CN1068456C - Crystal wafer fixing device and method - Google Patents
Crystal wafer fixing device and method Download PDFInfo
- Publication number
- CN1068456C CN1068456C CN97121343A CN97121343A CN1068456C CN 1068456 C CN1068456 C CN 1068456C CN 97121343 A CN97121343 A CN 97121343A CN 97121343 A CN97121343 A CN 97121343A CN 1068456 C CN1068456 C CN 1068456C
- Authority
- CN
- China
- Prior art keywords
- wafer
- groove
- vacuum
- pedestal
- several
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention discloses a wafer fixing device which is used for fixing a flat plate to a wafer with a hollow point. The device of the present invention comprises a base used for placing the wafer, a groove which is arranged on the base and is provided with an opening, and an air extractor, wherein when the wafer is placed on the base, the hollow point is corresponding to the groove; when the wafer is placed on the base, the air extractor is used for extracting the air in the groove through the opening, and therefore, the flat plate which is overlapped on the wafer is fixed to the wafer by vacuum suction force.
Description
The invention belongs to a kind of fixture and method of wafer, refer to a kind of fixedly device and method of wafer of pull of vacuum that utilizes especially.
In semi-conductive manufacturing process, often the relative position of two plates need be fixed, to carry out follow-up processing procedure, as a bonding wafer of desire and a flat board, its step is coated with sticker for (1) in regular turn on wafer, (2) flat board is placed on the wafer, (3) fixed flat planar and wafer, (4) wafer that transmits through fixing heats with flat board to heating plate pressing, (5) remove fixture, when manufacture of semiconductor has marched toward the deep-sub-micrometer epoch, the requirement of integrated level increases day by day, element and interelement distance are also dwindled gradually, it is very important that this fixing step just becomes, when flat board places on the wafer with the mode of accurate contraposition, if because of accidentally fixing, the situation of displacement takes place in transport process, and then this element just can't use, and reduces the qualification rate of production line.
Known fixing means is to utilize clamping and pressing device to fix, and sees also Fig. 1, and it is that oneself knows the fixedly schematic diagram of wafer method, and oneself is placed on its middle plateform 2 on the wafer 1, use a clamping and pressing device 3 fix this dull and stereotyped 2 with the relative position of wafer 1.This clamping and pressing device 3 comprises base 31, clamping part 32, pneumatic cylinder 33 and air supply pipe 34, the air capacity of utilizing 34 controls of air supply pipe to enter pneumatic cylinder 33, and the clamping part 32 above making is toward pressing down, to fix this flat board 2 and wafer 1.This kind device still can utilize amount of supplied air to control the pressure that clamping part 32 is bestowed flat board 2 and wafer 1, imposes suitable chucking power with the wafer at varying strength; Especially bad, fix with very easy anchor clamps, ignored the control of chucking power size, this type of grip device is improper because of the anchor clamps spin easily, causes the intervention of non-positive force, and make dull and stereotyped 2 with wafer 1 between produce and be shifted, or both sides anchor clamps application of force inequality, cause inclination, equally properly fixed flat planar 2 and wafer 1, therefore the step of accurate contraposition before also falls short of success for lack of final effort.So, fix wafer and can't satisfy the required requirement of fixing step with pressing mode.
Main purpose of the present invention is to overcome the deficiency of prior art, and a kind of fixture of wafer is provided, to improve wafer easily produces displacement fixedly time the defective; Its fixing means is provided simultaneously.
The 3rd purpose of the present invention promptly is to provide a kind of method of bonding ink gun spray nozzle sheet, properly fixedly spray nozzle sheet to carry out down-stream.
Main purpose of the present invention is achieved in that a kind of fixture of wafer, and in order to fix a flat board on a wafer, this wafer has several hollow out places, is characterized in, this device system comprises: a pedestal, and it is in order to place this wafer; Be provided with at least one groove on this pedestal, and each groove has a separate openings, be opened in pedestal one side, when this wafer placed on this pedestal, described hollow out place was corresponding to described groove; And an air-extractor, be connected with the opening of described groove.
