CN106826540A - A kind of smooth curable type resin ground pad and preparation method thereof - Google Patents
A kind of smooth curable type resin ground pad and preparation method thereof Download PDFInfo
- Publication number
- CN106826540A CN106826540A CN201710081383.3A CN201710081383A CN106826540A CN 106826540 A CN106826540 A CN 106826540A CN 201710081383 A CN201710081383 A CN 201710081383A CN 106826540 A CN106826540 A CN 106826540A
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- CN
- China
- Prior art keywords
- curable type
- type resin
- ground pad
- resin ground
- smooth
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention provides a kind of smooth curable type resin ground pad, it is prepared by following raw material：The diamond of 2~10wt%；The abrasive material of 10~50wt%；The filler of 10~40wt%；The light curable type resin of 20~60wt%.Present invention also provides a kind of preparation method of smooth curable type resin ground pad.By adding light curable type resin in the light curable type resin ground pad that the application is provided, it is effectively connected to all powders as bonding agent, light curable type resin ground pad is had preferable intensity, good stability, service life.In addition, the cost of the application light curable type resin ground pad is relatively low, preparation method is simple.
Description
Technical field
The present invention relates to grinding technique field, more particularly to a kind of smooth curable type resin ground pad and preparation method thereof.
Background technology
At present, the processing enterprise such as most domestic glass, ceramics is all using traditional free abrasive grinding technics, that is, to exist
Free abrasive is added to be ground in cooling water, this lapping mode existence and stability is poor, stock-removing efficiency is low, converted products yield
The problems such as low and rear operation is difficult.In order to solve above-mentioned technical barrier, solidified abrasive grinding technique is gradually subject to researcher
Favor.Solidified abrasive grinding technique is mainly abrasive material is fixed on above a mill by bonding agent, easy to operate, plus
Work efficiency high.The Chinese patent of Publication No. CN102632453A discloses a kind of thermosetting resin grinding pad and its preparation side
Method, but the grinding pad has that relatively costly, mechanical strength is poor, cutting force is unstable and service life is short.
The content of the invention
Present invention solves the technical problem that being the light curable type for providing a kind of big intensity, good stability and long service life
Resin ground pad.
In view of this, this application provides a kind of smooth curable type resin ground pad, prepared by following raw material：
Preferably, the abrasive material is selected from one or more in alundum (Al2O3), silica and carborundum.
Preferably, described filler is selected from one or more in calcium carbonate, barium sulfate and sodium acid carbonate.
Preferably, the smooth curable type resin is selected from epoxy acrylate, urethane acrylate and polyether acrylate
One or more.
Preferably, the granularity of the diamond is 10~50 μm, and the granularity of the abrasive material is 20~80 μm, described filler
Granularity is 20~100 μm.
Preferably, the content of the diamond is 4~10wt%, and the content of abrasive material is 15~35wt%, the content of filler
It is 20~30wt%, the content of light curable type resin is 30~50wt%.
Present invention also provides the preparation method of the light curable type resin ground pad described in such scheme, including：
To be filled into mould after diamond, abrasive material, filler and light curable type mixed with resin, then carry out froth in vacuum treatment,
Obtain initial grinding pad；
In the initial grinding pad surface sticking film, then photocuring is carried out, obtain light curable type resin ground pad.
Preferably, the time of the mixing is 10~30min, and the time of the froth in vacuum treatment is 10~60min, institute
The time for stating photocuring is 3~10min.
Preferably, the photocuring is carried out in UV curing ovens, and the film is PET film.
This application provides a kind of smooth curable type resin ground pad, it includes：The diamond of 2~10wt%；10~50wt%
Abrasive material；The filler of 10~40wt%；The light curable type resin of 20~60wt%；Wherein diamond mainly plays ablation, abrasive material
Effect with assistant grinding, filler enhances the intensity of grinding pad, and light curable type resin effectively connects all powder as bonding agent
Material；Therefore, the application provide light curable type resin ground pad by adding auxiliary abrasive, using light-cured resin curing molding,
Enhance the intensity of grinding pad and improve the service life of grinding pad well.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, but
It should be appreciated that these descriptions are simply to further illustrate the features and advantages of the present invention, rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of smooth curable type resin ground pad, prepared by following raw material：
This application provides a kind of smooth curable type resin ground pad, by introducing light curable type resin in grinding pad, its is effective
The intensity of grinding pad is enhanced, and improves the service life of grinding pad.Therefore, the light curable type resin ground pad that the application is provided
Intensity is big, impact resistance, grinding efficiency high, good stability, long service life, be widely used in the manufacture fields such as glass, ceramics.
According to the present invention, the smooth curable type resin ground pad is prepared into by diamond, abrasive material, filler and light curable type resin
Arrive.Wherein, the diamond mainly plays ablation in light curable type resin ground pad, the content of the diamond for 2~
10wt%, in a particular embodiment, the content of the diamond is 4~10wt%, specifically, the content of the diamond is
4wt%, 5.5wt%, 6wt%, 7wt%, 8.5wt%, 9wt% or 10wt%.
The abrasive material mainly plays assistant grinding, herein described abrasive material be selected from alundum (Al2O3), silica and
One or more in carborundum.The content of the abrasive material is 10~50wt%, in certain embodiments, the content of the abrasive material
It is 15~35wt%, in some specific embodiments, the content of the abrasive material is 20wt%~30wt%.
Described filler be mainly used in strengthen grinding pad intensity, filler described herein be selected from calcium carbonate, barium carbonate and
One or more in sodium acid carbonate.The content of described filler is 10~40wt%, in some specific embodiments, described filler
Content be 20~30wt%.
The smooth curable type resin as grinding pad matrix, it is used as bonding agent, effectively connects all powders.The application institute
State one or more during light curable type resin is selected from epoxy acrylic resin, urethane acrylate and polyether acrylate.Institute
The content of light curable type resin is stated for 20~60wt%, in certain embodiments, the content of the smooth curable type resin for 30~
50wt%, in some specific embodiments, the content of the smooth curable type resin is 35~40wt%.
The granularity of diamond described herein is 10~50 μm, specifically, the granularity of the diamond can be 10~20 μ
M, or 20~40 μm, can also be 40~50 μm；The granularity of the abrasive material is 20~80 μm, in certain embodiments, described
The granularity of abrasive material can be 20~40 μm, or 40~50 μm, can also be 50~60 μm；The granularity of described filler is 20~100 μ
M, in some specific embodiments, the granularity of described filler can be 30~50 μm, or 50~70 μm, can also be 70~90 μ
m.The granularity of the diamond and the abrasive material and light curable type resin ground pad into positive correlation；The granularity of filler is to light curable type resin
The intensity and service life of grinding pad produce considerable influence.
Present invention also provides the preparation method of above-mentioned smooth curable type resin ground pad, including：
To be filled into mould after diamond, abrasive material, filler and light curable type mixed with resin, then carry out froth in vacuum treatment,
Obtain initial grinding pad；
In the initial grinding pad surface sticking film, then photocuring is carried out, obtain light curable type resin ground pad.
Present invention also provides the preparation method of light curable type resin ground pad, idiographic flow is：Mixing-sizing-de-bubble-viscous
Patch film-photocuring；The preparation method cost is relatively low, easy to operate.
During light curable type resin ground pad is prepared, the application is first by diamond, abrasive material, filler and light curable type tree
Fat proportionally relation mixing；The time of the mixing is 10~30min.The mixture filling that will be obtained after blending
Tentatively shaped in mould, then carried out froth in vacuum treatment, the froth in vacuum is processed as those skilled in the art and known
Treatment, this application is had no particular limits, froth in vacuum treatment is removing the bubble in mixture.
After initial grinding pad is obtained, then in its surface mount film, with contribute to reinforced resin grinding pad particle it
Between interaction force, it is ensured that the stability of grinding pad.The film is film well known to those skilled in the art, to this this Shen
Please have no particular limits, example, the film is preferably PET film.The application is finally carried out the grinding pad of sticking film
Photocuring, obtains light curable type resin ground pad.Resin matrix described herein is light curable type resin, then the application is solid using light
The mode of change, so as to get grinding pad solidification, finally give light curable type resin ground pad.The time of the photocuring be 3~
10min, the photocuring is preferably carried out in UV curing ovens.
This application provides a kind of smooth curable type resin ground pad and preparation method thereof, the smooth curable type resin ground pad is by gold
Hard rock, filler, abrasive material and light curable type resin matrix are prepared, and its preparation method is molded admittedly with light by casting mold.This
Apply for that the light curable type resin ground pad intensity for preparing big, impact resistance, grinding efficiency is high, good stability, long service life extensively should
For manufacture fields such as glass, ceramics.
For a further understanding of the present invention, the light curable type resin ground pad that is provided the present invention with reference to embodiment and its
Preparation method is described in detail, and protection scope of the present invention is not limited by the following examples.
Embodiment 1
The light curable type resin ground pad is made by the following method：Weigh the diamond that 10 gram particle footpaths are 10~20 μm, 30 grams
Particle diameter is 20~40 μm of alundum (Al2O3), and 20 grams 30~50 μm of calcium carbonate, 40 grams of epoxy acrylates are mixed
It is filled into mould after 25min, froth in vacuum treatment 30min, then surface mount PET film, light is consolidated in being positioned over UV curing ovens
Change 5min, naturally cool to room temperature.
Certain epoxy resin grinding pad mainly constitutes and is：Epoxy resin addition is 40g, and diamond addition is 10g, three oxygen
Change two aluminium additions for 30g, calcium carbonate 20g；Its preparation method is：Second step, all raw material is sufficiently mixed；Second step,
Raw material are uniformly filled into mould；3rd step, be placed in baking oven high temperature solidification (under 70 ° of -80 ° of high temperature solidify 0.5-1 it is small
When, then solidify 0.5-1 hours under 130 ° of -140 ° of high temperature), obtain being molded grinding pad.
The properties data of the light curable type resin ground pad of the present invention of table 1 and certain epoxy resin grinding pad
Table
Embodiment 2
The light curable type resin ground pad is made by the following method：Weigh the diamond that 10 gram particle footpaths are 20~40 μm, 30 grams
Particle diameter is 40~50 μm of silica, and 20 grams 50~70 μm of barium sulfate, 40 grams of urethane acrylates are mixed
It is filled into mould after 25min, froth in vacuum treatment 30min, then surface mount PET film, light is consolidated in being positioned over UV curing ovens
Change 5min, naturally cool to room temperature.
Certain thermosetting resin grinding pad mainly constitutes and is：Resinoid bond addition is 30wt%, and abrasive material addition is
20wt%, filler addition is 30wt%；Preparation method with the thermosetting resin grinding pad in embodiment 1 preparation method.
The properties contrast table of the smooth curable type resin ground pad of the invention of table 2 and certain thermosetting resin grinding pad
Embodiment 3
The light curable type resin ground pad is made by the following method：Weigh the diamond that 10 gram particle footpaths are 40~50 μm, 30 grams
Particle diameter is 50~60 μm of carborundum, and 20 grams 70~90 μm of sodium acid carbonate is substituted, and 40 grams of polyether acrylates mix 25
It is filled into mould after minute, froth in vacuum treatment 30min, then surface mount PET film, being positioned in UV curing ovens carries out light
Solidification 5min, naturally cools to room temperature.
Certain thermosetting resin grinding pad mainly constitutes and is：Resinoid bond addition is 35wt%, and diamond addition is
8wt%, calcium silicates addition is 20wt%, and carborundum addition is 20wt%；Preparation method is with the thermosetting tree in embodiment 1
The preparation method of fat grinding pad.
The properties contrast table of the smooth curable type resin ground pad of the invention of table 3 and certain thermosetting resin grinding pad
The explanation of above example is only intended to help and understands the method for the present invention and its core concept.It should be pointed out that right
For those skilled in the art, under the premise without departing from the principles of the invention, the present invention can also be carried out
Some improvement and modification, these are improved and modification is also fallen into the protection domain of the claims in the present invention.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or uses the present invention.
Various modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The scope most wide for causing.
Claims (9)
1. a kind of smooth curable type resin ground pad, is prepared by following raw material：
2. smooth curable type resin ground pad according to claim 1, it is characterised in that the abrasive material be selected from alundum (Al2O3),
One or more in silica and carborundum.
3. smooth curable type resin ground pad according to claim 1, it is characterised in that described filler is selected from calcium carbonate, sulfuric acid
One or more in barium and sodium acid carbonate.
4. smooth curable type resin ground pad according to claim 1, it is characterised in that the smooth curable type resin is selected from epoxy third
One or more in olefin(e) acid ester, urethane acrylate and polyether acrylate.
5. smooth curable type resin ground pad according to claim 1, it is characterised in that the granularity of the diamond is 10~50
μm, the granularity of the abrasive material is 20~80 μm, and the granularity of described filler is 20~100 μm.
6. smooth curable type resin ground pad according to claim 1, it is characterised in that the content of the diamond is 4~
10wt%, the content of abrasive material is 15~35wt%, and the content of filler is 20~30wt%, the content of light curable type resin for 30~
50wt%.
7. the preparation method of the light curable type resin ground pad described in claim 1, including：
To be filled into mould after diamond, abrasive material, filler and light curable type mixed with resin, then carry out froth in vacuum treatment, obtained
Initial grinding pad；
In the initial grinding pad surface sticking film, then photocuring is carried out, obtain light curable type resin ground pad.
8. preparation method according to claim 7, it is characterised in that the time of the mixing is 10~30min is described true
The time of empty de-bubble treatment is 10~60min, and the time of the photocuring is 3~10min.
9. preparation method according to claim 7, it is characterised in that the photocuring is carried out in UV curing ovens, described
Film is PET film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710081383.3A CN106826540A (en) | 2017-02-15 | 2017-02-15 | A kind of smooth curable type resin ground pad and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710081383.3A CN106826540A (en) | 2017-02-15 | 2017-02-15 | A kind of smooth curable type resin ground pad and preparation method thereof |
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| CN106826540A true CN106826540A (en) | 2017-06-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710081383.3A Pending CN106826540A (en) | 2017-02-15 | 2017-02-15 | A kind of smooth curable type resin ground pad and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113442430A (en) * | 2021-06-30 | 2021-09-28 | 广东工业大学 | Preparation method and application of diamond composite material based on photocuring 3D printing molding |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1266392A (en) * | 1997-09-11 | 2000-09-13 | 诺顿公司 | Structured abrasives with adhered functional powders |
| CN1586002A (en) * | 2001-11-13 | 2005-02-23 | 东洋纺织株式会社 | Grinding pad and method of producing the same |
| CN1610962A (en) * | 2001-12-28 | 2005-04-27 | 旭化成电子材料元件株式会社 | Polishing pad, process for producing the same, and method of polishing |
| CN1792554A (en) * | 2005-12-23 | 2006-06-28 | 浙江工业大学 | Method for preparing grinding dish of photosensitive resin binding agent |
| CN101175608A (en) * | 2005-04-14 | 2008-05-07 | 圣戈本磨料股份有限公司 | Abrasive articles and methods for making same |
| CN102632453A (en) * | 2012-04-24 | 2012-08-15 | 浙江浦江敏锐精密机械科技有限公司 | Thermosetting resin grinding pad and preparation method thereof |
| CN105150120A (en) * | 2015-09-01 | 2015-12-16 | 河南科技学院 | Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer |
-
2017
- 2017-02-15 CN CN201710081383.3A patent/CN106826540A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1266392A (en) * | 1997-09-11 | 2000-09-13 | 诺顿公司 | Structured abrasives with adhered functional powders |
| CN1586002A (en) * | 2001-11-13 | 2005-02-23 | 东洋纺织株式会社 | Grinding pad and method of producing the same |
| CN1610962A (en) * | 2001-12-28 | 2005-04-27 | 旭化成电子材料元件株式会社 | Polishing pad, process for producing the same, and method of polishing |
| CN101175608A (en) * | 2005-04-14 | 2008-05-07 | 圣戈本磨料股份有限公司 | Abrasive articles and methods for making same |
| CN1792554A (en) * | 2005-12-23 | 2006-06-28 | 浙江工业大学 | Method for preparing grinding dish of photosensitive resin binding agent |
| CN102632453A (en) * | 2012-04-24 | 2012-08-15 | 浙江浦江敏锐精密机械科技有限公司 | Thermosetting resin grinding pad and preparation method thereof |
| CN105150120A (en) * | 2015-09-01 | 2015-12-16 | 河南科技学院 | Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113442430A (en) * | 2021-06-30 | 2021-09-28 | 广东工业大学 | Preparation method and application of diamond composite material based on photocuring 3D printing molding |
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Application publication date: 20170613 |
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