CN106826538B - Milling apparatus with automatic discharging function - Google Patents
Milling apparatus with automatic discharging function Download PDFInfo
- Publication number
- CN106826538B CN106826538B CN201611232582.1A CN201611232582A CN106826538B CN 106826538 B CN106826538 B CN 106826538B CN 201611232582 A CN201611232582 A CN 201611232582A CN 106826538 B CN106826538 B CN 106826538B
- Authority
- CN
- China
- Prior art keywords
- chip
- driving box
- grinding head
- mounting table
- machine table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The present invention relates to optical crystal chip production fields, specially a kind of milling apparatus with automatic discharging function, include machine table for placing chip to be ground and the grinding mechanism being ground to chip, grinding mechanism is located at the top of machine table, it includes grinding head, drive rod and driving box to grind mechanism, grinding head is slidably fitted in driving box, and the lower end of drive rod is stretched into driving box and connect with grinding head；The two sides of driving box are rotatably connected to supporting rod；Mounting table is fixed in hollow cavity inside machine table, mounting table is equipped with adsorption hole；The top surface of machine table is provided with the putting hole that can accommodate chip, and the both sides of putting hole are communicated with slot；It is connected with gas-guide tube between grinding mechanism and machine table, the inlet end of gas-guide tube is located at the top of grinding head and is connected to driving box, and the outlet side of gas-guide tube is connected to mounting table.The invention is intended to provide a kind of milling apparatus for the automatic blanking operation that chip may be implemented.
Description
Technical field
The present invention relates to optical crystal chip production field, specially a kind of milling apparatus with automatic discharging function.
Background technology
A kind of light transmission equipment of the chip as imaging device, needs to be ground throwing to the surface of chip in process
Light processing.The basic fundamental of wafer grinding is grinding, passes through the rotation of grinder nog plate and the grinding agent being dispersed on nog plate
Chip to making planetary motion carries out continuous grinding, and to reach the tool marks generated in removal slicing processes, slice damages
Hinder layer and controls the purpose of thickness.
Existing grinder includes the grinding head placed the workbench of chip and be ground to chip, first will be to be ground
After chip is put on workbench, grinding head is ground the chip of placement on the table.But common grinder is not
There are the cutting agency of setting chip, chip to need worker manually to remove chip from workbench after completing to grind, such one
Come, just increase the workload of worker, extend the process time needed for wafer grinding, to reduce the processing effect of chip
Rate.
Invention content
The invention is intended to provide a kind of milling apparatus for the automatic blanking operation that chip may be implemented.
The present invention provides base case：Milling apparatus with automatic discharging function, including it is used to place crystalline substance to be ground
The machine table of piece and the grinding mechanism that chip is ground, wherein grinding mechanism is located at the top of machine table, grinding mechanism packet
Grinding head is included, can be moved up and down and rotatable drive rod and is socketed on drive rod and downward opening driving box, grinding head
It is slidably fitted in driving box, the lower end of drive rod is stretched into driving box and connect with grinding head；The two sides rotation of driving box connects
It is connected to supporting rod, supporting rod may be reversed after being contacted with machine table；It is fixed in hollow cavity inside machine table for placing chip
Mounting table, mounting table is equipped with the adsorption hole of absorption chip, and the top surface of mounting table offsets with the inner wall for processing countertop；Processing
The top surface of platform is provided with the putting hole that can accommodate chip, and putting hole is located at the surface of mounting table, and the both sides of putting hole are communicated with
It can be inserted into the slot of driving plate；It is connected with gas-guide tube between grinding mechanism and machine table, the inlet end of gas-guide tube is located at grinding head
Top and be connected to driving box, the outlet side of gas-guide tube is connected to mounting table.