According to above-mentioned conception, this groove can be arbitrary shape in the fixture of wafer, and as the microscler groove or the ring-shaped groove of bending: the groove in the fixture of wafer is after bleeding, and the preferable system of its pressure is than the low 50～200mmHg of surrounding environment.
According to above-mentioned conception, this device also comprises a bidirectional valve in the fixture of wafer, is connected between this air-extractor and this opening, and when desire formed this pull of vacuum, this bidirectional valve system is communicated with this opening and this takes out device equipment, so gas system extracts out in this groove; When desiring to remove this pull of vacuum, this bidirectional valve system is communicated with this opening and surrounding environment, so gas system is back in this groove from surrounding environment, to remove the program of vacuum.
According to above-mentioned conception, but this groove also comprises another make and break mouth in the fixture of wafer, when desire forms pull of vacuum, but should make and break mouth system be in a closed condition, so gas system extracts via air-extractor in this groove out; When desiring to remove this pull of vacuum, but should make and break mouth system be in an opening, but so gas system be back in this groove via the make and break mouth from surrounding environment, to remove the program of vacuum.
According to another object of the present invention, it is envisaged in the fixing means that a kind of wafer is provided, and in order to fix a flat board on a wafer, this wafer has several hollow out places, its step system comprises: place one to have on the pedestal of several grooves this wafer, make described hollow out place corresponding to described groove; Should be positioned on this wafer by the flat board aligning; And extract gas in this groove out, this flat board mat one pull of vacuum is fixed on this wafer.
According to above-mentioned conception, behind the gas of this method in extracting this groove out, also comprise a step in the fixing means of wafer: remove vacuum and make gas backstreaming to described groove, to remove the pull of vacuum between flat board and wafer.
According to above-mentioned conception, groove described in the fixing means of wafer is after bleeding, and its pressure system is than the low 50～200mmHg of surrounding environment.
According to above-mentioned conception, this pedestal also comprises several grooves in the fixing means of wafer, and each groove all has a separate openings, therefore each groove can independently be bled, in response to the difference of dull and stereotyped intensity, these several grooves have different vacuum degree in different groove cordings after bleeding.
According to the 3rd purpose of the present invention, it is envisaged in the method that a kind of bonding ink gun spray nozzle sheet is provided, this ink gun comprises one in order to spray the spray nozzle sheet of ink, and in order to control several wafers that this ink penetrates, tool one hollow out place on described each wafer, in order to the splendid attire ink, its step system comprises: this wafer is placed on the pedestal of a tool one groove, make this hollow out place corresponding to this groove; Coating one adhesion coating on this wafer; This spray nozzle sheet aligning is positioned on the wafer; Extract the gas in the groove out, spray nozzle sheet mat one pull of vacuum is fixed on the wafer; The heating adhesion coating makes bonding spray nozzle sheet of adhesion coating and wafer; And remove vacuum and make gas backstreaming to groove, to remove the pull of vacuum between spray nozzle sheet and wafer.
The present invention is owing to offer ostiolate groove being provided with on the pedestal of wafer, make the hollow out place respective grooves opening of wafer, be provided with one simultaneously and bleed and establish each and be connected, the dull and stereotyped Drawing upon pull of vacuum that coincides on wafer is firmly fixed on the wafer with groove opening.
This method of utilizing suction to reach fixed effect, compare with the known clamp pressure that utilizes, effect with excellent improvement displacement, as long as will be positioned on the pedestal after flat board and the accurate contraposition of wafer, after treating that vacuum degree in the groove reaches requirement, flat board closely is fixed on the wafer, does not have the intervention of non-positive force in the known technology and produce a shearing on flat board.Small deformation utilizes groove pull of vacuum can be evenly distributed on the flat board in addition, only do not cause stress in the known technology, even therefore can not take place yet at bite and do not resemble.
This technology may be used in many semiconductor production, as in the production of ink gun, being used for the spray nozzle sheet of bonding ink gun, same use the vacuum principle of bleeding make dull and stereotyped be bonded on the wafer that scribbles sticker stably after, heating, bonding can be improved the quality of products and operating efficiency greatly.
