CN106835078A - A kind of structure of trap Ag/TiO2The preparation method of/Au coatings - Google Patents

A kind of structure of trap Ag/TiO2The preparation method of/Au coatings Download PDF

Info

Publication number
CN106835078A
CN106835078A CN201710042284.4A CN201710042284A CN106835078A CN 106835078 A CN106835078 A CN 106835078A CN 201710042284 A CN201710042284 A CN 201710042284A CN 106835078 A CN106835078 A CN 106835078A
Authority
CN
China
Prior art keywords
trap
silver
coatings
tio
tbt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710042284.4A
Other languages
Chinese (zh)
Other versions
CN106835078B (en
Inventor
马建中
吴朵朵
鲍艳
崔万照
胡天存
杨晶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shaanxi University of Science and Technology
Xian Institute of Space Radio Technology
Original Assignee
Shaanxi University of Science and Technology
Xian Institute of Space Radio Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shaanxi University of Science and Technology, Xian Institute of Space Radio Technology filed Critical Shaanxi University of Science and Technology
Priority to CN201710042284.4A priority Critical patent/CN106835078B/en
Publication of CN106835078A publication Critical patent/CN106835078A/en
Application granted granted Critical
Publication of CN106835078B publication Critical patent/CN106835078B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/04Pretreatment of the material to be coated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208Oxides, e.g. ceramics
    • C23C18/1216Metal oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1229Composition of the substrate
    • C23C18/1241Metallic substrates
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125Process of deposition of the inorganic material
    • C23C18/1254Sol or sol-gel processing
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1633Process of electroless plating
    • C23C18/1646Characteristics of the product obtained
    • C23C18/165Multilayered product
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

The invention discloses a kind of structure of trap Ag/TiO2The preparation method of/Au coatings, silver-plated aluminum alloy surface is processed using two step wet-chemical chamber methods, silver-plated aluminum alloy surface is formed structure of trap;Then TiO is prepared using class electroless plating method on structure of trap surface2Film transition layer, to reach TiO2Profile-followed deposition of the film on structure of trap surface;Finally using electroless plating method in TiO2Surface deposits Au films with the shape, so as to form a kind of structure of trap Ag/TiO in silver-plated aluminum alloy surface2/ Au coatings, improve the secondary electron rejection characteristic and its environmental stability of silver-plated aluminum alloy surface.

Description

A kind of structure of trap Ag/TiO2The preparation method of/Au coatings
Technical field
The present invention relates to a kind of structure of trap Ag/TiO2The preparation method of/Au coatings, more particularly in silver-plated aluminium alloy table Structure of trap Ag/TiO is constructed in face2/ Au coatings, improve the secondary electron rejection characteristic and its ambient stable of silver-plated aluminum alloy surface Property.
Background technology
The base material that silver-plated aluminium alloy is commonly used as microwave component in current Satellite Payloads system, with device can be reduced The advantage of part loss, but in actual use, silver-plated part is susceptible to two under great-power electromagnetic ripple transmission conditions Secondary electron multiplication is to produce Multipactor, causes HIGH-POWERED MICROWAVES component failure.Suppress the method master of Multipactor at present Parts surface is included in construct coating and construct structure of trap etc. in parts surface.
Research shows that being prepared in silver-plated aluminum alloy surface has the coating material of low secondary electron yield (SEY), such as Titanium nitride (TiN), graphitized carbon etc., can effectively suppress Multipactor, but such coating material self-conductive is poor, makes microwave Part is big in high frequency condition lower surface impedance.
Document " Controllable fabrication of one-dimensional ZnO nanoarrays and their application in constructing silver trap structures.RSC Advances.2014,4, 33198-33205. " one kind is disclosed with ZnO arrays as template, is prepared in silver-plated aluminum alloy surface by electrochemical deposition method Structure of trap silver, it is possible to decrease SEY to less than 1.6, but the method technical process is relatively complicated.
Document " Investigation into anomalous total secondary electron yield for micro-porous Ag surface under oblique incidence conditions.Journal of Applied Physics.2013,114:1-9. " discloses the method for constructing structure of trap silver a kind of easy to operate and low cost, it is possible to decrease The SEY of silver-plated aluminium alloy to less than 1.2, but the method there are certain requirements to the grain boundary structure of initial silver-plated aluminium alloy.Additionally, falling into The environmental stability of well structure silver is typically poor.
The content of the invention
The purpose of the present invention is to overcome the deficiencies in the prior art, there is provided a kind of structure of trap Ag/TiO2The preparation of/Au coatings Method, the method is simple, and grain boundary structure to initial silver-plated aluminium alloy is not required, while can both reduce silver coated aluminum conjunction The SEY of gold, can improve its environmental stability again.
To realize above-mentioned target, the technical solution adopted by the present invention is:
A kind of structure of trap Ag/TiO2The preparation method of/Au coatings, comprises the following steps:
(1) using Fe (NO3)3The aqueous solution is performed etching to silver-plated aluminium alloy, and etching temperature is 45-55 DEG C, and etch period is 35-45s, dries after cleaning;
Repeat step (1), structure of trap is formed in silver-plated aluminum alloy surface;
(2) the silver-plated aluminium alloy that surface forms structure of trap be impregnated in into 10-30min in TBT solution, is then transferred to 10-20min is reacted in ionized water, is finally calcined;
(3) the silver-plated aluminium alloy after step (2) is calcined is placed in gold plating liquid and reacts 0.5-2h at 25-35 DEG C, cleans After dry, obtain structure of trap Ag/TiO2/ Au coatings.
The present invention is further improved, the Fe (NO3)3The mass fraction of the aqueous solution is 20%-40%.
Further improvement of the invention is that the TBT solution is by obtained in procedure below:By TBT, glacial acetic acid and Ethanol is well mixed, and obtains TBT solution, wherein, the mass fraction of TBT is 3%-7%, the quality point of glacial acetic acid in TBT solution Number is 4%-6%.
Further improvement of the invention is that the temperature of the calcining is 100-400 DEG C, and the time is 1h.
Further improvement of the invention is that the gold plating liquid is prepared by procedure below:By HAuCl4, glucose, nothing Aqueous sodium carbonate is added to the water, and is well mixed, and obtains the gold plating liquid that pH value is 10.5-11.5;Wherein, HAuCl4Concentration be 2- 6mmol/L, the concentration of glucose is 4-12mmol/L.
Further improvement of the invention is that the dry temperature in step (1), step (2) and step (3) is 50-70 DEG C, the time is 30min.
Compared with the prior art, the invention has the advantages that:
1. the present invention prepares structure of trap silver, to initial by repeating etch step using two step wet-chemical chamber methods The grain boundary structure of silver-plated aluminium alloy do not require, and two step wet-chemical chambers prepare structure of trap silver technology stability it is good.Adopt TiO is prepared with class electroless plating method2Film transition layer, it is easy to operate, it is possible to achieve TiO2The profile-followed deposition of film, does not destroy original Structure of trap.Using chemically plating for Au films as environmental stability coating, technical process is easy.
2. the present invention constructs structure of trap reduction SEY by silver-plated aluminum alloy surface, and profile-followed deposition Au coatings improve ring Border stability, introduces TiO between the two2Transition zone prevents the formation of electrum, it is to avoid electrical property declines.
3. the structure of trap Ag/TiO for being prepared using the present invention2/Au coatings can make the SEY of silver-plated aluminium alloy be reduced to 1.2 with Under, the secondary electron rejection characteristic of silver-plated aluminum alloy surface is improved, and environmental stability is good.
Further, Fe (NO in the present invention3)3The mass fraction of the aqueous solution is 20%-40%, if concentration is too low, it is impossible to Structure of trap is formed, if excessive concentration, overetch can be caused.
Further, the glacial acetic acid in TBT solution plays a part of complexing agent, and ethanol plays scattered work as solvent With.
Further, the temperature of calcining uses 100-400 DEG C, because different calcining heats can form different crystal forms Titanium dioxide, and calcining heat is too high, silver-plated aluminium alloy can deform, in order to obtain anatase crystal and not shadow in the present invention The shape of the silver-plated aluminium alloy of sound, so using 100-400 DEG C.
Brief description of the drawings
Fig. 1 is the SEM photograph of silver-plated aluminium alloy after two step wet-chemical chambers, wherein, figure (a) multiplication factor is 10k, figure B () multiplication factor is 20k.
Fig. 2 is class chemically plating for TiO2SEM photograph after film, wherein, figure (a) multiplication factor is 10k, and figure (b) is put Big multiple is 30k.
Fig. 3 be chemically plating for the SEM photograph after Au films, wherein, figure (a) multiplication factor be 5k, scheme (b) multiplication factor It is 30k.
Fig. 4 is that the SEY characteristics of the 4 silver-plated aluminum alloy samples prepared by the step wet-chemical chamber technique of identical two are bent Line.
Fig. 5 is structure of trap Ag/TiO2After/Au coatings are placed 6 months, the SEY after its surface takes 3 point tests at random Characteristic curve.
Specific embodiment
With reference to specific embodiment and accompanying drawing, the present invention will be described in detail.
Embodiment 1
(1) it is 20mm long, 12mm wide, 1mm high to size to use 50mL detergent, deionized water, acetone and ethanol successively Silver-plated aluminium alloy be cleaned by ultrasonic, each 15min.
(2) use 12g mass fractions for 20% Fe (NO3)3Silver-plated aluminium alloy after the aqueous solution is cleaned to step (1) enters Row etching, etching temperature is 45 DEG C, and etch period is 35s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 50 DEG C of baking ovens.
(3) use 12g mass fractions for 20% Fe (NO3)3The aqueous solution enters to the dried silver-plated aluminium alloy of step (2) Row etching, etching temperature is 45 DEG C, and etch period is 35s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 50 DEG C of baking ovens, and structure of trap is formed in silver-plated aluminum alloy surface.
(4) the dried silver-plated aluminium alloy of step (3) be impregnated in into 10min in 10g TBT solution, is then transferred to 50mL 10min is reacted in deionized water, finally in Muffle furnace in calcining 1h at 100 DEG C.Wherein, TBT solution passes through procedure below system :TBT, glacial acetic acid and ethanol are well mixed, TBT solution is obtained, wherein, the mass fraction of TBT is 3%, ice in TBT solution The mass fraction of acetic acid is 4%.
(5) the silver-plated aluminium alloy after step (4) is calcined is placed in 25mL gold plating liquids and reacts 0.5h at 25 DEG C, then adopts Silver-plated aluminium alloy is cleaned with deionized water and is cleaned by ultrasonic 15min, finally dry 30min in 50 DEG C of baking ovens, obtain trap knot Structure Ag/TiO2/ Au coatings.Wherein, gold plating liquid is prepared by procedure below:By HAuCl4, glucose, natrium carbonicum calcinatum be added to In water, it is well mixed, obtains the gold plating liquid that pH value is 10.5;Wherein, HAuCl4Concentration be 2mmol/L, the concentration of glucose It is 4mmol/L.
Embodiment 2
(1) successively using 50mL detergent, deionized water, acetone and ethanol to the 20mm long, 12mm wide, 1mm high of size Silver-plated aluminium alloy be cleaned by ultrasonic, each 15min.
(2) use 12g mass fractions for 40% Fe (NO3)3Silver-plated aluminium alloy after the aqueous solution is cleaned to step (1) enters Row etching, etching temperature is 55 DEG C, and etch period is 45s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 70 DEG C of baking ovens.
(3) use 12g mass fractions for 40% Fe (NO3)3The aqueous solution enters to the dried silver-plated aluminium alloy of step (2) Row etching, etching temperature is 55 DEG C, and etch period is 45s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 70 DEG C of baking ovens, and structure of trap is formed in silver-plated aluminum alloy surface.
(4) the dried silver-plated aluminium alloy of step (3) be impregnated in into 30min in 10g TBT solution, is then transferred to 50mL 20min is reacted in deionized water, finally in Muffle furnace in calcining 1h at 400 DEG C.Wherein, TBT solution passes through procedure below system :TBT, glacial acetic acid and ethanol are well mixed, TBT solution is obtained, wherein, the mass fraction of TBT is 7%, ice in TBT solution The mass fraction of acetic acid is 6%.
(5) the silver-plated aluminium alloy after step (4) is calcined is placed in 25mL gold plating liquids and reacts 2h at 35 DEG C, then uses Deionized water is cleaned silver-plated aluminium alloy and is cleaned by ultrasonic 15min, finally dries 30min in 70 DEG C of baking ovens, obtains structure of trap Ag/TiO2/ Au coatings.Wherein, gold plating liquid is prepared by procedure below:By HAuCl4, glucose, natrium carbonicum calcinatum be added to water In, it is well mixed, obtain the gold plating liquid that pH value is 11.5;Wherein, HAuCl4Concentration be 6mmol/L, the concentration of glucose is 12mmol/L。
Embodiment 3
(1) it is 20mm long, 12mm wide, 1mm high to size to use 50mL detergent, deionized water, acetone and ethanol successively Silver-plated aluminium alloy be cleaned by ultrasonic, each 15min.
(2) use 12g mass fractions for 30% Fe (NO3)3Silver-plated aluminium alloy after the aqueous solution is cleaned to step (1) enters Row etching, etching temperature is 50 DEG C, and etch period is 40s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 60 DEG C of baking ovens.
(3) use 12g mass fractions for 20% Fe (NO3)3Silver-plated aluminium alloy after the aqueous solution is cleaned to step (2) enters Row etching, etching temperature is 50 DEG C, and etch period is 40s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 60 DEG C of baking ovens, and structure of trap is formed in silver-plated aluminum alloy surface.
(4) the dried silver-plated aluminium alloy of step (3) be impregnated in into 20min in 10g TBT, be then transferred to 50mL go from 10min is reacted in sub- water, finally in Muffle furnace in calcining 1h at 200 DEG C.Wherein, TBT solution is obtained by procedure below:Will TBT, glacial acetic acid and ethanol are well mixed, and obtain TBT solution, wherein, the mass fraction of TBT is 5%, glacial acetic acid in TBT solution Mass fraction be 4%.
(5) the silver-plated aluminium alloy after step (4) is calcined is placed in 25mL gold plating liquids and reacts 1h at 30 DEG C, then uses Deionized water is cleaned silver-plated aluminium alloy and is cleaned by ultrasonic 15min, finally dries 30min in 60 DEG C of baking ovens, obtains structure of trap Ag/TiO2/ Au coatings.Wherein, gold plating liquid is prepared by procedure below:By HAuCl4, glucose, natrium carbonicum calcinatum be added to water In, it is well mixed, obtain the gold plating liquid that pH value is 10.8;Wherein, HAuCl4Concentration be 4mmol/L, the concentration of glucose is 8mmol/L。
Embodiment 4
(1) it is 20mm long, 12mm wide, 1mm high to size to use 50mL detergent, deionized water, acetone and ethanol successively Silver-plated aluminium alloy be cleaned by ultrasonic, each 15min.
(2) use 12g mass fractions for 40% Fe (NO3)3Silver-plated aluminium alloy after the aqueous solution is cleaned to step (1) enters Row etching, etching temperature is 50 DEG C, and etch period is 40s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 60 DEG C of baking ovens.
(3) use 12g mass fractions for 20% Fe (NO3)3The aqueous solution enters to the dried silver-plated aluminium alloy of step (2) Row etching, etching temperature is 50 DEG C, and etch period is 40s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 60 DEG C of baking ovens, and structure of trap is formed in silver-plated aluminum alloy surface.
(4) the dried silver-plated aluminium alloy of step (3) be impregnated in into 20min in 10g TBT solution, is then transferred to 50mL 10min is reacted in deionized water, finally in Muffle furnace in calcining 1h at 400 DEG C.Wherein, TBT solution passes through procedure below system :TBT, glacial acetic acid and ethanol are well mixed, TBT solution is obtained, wherein, the mass fraction of TBT is 3%, ice in TBT solution The mass fraction of acetic acid is 4%.
(5) the silver-plated aluminium alloy after step (4) is calcined is placed in 25mL gold plating liquids and reacts 1h at 30 DEG C, then uses Deionized water is cleaned silver-plated aluminium alloy and is cleaned by ultrasonic 15min, finally dries 30min in 60 DEG C of baking ovens, obtains structure of trap Ag/TiO2/ Au coatings.Wherein, gold plating liquid is prepared by procedure below:By HAuCl4, glucose, natrium carbonicum calcinatum be added to water In, it is well mixed, obtain the gold plating liquid that pH value is 11.5;Wherein, HAuCl4Concentration be 4mmol/L, the concentration of glucose is 8mmol/L。
Embodiment 5
(1) it is 20mm long, 12mm wide, 1mm high to size to use 50mL detergent, deionized water, acetone and ethanol successively Silver-plated aluminium alloy be cleaned by ultrasonic, each 15min.
(2) use 12g mass fractions for 30% Fe (NO3)3Silver-plated aluminium alloy after the aqueous solution is cleaned to step (1) enters Row etching, etching temperature is 50 DEG C, and etch period is 38s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 70 DEG C of baking ovens.
(3) use 12g mass fractions for 30% Fe (NO3)3The aqueous solution enters to the dried silver-plated aluminium alloy of step (2) Row etching, etching temperature is 55 DEG C, and etch period is 38s, then cleans silver-plated aluminium alloy using deionized water and is cleaned by ultrasonic 3min, finally dries 30min in 60 DEG C of baking ovens, and structure of trap is formed in silver-plated aluminum alloy surface.
(4) the dried silver-plated aluminium alloy of step (3) be impregnated in into 20min in 10g TBT solution, is then transferred to 50mL 10min is reacted in deionized water, finally in Muffle furnace in calcining 1h at 300 DEG C.Wherein, TBT solution passes through procedure below system :TBT, glacial acetic acid and ethanol are well mixed, TBT solution is obtained, wherein, the mass fraction of TBT is 5%, ice in TBT solution The mass fraction of acetic acid is 4%.
(5) the silver-plated aluminium alloy after step (4) treatment is placed in 25mL gold plating liquids and reacts 1h at 35 DEG C, then used Deionized water is cleaned silver-plated aluminium alloy and is cleaned by ultrasonic 15min, finally dries 30min in 70 DEG C of baking ovens, obtains structure of trap Ag/TiO2/ Au coatings.Wherein, gold plating liquid is prepared by procedure below:By HAuCl4, glucose, natrium carbonicum calcinatum be added to water In, it is well mixed, obtain the gold plating liquid that pH value is 11.5;Wherein, HAuCl4Concentration be 6mmol/L, the concentration of glucose is 12mmol/L。
Structure of trap Ag/TiO is successfully prepared using the method for the present invention2/ Au coatings.It will be seen from figure 1 that by two There is significant structure of trap in the silver-plated aluminum alloy surface for walking wet-chemical chamber, figure it is seen that TiO2Film is by tiny TiO2Particle is constituted, and the film realizes profile-followed deposition in structure of trap silver surface.From figure 3, it can be seen that Au coating is by chi Very little uniform Au particles are constituted, and structure of trap surface is deposited on the shape.Fig. 4 is prepared by the step wet-chemical chamber technique of identical two 4 SEY characteristic curves of silver-plated aluminum alloy sample, 4 silver-plated aluminum alloy samples are respectively designated as S-1, S-2, S-3 and S-4,4 The SEY of individual silver-plated aluminum alloy sample shows the technique that two step wet-chemical chamber methods prepare structure of trap silver coating below 1.3 Stability is preferable.Fig. 5 is structure of trap Ag/TiO2After/Au coatings are placed 6 months, take what 3 points were tested at random on its surface SEY, 3 points are respectively designated as point 1, point 2 and 3,3 SEY of point of point below 1.2, show trap knot Structure Ag/TiO2The covering of/Au coatings is uniform, and environmental stability is good.

Claims (6)

1. a kind of structure of trap Ag/TiO2The preparation method of/Au coatings, it is characterised in that comprise the following steps:
(1) using Fe (NO3)3The aqueous solution is performed etching to silver-plated aluminium alloy, and etching temperature is 45-55 DEG C, and etch period is 35- 45s, dries after cleaning;
Repeat step (1), structure of trap is formed in silver-plated aluminum alloy surface;
(2) the silver-plated aluminium alloy that surface forms structure of trap be impregnated in into 10-30min in TBT solution, is then transferred to deionization 10-20min is reacted in water, is finally calcined;
(3) the silver-plated aluminium alloy after step (2) is calcined is placed in gold plating liquid and 0.5-2h is reacted at 25-35 DEG C, is done after cleaning It is dry, obtain structure of trap Ag/TiO2/ Au coatings.
2. a kind of structure of trap Ag/TiO according to claim 12The preparation method of/Au coatings, it is characterised in that described Fe(NO3)3The mass fraction of the aqueous solution is 20%-40%.
3. a kind of structure of trap Ag/TiO according to claim 12The preparation method of/Au coatings, it is characterised in that described TBT solution is by obtained in procedure below:TBT, glacial acetic acid and ethanol are well mixed, TBT solution is obtained, wherein, TBT is molten The mass fraction of TBT is 3%-7% in liquid, and the mass fraction of glacial acetic acid is 4%-6%.
4. a kind of structure of trap Ag/TiO according to claim 12The preparation method of/Au coatings, it is characterised in that described The temperature of calcining is 100-400 DEG C, and the time is 1h.
5. a kind of structure of trap Ag/TiO according to claim 12The preparation method of/Au coatings, it is characterised in that described Gold plating liquid is prepared by procedure below:By HAuCl4, glucose, natrium carbonicum calcinatum be added to the water, be well mixed, obtain pH value It is the gold plating liquid of 10.5-11.5;Wherein, HAuCl4Concentration be 2-6mmol/L, the concentration of glucose is 4-12mmol/L.
6. a kind of structure of trap Ag/TiO according to claim 12The preparation method of/Au coatings, it is characterised in that step (1), the dry temperature in step (2) and step (3) is 50-70 DEG C, and the time is 30min.
CN201710042284.4A 2017-01-20 2017-01-20 A kind of structure of trap Ag/TiO2The preparation method of/Au coating Expired - Fee Related CN106835078B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710042284.4A CN106835078B (en) 2017-01-20 2017-01-20 A kind of structure of trap Ag/TiO2The preparation method of/Au coating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710042284.4A CN106835078B (en) 2017-01-20 2017-01-20 A kind of structure of trap Ag/TiO2The preparation method of/Au coating

Publications (2)

Publication Number Publication Date
CN106835078A true CN106835078A (en) 2017-06-13
CN106835078B CN106835078B (en) 2019-02-01

Family

ID=59119991

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710042284.4A Expired - Fee Related CN106835078B (en) 2017-01-20 2017-01-20 A kind of structure of trap Ag/TiO2The preparation method of/Au coating

Country Status (1)

Country Link
CN (1) CN106835078B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113737134A (en) * 2021-09-02 2021-12-03 西安交通大学 Thin film containing nested micro-trap structure and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130048575A (en) * 2011-11-02 2013-05-10 한양대학교 산학협력단 Organic-inorganic nanohybrid non-volatile memory capacitor, organic-inorganic nanohybrid non-volatile memory transistor, and preparing method of the same
CN103151534A (en) * 2013-03-19 2013-06-12 南通大学 Direct methanol fuel cell (DMFC) nano PdNi (lead nickel)/mesoporous TiO2 (titanium dioxide) membrane anode and preparation method thereof
CN103730574A (en) * 2013-12-30 2014-04-16 合肥工业大学 Organic thin-film transistor and manufacturing method thereof
CN103882487A (en) * 2014-03-24 2014-06-25 陕西科技大学 Preparation method of silver membrane trap structure for inhibiting secondary electron emission on surface of microwave part
CN105369223A (en) * 2015-10-27 2016-03-02 重庆理工大学 Liquid deposition preparing method for anti-corrosion TiO2-ZrO2 coating and anti-corrosion metal with anti-corrosion TiO2-ZrO2 coating

