CN106847731B - Silicon wafer overturning device - Google Patents
Silicon wafer overturning device Download PDFInfo
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- CN106847731B CN106847731B CN201710166701.6A CN201710166701A CN106847731B CN 106847731 B CN106847731 B CN 106847731B CN 201710166701 A CN201710166701 A CN 201710166701A CN 106847731 B CN106847731 B CN 106847731B
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- conveying
- conveying roller
- conveying mechanism
- roller
- silicon wafer
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 81
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 81
- 239000010703 silicon Substances 0.000 title claims abstract description 81
- 235000012431 wafers Nutrition 0.000 claims description 62
- 238000000926 separation method Methods 0.000 claims description 6
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000007306 turnover Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of silicon wafer production equipment, in particular to a silicon wafer overturning device which comprises a control unit, a color sensor, a front end conveying mechanism and a rear end conveying mechanism, wherein the front end conveying mechanism and the rear end conveying mechanism are mutually staggered along the silicon wafer conveying direction and are connected end to end.
Description
Technical Field
The invention relates to the technical field of silicon wafer production equipment, in particular to a silicon wafer overturning device.
Background
The printing of the solar cell mainly comprises three steps, namely, the printing of a back electrode, the printing of a back electric field and the printing of a front electrode after the turnover of a silicon wafer. In the third step, the silicon wafer needs to be turned over for printing, and the existing silicon wafer turning mechanism is complex in structure and inconvenient to maintain.
Disclosure of Invention
The invention aims to solve the technical problems that: in order to solve the problems that the existing silicon wafer turnover mechanism is complex in structure and inconvenient to maintain, a silicon wafer turnover device is provided.
The technical scheme adopted for solving the technical problems is as follows: the front end conveying mechanism and the rear end conveying mechanism are staggered with each other along the conveying direction of the silicon wafer and are connected end to end, the front end conveying mechanism comprises a first conveying frame and a first conveying roller which is rotatably arranged on the first conveying frame, a first motor for driving the first conveying roller to rotate is arranged on the first conveying frame, the central axis of the first conveying roller gradually inclines upwards with one end as a swinging center, the rear end conveying mechanism comprises a second conveying frame and a second conveying roller which is rotatably arranged on the second conveying frame, a second motor for driving the second conveying roller to rotate is arranged on the second conveying frame, the central axis of the second conveying roller gradually inclines upwards with one end as the swinging center, the first conveying roller and the second conveying roller are oppositely arranged, the first conveying roller and the second conveying roller gradually bulge towards the middle from two ends along the conveying direction of the silicon wafer, a push plate is hinged to one end, close to the second conveying frame, of the first conveying frame, a first air cylinder is arranged on the first conveying frame, the first air cylinder is rotatably connected with one end, far away from a hinge point, of the push plate, a third conveying roller is rotatably arranged on the push plate, a turning plate is hinged to the push plate, a second air cylinder for driving the turning plate to swing is arranged on the push plate, a driven friction wheel is arranged on the third conveying roller, a separation conveying mechanism is arranged at the output end of the front-end conveying mechanism, the separation conveying mechanism comprises a third conveying frame and a fourth conveying roller rotatably arranged on the third conveying frame, a third motor for driving the fourth conveying roller to rotate is arranged on the third conveying frame, a driving friction wheel is rotatably arranged on the third conveying frame, the driving friction wheel corresponds to the driven friction wheel, a fourth motor for driving the driving friction wheel to rotate is arranged on the third conveying frame, the color sensor is arranged above the front-end conveying mechanism, and the first cylinder, the second cylinder and the color sensor are all in signal connection with the control unit.