Below in conjunction with accompanying drawing the present invention is described in further detail:
Fig. 1 is the schematic diagram of known fixed wafer method;
Fig. 2 is the fixedly wafer device schematic diagram of preferred embodiment 1 of the present invention;
Fig. 3 is the fixedly wafer device vertical view of preferred embodiment 2 of the present invention;
Fig. 4 is the structural representation of ink gun in the preferred embodiment 3 of the present invention;
Fig. 5 is for being applied to fixture in the schematic diagram of Fig. 4 structure.
See also Fig. 2, it is the fixedly wafer device schematic diagram of preferred embodiment 1 of the present invention, with flat board 2 and wafer 1 superimposed being positioned on the pedestal 4, several hollow out places 111 are arranged on this wafer 1, these hollow out places are just corresponding to microscler groove 41 crooked on the pedestal 4, the opening 411 of this microscler groove 41 is connected to an air-extractor 5, and this air-extractor 5 can be traditional vacuum pump, as Clothoid type pump (rotary pump).Simultaneously, can add a bidirectional valve 6 in 411 of the openings of air-extractor 5 and groove 41, but or groove 41 has another make and break mouth 412, but this bidirectional valve 6 or make and break mouth 412 are will form or remove pull of vacuum with deciding.To use bidirectional valve 6 to be example, when desiring fixed flat planar 2 with wafer 1, then bidirectional valve 6 is open communication 411 and air-extractor 5, therefore air-extractor 5 can be extracted the air in the groove 41 out, cause vacuum, pressure in the groove 41 should be less than the about 50～20mmHg of the pressure of surrounding environment, the hollow out place 111 that the formation of this vacuum can see through wafer 1 produces suction to the flat board on it, external and internal pressure difference represents that greatly promptly pull of vacuum is big, on the contrary, the little pull of vacuum of promptly representing of external and internal pressure difference is little, therefore our speed of exhaust that can decide air-extractor 5 according to dull and stereotyped 2 intensity or other factors, different suction requires and can decide by changing the speed of exhaust easily, but must be noted that, the flat board 2 of part cannot be a hollow out directly over the hollow out place 111, otherwise the merit of just wasting air-extractor 5, and can't reach the effect of fixed flat planar 5 and wafer 1; After other subsequent steps finish, just to remove and hold dull and stereotyped 2 pull of vacuum, make bidirectional valve 6 into open communication 411 and surrounding environment this moment, and then ambient air begins to pass back into groove 41, so pull of vacuum is also more and more little, until disappearance.But to use make and break mouth 412 to be example, when desire forms pull of vacuum, but make and break mouth 412 is to be in closed condition, air-extractor 5 could extract the air in the groove 41, keep the vacuum state in the groove 41, when desiring to remove pull of vacuum, but make and break mouth 412 is to be in opening, allow the air of surrounding environment return in the indwelling groove 41, finish removing vacuum.
Certainly, do not need each hollow out place all to correspond to groove 41, can have some hollow out places to be close to pedestal 4, so do not influence the formation of pull of vacuum.
See also Fig. 3, it is the fixedly wafer device vertical view of another preferred embodiment 2 of this case, wherein pedestal 4 also can comprise several grooves that do not communicate 41, each groove 41 has opening 411 independently and corresponds to separately valve 6 and air-extractor 5, insufficient strength when dull and stereotyped 2 is even, some position is fragile, and some position is more tough, just can adjust the vacuum degree of each groove 41 according to dull and stereotyped 2 position intensity, different grooves has different vacuum degree, represent that promptly different grooves can cause different suction, so can adjust the extremely appropriate value of pull of vacuum that everybody puts, can be because of pull of vacuum cause dull and stereotyped 2 not break too by force, be not directed at a little less than too fixing not good because of pull of vacuum yet.In addition, the visual demand of the shape of groove and changing all is applicable to manufacture of semiconductor as the ring-shaped groove of present embodiment and the microscler groove of the foregoing description.