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130048575A (en) * 2011-11-02 2013-05-10 한양대학교 산학협력단 Organic-inorganic nanohybrid non-volatile memory capacitor, organic-inorganic nanohybrid non-volatile memory transistor, and preparing method of the same
CN103151534A (en) * 2013-03-19 2013-06-12 南通大学 Direct methanol fuel cell (DMFC) nano PdNi (lead nickel)/mesoporous TiO2 (titanium dioxide) membrane anode and preparation method thereof
CN103730574A (en) * 2013-12-30 2014-04-16 合肥工业大学 Organic thin-film transistor and manufacturing method thereof
CN103882487A (en) * 2014-03-24 2014-06-25 陕西科技大学 Preparation method of silver membrane trap structure for inhibiting secondary electron emission on surface of microwave part
CN105369223A (en) * 2015-10-27 2016-03-02 重庆理工大学 Liquid deposition preparing method for anti-corrosion TiO2-ZrO2 coating and anti-corrosion metal with anti-corrosion TiO2-ZrO2 coating

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113737134A (en) * 2021-09-02 2021-12-03 西安交通大学 Thin film containing nested micro-trap structure and preparation method thereof

Also Published As

Publication number Publication date
CN106835078B (en) 2019-02-01

Similar Documents

Publication Publication Date Title
CN104130719B (en) A kind of graphene oxide conductive adhesive and preparation and application thereof
CN107098321A (en) The method that low temperature plasma prepares two-dimensional structure carboritride
CN107557825A (en) The copper powder coat of metal, metal substrate, energy-saving prevention are swollen quick-fried heat abstractor and its preparation technology
CN103981513A (en) Chemical nickel plating method on carbon fiber surface
CN104928738A (en) Continuous metal electroplating method and device for carbon fiber tows
CN101319325A (en) Method of manufacturing fine helical nickel-carbon alloy material
CN106835078B (en) A kind of structure of trap Ag/TiO2The preparation method of/Au coating
CN107910443B (en) A kind of carbon electrode perovskite solar battery and preparation method thereof
CN102995396A (en) Metallization treatment method for continuous carbon fiber surface
CN107705952B (en) A kind of preparation method of thermistor CuO-GO self assembly hydrogen reducing combination electrode
CN107304479A (en) A kind of coating method of silumin
CN110724983A (en) Method for preparing nano-copper-coated tungsten carbide core-shell structure powder by pulse electrodeposition
CN106757248A (en) The preparation facilities and method of lead dioxide electrode
CN108831751A (en) One kind is with FeCo2O4For the Micron-nano composites and its preparation method and application of substrate
CN108546929A (en) A kind of method, the substrate with film and its application preparing titanium nitride nano film in substrate surface
CN109440099B (en) Preparation method of composite metal layer plated carbon skeleton electromagnetic shielding composite material
CN103401052B (en) A kind of TiO 2/ TiO 2the preparation method of Au/Au structure Au electrode
CN206244889U (en) The preparation facilities of lead dioxide electrode
CN106299130A (en) Low resistance electrode, preparation method and the application on carbon back perovskite solaode thereof
CN106835077B (en) A kind of preparation method for the porous Au coating inhibiting Multipactor
CN105332016B (en) Plating solution for electro-coppering on the carbon nanotubes
CN107895786A (en) Flexible self-supporting SnS/ carbon foam composites and its preparation method and application
JP5593598B2 (en) Titanium material plated with noble metal and method for producing the same
CN107768348B (en) A kind of electrically conductive barrier material and preparation method thereof for copper interconnection
CN105256344A (en) Method for preparing single substance tin thin films through electrochemical deposition

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190201

Termination date: 20210120

CF01 Termination of patent right due to non-payment of annual fee