The invention detects the positive and negative chromatic aberration of the silicon chip through the color sensor, and control the first cylinder or the second cylinder by the controller, the silicon chip is transferred on the first conveying roller on the front conveying mechanism, the silicon chip rotates slowly towards the direction of the rear conveying mechanism along with the swing of the first conveying roller, when the silicon chip reaches the push plate, when the color of the silicon chip is detected to be in the range, the turnover plate pushes the silicon chip to the second conveying roller of the rear conveying mechanism, the silicon chip rotates slowly along with the conveying of the second conveying roller, finally, the silicon chip is horizontally output, the turnover work of the silicon chip is completed, when the color of the silicon chip is detected to be out of the range, the push plate rotates, and the driven friction wheel on the third conveying roller contacts with the driving friction wheel on the third conveying frame, so that the third conveying roller conveys the silicon chip to the fourth conveying roller on the third conveying frame and outputs the silicon chip.
In order to prevent collision between the silicon wafer and the second conveying roller, a buffer rubber layer is further arranged on the outer circumferential surface of the second conveying roller. Through setting up the cushion rubber layer on the second conveying roller for the silicon chip can be the cushioning effect of a specific point when with the second conveying roller contact, reduced the impact force of silicon chip and second conveying roller.
In order to prevent the silicon wafer from sliding off the first conveying roller, a first limiting ring is arranged on the first conveying roller, and the first limiting ring is positioned on one side close to the rear-end conveying mechanism. Through setting up first spacing ring in the one side that first conveying roller is close to front end conveying mechanism, first spacing ring is effectual blocks the silicon chip, prevents that the silicon chip from landing on first conveying roller.
In order to prevent the silicon wafer from sliding off the second conveying roller, a second limiting ring is arranged on the second conveying roller, and the second limiting ring is positioned on one side close to the front-end conveying mechanism. By arranging the second limiting ring on one side of the second conveying roller close to the front-end conveying mechanism, the second limiting ring effectively blocks the silicon wafer and prevents the silicon wafer from sliding off on the second conveying roller.
In order to prevent the silicon wafer from sliding on the third conveying roller, a third limiting ring is further arranged on the third conveying roller, and the third limiting ring is positioned on one side close to the rear-end conveying mechanism. Through setting up the third spacing ring in the one side that the third conveying roller is close to rear end conveying mechanism, the third spacing ring is effectual blocks the silicon chip, prevents that the silicon chip from sliding on the third conveying roller.
In order to prevent the silicon wafer from falling off at the output end of the first conveying frame, further, a baffle plate for limiting the silicon wafer is arranged at the output end of the first conveying frame. Through setting up the baffle at the output of first carriage, carry out spacingly to the silicon chip, effectually prevent that the silicon chip from dropping.
The beneficial effects of the invention are as follows: when the silicon wafer overturning device is used, the first conveying roller on the front-end conveying mechanism is arranged into a spiral mechanism along the silicon wafer conveying direction, the second conveying roller on the rear-end conveying mechanism is arranged into a spiral shape opposite to the first conveying roller along the silicon wafer conveying direction, the color difference of the silicon wafer is detected through the color sensor, when the color difference is within the detection range, the overturning plate conveys the silicon wafer on the first conveying roller to the second conveying roller, and when the color difference exceeds the detection range, the push plate overturns to convey the silicon wafer to the fourth conveying roller.
Drawings
The invention will be further described with reference to the drawings and examples.
FIG. 1 is a front view of a silicon wafer flipping device of the present invention;
FIG. 2 is a top view of the wafer flipping device of the present invention;
FIG. 3 is a front view of a first transport roller in the wafer flipping apparatus of the present invention;
FIG. 4 is a schematic cross-sectional view of a second transfer roll in the wafer flipping apparatus of the present invention.
In the figure: 1. the device comprises a first conveying frame, 2, a first conveying roller, 201, a first limiting ring, 3, a first motor, 4, a second conveying frame, 5, a second conveying roller, 501, a second limiting ring, 6, a second motor, 7, a push plate, 8, a baffle, 9, a buffer rubber layer, 10, a control unit, 11, a color sensor, 12, a third conveying roller, 13, a turning plate, 14, a first cylinder, 15, a second cylinder, 16, a driven friction wheel, 17, an active friction wheel, 18, a fourth motor, 19, a third limiting ring, 20, a third conveying frame, 21, a fourth conveying roller, 22 and a third motor.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the invention and therefore show only the structures which are relevant to the invention.
Examples
As shown in fig. 1, 2, 3 and 4, a silicon wafer turning device comprises a control unit 10, a color sensor 11, a front end conveying mechanism and a rear end conveying mechanism for conveying silicon wafers, wherein the front end conveying mechanism and the rear end conveying mechanism are staggered with each other along the conveying direction of the silicon wafers and are connected end to end, the front end conveying mechanism comprises a first conveying frame 1 and a first conveying roller 2 rotatably arranged on the first conveying frame 1, a first motor 3 for driving the first conveying roller 2 to rotate is arranged on the first conveying frame 1, the central axis of the first conveying roller 2 gradually inclines upwards by taking one end as a swinging center, the rear end conveying mechanism comprises a second conveying frame 4 and a second conveying roller 5 rotatably arranged on the second conveying frame 4, a second motor 6 for driving the second conveying roller 5 to rotate is arranged on the second conveying frame 4, the central axis of the second conveying roller 5 takes one end as a swing center and gradually inclines upwards, the first conveying roller 2 and the second conveying roller 5 are oppositely arranged, the first conveying roller 2 and the second conveying roller 5 gradually bulge towards the middle from two ends along the conveying direction of the silicon wafer, one end of the first conveying frame 1, which is close to the second conveying frame 4, is hinged with a push plate 7, a first cylinder 14 is arranged on the first conveying frame 1, the first cylinder 14 is rotationally connected with one end, which is far away from the hinge point, of the push plate 7, a third conveying roller 12 is rotationally arranged on the push plate 7, a turning plate 13 is hinged on the push plate 7, a second cylinder 15 for driving the turning plate 13 to swing is arranged on the push plate 7, a driven friction wheel 16 is arranged on the third conveying roller 12, the output end of the front conveying mechanism is provided with a separation conveying mechanism, the separation conveying mechanism comprises a third conveying frame 20 and a fourth conveying roller 21 rotatably arranged on the third conveying frame 20, a third motor 22 for driving the fourth conveying roller 21 to rotate is arranged on the third conveying frame 20, a driving friction wheel 17 is rotatably arranged on the third conveying frame 20, the driving friction wheel 17 corresponds to the driven friction wheel 16, a fourth motor 18 for driving the driving friction wheel 17 to rotate is arranged on the third conveying frame 20, the color sensor 11 is arranged above the front-end conveying mechanism, and the first cylinder 14, the second cylinder 15 and the color sensor 11 are all in signal connection with the control unit 10.
The outer peripheral surface of the second conveying roller 5 is provided with a buffer rubber layer 9.
The first conveying roller 2 is provided with a first limiting ring 201, and the first limiting ring 201 is positioned at one side close to the rear-end conveying mechanism.
The second conveying roller 5 is provided with a second limiting ring 501, and the second limiting ring 501 is positioned at one side close to the front-end conveying mechanism.
The third conveying roller 12 is provided with a third limiting ring 19, and the third limiting ring 19 is positioned at one side close to the rear-end conveying mechanism.
The output end of the first conveying frame 1 is provided with a baffle plate 8 for limiting silicon wafers.
When the silicon wafer overturning device is used, the first motor 3, the second motor 6, the third motor 22 and the fourth motor 18 are started, the first motor 3 drives the first conveying roller 2 on the first conveying frame 1 to rotate, the second motor 6 drives the second conveying roller 5 on the second conveying frame 4 to rotate, the third motor 22 drives the fourth conveying roller 21 to rotate, the fourth motor 18 drives the driving friction wheel 17 to rotate, firstly, the silicon wafer is placed at one end of the front-end conveying mechanism far away from the rear-end conveying mechanism and is input, because the central axis of the first conveying roller 2 gradually inclines upwards by taking one end as a swinging center, the first conveying roller 2 is spiral along the conveying direction of the silicon wafer, the silicon wafer slowly rotates along with the first conveying roller 2 and is detected by the color sensor 11, the color sensor 11 sends the detected signal to the control unit 10, when the color of the silicon wafer is within the range and reaches the push plate 7, the control unit 10 starts the first air cylinder 14, the first air cylinder 14 drives the turning plate 13 to rotate on the push plate 7 towards the rear end conveying mechanism, so that the silicon wafer turns over onto the second conveying roller 5 of the second conveying frame 4, as the central axis of the second conveying roller 5 takes one end as a swinging center and gradually inclines upwards, the first conveying roller 2 and the second conveying roller 5 are oppositely arranged, the first conveying roller 2 and the second conveying roller 5 gradually bulge towards the middle from two ends along the conveying direction of the silicon wafer, the second conveying roller 5 also takes a spiral shape along the conveying direction of the silicon wafer, the silicon wafer slowly rotates along with the second conveying roller 5 and returns to a horizontal state, and finally the silicon wafer is output by the second conveying roller 5, so that the turning work of the silicon wafer is completed; when the color detection of the silicon wafer exceeds the range, the control unit 10 controls the second air cylinder 15 to shrink, the third conveying frame 20 rotates on the first conveying frame 1 until the third conveying frame 20 is horizontal, at the moment, the passive friction wheel 16 on the third conveying roller 12 contacts with the active friction wheel 17 on the third conveying frame 20, so that the third conveying roller 12 rotates and drives the silicon wafer to be conveyed to the fourth conveying roller 21, and the silicon wafer is output through the third conveying frame 20; the first limiting ring 201 on the first conveying roller 2 limits the position of the silicon wafer on the first conveying roller 2, the silicon wafer is prevented from sliding down on the first conveying roller 2, the second limiting ring 501 on the second conveying roller 5 limits the position of the silicon wafer on the second conveying roller 5, the silicon wafer is prevented from sliding down on the second conveying roller 5, the third limiting ring 19 on the third conveying roller 12 limits the position of the silicon wafer on the third conveying roller 12, the silicon wafer is prevented from sliding down on the third conveying roller 12, meanwhile, the buffer rubber layer 9 is arranged on the second conveying roller 5, and when the silicon wafer is overturned onto the second conveying roller 5, the shock absorption and buffering effects are achieved, the impact force of the silicon wafer is reduced, and the baffle 8 effectively prevents the silicon wafer from falling down on the first conveying frame 1.
The above-described preferred embodiments according to the present invention are intended to suggest that, from the above description, various changes and modifications can be made by the worker in question without departing from the technical spirit of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (6)
1. A silicon chip turning device is characterized in that: including control unit (10), colour sensor (11) and be used for carrying front end conveying mechanism and rear end conveying mechanism of silicon chip, front end conveying mechanism and rear end conveying mechanism stagger each other along the silicon chip direction of delivery and set up and end to end, front end conveying mechanism includes first carriage (1) and rotates first conveying roller (2) of establishing on first carriage (1), be equipped with on first carriage (1) and be used for driving first conveying roller (2) pivoted first motor (3), the central axis of first conveying roller (2) is with one end as swing center progressively upwards slope, rear end conveying mechanism includes second carriage (4) and rotates second conveying roller (5) of establishing on second carriage (4), be equipped with on second carriage (4) and be used for driving second conveying roller (5) pivoted second motor (6), the central axis of second conveying roller (5) is with one end as swing center and progressively upwards slope, first conveying roller (2) and second conveying roller (5) are provided with one end and swing center gradually upwards slope, first carriage (2) are provided with first cylinder (4) and second conveying roller (5) are close to one end (1) by first cylinder (1), the color sensor is characterized in that the first air cylinder (14) is rotationally connected with one end of the push plate (7) away from a hinge point, a third conveying roller (12) is rotationally arranged on the push plate (7), a turning plate (13) is hinged on the push plate (7), a second air cylinder (15) for driving the turning plate (13) to swing is arranged on the push plate (7), a driven friction wheel (16) is arranged on the third conveying roller (12), a separation conveying mechanism is arranged at the output end of the front end conveying mechanism, the separation conveying mechanism comprises a third conveying frame (20) and a fourth conveying roller (21) rotationally arranged on the third conveying frame (20), a third motor (22) for driving the fourth conveying roller (21) to rotate is arranged on the third conveying frame (20), a driving friction wheel (17) is rotationally arranged on the third conveying frame (20), the driving friction wheel (17) corresponds to the driven friction wheel (16), a fourth sensor (18) for driving the driving friction wheel (17) to rotate is arranged on the third conveying frame (20), and the color sensor (11), the color sensor is arranged on the first air cylinder (11) and the color sensor is connected with the first air cylinder (11).
2. The wafer flipping device according to claim 1, wherein: the outer peripheral surface of the second conveying roller (5) is provided with a buffer rubber layer (9).
3. The wafer flipping device according to claim 1, wherein: the first conveying roller (2) is provided with a first limiting ring (201), and the first limiting ring (201) is positioned at one side close to the rear-end conveying mechanism.
4. The wafer flipping device according to claim 1, wherein: and a second limiting ring (501) is arranged on the second conveying roller (5), and the second limiting ring (501) is positioned at one side close to the front-end conveying mechanism.
5. The wafer flipping device according to claim 1, wherein: and a third limiting ring (19) is arranged on the third conveying roller (12), and the third limiting ring (19) is positioned at one side close to the rear-end conveying mechanism.
6. The wafer flipping device according to claim 1, wherein: the first conveying frame (1) is positioned at the output end of the first conveying frame and is provided with a baffle (8) for limiting silicon wafers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710166701.6A CN106847731B (en) | 2017-03-20 | 2017-03-20 | Silicon wafer overturning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710166701.6A CN106847731B (en) | 2017-03-20 | 2017-03-20 | Silicon wafer overturning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106847731A CN106847731A (en) | 2017-06-13 |
| CN106847731B true CN106847731B (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710166701.6A Active CN106847731B (en) | 2017-03-20 | 2017-03-20 | Silicon wafer overturning device |
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| Country | Link |
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| CN (1) | CN106847731B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272102A (en) * | 2004-03-25 | 2005-10-06 | Maruyasu Kikai Kk | Roller type conveyer |
| CN205194661U (en) * | 2015-11-17 | 2016-04-27 | 深圳市捷佳伟创新能源装备股份有限公司 | Silicon chip positive and negative colour difference detection device |
| CN106169521A (en) * | 2016-08-25 | 2016-11-30 | 浙江绿远光伏科技有限公司 | What a kind of crystal silicon solar energy battery was processed removes phosphorosilicate glass machining production line |
| CN206574685U (en) * | 2017-03-20 | 2017-10-20 | 常州亿晶光电科技有限公司 | Silicon wafer turnover device |
-
2017
- 2017-03-20 CN CN201710166701.6A patent/CN106847731B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272102A (en) * | 2004-03-25 | 2005-10-06 | Maruyasu Kikai Kk | Roller type conveyer |
| CN205194661U (en) * | 2015-11-17 | 2016-04-27 | 深圳市捷佳伟创新能源装备股份有限公司 | Silicon chip positive and negative colour difference detection device |
| CN106169521A (en) * | 2016-08-25 | 2016-11-30 | 浙江绿远光伏科技有限公司 | What a kind of crystal silicon solar energy battery was processed removes phosphorosilicate glass machining production line |
| CN206574685U (en) * | 2017-03-20 | 2017-10-20 | 常州亿晶光电科技有限公司 | Silicon wafer turnover device |
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| CN106847731A (en) | 2017-06-13 |
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