This technique for fixing can be applied on many manufacture of semiconductor, making as ink gun, see also Fig. 4, it is the structural representation of ink gun in the preferred embodiment 3 of the present invention, wherein the main body of ink gun is a wafer 1, wherein include circuit, be used for accepting the control of software to carry out the ink-jet action, there is a hollow out place 111 centre in order to all inks 113 of splendid attire, and 111 have many ink containers 112 on every side at the hollow out place, can communicate with hollow out place 111, make that ink 113 is flowed into, covering one contains the spray nozzle sheet 21 of many jet orifice 211 on ink container 112, and each ink container 112 is all corresponding to a jet orifice 211, as the outlet of penetrating ink 113.
See also Fig. 5, it is the schematic diagram that fixture is applied to Fig. 4 structure, the flat board 2 that desire will contain dozens of spray nozzle sheet 21 is bonded on the wafer 1 that contains dozens of wafer 11, earlier wafer 1 is positioned on the pedestal 4, with some hollow out place 111 alignment grooves on it (not indicating among the figure), on wafer 1, be coated with one deck sticker then, the mode side of the accurate contraposition of dull and stereotyped 2 usefulness is put on wafer 1, the vacuum that running air-extractor 5 forms in the groove, produce pull of vacuum to dull and stereotyped 2, then dull and stereotyped 2 be fixed on stably on the wafer 1, can be sent to the parallel-plate pressurization of heating with wafer 1 with dull and stereotyped 2 with that, with bonding dull and stereotyped 2 with wafer 1, after flat board 2 has been bonded on the wafer 1, promptly can rotate bidirectional valve 6 and make the air circulation groove of environment, promptly finish adhesion step.
In sum, present device is simple, method is easy, is applicable to many manufacture of semiconductor, and fruitful to improving the displacement disadvantage simultaneously, is in fact one to have the work of industrial value.
Claims (9)
1. the fixture of a wafer, in order to fix a flat board on a wafer, this wafer has several hollow out places, it is characterized in that, and this device system comprises:
One pedestal, it is in order to place this wafer:
Be provided with at least one groove on this pedestal, and each groove has a separate openings, be opened in pedestal one side, when this wafer placed on this pedestal, described hollow out place was corresponding to described groove; And
One air-extractor is connected with the opening of described groove.
2. the fixture of wafer as claimed in claim 1 is characterized in that, described groove is the microscler groove or a ring-shaped groove of a bending, and groove is after bleeding, and its pressure is than the low 50～200mmHg of surrounding environment.
3. the fixture of wafer as claimed in claim 1 is characterized in that, also comprises a bidirectional valve, and it is connected between the opening of described air-extractor and described base slot.
4. the fixture of wafer as claimed in claim 1 is characterized in that, but described groove has another make and break mouth.
5. the fixing means of a wafer, in order to fix a flat board on a wafer, this wafer has several hollow out places, it is characterized in that, and its step system comprises:
Place one to have on the pedestal of several grooves this wafer, make described hollow out place corresponding to described groove;
Should be positioned on this wafer by the flat board aligning; And
Extract the gas in the described groove out, this flat board mat one pull of vacuum is fixed on this wafer.
6. the fixing means of wafer according to claim 5 is characterized in that, behind the gas in extracting described groove out, also comprises a step: remove vacuum and make gas backstreaming to described groove, to remove the pull of vacuum between described flat board and described wafer.
7. the fixing means of wafer according to claim 5 is characterized in that, described groove is after bleeding, and its pressure system is than the low 50～200mmHg of surrounding environment.
8. the fixing means of wafer according to claim 5 is characterized in that, described pedestal also comprises several grooves, and each groove all has a separate openings, and these several grooves have different vacuum degree in different groove cordings after bleeding.
9. the method for a bonding ink gun spray nozzle sheet, this ink gun comprise one in order to spraying the spray nozzle sheet of ink, and in order to control several wafers that this ink penetrates, tool one hollow out place on described each wafer, in order to the splendid attire ink, it is characterized in that its step system comprises:
Place one to have on the pedestal of several grooves described several wafers, make described hollow out place corresponding to described groove;
Coating one adhesion coating on described wafer;
Described several spray nozzle sheets alignings are positioned on described several wafers;
Extract the gas in several grooves out, this spray nozzle sheet mat one pull of vacuum is fixed on this wafer;
Heat this adhesion coating, make bonding this spray nozzle sheet of this adhesion coating and this wafer; And
Remove vacuum and make gas backstreaming to this groove, to remove the pull of vacuum between this spray nozzle sheet and this wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97121343A CN1068456C (en) | 1997-10-21 | 1997-10-21 | Crystal wafer fixing device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN97121343A CN1068456C (en) | 1997-10-21 | 1997-10-21 | Crystal wafer fixing device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1215226A CN1215226A (en) | 1999-04-28 |
| CN1068456C true CN1068456C (en) | 2001-07-11 |
Family
ID=5176251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97121343A Expired - Fee Related CN1068456C (en) | 1997-10-21 | 1997-10-21 | Crystal wafer fixing device and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1068456C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100397564C (en) * | 2005-08-26 | 2008-06-25 | 南茂科技股份有限公司 | Wafer laser marker method and its wafer |
| CN105092904B (en) * | 2014-05-04 | 2018-04-10 | 无锡华润上华科技有限公司 | MEMS fixing device for silicon piece, fixing means and method of testing |
| CN106112170B (en) * | 2016-08-17 | 2018-09-14 | 京信通信系统（中国）有限公司 | PCB components welder and welding system |
| CN112394202B (en) * | 2020-10-29 | 2023-06-27 | 珠海天成先进半导体科技有限公司 | Interconnection test fixture and interconnection test method for silicon adapter plate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4600936A (en) * | 1983-07-12 | 1986-07-15 | International Business Machines Corporation | Chip registration mechanism |
-
1997
- 1997-10-21 CN CN97121343A patent/CN1068456C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4600936A (en) * | 1983-07-12 | 1986-07-15 | International Business Machines Corporation | Chip registration mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1215226A (en) | 1999-04-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1068456C (en) | Crystal wafer fixing device and method | |
| US5226578A (en) | Method of manufacturing an article, a method of diffusion bonding and a vacuum chamber | |
| CN101118843A (en) | Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods | |
| US4304350A (en) | Method of pressurization system for superplastic forming and diffusion bonding | |
| US6675621B2 (en) | Plural sheet superplastic forming equipment and process | |
| US6051067A (en) | Wafer securing device and method | |
| US20030196466A1 (en) | Mid plate process and equipment for the superplastic forming of parts from plural sheets | |
| JPH02133125A (en) | Method and device for transferring comparatively flat body | |
| EP3825098B1 (en) | Optimized lamination device and optimized laminating method | |
| US7653978B2 (en) | Method for providing stop-off on a workpiece | |
| CN2918044Y (en) | Polyamine ester synchronization driving belt hot pressing fusion jointing press | |
| US5457884A (en) | Method of manufacturing an article by superplastic forming and diffusion bonding | |
| KR900016726A (en) | Thermoplastic Panel Heat Exchanger and Manufacturing Method Thereof | |
| US20200148491A1 (en) | Systems and Methods of Automated Film Removal | |
| US5273202A (en) | Method of manufacturing an article, a method of diffusion bonding and a vacuum chamber | |
| WO2008135220A1 (en) | Surface gripper unit | |
| US7105056B2 (en) | Pneumatic handling and recoating apparatus and method of use | |
| CN114551968A (en) | Battery cell module glue fixing system and method | |
| CN211306338U (en) | PCB abnormal shape multi-clamping jaw machine | |
| US6444082B1 (en) | Apparatus and method for removing a bonded lid from a substrate | |
| KR100345204B1 (en) | Apparatus for inserting rivets | |
| KR950013690A (en) | Thermal transfer device and its method of coating film material | |
| DE102019001705B4 (en) | Thermoforming machine and method for producing decorated molded parts | |
| CN218742685U (en) | Special-shaped aluminum alloy plate flexible clamp for spraying | |
| US20040187298A1 (en) | System for handling microelectronic dies having a non-piercing die ejector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |