CN201863103U - Polishing machine - Google Patents
Polishing machine Download PDFInfo
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- CN201863103U CN201863103U CN2010202465227U CN201020246522U CN201863103U CN 201863103 U CN201863103 U CN 201863103U CN 2010202465227 U CN2010202465227 U CN 2010202465227U CN 201020246522 U CN201020246522 U CN 201020246522U CN 201863103 U CN201863103 U CN 201863103U
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- polishing machine
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- polishing
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Abstract
The utility model provides a polishing machine, which comprises a worktable, a polishing pad, a supporting frame, a locking and fixing column fixed at one end of the supporting frame and located above the worktable, a sample clamping device, and a disc set fixed on the sample clamping device for adjusting the acting force applied to a sample, wherein the sample clamping device further comprises a sleeve column sleeved at the outer side of the locking and fixing column and a sample accommodating disc connected with one end of the sleeve column, and the supporting frame is screwed and fixed at one side of the worktable through screw threads. As the sample clamping device with the sample accommodating disc is additionally arranged on the worktable, and discs of different specifications in the disc set can be selected to adjust the acting force applied to the sample accommodating disc, a polishing surface of the sample receives uniform force during the polishing process, so as to reach target layers at the same time; therefore, not only the production efficiency is improved, but also the loss and omission are avoided; and the yield rate of sample analysis is improved.
Description
Technical field
The utility model relates to semiconductor manufacturing facility, relates in particular to a kind of polishing machine.
Background technology
Make to pursue in the trend of structure miniaturization, filming and lead multiple stratification at IC (Integrated Circuit), when characteristic size reaches sub-micron and deep-submicron, semiconductor process technique has run into new challenge.The IC chip manufacturing relates at the thin-film deposition of silicon chip surface or interface layer and growth technique, and forms device or the required repeatedly graphic making of multilayer interconnect structure later on.If there is not good planarization between every layer, then the fluctuating of silicon chip surface is along with the increase of the number of plies rises and falls more obvious.Not only cause with layer thickness of metal film inhomogeneous, the thin local resistance value can be higher, cause electromigration easily and cause line short, circuit reliability is reduced.And up-and-down surface can be because of the uneven thickness of photoresist, influence when photoetching to the control of live width, in the restriction that adds the photoresist depth of focus, silicon chip surface or interface layer rise and fall and inhomogeneously can't carry out painting photoresist thereon or be difficult to making figure on uneven photoresist when serious.
At present, solve above-mentioned way and have only the flatness of improving interlayer surface, it is poor to reduce pattern.In order to obtain photoengraving pattern accurately, in the multilayer wiring stereochemical structure, require before the etching in the whole silicon wafer surface difference of height of each several part more and more littler, promptly require to guarantee every layer of overall planarization.Common conventional planar technology is a lot, such as chemically mechanical polishing (CMP), heat flow method, rotary glass method, eat-back method etc.
The structure of traditional polishing system 2 as shown in Figure 7.Described polishing system 2 has second workbench 22 of carrying second polishing pad 21.Second workbench 22 is "T"-shaped, and described second workbench 22 comprises second work top 221 and supports second rotating shaft 222 of second work top 221.When second sample 23 was polished, operator 24 was placed on second sample 23 on second polishing pad 21.Wherein, second sample, 23 polished sides contact with second polishing cloth 21.Operator 24 acts on second sample 23 with certain pressure, simultaneously the pressure size of control action on second sample 23 and the rotary speed and the time of second rotating shaft 222 of second workbench 22, so that second sample 23 is polished, and obtain the needed destination layer of observation under SEM or OM.
But because the pressure that operator 24 acts on second sample 23 has inhomogeneity, then the pressure of described inhomogeneity has caused the inhomogeneity of second sample, 23 burnishing surfaces.Particularly, as shown in Figure 8, after second sample 23 was finished polishing, the bigger part of second sample, 23 pressurizeds had reached second terminal layer 231, and the smaller part of pressurized also is in second top layer metallic layer 232.More seriously, in the failure analysis process, if second sample 23 with long bit line or word line is polished, because the polished face of second sample 23 is bigger, then the burnishing surface inhomogeneity that causes of pressure inhomogeneity to influence meeting more outstanding, finally cause disappearance to be left in the basket, second sample 23 is existed analyze hidden danger.
At the problem that prior art exists, this case designer relies on the industry experience for many years of being engaged in, and the active research improvement is so there has been the utility model polishing machine.
The utility model content
The purpose of this utility model is in the prior art, polished sample is in the process of polishing, be with artificial the acting on the sample of pressure by the operator, and make sample unbalance stress one, finally cause the burnishing surface of sample to have inhomogeneity and in big specification sample polishing process defective such as disappearance omissions a kind of disappearance omission of avoiding is provided, and make burnishing surface have the polishing machine of homogeneity.
For achieving the above object, the present invention adopts following technical scheme: a kind of polishing machine comprises: workbench; Polishing pad is carried on the workbench; Bracing frame is fixed on workbench one side; The locking post is fixed on bracing frame one end, and is positioned at the workbench vertical direction; Sample holder is set in the locking post outside, and in order to accommodate polished sample; The disc group is fixed on the sample holder, and acts on active force on the sample in order to regulate sample holder.Wherein, described sample holder further comprises sleeve column that is set in the described locking post outside and the sample accommodating disc that is connected sleeve column one end.Support frame as described above is fixed on workbench one side by screwed.Described locking post is fixed on the bracing frame by screwed.Described locking post further comprises the bolt that is arranged on locking post and bracing frame contact site by screwed.A side that differs from sleeve column of described sample accommodating disc forms the ccontaining hole of sample.The diameter in the ccontaining hole of described sample is 5～15mm.Described disc group comprises the disc of Different Weight specification.
Compared with prior art, the utlity model has following advantage: the utility model is by setting up the sample holder with sample accommodating disc on workbench, and pass through to select the disc of different size in the disc group with the active force of regulating action on the sample accommodating disc, making in the polishing process of sample that its burnishing surface is stressed has a homogeneity, and can reach destination layer simultaneously, not only improve production efficiency, and avoided disappearance to omit, and improved the success rate of sample analysis.
Description of drawings
Fig. 1 is the perspective view of utility model polishing machine.
Fig. 2 is the perspective view of the bracing frame of the utility model polishing machine.
Fig. 3 is the perspective view of the locking post of the utility model polishing machine.
Fig. 4 is the upward view of the sample holder mechanism of this practical polishing machine.
Fig. 5 is the structural representation of disc of the disc group of this practical property polishing machine.
Fig. 6 is the design sketch after first sample polishes through the utility model polishing machine.
Fig. 7 is the structural representation of existing polishing system.
Fig. 8 is the design sketch after second sample polishes by existing polishing system.
The specific embodiment
By describing technology contents, structural feature that the utility model creates in detail, being reached purpose and effect, described in detail below in conjunction with embodiment and conjunction with figs..
See also Fig. 1, and in conjunction with consulting Fig. 6.Fig. 1 is the perspective view of polishing machine 1.Described polishing machine 1 comprises first workbench 12, the bracing frame 13 that is mechanically anchored in first workbench, 12 1 sides that carry first polishing pad 11, be mechanically anchored on the bracing frame 13 and be positioned at first workbench, 12 tops locking post 14, be set in locking post 14 outsides and in order to the sample holder 16 of clamping first sample 15, and be set in sample holder 16 outsides and be applied to the disc group 17 of active force on first sample 15 in order to regulate sample holder 16.
See also Fig. 2, Fig. 3, and in conjunction with consulting Fig. 1.Fig. 2 is the structural representation of bracing frame 13.Support frame as described above 13 is " Γ " shape, and has the crossbeam 132 of fixed leg 131 and horizontal direction longitudinally.Offer the have internal thread locking hole 133 of (not shown) at an end that differs from fixed leg 131 of crossbeam 132.Bottom and crossbeam 132 equidirectional outwards protruding out at fixed leg 131 longitudinally form locking screws 134.Described locking screw 134 is in order to be fixed on bracing frame 13 side of first workbench 12.
Fig. 3 is the locking post 14 that an end has external screw thread (not shown).Wherein, described locking post 14 further comprises the bolt 141 in order to fixing locking post 14 positions.The external screw thread of locking post 14 and the internal thread of crossbeam 132 are complementary, and promptly lock post 14 and crossbeam 132 are fixed by the mode of screwed.Described bolt 141 has internal thread, and the external screw thread of described internal thread and locking post 14 is complementary.In the assembling process of polishing block 1, bolt 141 is complied with the contact site place that default height is screwed in locking post 14 and crossbeam 132, to prevent the post 14 automatic slippages that lock.
See also Fig. 4, and continue to consult Fig. 1.Fig. 4 is the perspective view of sample holder 16.Wherein, described sample holder 16 comprises the sleeve column 161 of hollow and the sample accommodating disc 162 that is formed on sleeve column 161 1 ends.The lower end of described locking post 14 is interted and is fixed in the sleeve column 161 of described hollow.A side that differs from sleeve column 161 of described sample accommodating disc 162 forms the ccontaining hole 163 of sample.Wherein, the diameter in the ccontaining hole 163 of sample and the degree of depth are according to the size setting of the first polished sample 15.In the present embodiment, the diameter in the ccontaining hole 163 of sample is 5～15mm, and the degree of depth in the ccontaining hole 163 of sample is 0.1mm.
See also Fig. 5, and in conjunction with consulting Fig. 1, Fig. 6.In the polishing process of first sample 15, first sample 15 is placed in the ccontaining hole 163 of sample, and the polished side of described first sample 15 contacts with first polishing pad 11 on being positioned at first workbench 12.According to the thickness of destination layer, determine required external pressure and be applied on the sample accommodating disc 162 by sleeve column 161, and then average acting on first sample 15.Particularly, promptly by required external pressure, in disc group 17, select the disc 171 of Different Weight specification, and be set in sleeve column 161 outsides.Sleeve column 161 is subjected to the downward pressure of disc 171, and with average the affacting on the sample accommodating disc 162 of described pressure.Polished the side of differing from that then is positioned at first sample 15 in the ccontaining hole 163 of sample is subjected to evenly downward active force.The pressure that is subjected to owing to a side that differs from burnishing surface that acts on first sample 15 has homogeneity, then first sample 15 burnishing surface in polishing process also has the stressed of homogeneous accordingly, has homogeneity thereby the burnishing surface that makes the sample 15 of winning is stressed, in polishing process, can arrive destination layer simultaneously, and do not need repeatedly to go observation whether to arrive destination layer, while can not omitted disappearance yet in the failure analysis of first sample 15 of big specification, and has improved the analysis yield of first sample 15.
In sum, the utility model is by setting up the sample holder 16 with sample accommodating disc 162 on first workbench 12, and pass through to select the disc 171 of different size in the disc group 17 with the active force of regulating action on sample accommodating disc 162, making in the polishing process of first sample 15 that its burnishing surface is stressed has a homogeneity, and can reach destination layer simultaneously, not only improve sample preparation efficient, and avoided disappearance to omit, and improved the analysis yield of first sample 15.
Those skilled in the art all should be appreciated that, under the situation that does not break away from spirit or scope of the present utility model, can carry out various modifications and variations to the utility model.Thereby, if when any modification or modification fall in the protection domain of appended claims and equivalent, think that the utility model contains these modifications and modification.
Claims (7)
1. polishing machine comprises:
Workbench;
Polishing pad is carried on the workbench;
Bracing frame is fixed on workbench one side;
The locking post is fixed on bracing frame one end, and is positioned at the workbench top;
Sample holder is set in the locking post outside, and in order to ccontaining polished sample;
The disc group is fixed on the sample holder, and acts on active force on the sample in order to regulate sample holder;
It is characterized in that: described sample holder further comprises sleeve column that is set in the described locking post outside and the sample accommodating disc that is connected sleeve column one end.
2. polishing machine according to claim 1 is characterized in that: support frame as described above is fixed on workbench one side by screwed.
3. polishing machine according to claim 1 is characterized in that: described locking post is fixed on the bracing frame by screwed.
4. polishing machine according to claim 3 is characterized in that: described locking post further comprises the bolt that is arranged on locking post and bracing frame contact site by screwed.
5. polishing machine according to claim 1 is characterized in that: a side that differs from sleeve column of described sample accommodating disc forms the ccontaining hole of sample.
6. polishing machine according to claim 5 is characterized in that: the diameter in the ccontaining hole of described sample is 5～15mm.
7. polishing machine according to claim 1 is characterized in that described disc group comprises the disc of Different Weight specification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202465227U CN201863103U (en) | 2010-06-30 | 2010-06-30 | Polishing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202465227U CN201863103U (en) | 2010-06-30 | 2010-06-30 | Polishing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201863103U true CN201863103U (en) | 2011-06-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202465227U Expired - Fee Related CN201863103U (en) | 2010-06-30 | 2010-06-30 | Polishing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201863103U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106826538A (en) * | 2016-12-28 | 2017-06-13 | 重庆晶宇光电科技有限公司 | Milling apparatus with automatic discharging function |
-
2010
- 2010-06-30 CN CN2010202465227U patent/CN201863103U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106826538A (en) * | 2016-12-28 | 2017-06-13 | 重庆晶宇光电科技有限公司 | Milling apparatus with automatic discharging function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110615 Termination date: 20180630 |