CN106833474A - A kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof - Google Patents
A kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof Download PDFInfo
- Publication number
- CN106833474A CN106833474A CN201710116574.9A CN201710116574A CN106833474A CN 106833474 A CN106833474 A CN 106833474A CN 201710116574 A CN201710116574 A CN 201710116574A CN 106833474 A CN106833474 A CN 106833474A
- Authority
- CN
- China
- Prior art keywords
- low temperature
- parts
- crystalline substance
- resistive connection
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Abstract
The invention provides a kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof., by A, B bi-components are with 2 for low temperature resistive connection crystalline substance epoxy structural rubber:1 mass ratio is mixed, and wherein component A is by bisphenol A type epoxy resin, bisphenol f type epoxy resin, diluent, toughener, thixotropic agent, coupling agent, filler component；B component is by changing alicyclic ring amine hardener, thixotropic agent, coupling agent, filler composition.The low temperature resistive connection crystalline substance epoxy structural rubber that the present invention is provided, compounds to suppress the crystallization of component A epoxy resin by bisphenol A type epoxy resin and bisphenol f type epoxy resin；Low temperature resistant polyfunctional group reactive diluent is used simultaneously, the viscosity and shrinkage factor of adhesive system is on the one hand reduced, the activity under epoxy resin low temperature is on the other hand improved, and reaches low temperature resistant easy working effect.Low temperature resistive connection crystalline substance epoxy structural rubber can construct under 0 DEG C of environment；Structure glue low cost, performance is high, seven days tensile strength 45MPa, tensile shear 17.4MPa.
Description
Technical field
The present invention relates to sqtructural adhesive field, more particularly to a kind of low temperature resistive connection crystalline substance epoxy structural rubber and its preparation side
Method.
Background technology
Reinforcement of Engineering Structure is an emerging industry, refers to make when the structural system of building or structures can not meet
During with requiring, necessary structure of modification is carried out to it and is reinforced.In Reinforcement of Engineering Structure, sqtructural adhesive is generally used,
And epoxy structural rubber is most common one kind in structure glue adhesive agent, because epoxy structural rubber has high intensity, cohesive force high is excellent
Different weatherability, therefore application is more and more extensive.
Epoxy structural rubber is typically A, and B bi-components are constituted, and wherein component A contains epoxy resin, mixes the two when using
It is uniform.Because epoxy resin belongs to subcooled liquid, to very temperature sensitive, when the temperature decreases, component A viscosity drastically increases
Greatly, A, B is caused to mix difficulty, construction experience is poor；And component A is in temperature reduction, epoxide resin reactive reduction, A groups
There is crystal hardened phenomenon in branch, using being very restricted.Summarize epoxy structural rubber when using at low ambient temperatures,
There is reactivity low, easily crystallization, the technical barrier of constructional difficulties.
The content of the invention
When being used at low ambient temperatures for above-mentioned epoxy structural rubber, reactivity is low, easily crystallization, the technology of constructional difficulties
Problem, it is an object of the invention to provide a kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof.
To achieve the above object, the present invention is adopted the following technical scheme that:
The present invention provides a kind of low temperature resistive connection crystalline substance epoxy structural rubber, it is characterised in that by component A, B component is with 2:1 quality
Formed than well mixed.
Described component A is made up of following raw materials according in parts by weight：55 parts of bisphenol A type epoxy resin, 15 parts double
Phenol F types epoxy resin, 25~35 parts of diluent, 5~15 parts of toughener, 1~8 part of coupling agent, 2~8 parts of thixotropic agent,
200~240 parts of filler.
Described B component is made up of following raw materials according in parts by weight：100~120 parts of modified aliphatic cyclic amine amine hardener,
1~8 part of coupling agent, 2~8 parts of thixotropic agent, 200~240 parts of filler.
The epoxide number of described bisphenol A type epoxy resin is 0.48~0.54, and the epoxide number of bisphenol f type epoxy resin is
0.56~0.63.
Described diluent is reactive diluent tetrahydrophthalic acid 2-glycidyl ester.
Described toughener is selected from liquid polysulphide rubber, liquid carboxyl end group nitrile rubber, liquid polybutadiene rubber
It is at least one.
Described coupling agent is selected from gamma-aminopropyl-triethoxy-silane (KH-550), the γ-ethoxy of glycidyl ethers propyl group three
At least one in base silane (KH-560), γ-oxypropyl trimethyl silane (KH-570).
Described thixotropic agent is selected from specific surface area in 150~250m2/ g, pH value is 4.0~7.0 hydrophobicity gas phase dioxy
SiClx.
Described filler is selected from mesh number in 400 mesh~800 mesh, the activated silica that surface has been processed by surface modifying agent
Micro mist.
The preparation method of described low temperature resistive connection crystalline substance epoxy structural rubber, it is characterised in that：
(1) preparation of component A
By 55 parts of bisphenol A type epoxy resin, 15 parts of bisphenol f type epoxy resin, 25~35 parts of the dilution of weight portion meter
Agent, 5~15 parts of toughener, 1~8 part of coupling agent, 2~8 parts of thixotropic agent mixing and stirring, add 200~240 parts
Filler mixing and stirring.
(2) preparation of B component
By 100~120 parts of modified alicyclic ring amine hardener, 1~8 part of coupling agent of weight portion meter, 2~8 parts of thixotropic agent
Mixing and stirring, adds 200~240 parts of filler mixing and stirring.
(3) by A, B component is by weight 2:1 mixing and stirring, that is, be obtained low temperature resistive connection crystalline substance epoxy structural rubber.
Emphasis of the invention mainly has at following 2 points：
1. using the bifunctional epoxy resin system of compounding.Compounded with bisphenol A type epoxy resin and bisphenol f type epoxy resin, one
Aspect can reduce the viscosity of component A system, on the other hand by lowering the purity of bisphenol A type epoxy resin, reach suppression component A
The purpose of crystallization.
2. low temperature resistant reactive diluent is used.Reactive diluent tetrahydrophthalic acid 2-glycidyl ester has excellent
Resistance to low temperature, it is good with bisphenol A type epoxy resin compatibility, and also viscosity is low, by adding the shrink of tetrahydrophthalic acid two
Glyceride can reduce component A viscosity, improve workability, and the reactivity that component A can be improved again is big, suppress crystal hardened and show
The generation of elephant.
Beneficial effects of the present invention：When the present invention solves epoxy structural rubber and uses at low ambient temperatures, reactivity is low,
Easily crystallization, the technical barrier of constructional difficulties.The structure glue that the present invention is provided, after normal cure, tensile strength 45MPa, stretching is cut
17.4MPa is cut, structure glue performance fully meets GB 50728-2011 related requests, and the epoxy structural rubber that the present invention is provided
Low cost, easy construction.
Specific implementation method
The present invention is further explained with reference to some embodiments, it should be appreciated that following examples are intended to explanation, no
Should be taken as limiting
Embodiment 1
The preparation of component A：By 55 parts of bisphenol A type epoxy resin, 15 parts of bisphenol f type epoxy resin, 25 of weight portion meter
The diluent, 5 parts of toughener, 2 parts of coupling agent of part, 5 parts of thixotropic agent mixing and stirring add 200 parts of filler
Mixing and stirring.
The preparation of B component：By 120 parts of modified alicyclic ring amine hardener, 2 parts of coupling agent of weight portion meter, 5 parts of thixotropic agent
Mixing and stirring, adds 200 parts of filler mixing and stirring.
By A, B component is by weight 2:1 mixing and stirring, that is, be obtained low temperature resistive connection crystalline substance epoxy structural rubber.
Embodiment 2
The preparation of component A：By 55 parts of bisphenol A type epoxy resin, 15 parts of bisphenol f type epoxy resin, 25 of weight portion meter
The diluent, 10 parts of toughener, 2 parts of coupling agent of part, 5 parts of thixotropic agent mixing and stirring add 200 parts of filler
Mixing and stirring.
The preparation of B component：By 120 parts of modified alicyclic ring amine hardener, 2 parts of coupling agent of weight portion meter, 5 parts of thixotropic agent
Mixing and stirring, adds 200 parts of filler mixing and stirring.
By A, B component is by weight 2:1 mixing and stirring, that is, be obtained low temperature resistive connection crystalline substance epoxy structural rubber.
Embodiment 3
The preparation of component A：By 55 parts of bisphenol A type epoxy resin, 15 parts of bisphenol f type epoxy resin, 25 of weight portion meter
The diluent, 10 parts of toughener, 2 parts of coupling agent of part, 5 parts of thixotropic agent mixing and stirring add 220 parts of filler
Mixing and stirring.
The preparation of B component：120 parts of phenolic aldehyde amide hardener, 2 parts of coupling agent of weight portion meter, 5 parts of thixotropic agent are mixed
Conjunction stirs, and adds 220 parts of filler mixing and stirring.
By A, B component is by weight 2:1 mixing and stirring, that is, be obtained low temperature resistive connection crystalline substance epoxy structural rubber.
Steel bonding glue obtained by three embodiments of the invention carries out performance detection by GB 50728-2011 related requests, examines
Survey data and be shown in Table one.
Table one
Claims (8)
1. a kind of low temperature resistive connection crystalline substance epoxy structural rubber, it is characterised in that by component A, B component is with 2:1 mass ratio is mixed.
Wherein：
Described component A is made up of following raw materials according in parts by weight：
Described B component is made up of following raw materials according in parts by weight：
2. low temperature resistive connection according to claim 1 crystalline substance epoxy structural rubber, it is characterised in that described bisphenol type epoxy tree
The epoxide number of fat is 0.48~0.54, and the epoxide number of bisphenol f type epoxy resin is 0.56~0.63.
3. low temperature resistive connection according to claim 1 crystalline substance epoxy structural rubber, it is characterised in that described diluent is dilute for activity
Release agent tetrahydrophthalic acid 2-glycidyl ester.
4. low temperature resistive connection according to claim 1 crystalline substance epoxy structural rubber, it is characterised in that described toughener is selected from liquid
At least one in polysulfide rubber, liquid carboxyl end group nitrile rubber, liquid polybutadiene rubber.
5. low temperature resistive connection according to claim 1 crystalline substance epoxy structural rubber, it is characterised in that described coupling agent be selected from γ-
Aminopropyl triethoxysilane (KH-550), γ-glycidyl ethers propyl-triethoxysilicane (KH-560), γ-propyl group front three
At least one in base silane (KH-570).
6. low temperature resistive connection according to claim 1 crystalline substance epoxy structural rubber, it is characterised in that described thixotropic agent is selected from than table
Area is in 150~250m2/ g, pH value is 4.0~7.0 hydrophobicity aerosil.
7. low temperature resistive connection according to claim 1 crystalline substance epoxy structural rubber, it is characterised in that described filler exists selected from mesh number
400 mesh~800 mesh, the active micro silicon powder that surface has been processed by surface modifying agent.
