CN106827321A - Cellular board manufactures the manufacture method of mould and thermosetting resin cellular board - Google Patents
Cellular board manufactures the manufacture method of mould and thermosetting resin cellular board Download PDFInfo
- Publication number
- CN106827321A CN106827321A CN201710061730.6A CN201710061730A CN106827321A CN 106827321 A CN106827321 A CN 106827321A CN 201710061730 A CN201710061730 A CN 201710061730A CN 106827321 A CN106827321 A CN 106827321A
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- Prior art keywords
- plug
- mould
- layer
- ground floor
- prepreg
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
- B29C67/20—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for porous or cellular articles, e.g. of foam plastics, coarse-pored
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/30—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
- B29C70/34—Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core and shaping or impregnating by compression, i.e. combined with compressing after the lay-up operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/60—Multitubular or multicompartmented articles, e.g. honeycomb
- B29L2031/608—Honeycomb structures
Abstract
The invention discloses cellular board manufacture mould and the manufacture method of thermosetting resin cellular board.The cellular board manufacture mould includes upper die and lower die and multilayer plug, and every layer of plug number is multiple, and removably superposition is set；The multilayer plug is cellular for multilayer board-like material to be compressed to；Upper mould is set and is detachably connected with lower mode spacing, and the multilayer plug is arranged between the upper mould and the lower mould；The upper mould holds the multilayer plug with the lower die clamp.Cellular board manufacture mould in the present invention, can be according to the honeycomb plate shape that raw material are compressed to needs the need for use.Using the method in the present invention, thermosetting resin cellular board can be easily and fast produced.
Description
Technical field
The present invention relates to cellular board manufacture mould and the manufacture method of thermosetting resin cellular board.
Background technology
Honeycomb board structure has good bending resistance and shear behavior, in the traffic such as aviation, high ferro and new-energy automobile neck
There is very big application in domain, but traditional air cellular major part is made of aramid fiber, and aramid fiber naturally has water imbibition, limit
Its application on load-carrying member high is made.Fiber is broken into paper pulp by the manufacture craft of simultaneously traditional aramid fiber honeycomb first
The scraps of paper are made, then again by being bonded stretching, phenolic resin solidify afterwards is finally infiltrated qualitative.This processing damage company of fiber
Continuous property, so cellular resistance to compression and shearing strength are lost significantly, it is difficult to more than 1.5MPA.And in the prior art, still without public affairs
Switch in the mould of manufacture thermosetting resin cellular board, limit the production and extension of cellular board.
The content of the invention
An object of the present invention is to overcome deficiency of the prior art, there is provided the cellular board manufacture mould of convenient use
Tool.
To realize object above, the present invention is achieved through the following technical solutions：
Cellular board manufactures mould, it is characterised in that including
Upper mould；
Lower mould；
Multilayer plug, every layer of plug number is multiple, and removably superposition is set；The multilayer plug is used for multi-layer sheet
Shape material is compressed to cellular；
Upper mould sets and is detachably connected with lower mode spacing, the multilayer plug be arranged at the upper mould and the lower mould it
Between；The upper mould holds the multilayer plug with the lower die clamp.
According to one embodiment of present invention, the lower mould includes base plate, is provided with the base plate：
Multiple first pellets；First pellet is arranged at plate upper surface and protrudes from the plate upper surface；Institute
State laying ground floor plug on base plate, the upper surface of the upper surface higher than the first pellet of ground floor plug, under ground floor plug
Upper surface of the surface less than the first pellet；
Or multiple first grooves, first groove is extended downwardly from the plate upper surface, on the base plate
Laying ground floor plug, ground floor plug is partially submerged into the first groove along short transverse, is partially protrude through the first groove.
According to one embodiment of present invention, the upper mould includes top board；It is provided with the top board：
Multiple second pellets；Second pellet is arranged at top board lower surface and protrudes from the top board lower surface；It is described
Top board is pressed against on most last layer plug, and the most lower surface of last layer plug is less than the lower surface of the second pellet, most last layer core
Lower surface of the upper surface of rod higher than the second pellet；
Or multiple second grooves, second groove upwardly extends from the top board lower surface, and the top board is pressed against
On most last layer plug, most last layer plug is partially submerged into the second groove along short transverse, is partially protrude through the second groove.
According to one embodiment of present invention, each layer plug is identical perpendicular to the cross sectional shape of length direction.
According to one embodiment of present invention, the plug is hexagon perpendicular to the cross sectional shape of length direction.
According to one embodiment of present invention, the upper mould is connected with the lower mould by connector.
According to one embodiment of present invention, the connector includes connecting rod, and the interlinking lever end is provided with screw thread；It is described
Connecting rod two ends are each passed through the upper mould and the lower mould；The connecting rod two ends are threaded with one or more nuts；It is described
One or more nuts are engaged with the connecting rod and are connected the upper mould and the lower mould.
According to one embodiment of present invention, the connector also includes multiple connecting plates, the multiple connecting plate interval
Set and be connected with the upper mould and the lower mould.
According to one embodiment of present invention, the connecting plate includes vertical connecting plate and cross connecting plate；It is described vertical
Connecting plate is connected with the upper mould and the lower mould；The cross connecting plate is connected with the multiple vertical connecting plate.
According to one embodiment of present invention, the plug is tubular structure, and the plug has tube chamber.
Another object of the present invention is to overcome deficiency of the prior art, there is provided the thermosetting resin of easy construction
The manufacture method of cellular board.
To realize object above, the present invention is achieved through the following technical solutions：
The manufacture method of thermosetting resin cellular board, it is characterised in that
Mould is provided, the mould includes lower mould, upper mould and multiple plugs；The upper mould is set with the lower mode spacing；
Plug described in multilayer is provided between the upper mould and the lower mould, every layer of plug number is multiple；Every layer of plug upper surface paving
Prepreg is provided with, be compressed to for multilayer prepreg cellular by the upper die and lower die and the multilayer plug；
Mould and prepreg are heated, each layer prepreg is heating and curing, neighbouring each layer prepreg is in contact site
Position bonding；
Mould, each layer plug and lower mould are exited, that is, is made thermosetting resin cellular board.
Embodiments in accordance with the present invention, including step：
The lower mould includes base plate；
Ground floor plug is laid on the base plate, ground floor plug number is multiple, multiple ground floor plug intervals set
Put；Then ground floor prepreg is laid on ground floor plug, makes ground floor prepreg according to plate upper surface and ground floor core
The shape bending that rod surface limits；
Second layer plug is laid on ground floor prepreg, second layer plug number is multiple；Each second layer plug is embedding
Enter between two neighboring ground floor plug；Second layer plug lower surface is less than ground floor plug upper surface, second layer plug upper table
Face is higher than ground floor plug upper surface；Second layer plug lower surface is pressed against on ground floor prepreg；
Second layer prepreg is laid in second layer plug upper surface again, second layer prepreg is according to ground floor plug and second
The shape bending that layer plug is limited；Second layer prepreg is contacted with ground floor prepreg between two neighboring second layer plug；
It is sequentially overlapped each layer plug and lays multilayer prepreg successively, until most last layer plug；
Mould in laying, the mold has top board；The top board is pressed against on most last layer plug；Base plate will be each with top board
Layer plug and each layer prepreg are compressed；
Then upper mould, each layer plug, each layer prepreg and lower mould are heating and curing together, neighbouring each layer prepreg
In contact site bonding；
Mould, each layer plug and lower mould are exited, that is, is made thermosetting resin cellular board.
Embodiments in accordance with the present invention, the lower mould includes base plate, is provided with the base plate：
Multiple first pellets；First pellet is arranged at plate upper surface and protrudes from the plate upper surface；Institute
State laying ground floor plug on base plate, the upper surface of the upper surface higher than the first pellet of ground floor plug, under ground floor plug
Upper surface of the surface less than the first pellet；
Or multiple first grooves, first groove is extended downwardly from the plate upper surface, on the base plate
Laying ground floor plug, ground floor plug is partially submerged into the first groove along short transverse, is partially protrude through the first groove.
Embodiments in accordance with the present invention, lay bottom prepreg on the base plate, and the bottom prepreg is along base plate
Shape bending or bent along the shape that plate upper surface and the first groove are limited that surface and the first pellet surface limit；The bottom of at
Ground floor plug is laid on layer prepreg.
Embodiments in accordance with the present invention, the upper mould includes top board；It is provided with the top board：
Multiple second pellets；Second pellet is arranged at top board lower surface and protrudes from the top board lower surface；It is described
Top board is pressed against on most last layer plug, and the most lower surface of last layer plug is less than the lower surface of the second pellet, most last layer core
Lower surface of the upper surface of rod higher than the second pellet；
Or multiple second grooves, second groove upwardly extends from the top board lower surface, and the top board is pressed against
On most last layer plug, most last layer plug is partially submerged into the second groove along short transverse, is partially protrude through the second groove.
Embodiments in accordance with the present invention, lay top layer prepreg, the top layer prepreg on the most last layer plug
Along most last layer plug and the shape bending of second layer mandrel surface restriction from top to bottom.
Embodiments in accordance with the present invention, each layer plug is identical perpendicular to the cross sectional shape of length direction.
Embodiments in accordance with the present invention, the plug is hexagon perpendicular to the cross sectional shape of length direction.
Embodiments in accordance with the present invention, the prepreg is that thermosetting resin impregnates the prepreg that fiber or fabric are made.
Embodiments in accordance with the present invention, the fiber be carbon fiber, metallic fiber, carbon fiber, boron fibre, asbestos fibre,
Metallic fiber, aramid fiber, Orlon fiber, polyester fiber, nylon fiber, vinylon fiber, polypropylene fibre, polyimides are fine
One or more in dimension, cotton fiber and sisal hemp；The thermosetting resin be selected from epoxy resin, phenolic resin, vinylite,
Benzoxazine colophony, polyimide resin, bimaleimide resin, Lauxite, melmac, unsaturated polyester (UP) tree
One kind or any several in fat, organic siliconresin, polyurethane.
Cellular board manufacture mould in the present invention, upper mould is detachably connected with lower mould, and multilayer plug is removably superimposed and sets
Put, it is easy to use, can be according to the honeycomb plate shape that raw material are compressed to needs the need for use.Matched using connecting rod and nut
Close the upper mould of connection and lower mould, easy to manufacture and easy to use.Plug is set to hollow tubulose, has not only saved raw material but also can mitigate
The overall weight of mould, convenient in carrying.Using connecting plate, the bonding strength of upper mould and lower mould can be strengthened, keep multilayer plug
Stabilization.
The manufacture method of the thermosetting resin cellular board in the present invention, can as needed design the shape and the first core of plug
The shape of block, the second pellet, can manufacture the cellular board of variously-shaped honeycomb hole.Plug is easily laid and can easily be moved back
Go out, it is easy to use.Mould is demountable structure, using, it is easy to maintenance.Using the method in the present invention, can easily and fast give birth to
Heat production thermosetting resin cellular board.
Brief description of the drawings
Fig. 1 is the mould structure schematic diagram that the present invention is used.
Fig. 2 is the mould partial structurtes front view in the present invention
Fig. 3 is lower die structure schematic diagram.
Fig. 4 is the structural representation after the mould laying ground floor plug that the present invention is used.
Fig. 5 is the part A structure enlarged diagram in Fig. 4.
Fig. 6 is that the structural representation after second layer plug is laid on the basis of Fig. 4.
Fig. 7 is the part B structure enlarged diagram in Fig. 6.
Fig. 8 is upper mould and most last layer plug matching relationship schematic diagram.
Fig. 9 is the C portion structure enlarged diagram in Fig. 8.
Figure 10 is the thermosetting resin honeycomb plate structure schematic diagram of the inventive method production.
Specific embodiment
The present invention is described in further details below in conjunction with accompanying drawing.
As shown in Figures 1 to 9, cellular board manufacture mould, the mould includes lower mould 11, upper mould 12 and multilayer plug 13.
Upper mould 11 and the lower interval setting of mould 12, the superposition of multilayer plug 13 are arranged between mould 11 and lower mould 12.As shown in Fig. 2 described
Lower mould 11 includes base plate 14 and multiple first pellets 15, the multiple interval setting of first pellet 15.First pellet 15 is arranged at
The upper surface 141 of base plate simultaneously protrudes from the upper surface 141 of base plate.According to being actually needed for using, can also be in two the first cores
Cushion block 16 is set between block 15.The upper mould 12 includes top board 121.Multiple second grooves 122 are provided with top board 121.It is multiple
The interval setting of second groove 122.Second groove 122 upwardly extends selected depth from the lower surface 123 of top board.Base plate 14 and top
Plate 121 is connected using many connecting rods 21.The every end of connecting rod 21 is provided with screw thread (not shown).The top and bottom of connecting rod 21
It is respectively arranged with four nuts 22.Nut 22 is engaged with connecting rod 21 and is connected top board 121 and base plate 14.Showing as depicted
In example, mould is additionally provided with connecting plate, and connecting plate includes the vertical connecting plate 31 of polylith and polylith cross connecting plate 32.Vertical connection
The two ends of plate 31 are connected with top board 121 and base plate 14 respectively.The two ends of cross connecting plate 32 are connected with vertical connecting plate 31 respectively.
Multilayer plug 13 is equipped between top board 121 and base plate 14.Every layer of number of plug 13 is multiple, each layer of multiple
The interval setting of plug 13.Plug 13 is tubular structure, is provided with tube chamber.
Be compressed to for prepreg cellular by multilayer plug 13.Upper mould 11, lower mould 12 and each layer plug are used to presoak multilayer
Material is compressed to cellular.
The manufacture method of thermosetting resin cellular board, uses mould as shown in Figures 1 to 9.The mould includes lower mould
11st, upper mould 12 and multilayer plug.Upper mould 11 and the lower interval setting of mould 12, multilayer plug superposition be arranged on mould 11 and lower mould 12 it
Between.As shown in figure 3, the lower mould 11 includes base plate 14 and multiple first pellets 15, the multiple interval setting of first pellet 15.
First pellet 15 is arranged at the upper surface 141 of base plate and protrudes from the upper surface 141 of base plate.According to being actually needed for using, also
Cushion block 16 can be set between two the first pellets 15.As shown in Figure 8, Figure 9, the upper mould 12 includes top board 121.Top board
Multiple second grooves 122 are provided with 121.Multiple interval settings of second groove 122.Lower surface of second groove 122 from top board
123 upwardly extend selected depth.Multilayer plug is equipped between top board 121 and base plate 14.Upper mould 11, lower mould 12 and each layer core
Rod is cellular for multilayer prepreg to be compressed to.
The manufacture method of thermosetting resin cellular board, specifically includes following steps：
Bottom prepreg (not shown) is laid on the lower mould 11, the bottom prepreg is according to plate upper surface
141st, the shape bending that the surface of 16 and first pellet of cushion block 15 limits.
As shown in Figure 4 and Figure 5, ground floor plug 131 is laid on bottom prepreg, the number of ground floor plug 131 is many
It is individual.Ground floor plug 131 is embedded between two the first pellets 15.The lower surface 132 of each ground floor plug 131 is less than the first core
Block upper surface 151, the upper surface 133 of each ground floor plug protrudes from the first its upper surface 151.It is of the invention preferred
Embodiment, ground floor plug 131 is embedded between the first pellet 15 along the half of short transverse.Ground floor plug lower surface 132 is pressed
Lean against on bottom prepreg.
Ground floor prepreg is laid on ground floor plug 131, ground floor prepreg is along the core of ground floor plug 131 and first
The shape bending that block 15 is limited.The ground floor prepreg and bottom prepreg are between two neighboring ground floor plug 131
First its upper surface 151 is contacted.
As shown in Figure 6 and Figure 7, second layer plug 134 is laid on ground floor prepreg, the number of second layer plug 134 is
It is multiple.Each second layer plug 134 is identical with the shape of ground floor plug 131 and size.Each second layer plug 134 is along height side
To half be embedded in two ground floor plugs 131 between.The lower surface 135 of each second layer plug is upper less than ground floor plug
Surface 133.Upper surface 133 of the upper surface 136 of each second layer plug higher than ground floor plug.The lower surface of second layer plug
135 compress ground floor prepreg.
Second layer prepreg is laid on second layer plug 134, second layer prepreg is along second layer plug and ground floor core
The surface configuration bending that rod is limited.The second layer prepreg and ground floor prepreg two neighboring second layer plug 134 it
Between ground floor plug upper surface 133 contact.
As shown in Figure 8 and Figure 9, each layer plug is sequentially overlapped, until most last layer plug 137 and top layer prepreg.Top layer
The prepreg shape bending that second layer mandrel surface is limited along most last layer plug and from top to bottom.
The mould 12 in the laying of top layer prepreg.The upper mould 12 has top board 121.Multiple second is provided with top board 121
Groove 122.Multiple interval settings of second groove 122.Second groove 122 upwardly extends selected depth from the lower surface 123 of top board
Degree.Second groove 122 is half of each layer plug perpendicular to length direction section perpendicular to the section of length direction so that most gone up
One layer of plug 137 is embedded in the second groove 122 along the half of short transverse.Second groove 122 is perpendicular to the section of length direction
Be each layer plug perpendicular to the half in length direction section so that most last layer plug 137 along short transverse half insertion the
In two grooves 122
Mould and each layer prepreg are heated together, each layer prepreg is heating and curing, neighbouring each layer prepreg
In contact site bonding.Mould 11, each layer plug and lower mould 12 are exited, that is, is made thermosetting resin cellular board as shown in Figure 10
100。
According to one embodiment of present invention, plug can determine its shape of cross section according to actual requirement.Such as scheming institute
Plug cross section described in the example shown is hexagon.
The prepreg is that thermosetting resin impregnates the prepreg that fiber or fabric are made.The fiber is carbon fiber, gold
Category fiber, carbon fiber, boron fibre, asbestos fibre, metallic fiber, aramid fiber, Orlon fiber, polyester fiber, nylon fiber, dimension
One or more in nylon fiber, polypropylene fibre, polyimide fiber, cotton fiber and sisal hemp.The thermosetting resin choosing
From epoxy resin, phenolic resin, vinylite, benzoxazine colophony, polyimide resin, bimaleimide resin, urea
One kind or any several in urea formaldehyde, melmac, unsaturated polyester resin, organic siliconresin, polyurethane.It is described pre-
Leaching material can also include conventional plastic additive, such as antioxidant, fire retardant, lubricant, plasticizer, filler.
It is of the present invention it is upper and lower wait represent direction word be consult and use relatively general with Fig. 2 to describe conveniently
Read.
Cellular board manufacture mould in the present invention, upper mould is detachably connected with lower mould, and multilayer plug is removably superimposed and sets
Put, it is easy to use, can be according to the honeycomb plate shape that raw material are compressed to needs the need for use.Matched using connecting rod and nut
Close the upper mould of connection and lower mould, easy to manufacture and easy to use.Plug is set to hollow tubulose, has not only saved raw material but also can mitigate
The overall weight of mould, convenient in carrying.Using connecting plate, the bonding strength of upper mould and lower mould can be strengthened, keep multilayer plug
Stabilization.
The manufacture method of the thermosetting resin cellular board in the present invention, can as needed design the shape and the first core of plug
The shape of block, the second pellet, can manufacture the cellular board of variously-shaped honeycomb hole.Plug is easily laid and can easily be moved back
Go out, it is easy to use.Mould is demountable structure, using, it is easy to maintenance.Using the method in the present invention, can easily and fast give birth to
Heat production thermosetting resin cellular board.
Embodiment in the present invention is only used for that the present invention will be described, does not constitute the limitation to right,
Other substantially equivalent replacements that those skilled in that art are contemplated that, all fall in the scope of protection of the present invention.
Claims (20)
1. cellular board manufactures mould, it is characterised in that including
Upper mould；
Lower mould；
Multilayer plug, every layer of plug number is multiple, and removably superposition is set；The multilayer plug is used for multilayer tabular material
Material is compressed to cellular；
Upper mould is set and is detachably connected with lower mode spacing, and the multilayer plug is arranged between the upper mould and the lower mould；
The upper mould holds the multilayer plug with the lower die clamp.
2. cellular board according to claim 1 manufactures mould, it is characterised in that the lower mould includes base plate,
It is provided with the base plate：
Multiple first pellets；First pellet is arranged at plate upper surface and protrudes from the plate upper surface；At the bottom
Ground floor plug, the upper surface of the upper surface higher than the first pellet of ground floor plug, the lower surface of ground floor plug are laid on plate
Less than the upper surface of the first pellet；
Or multiple first grooves, first groove extends downwardly from the plate upper surface, is laid on the base plate
Ground floor plug, ground floor plug is partially submerged into the first groove along short transverse, is partially protrude through the first groove.
3. cellular board according to claim 1 and 2 manufactures mould, it is characterised in that the upper mould includes top board；The top
It is provided with plate：
Multiple second pellets；Second pellet is arranged at top board lower surface and protrudes from the top board lower surface；The top board
It is pressed against on most last layer plug, the most lower surface of last layer plug is less than the lower surface of the second pellet, most last layer plug
Lower surface of the upper surface higher than the second pellet；
Or multiple second grooves, second groove upwardly extends from the top board lower surface, and the top board is pressed against most
On last layer plug, most last layer plug is partially submerged into the second groove along short transverse, is partially protrude through the second groove.
4. cellular board according to claim 1 manufactures mould, it is characterised in that each layer plug is perpendicular to length direction
Cross sectional shape it is identical.
5. cellular board according to claim 4 manufactures mould, it is characterised in that the plug cuts perpendicular to length direction
Face is shaped as hexagon.
6. cellular board according to claim 1 manufactures mould, it is characterised in that the upper mould is with the lower mould by being connected
Part is connected.
7. cellular board according to claim 6 manufactures mould, it is characterised in that the connector includes connecting rod, the company
Boom end is provided with screw thread；The connecting rod two ends are each passed through the upper mould and the lower mould；The connecting rod two ends threaded connection
There are one or more nuts；One or more of nuts are engaged with the connecting rod and are connected the upper mould and the lower mould.
8. the cellular board according to claim 1,6 or 7 manufactures mould, it is characterised in that the connector also includes multiple
Connecting plate, the multiple connecting plate interval setting is simultaneously connected with the upper mould and the lower mould.
9. cellular board according to claim 8 manufacture mould, it is characterised in that the connecting plate include vertical connecting plate and
Cross connecting plate；The vertical connecting plate is connected with the upper mould and the lower mould；The cross connecting plate is described perpendicular with multiple
Connected to connecting plate.
10. the cellular board according to claim 1 or 9 manufactures mould, it is characterised in that the plug is tubular structure, institute
Stating plug has tube chamber.
The manufacture method of 11. thermosetting resin cellular boards, it is characterised in that
Mould is provided, the mould includes lower mould, upper mould and multiple plugs；The upper mould is set with the lower mode spacing；It is described
Plug described in multilayer is provided between upper mould and the lower mould, every layer of plug number is multiple；
Every layer of plug upper surface is equipped with prepreg, and be compressed to for multilayer prepreg by the upper die and lower die and the multilayer plug
It is cellular；
Mould and prepreg are heated, each layer prepreg is heating and curing, neighbouring each layer prepreg is viscous in contact site
Connect；
Mould, each layer plug and lower mould are exited, that is, is made thermosetting resin cellular board.
The manufacture method of 12. thermosetting resin cellular boards according to claim 11, it is characterised in that including step：
The lower mould includes base plate；
Ground floor plug is laid on the base plate, ground floor plug number is multiple, multiple ground floor plug interval settings；So
Ground floor prepreg is laid on ground floor plug afterwards, makes ground floor prepreg according to plate upper surface and ground floor mandrel surface
The shape bending of restriction；
Second layer plug is laid on ground floor prepreg, second layer plug number is multiple；Each second layer plug is embedded in phase
Between adjacent two ground floor plugs；Second layer plug lower surface is less than ground floor plug upper surface, and second layer plug upper surface is high
In ground floor plug upper surface；Second layer plug lower surface is pressed against on ground floor prepreg；
Second layer prepreg is laid in second layer plug upper surface again, second layer prepreg is according to ground floor plug and second layer core
The shape bending that rod is limited；Second layer prepreg is contacted with ground floor prepreg between two neighboring second layer plug；
It is sequentially overlapped each layer plug and lays multilayer prepreg successively, until most last layer plug；
Mould in laying, the mold has top board；The top board is pressed against on most last layer plug；Base plate and top board are by each layer core
Rod and each layer prepreg are compressed；
Then upper mould, each layer plug, each layer prepreg and lower mould are heating and curing together, neighbouring each layer prepreg is connecing
Contact portion position bonding；
Mould, each layer plug and lower mould are exited, that is, is made thermosetting resin cellular board.
The manufacture method of the 13. thermosetting resin cellular board according to claim 11 or 12, it is characterised in that the lower mould
Including base plate, it is provided with the base plate：
Multiple first pellets；First pellet is arranged at plate upper surface and protrudes from the plate upper surface；At the bottom
Ground floor plug, the upper surface of the upper surface higher than the first pellet of ground floor plug, the lower surface of ground floor plug are laid on plate
Less than the upper surface of the first pellet；
Or multiple first grooves, first groove extends downwardly from the plate upper surface, is laid on the base plate
Ground floor plug, ground floor plug is partially submerged into the first groove along short transverse, is partially protrude through the first groove.
The manufacture method of 14. thermosetting resin cellular boards according to claim 13, it is characterised in that on the base plate
Laying bottom prepreg, the bottom prepreg bends or the bottom of along along the shape that plate upper surface and the first pellet surface limit
The shape bending that plate upper surface and the first groove are limited；Ground floor plug is laid on bottom prepreg.
The manufacture method of the 15. thermosetting resin cellular board according to claim 11 or 12, it is characterised in that the upper mould
Including top board；It is provided with the top board：
Multiple second pellets；Second pellet is arranged at top board lower surface and protrudes from the top board lower surface；The top board
It is pressed against on most last layer plug, the most lower surface of last layer plug is less than the lower surface of the second pellet, most last layer plug
Lower surface of the upper surface higher than the second pellet；
Or multiple second grooves, second groove upwardly extends from the top board lower surface, and the top board is pressed against most
On last layer plug, most last layer plug is partially submerged into the second groove along short transverse, is partially protrude through the second groove.
The manufacture method of 16. thermosetting resin cellular boards according to claim 15, it is characterised in that most go up one described
Top layer prepreg is laid on layer plug, second layer mandrel surface is limited the top layer prepreg along most last layer plug and from top to bottom
Fixed shape bending.
The manufacture method of the 17. thermosetting resin cellular board according to claim 11 or 12, it is characterised in that each layer
Plug is identical perpendicular to the cross sectional shape of length direction.
The manufacture method of 18. thermosetting resin cellular boards according to claim 17, it is characterised in that the plug is vertical
In length direction cross sectional shape be hexagon.
The manufacture method of 19. thermosetting resin cellular boards according to claim 11, it is characterised in that the prepreg is
Thermosetting resin impregnates the prepreg that fiber or fabric are made.
The manufacture method of 20. thermosetting resin cellular boards according to claim 19, it is characterised in that the fiber is carbon
Fiber, metallic fiber, carbon fiber, boron fibre, asbestos fibre, metallic fiber, aramid fiber, Orlon fiber, polyester fiber, nylon
One or more in fiber, vinylon fiber, polypropylene fibre, polyimide fiber, cotton fiber and sisal hemp；The thermosetting
Resin is selected from epoxy resin, phenolic resin, vinylite, benzoxazine colophony, polyimide resin, BMI tree
One kind or any several in fat, Lauxite, melmac, unsaturated polyester resin, organic siliconresin, polyurethane.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108609054A (en) * | 2018-06-08 | 2018-10-02 | 苏州云逸航空复合材料结构有限公司 | Compound ceiling of bus and preparation method thereof |
| CN110039874A (en) * | 2018-11-22 | 2019-07-23 | 阜宁云逸航空复合材料有限公司 | A kind of production method of honeycomb |
| CN111674058A (en) * | 2020-06-01 | 2020-09-18 | 南京航空航天大学 | Preparation device and method of carbon fiber three-dimensional woven honeycomb composite material |
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2017
- 2017-01-26 CN CN201710061730.6A patent/CN106827321A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108609054A (en) * | 2018-06-08 | 2018-10-02 | 苏州云逸航空复合材料结构有限公司 | Compound ceiling of bus and preparation method thereof |
| CN110039874A (en) * | 2018-11-22 | 2019-07-23 | 阜宁云逸航空复合材料有限公司 | A kind of production method of honeycomb |
| CN111674058A (en) * | 2020-06-01 | 2020-09-18 | 南京航空航天大学 | Preparation device and method of carbon fiber three-dimensional woven honeycomb composite material |
| CN111674058B (en) * | 2020-06-01 | 2021-06-29 | 南京航空航天大学 | Preparation device and method of carbon fiber three-dimensional woven honeycomb composite material |
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