The operation principle of base case：First chip to be ground is placed on mounting table；Start grinding mechanism, drive rod
Decline, grinding head declines, and driving box declines with grinding head；During the decline, the supporting rod of both sides is contacted with machine table
After begin turning, grinding head continues to decline, and driving box no longer declines after being contacted with machine table, at this time drive of the grinding head in drive rod
Continue to decline under dynamic, after contact wafers, grinding head no longer declines, and supporting rod stops in machine table at this time；Meanwhile it grinding
When head declines, space between driving box top surface and grinding head increases, at this point, the gas in mounting table by gas-guide tube into
Enter into driving box, the air pressure in mounting table reduces, and chip is adsorbed on mounting table by adsorption hole；Drive rod drives grinding at this time
Head rotation, grinding head relatively rotate with chip, to be ground to chip；After wafer grinding is good, stop grinding head
Rotation, grinding head begins to ramp up, and during grinding head rises, grinding head is contacted with the top surface of driving box, to drive
Driving box starts to move up, while the gas in driving box is entered by gas-guide tube in mounting table, and the air pressure in mounting table increases,
No longer adsorb chip；Grinding head continues to move up with driving box, and supporting rod begins to change into inclination under the drive of driving box at this time
State continues to rise with grinding head, and supporting rod eventually becomes vertical state, and the bottom end of supporting rod is located in slot at this time,
And the chip in putting hole is clamped；After grinding head continues rising, supporting rod then drives chip to rise, to by chip from
It is proposed in putting hole, completes to operate the automatic blanking of chip.
Turnover supporting rod is set, and after good to wafer grinding, during grinding head rises, supporting rod becomes vertical
Chip is clamped in state, to remove chip from mounting table, completes to operate the automatic blanking of chip, reduces work
The amount of labour of people, and then improve the processing efficiency to chip.
The advantageous effect of base case is：1. realizing the overturning of supporting rod using the cooperation of grinding head and workbench, in turn
It realizes that supporting rod operates the automatic blanking of chip, reduces the amount of labour of worker；
2. after declining, stop when in machine table in supporting rod, offset with the side of chip, chip is realized and is positioned, protects
The relative rotation between chip and grinding head has been demonstrate,proved, and then ensure that grinding effect of the grinding head to chip；
3. the change of air pressure in mounting table is realized using the movement of gas-guide tube cooperation grinding head, to realize mounting table to crystalline substance
The absorption of piece ensure that grinding effect of the grinding head to chip.
Preferred embodiment one：As the preferred of basic scheme, the side of slot is communicated with the guide groove for overturning supporting rod.
Advantageous effect：Guide groove is set, after supporting rod drops to and contacted with guide groove, guide groove is oriented to supporting rod, to
The overturning of supporting rod is realized, it is simple in structure.
Preferred embodiment two：Preferably one it is preferred, guide groove close to one end of slot be higher than far from slot one
End.Advantageous effect：Guide groove is higher than one end far from slot close to one end of slot to be arranged, realizes guide groove in vertical side
Upward inclination, convenient for the guiding to supporting rod.
Preferred embodiment three：As the preferred of basic scheme, the lower end of supporting rod is tapered end.Advantageous effect：By supporting rod
Lower end be set as tapered end, after the lower end of supporting rod touches workbench, the tapered end of supporting rod being turned over convenient for supporting rod
Turn.
Preferred embodiment four：As the preferred of basic scheme, the surface of mounting table is equipped with rubber pad.Advantageous effect：It is placing
It will produce extruding when platform adsorbs chip, between chip and mounting table, after rubber pad is set, utilize rubber pad itself
Elasticity, reduce the extruding that chip is subject to.
Preferred embodiment five：As the preferred of basic scheme, the longitudinal section of putting hole is inverted trapezoidal.Advantageous effect：It will place
After the longitudinal section in hole is set as inverted trapezoidal, the side of putting hole can play guiding role to chip, to ensure that chip can be accurate
Be placed on mounting table.
Description of the drawings
Fig. 1 is the structural schematic diagram for the milling apparatus embodiment that the present invention has automatic discharging function；
Fig. 2 is the vertical view that countertop is processed in Fig. 1；
Fig. 3 is the Longitudinal cross section schematic of machine table；
Fig. 4 is the connection diagram of supporting rod and driving box.
Specific implementation mode
Below by specific implementation mode, the present invention is described in further detail：
Reference numeral in Figure of description includes：Machine table 10, mounting table 13, adsorption hole 131, slot 101, putting hole
103, chip 3, supporting rod 231, connecting rod 235, driving box 21, grinding head 23, drive rod 20, gas-guide tube 25, guide groove 107.
