CN106833473A - A kind of anchor device structure glue and preparation method thereof - Google Patents
A kind of anchor device structure glue and preparation method thereof Download PDFInfo
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- CN106833473A CN106833473A CN201710111782.XA CN201710111782A CN106833473A CN 106833473 A CN106833473 A CN 106833473A CN 201710111782 A CN201710111782 A CN 201710111782A CN 106833473 A CN106833473 A CN 106833473A
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- parts
- device structure
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- anchor device
- structure glue
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
Abstract
The invention provides a kind of anchor device structure glue and preparation method thereof., by A, B component is with 2 for the anchor device structure glue:1 mass ratio is mixed, and wherein component A is by bisphenol A type epoxy resin, bisphenol f type epoxy resin, diluent, toughener, thixotropic agent, coupling agent, filler composition；B component is by polyamide curing agent, thixotropic agent, coupling agent, filler composition.The anchor device structure glue has good fluidity, and is difficult trickling, and thixotropy is good, easy construction.
Description
Technical field
The present invention relates to sqtructural adhesive field, more particularly to a kind of anchor device structure glue and preparation method thereof.
Background technology
Adhesive mainly unsaturated-resin glue on current anchor tool system, unsaturated-resin glue has curing rate
Hurry up, the early strong time is short, the advantages of cohesive force is preferable, but unsaturated-resin glue when using smell it is big, the colloid quality after solidification is crisp
Firmly, toughness is not enough, and weather resisteant, and heat resistant performance is poor.
Epoxyn has excellent processing performance, mechanical property, adhesive property, and good weatherability, shrinkage factor
It is low, cheap, it is widely used in the engineering field such as national defence, civilian.Reinforcement material is applied to, durability is one necessary
Performance, thus exploitation good endurance anchor device structure glue be very important.
The content of the invention
For domestic existing anchorage glue in the technical a variety of deficiencies of durability, the present invention provide a kind of anchor device structure glue and
Its preparation method improves the durability of anchorage glue.
To achieve the above object, the present invention is adopted the following technical scheme that:
The present invention provides a kind of anchor device structure glue, it is characterised in that by component A, B component is with 1:1 mass ratio is well mixed
Form.
Described component A is made up of following raw materials according in parts by weight：70 parts of bisphenol A type epoxy resin, 30 parts double
Phenol F types epoxy resin, 3~6 parts of diluent, 4~8 parts of toughener, 1~2 part of coupling agent, 5~10 parts of thixotropic agent,
150~300 parts of filler.
Described B component is made up of following raw materials according in parts by weight：100 parts of polyamide curing agent, 1~3 part of idol
Connection agent, 2~4 parts of thixotropic agent, 110~140 parts of filler.
The epoxide number of described bisphenol A type epoxy resin is 0.48~0.54, and the epoxide number of bisphenol f type epoxy resin is
0.56~0.63.
Described curing agent is polyamide curing agent, with preferable adhesive property.
Described diluent is reactive diluent 1,4- butanediol diglycidyl ethers (622).
Described diluent is reactive diluent 1,4- butanediol diglycidyl ethers (622).
Described coupling agent is selected from gamma-aminopropyl-triethoxy-silane (KH-550), the γ-ethoxy of glycidyl ethers propyl group three
At least one in base silane (KH-560).
Described thixotropic agent is selected from specific surface area in 150~250m2/ g, pH value is 4.0~7.0 hydrophobicity gas phase dioxy
SiClx.
Described filler is selected from mesh number in 1000 mesh, 1200 mesh, 3200 mesh or 5000 mesh, and surface is by surface modifier
One or more in the active micro silicon powder of modification.
A kind of preparation method of described anchor device structure glue, it is characterised in that：
(1) preparation of component A
By the bisphenol A type epoxy resin of 70 parts of weight portion meter, 30 parts of bisphenol f type epoxy resin, 3~6 parts of diluent,
4~8 parts of toughener, 1~2 part of coupling agent, 5~10 parts of thixotropic agent mixing and stirring, add 150~300 parts
Filler mixing and stirring, that is, be obtained component A.
(2) preparation of B component
The polyamide curing agent of 100 parts of weight portion meter, 1~3 part of coupling agent, 2~4 parts of thixotropic agent are mixed equal
It is even, add 110~140 parts of filler mixing and stirring, that is, B component is obtained.
(3) by A, B component presses 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Emphasis of the invention mainly has following three points：
1. polyamide curing agent is employed, and the polyamide curing agent has good pliability and adhesive property.
2. toughener uses QS-EC, and solidfied material can be made to form the epoxy resin with " island structure ", so that several times are improved
Fracture toughness, and QS-EC is added, adhesive strength can significantly rise.
Beneficial effects of the present invention：The present invention uses AB double-component paste body shape structure glues, is not trickled in construction, cementability
Can be high, solidfied material good endurance can increase substantially the use time of anchor device structure glue.
Specific implementation method
It is considered as below and this is further explained with reference to some embodiments to the present invention, it should be appreciated that following examples is intended to
Illustrate, the limitation that should not be invented
Embodiment 1
The preparation of component A：By the bisphenol A type epoxy resin of 70 parts of weight portion meter, 30 parts of bisphenol f type epoxy resin, 5 parts
Diluent, 5 parts of toughener, 1.6 parts of coupling agent, 6.5 parts of thixotropic agent mixing and stirring, add 200 parts and fill out
Material mixing and stirring, that is, be obtained component A.
The preparation of B component：By 100 parts of polyamide curing agent, 1.2 parts of coupling agent, 2.5 parts of thixotropic agent of weight portion meter
Mixing and stirring, adds 130 parts of filler mixing and stirring, that is, B component is obtained.
A, B component are pressed 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Embodiment 2
The preparation of component A：By the bisphenol A type epoxy resin of 70 parts of weight portion meter, 30 parts of bisphenol f type epoxy resin, 5 parts
Diluent, 5 parts of toughener, 2 parts of coupling agent, 6.5 parts of thixotropic agent mixing and stirring, add 200 parts of filler
Mixing and stirring, that is, be obtained component A.
The preparation of B component：The polyamide curing agent of 100 parts of weight portion meter, 2 parts of coupling agent, 2.5 parts of thixotropic agent are mixed
Conjunction stirs, and adds 130 parts of filler mixing and stirring, that is, B component is obtained.
A, B component are pressed 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Embodiment 3
The preparation of component A：By the bisphenol A type epoxy resin of 70 parts of weight portion meter, 30 parts of bisphenol f type epoxy resin, 5 parts
Diluent, 5 parts of toughener, 1.6 parts of coupling agent, 8 parts of thixotropic agent mixing and stirring, add 200 parts of filler
Mixing and stirring, that is, be obtained component A.
The preparation of B component：The polyamide curing agent of 100 parts of weight portion meter, 1.2 parts of coupling agent, 4 parts of thixotropic agent are mixed
Conjunction stirs, and adds 130 parts of filler mixing and stirring, that is, B component is obtained.
A, B component are pressed 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Steel bonding glue obtained by three embodiments of the invention carries out performance detection by GB 50728-2011 related requests, examines
Survey data and be shown in Table one
Table one
Claims (9)
1. a kind of anchor device structure glue, it is characterised in that by component A, B component is with 2:1 mass ratio is mixed.
Wherein：
Described component A is made up of following raw materials according in parts by weight：
70 parts of bisphenol A type epoxy resin；
30 parts of bisphenol f type epoxy resin；
3~6 parts of diluent；
4~8 parts of toughener；
1~2 part of coupling agent；
5~10 parts of thixotropic agent；
150~300 parts of filler；
Described B component is made up of following raw materials according in parts by weight：
100 parts of polyamide curing agent；
1~3 part of coupling agent；
2~4 parts of thixotropic agent；
110~140 parts of filler.
2. anchor device structure glue according to claim 1, it is characterised in that the epoxide number of described bisphenol A type epoxy resin
It is 0.48~0.54, the epoxide number of bisphenol f type epoxy resin is 0.56~0.63.
3. anchor device structure glue according to claim 1, it is characterised in that described curing agent is polyamide curing agent, tool
There is preferable adhesive property.
4. anchor device structure glue according to claim 1, it is characterised in that described diluent is reactive diluent Isosorbide-5-Nitrae-fourth
Hexanediol diglycidyl ether (622).
5. anchor device structure glue according to claim 1, it is characterised in that described toughener is QS-EC.
6. anchor device structure glue according to claim 1, it is characterised in that described coupling agent is selected from the second of γ-aminopropyl three
At least one in TMOS (KH-550), γ-glycidyl ethers propyl-triethoxysilicane (KH-560).
7. anchor device structure glue according to claim 1, it is characterised in that described thixotropic agent is selected from specific surface area 150
~250m2/ g, pH value is 4.0~7.0 aerosil.
8. anchor device structure glue according to claim 1, it is characterised in that described filler be selected from mesh number 1000 mesh,
1200 mesh, 3200 mesh or 5000 mesh, surface by surface modifying agent process active micro silicon powder in one or more.
9. the preparation method of the anchor device structure glue according to claim 1,2,3,4,5,6,7,8, it is characterised in that：
(1) preparation of component A
By 70 parts of bisphenol A type epoxy resin, 30 parts of bisphenol f type epoxy resin, 3~6 parts of diluent, 4~8 of weight portion meter
The toughener, 1~2 part of coupling agent, 5~10 parts of thixotropic agent mixing and stirring of part, add 150~300 parts of filler
Mixing and stirring, that is, be obtained component A；
(2) preparation of B component
By 100 parts of polyamide curing agent, 1~3 part of coupling agent, 2~4 parts of thixotropic agent mixing and stirring of weight portion meter,
110~140 parts of filler mixing and stirring is added, that is, B component is obtained；
(3) by A, B component presses 2:1 weight be obtained anchor device structure glue than mixing and stirring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710111782.XA CN106833473A (en) | 2017-02-28 | 2017-02-28 | A kind of anchor device structure glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710111782.XA CN106833473A (en) | 2017-02-28 | 2017-02-28 | A kind of anchor device structure glue and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106833473A true CN106833473A (en) | 2017-06-13 |
Family
ID=59134776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710111782.XA Pending CN106833473A (en) | 2017-02-28 | 2017-02-28 | A kind of anchor device structure glue and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN106833473A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659369A (en) * | 2012-05-18 | 2012-09-12 | 山西省交通科学研究院 | Epoxy emulsion modified quick repair mortar for concrete roads and bridges and preparation method for mortar |
| CN105062396A (en) * | 2015-08-21 | 2015-11-18 | 卡本复合材料（天津）有限公司 | Double-component high-strength building epoxy structural adhesive and preparing method thereof |
-
2017
- 2017-02-28 CN CN201710111782.XA patent/CN106833473A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102659369A (en) * | 2012-05-18 | 2012-09-12 | 山西省交通科学研究院 | Epoxy emulsion modified quick repair mortar for concrete roads and bridges and preparation method for mortar |
| CN105062396A (en) * | 2015-08-21 | 2015-11-18 | 卡本复合材料（天津）有限公司 | Double-component high-strength building epoxy structural adhesive and preparing method thereof |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
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| RJ01 | Rejection of invention patent application after publication |