8. the preparation method of the brilliant epoxy structural rubber of low temperature resistive connection according to claim 1,2,3,4,5,6,7, its feature exists
In：
(1) preparation of component A
By 55 parts of bisphenol A type epoxy resin, 15 parts of bisphenol f type epoxy resin, 25~35 parts of diluent, 5 of weight portion meter
~15 parts of toughener, 1~8 part of coupling agent, 2~8 parts of thixotropic agent mixing and stirring add 200~240 parts and fill out
Material mixing and stirring；
(2) preparation of B component
By 100~120 parts of modified alicyclic ring amine hardener, 1~8 part of coupling agent of weight portion meter, 2~8 parts of thixotropic agent mixing
Stir, add 200~240 parts of filler mixing and stirring；
(3) by A, B component is by weight 2:1 mixing and stirring, that is, be obtained low temperature resistive connection crystalline substance epoxy structural rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710116574.9A CN106833474A (en) | 2017-02-28 | 2017-02-28 | A kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710116574.9A CN106833474A (en) | 2017-02-28 | 2017-02-28 | A kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106833474A true CN106833474A (en) | 2017-06-13 |
Family
ID=59138349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710116574.9A Pending CN106833474A (en) | 2017-02-28 | 2017-02-28 | A kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106833474A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108384497A (en) * | 2018-03-13 | 2018-08-10 | 中冶武汉冶金建筑研究院有限公司 | A kind of low viscosity repairing concrete crack potting compound and preparation method thereof |
| CN110144184A (en) * | 2018-10-15 | 2019-08-20 | 卡本科技股份有限公司 | Epoxy structural rubber is used in a kind of bridge subsection splicing under low temperature environment |
| CN112680156A (en) * | 2020-12-23 | 2021-04-20 | 重庆德天汽车新材料研究院有限公司 | High-toughness bi-component epoxy structural adhesive and preparation method thereof |
| CN113088226A (en) * | 2021-04-08 | 2021-07-09 | 杭州华圩新材料科技有限公司 | Double-component antiviral crack beautifying agent and preparation method thereof |
| CN113604180A (en) * | 2021-08-11 | 2021-11-05 | 北京华腾新材料股份有限公司 | Low-temperature-resistant high-thixotropy epoxy daub and preparation method thereof |
| CN114214019A (en) * | 2021-12-02 | 2022-03-22 | 深圳斯多福新材料科技有限公司 | Preparation method of high-temperature and low-temperature resistant single-component adhesive |
| CN114395354A (en) * | 2022-01-25 | 2022-04-26 | 苏州英田电子科技有限公司 | Low-shrinkage epoxy structural adhesive |
| CN115368857A (en) * | 2022-08-23 | 2022-11-22 | 书香门地集团股份有限公司 | Anti-cracking low-halogen low-transparency epoxy resin sealant |
| CN116179134A (en) * | 2023-03-10 | 2023-05-30 | 中德新亚建筑材料有限公司 | Ultralow Wen Deping repair adhesive and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104371627A (en) * | 2014-11-17 | 2015-02-25 | 卡本复合材料（天津）有限公司 | Low-temperature anti-crystalized structural adhesive and preparation method thereof |
-
2017
- 2017-02-28 CN CN201710116574.9A patent/CN106833474A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104371627A (en) * | 2014-11-17 | 2015-02-25 | 卡本复合材料（天津）有限公司 | Low-temperature anti-crystalized structural adhesive and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 孙曼灵: "《环氧树脂应用原理与技术》", 30 September 2002, 机械工业出版社 * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108384497A (en) * | 2018-03-13 | 2018-08-10 | 中冶武汉冶金建筑研究院有限公司 | A kind of low viscosity repairing concrete crack potting compound and preparation method thereof |
| CN108384497B (en) * | 2018-03-13 | 2020-11-20 | 中冶武汉冶金建筑研究院有限公司 | Low-viscosity concrete crack repairing perfusion adhesive and preparation method thereof |
| CN110144184A (en) * | 2018-10-15 | 2019-08-20 | 卡本科技股份有限公司 | Epoxy structural rubber is used in a kind of bridge subsection splicing under low temperature environment |
| CN112680156A (en) * | 2020-12-23 | 2021-04-20 | 重庆德天汽车新材料研究院有限公司 | High-toughness bi-component epoxy structural adhesive and preparation method thereof |