Milling apparatus with automatic discharging function as depicted in figs. 1 and 2 includes for placing chip 3 to be ground
Machine table 10 and the grinding mechanism being ground to chip 3, grinding mechanism are located at the top of machine table 10, and grinding mechanism includes grinding
It bistrique 23, drive rod 20 and is socketed on drive rod 20 and downward opening driving box 21, grinding head 23 are slidably fitted in driving
In case 21, the lower end of drive rod 20 is stretched into driving box 21 and is connect with grinding head 23, and the top of drive rod 20 is connected with stepping electricity
Machine；The two sides of driving box 21 are rotatably connected to supporting rod 231, and the lower end of supporting rod 231 is tapered end, supporting rod 231 with plus
Work platform 10 may be reversed after contacting, as shown in figure 4, driving box 21 connects supporting rod 231, driving box 21 and folder by connecting rod 235
It holds and is connected with tension spring between bar 231；
The mounting table 13 for placing chip 3 is fixed in hollow cavity inside machine table 10, the surface of mounting table 13 is set
It is equipped with rubber pad and equipped with the adsorption hole 131 of absorption chip 3, the inner wall of the top surface and 10 top surface of machine table of mounting table 13 offsets；
The top surface of machine table 10 is provided with the putting hole 103 that can accommodate chip 3, and putting hole 103 is located at the surface of mounting table 13, places
The both sides in hole 103 are communicated with the slot 101 of pluggable driving plate；As shown in Figures 2 and 3, the side of slot 101 is communicated with guiding
Slot 107, guide groove 107 are higher than one end far from slot 101 close to one end of slot 101, and driving box 21 is connect with machine table 10
There are gas-guide tube 25, the inlet end of gas-guide tube 25 to be located at the top of grinding head 23 and be connected to driving box 21, the outlet side of gas-guide tube 25
It is connected to mounting table 13.
First chip 3 to be ground is put into putting hole 103, chip 3 falls on mounting table 13 in putting hole 103 after sliding
On；Start grinding mechanism, stepper motor drives drive rod 20 to decline, and grinding head 23 declines, and driving box 21 is under grinding head 23
Drop；During the decline, start to slide along guide groove 107 after the supporting rod 231 of both sides is contacted with machine table 10, be put
Dynamic, grinding head 23 continues to decline, and driving box 21 no longer declines after being contacted with machine table 10, and grinding head 23 is in drive rod 20 at this time
Continue to decline under driving, after contacting with chip 3, grinding head 23 no longer declines, and supporting rod 231 stops in machine table 10 at this time；
Meanwhile when grinding head 23 declines, the space between 21 top surface of driving box and grinding head 23 increases, at this point,
Gas in mounting table 13 is entered by gas-guide tube 25 in driving box 21, and the air pressure in mounting table 13 reduces, and adsorption hole 131 will
Chip 3 is adsorbed on mounting table 13；Drive rod 20 drives grinding head 23 to rotate at this time, and with chip 3 opposite turn occurs for grinding head 23
It is dynamic, to be ground to chip 3；
After chip 3 is ground, stop the rotation of grinding head 23, grinding head 23 is begun to ramp up, and is risen in grinding head 23
In the process, grinding head 23 is contacted with the top surface of driving box 21, to drive driving box 21 to start to move up, while in driving box 21
Gas is entered by gas-guide tube 25 in mounting table 13, and the air pressure in mounting table 13 increases, and no longer adsorbs chip 3；Grinding head 23
Continue to move up with driving box 21, supporting rod 231 begins to change into heeling condition under the drive of driving box 21 at this time, with grinding
First 23 continue to rise, and supporting rod 231 eventually becomes vertical state, the bottom end of supporting rod 231 is located in slot 101 at this time, and
Chip 3 in putting hole 103 is clamped；After grinding head 23 continues rising, supporting rod 231 then drives chip 3 to rise, to
Chip 3 is proposed out of putting hole 103, completes to operate the automatic blanking of chip 3.
Above-described is only the embodiment of the present invention, and the common sense such as well known concrete structure and characteristic are not made herein in scheme
Excessive description.It, without departing from the structure of the invention, can be with it should be pointed out that for those skilled in the art
Several modifications and improvements are made, these should also be considered as protection scope of the present invention, these all do not interfere with what the present invention was implemented
Effect and patent practicability.The scope of protection required by this application should be based on the content of the claims, in specification
The records such as specific implementation mode can be used for explaining the content of claim.
Claims (6)
1. the milling apparatus with automatic discharging function includes machine table for placing chip to be ground and is ground to chip
The grinding mechanism of mill, it is characterised in that：The grinding mechanism is located at the top of the machine table, and the grinding mechanism includes grinding
Head can be moved up and down and rotatable drive rod and is socketed on the drive rod and downward opening driving box, the grinding
Head is slidably fitted in the driving box, and the lower end of the drive rod is stretched into the driving box and connect with the grinding head；Institute
The two sides for stating driving box are rotatably connected to supporting rod, and the supporting rod is swingable after being contacted with the machine table；The processing
The mounting table for placing chip is fixed in hollow cavity inside platform, the mounting table is equipped with the adsorption hole of absorption chip,
The top surface of the mounting table and the inner wall of the processing countertop offset；The top surface of the machine table, which is provided with, can accommodate chip
Putting hole, the putting hole are located at the surface of the mounting table, and the both sides of the putting hole are communicated with the pluggable clamping
The slot of bar；Gas-guide tube is connected between the grinding mechanism and the machine table, the inlet end of the gas-guide tube is positioned at described
The top of grinding head is simultaneously connected to the driving box, and the outlet side of the gas-guide tube is connected to the mounting table.
2. the milling apparatus according to claim 1 with automatic discharging function, it is characterised in that：The side of the slot
It is communicated with the guide groove for swinging the supporting rod.
3. the milling apparatus according to claim 2 with automatic discharging function, it is characterised in that：The guide groove is close
One end of the slot is higher than one end far from the slot.
4. the milling apparatus according to claim 1 with automatic discharging function, it is characterised in that：Under the supporting rod
End is tapered end.
5. the milling apparatus according to claim 1 with automatic discharging function, it is characterised in that：The table of the mounting table
Face is equipped with rubber pad.
6. the milling apparatus according to claim 1 with automatic discharging function, it is characterised in that：The putting hole is indulged
Section is inverted trapezoidal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611232582.1A CN106826538B (en) | 2016-12-28 | 2016-12-28 | Milling apparatus with automatic discharging function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611232582.1A CN106826538B (en) | 2016-12-28 | 2016-12-28 | Milling apparatus with automatic discharging function |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106826538A CN106826538A (en) | 2017-06-13 |
| CN106826538B true CN106826538B (en) | 2018-10-12 |
Family
ID=59113047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611232582.1A Active CN106826538B (en) | 2016-12-28 | 2016-12-28 | Milling apparatus with automatic discharging function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106826538B (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57189767A (en) * | 1981-05-12 | 1982-11-22 | Nec Corp | Continuous grinding device |
| JPS62124866A (en) * | 1985-10-28 | 1987-06-06 | Hitachi Ltd | Polishing device |
| JPH11207594A (en) * | 1997-11-05 | 1999-08-03 | Aplex Inc | Module type wafer grinding device and wafer grinding method |
| CN201863103U (en) * | 2010-06-30 | 2011-06-15 | 中芯国际集成电路制造(上海)有限公司 | Polishing machine |
| CN102592961A (en) * | 2011-01-12 | 2012-07-18 | 柏连企业股份有限公司 | Wafer feeding and arranging machine |
| CN203282328U (en) * | 2013-04-28 | 2013-11-13 | 株式会社荏原制作所 | Polishing device and base plate processing device |
| CN203712473U (en) * | 2014-03-20 | 2014-07-16 | 王超 | Polishing machine |
-
2016
- 2016-12-28 CN CN201611232582.1A patent/CN106826538B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN106826538A (en) | 2017-06-13 |
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