4th motor 18 drives 17 turns of active friction wheel
It is dynamic, silicon chip is placed on one end input of the front end conveying mechanism away from rear end conveying mechanism first, due in the first conveying roller 2
Heart axis is gradually inclined upwardly by oscillation center of one end, and along silicon chip conveying direction in the shape of a spiral, silicon chip is with for the first conveying roller 2
One conveying roller 2 is slow to be rotated, and is detected by color sensor 11, the signal that color sensor 11 will be detected send to
Control unit 10, when silicon chip color is in the range of, when push pedal 7 is reached, control unit 10 starts the first cylinder 14, the first cylinder
14 drive the rear end conveying mechanism in push pedal 7 of turnover panel 13 to rotate so that second conveying roller of the silicon wafer turnover to the second carriage 4
On 5, due to the second conveying roller 5 central axis is with one end as oscillation center and is gradually inclined upwardly, and the He of the first conveying roller 2
Second conveying roller 5 is oppositely arranged, and the first conveying roller 2 and the second conveying roller 5 are gradually convex to centre from two ends along silicon chip conveying direction
Rise, along silicon chip conveying direction also in the shape of a spiral, silicon chip is rotated the second conveying roller 5 as the second conveying roller 5 is slow, and recovers level
State, is finally exported by the second conveying roller 5, completes the upset work of silicon chip；When silicon chip color detection goes beyond the scope, control is single
Unit 10 controls the second cylinder 15 to shrink, and the 3rd carriage 20 is rotated on the first carriage 1, until mutual in the 3rd carriage 20
Level, now the driven pulley 16 on the 3rd conveying roller 12 contacted with the active friction wheel 17 on the 3rd carriage 20 so that
3rd conveying roller 12 is rotated and drives silicon chip to be delivered on the 4th conveying roller 21, is exported by the 3rd carriage 20；First conveying
The first spacing ring 201 on roller 2, limits position of the silicon chip on the first conveying roller 2, prevents silicon chip on the first conveying roller 2
Landing is got off, and the second spacing ring 501 on the second conveying roller 5 limits position of the silicon chip on the second conveying roller 5, prevents silicon chip
Slid on the second conveying roller 5, the 3rd spacing ring 19 on the 3rd conveying roller 12 limits silicon chip in the 3rd conveying roller 12
On position, prevent silicon chip from being slid on the 3rd conveying roller 12, while the second conveying roller 5 is provided with cushion rubber layer 9,
When on silicon wafer turnover to the second conveying roller 5, damping, buffering effect reduces the impulsive force of silicon chip, and baffle plate 8 effectively prevents silicon chip the
Fallen down on one carriage 1.
Above-mentioned is enlightenment according to desirable embodiment of the invention, and by above-mentioned description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention'.This invention it is technical
Scope is not limited to the content on specification, it is necessary to its technical scope is determined according to right.
Claims (6)
1. a kind of silicon wafer turnover device, it is characterised in that：Including control unit (10), color sensor (11) and for conveying silicon
The front end conveying mechanism and rear end conveying mechanism of piece, the front end conveying mechanism and rear end conveying mechanism are along silicon chip conveying direction phase
Mutually stagger and set and join end to end, the front end conveying mechanism includes that the first carriage (1) and rotation are located at the first carriage (1)
On the first conveying roller (2), first carriage (1) be provided with for drive the first conveying roller (2) rotate the first motor
(3), the central axis of first conveying roller (2) is gradually inclined upwardly by oscillation center of one end, the rear end conveying mechanism
The second conveying roller (5) on the second carriage (4) is located at including the second carriage (4) and rotation, on second carriage (4)
The second motor (6) for driving the second conveying roller (5) to rotate is provided with, the central axis of second conveying roller (5) is with one end
It is inclined upwardly for oscillation center and gradually, first conveying roller (2) and the second conveying roller (5) are oppositely arranged, and described first is defeated
Send roller (2) and the second conveying roller (5) along silicon chip conveying direction from two ends gradually to intermediate projections, first carriage (1) is leaned on
One end of nearly second carriage (4) is hinged with push pedal (7), and first carriage (1) is provided with the first cylinder (14), described
One cylinder (14) is rotated away from one end of its pin joint with the push pedal (7) and is connected, and is rotated on the push pedal (7) and is provided with the 3rd
Conveying roller (12), is hinged with turnover panel (13) on the push pedal (7), the push pedal (7) is provided with for driving turnover panel (13) to swing
The second cylinder (15), the 3rd conveying roller (12) is provided with driven pulley (16), the output of the front end conveying mechanism
End is provided with separating transport mechanism, and the separating transport mechanism includes that the 3rd carriage (20) and rotation are located at the 3rd carriage (20)
On the 4th conveying roller (21), the 3rd carriage (20) be provided with for drive the 4th conveying roller (21) rotate the 3rd electricity
Machine (22), rotates on the 3rd carriage (20) and is provided with active friction wheel (17), the active friction wheel (17) with it is described
Driven pulley (16) is corresponding, be provided with the 3rd carriage (20) for drive active friction wheel (17) to rotate the
Four motors (18), the color sensor (11) is arranged on the front end conveying mechanism top, first cylinder (14), second
Cylinder (15) and color sensor (11) are connected with control unit (10) signal.
2. silicon wafer turnover device according to claim 1, it is characterised in that：The outer peripheral face of second conveying roller (5) sets
There is cushion rubber layer (9).
3. silicon wafer turnover device according to claim 1, it is characterised in that：First conveying roller (2) is provided with first
Spacing ring (201), first spacing ring (201) is positioned near the side of rear end conveying mechanism.
4. silicon wafer turnover device according to claim 1, it is characterised in that：Second conveying roller (5) is provided with second
Spacing ring (501), second spacing ring (501) is positioned near the side of front end conveying mechanism.
5. silicon wafer turnover device according to claim 1, it is characterised in that：3rd conveying roller (12) is provided with the 3rd
Spacing ring (19), the 3rd spacing ring (19) is positioned near the side of rear end conveying mechanism.
6. silicon wafer turnover device according to claim 1, it is characterised in that：First carriage (1) exports positioned at it
End is provided with the baffle plate (8) for spacing silicon chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710166701.6A CN106847731B (en) | 2017-03-20 | 2017-03-20 | Silicon wafer overturning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710166701.6A CN106847731B (en) | 2017-03-20 | 2017-03-20 | Silicon wafer overturning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106847731A true CN106847731A (en) | 2017-06-13 |
| CN106847731B CN106847731B (en) | 2023-08-08 |
Family
ID=59130396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710166701.6A Active CN106847731B (en) | 2017-03-20 | 2017-03-20 | Silicon wafer overturning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106847731B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272102A (en) * | 2004-03-25 | 2005-10-06 | Maruyasu Kikai Kk | Roller type conveyer |
| CN205194661U (en) * | 2015-11-17 | 2016-04-27 | 深圳市捷佳伟创新能源装备股份有限公司 | Silicon chip positive and negative colour difference detection device |
| CN106169521A (en) * | 2016-08-25 | 2016-11-30 | 浙江绿远光伏科技有限公司 | What a kind of crystal silicon solar energy battery was processed removes phosphorosilicate glass machining production line |
| CN206574685U (en) * | 2017-03-20 | 2017-10-20 | 常州亿晶光电科技有限公司 | Silicon wafer turnover device |
-
2017
- 2017-03-20 CN CN201710166701.6A patent/CN106847731B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272102A (en) * | 2004-03-25 | 2005-10-06 | Maruyasu Kikai Kk | Roller type conveyer |
| CN205194661U (en) * | 2015-11-17 | 2016-04-27 | 深圳市捷佳伟创新能源装备股份有限公司 | Silicon chip positive and negative colour difference detection device |
| CN106169521A (en) * | 2016-08-25 | 2016-11-30 | 浙江绿远光伏科技有限公司 | What a kind of crystal silicon solar energy battery was processed removes phosphorosilicate glass machining production line |
| CN206574685U (en) * | 2017-03-20 | 2017-10-20 | 常州亿晶光电科技有限公司 | Silicon wafer turnover device |
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| Publication number | Publication date |
|---|---|
| CN106847731B (en) | 2023-08-08 |
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