| CN113088226A (en) * | 2021-04-08 | 2021-07-09 | 杭州华圩新材料科技有限公司 | Double-component antiviral crack beautifying agent and preparation method thereof |
| CN113604180A (en) * | 2021-08-11 | 2021-11-05 | 北京华腾新材料股份有限公司 | Low-temperature-resistant high-thixotropy epoxy daub and preparation method thereof |
| CN114214019A (en) * | 2021-12-02 | 2022-03-22 | 深圳斯多福新材料科技有限公司 | Preparation method of high-temperature and low-temperature resistant single-component adhesive |
| CN114395354A (en) * | 2022-01-25 | 2022-04-26 | 苏州英田电子科技有限公司 | Low-shrinkage epoxy structural adhesive |
| CN114395354B (en) * | 2022-01-25 | 2023-11-03 | 苏州英田电子科技有限公司 | Low-shrinkage epoxy structural adhesive |
| CN115368857A (en) * | 2022-08-23 | 2022-11-22 | 书香门地集团股份有限公司 | Anti-cracking low-halogen low-transparency epoxy resin sealant |
| CN116179134A (en) * | 2023-03-10 | 2023-05-30 | 中德新亚建筑材料有限公司 | Ultralow Wen Deping repair adhesive and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106833474A (en) | A kind of low temperature resistive connection crystalline substance epoxy structural rubber and preparation method thereof | |
| CN104371627A (en) | Low-temperature anti-crystalized structural adhesive and preparation method thereof | |
| CN110128982A (en) | A kind of fast fixing structure glue of room temperature and preparation method thereof | |
| CN106062030A (en) | Resin composition | |
| CN102746621B (en) | Low-viscosity epoxy resin system for rapid repair and reinforcement and preparation method of low-viscosity epoxy resin system | |
| CN106047254A (en) | Epoxy sticky steel glue with high strength and high breaking elongation and preparation method of epoxy sticky steel glue | |
| CN104804691A (en) | Room temperature curing high-temperature-resistant high-tenacity epoxy adhesive and preparation method thereof | |
| CN103289625B (en) | Low-temperature-resistant stone drying hanging adhesive and preparation method thereof | |
| CN106700992A (en) | Underwater curing high-performance epoxy anchoring glue as well as preparation method and application of underwater curing high-performance epoxy anchoring glue | |
| CN105925228A (en) | Multi-purpose modified epoxy resin adhesive | |
| CN106318302B (en) | A kind of temperature curing epoxy low Resin adhesive and preparation method thereof | |
| CN106928889A (en) | Anchoring adhesive and preparation method thereof under a kind of water at low temperature | |
| CN105884257A (en) | High-strength rapid-hardening type epoxy resin mortar and preparation method thereof | |
| CN108084663B (en) | High resiliency leak stopping modified epoxy grouting material and preparation method thereof | |
| CN108178999A (en) | A kind of seam double-component epoxy adhesive and preparation method thereof | |
| CN105271939A (en) | High-strength and high-toughness epoxy resin concrete material and preparation method thereof | |
| TWI534196B (en) | Reworkable epoxy resin and curative blend for low thermal expansion applications | |
| CN108047657A (en) | High-strength high fluidity epoxide resin grouting material and preparation method thereof | |
| CN103923587A (en) | Preparation method of bicomponent stone dry-hanging glue capable of being cured at normal temperature | |
| CN106103532A (en) | Novel novolac hardeners containing alkoxysilyl and preparation method thereof, the compositions containing sclerosing agent, hardening product and application thereof | |
| CN109370496A (en) | A kind of automobile epoxy structural rubber and preparation method thereof | |
| CN105238316B (en) | Two component epoxy stone material dry suspending glue of low-temperature setting and preparation method thereof | |
| CN103773301A (en) | Thixotropic light adhesive for bonding buoyancy material module | |
| JP5884304B2 (en) | Epoxy resin composition for fiber reinforced composite materials | |
| CN107699180A (en) | A kind of toughening type epoxy dry-hang glue and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |