CN106826406A

CN106826406A - Wafer processing method

Info

Publication number: CN106826406A
Application number: CN201611228473.2A
Authority: CN
Inventors: 侯明永
Original assignee: CHONGQING JINGYU OPTOELECTRONICS TECHNOLOGY Co Ltd
Current assignee: CHONGQING JINGYU OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority date: 2016-12-27
Filing date: 2016-12-27
Publication date: 2017-06-13
Anticipated expiration: 2036-12-27
Also published as: CN106826406B

Abstract

The present application relates to opto-electronic information technology field, a kind of wafer processing method is disclosed, comprised the following steps：S1:Place the wafer on chip saddle, pressing mechanism orders about the chip that grinding head is pushed down on chip saddle with certain pressure；S2：Start the motor of the motor and the first drive mechanism above grinding head, grinding head is driven by motor and rotates, the motor of the first drive mechanism is realized slowing down by governor gear, driven gear is driven to rotate by rotating shaft again, so as to drive the chip saddle in rotating shaft to rotate, the steering of chip saddle is with the steering of grinding head conversely, grinding head is ground to chip；The present patent application is intended to provide a kind of wafer processing method, during grinding wafers, can not only absorb the break flour that grinding is produced, moreover it is possible to play radiating and lubrication to equipment.

Description

Wafer processing method

Technical field

The present invention relates to opto-electronic information technology field, and in particular to a kind of wafer processing method.

Background technology

The problem of the chip easy turned-down edge of generally existing Waffer edge of conventional wafer lapping device processing.Cause this problem The reason for be that the abrasion path of rule causes edge abrasion and easily forms turned-down edge more than internal, original wafer polishing apparatus The qualification rate of the finished product for obtaining is low, and long processing time causes processing efficiency low and high cost, and surface roughness, flatness, The indexs such as wafer thickness tolerance can not all reach the requirement of graphics processing substrate wafer.

With developing rapidly for photoelectric technology, increasingly increase of the photovoltaic to the demand of chip, in order to meet optics The demand of device development, market occurs in that various high working efficiencies, percent defective are low, product smoothness is high, low cost grinding dress Put, but these lapping devices are in process, can produce many break flours, and break flour can fly upward everywhere, be difficult to sweep, and grind The operating for a long time of mill power-equipment used gets rusty easily, aging, it is necessary to periodically for power-equipment is lubricated maintenance and cleans, non- It is often troublesome.

In order to solve this problem, inventor has invented a kind of wafer grinding equipment, one kind has now been badly in need of based on this equipment Wafer processing method.

The content of the invention

It is an object of the invention to provide a kind of wafer processing method, during grinding wafers, can not only absorb and grind Grind the break flour for producing, moreover it is possible to radiating and lubrication are played to equipment.

To reach above-mentioned purpose, base case of the invention is as follows：

Wafer processing method, comprises the following steps：

S1:Place the wafer on chip saddle, pressing mechanism orders about the chip that grinding head is pushed down on chip saddle；S2：Start The motor of motor and the first drive mechanism above grinding head, grinding head is driven by motor and rotates, and first The motor of drive mechanism is realized slowing down by governor gear, then drives driven gear to rotate by rotating shaft, so as to drive be arranged on Chip saddle rotation in rotating shaft, the steering of chip saddle is with the steering of grinding head conversely, grinding head is ground to chip；

Wherein, while S2 steps, the flabellum being arranged in rotating shaft follows the rotation of rotating shaft and rotates, and flabellum drives workbench The air of cavity inside accelerates flowing, and negative pressure is formed at the first through hole of the first worktable upper surface, is ground in S2 steps and produced Raw chip break flour is inhaled into workbench cavity inside, meanwhile, workbench cavity inside produces negative pressure so that in workbench cavity Portion's pressure diminishes, so that oil pipe forms pressure difference with workbench cavity inside, by the machine oil in fuel tank because the work of pressure It is drawn at first through hole with by petroleum pipeline, machine oil back flows back into workbench cavity inside from first through hole, and to workbench First drive mechanism of cavity inside carries out automatically oiling, and then machine oil flows back to fuel tank from the second through hole.Workbench cavity inside Workbench cavity inside.

The beneficial effect of base case of the present invention：The grinding of chip can not only be realized, the chip powder produced in process of lapping Bits are inhaled into the workbench cavity inside, it is to avoid the break flour in process flies upward, processes problem not easy to clean；Together When, workbench cavity inside produces negative pressure, realizes automatically oiling, the first drive mechanism is lubricated and radiated, without extra Periodically it is lubricated and safeguards, whole process can realizes that the automatic cycle of machine oil is utilized, that is, facilitate, and save energy is conducive to again.

Preferred scheme one：Based on scheme preferred scheme, the driven gear in the step S1 is engaged with respectively Two driven gears and the 3rd driven gear, second driven gear and the 3rd driven gear are coaxially connected with the second rotating shaft respectively With the 3rd rotating shaft, after the upper end of second rotating shaft and the 3rd rotating shaft passes through the first through hole of the workbench, it is connected to The chip saddle, the flabellum is installed with second rotating shaft and the 3rd rotating shaft, can simultaneously process multiple chips, is improved Processing efficiency.

Preferred scheme two：Based on scheme preferred scheme, stomata is set on the chip saddle in the step S2, lead to Absorption chip of the stomata using the negative pressure produced in workbench cavity is crossed, the fixed wafer by the way of absorption can be avoided Because of the uneven problem of the wafer orientation caused by wax bonding mode and the cleaning problem of wax.

Preferred scheme three：Based on scheme preferred scheme, the grinding head in the step S1 is connected with connector, even Fitting includes travel(l)ing rest and support arm, and one end of support arm is fixedly connected on travel(l)ing rest, and the grinding head distribution is arranged on branch On arm, the coverage of the grinding head is less than wafer surface so that side milling time is slightly less than inside, it is ensured that whole chip table The grinding in face is uniform, reduces the generation of turned-down edge.

Preferred scheme four：Based on scheme preferred scheme, the workbench of the step S2 also uses the second driving machine Structure carries out irregular path grinding to chip, and second drive mechanism is located at the bottom of the workbench, and described second drives Motivation structure includes being used to drive the workbench generation to diametrically reciprocate the first leading screw and be used to drive the workbench to produce Second leading screw of front-rear reciprocation movement, for the workbench radially provides power with front-rear reciprocation movement so that carried out to chip Irregular path grinding, with balanced substrate interior and the milling time at edge, further reduces the generation of turned-down edge.

Preferred scheme five：Based on scheme preferred scheme, the pressing mechanism in the step S1 uses pneumatic shuttle The grinding head is pressurizeed, pressure is provided with to wafer grinding.

Brief description of the drawings

Fig. 1 is the structural representation of wafer processing method embodiment of the present invention；

Fig. 2 is the structural representation of workbench in Fig. 1.

Specific embodiment

Below by specific embodiment, the present invention is further detailed explanation：

Reference in Figure of description includes：Base station 1, chip saddle 2, workbench 3, grinding mechanism 4, pressing mechanism 5, grind Bistrique 6, connector 7, travel(l)ing rest 8, support arm 9, chip 10, the first drive mechanism 11, motor 12, drive mechanism 13, output gear Wheel 14, governor gear 15, driven gear 16, rotating shaft 17, the second driven gear 18, the 3rd driven gear 19, the second rotating shaft 20, the Three rotating shafts 21, first through hole 22, flabellum 23, fuel tank 24, petroleum pipeline 25, the second drive mechanism 26, the second through hole 27..

Embodiment 1

Wafer processing method, comprises the following steps：

Wherein, while S2 steps, the flabellum being arranged in rotating shaft follows the rotation of rotating shaft and rotates, and flabellum drives workbench The air of cavity inside accelerates flowing, and negative pressure is formed at the first through hole of the first worktable upper surface, is ground in S2 steps and produced Raw chip break flour is inhaled into workbench cavity inside, meanwhile, workbench cavity inside produces negative pressure so that in workbench cavity Portion's pressure diminishes, so that oil pipe forms pressure difference with workbench cavity inside, by the machine oil in fuel tank because the work of pressure It is drawn at first through hole with by petroleum pipeline, machine oil back flows back into workbench cavity inside from first through hole, and to workbench First drive mechanism of cavity inside carries out automatically oiling, and then machine oil flows back to fuel tank from the second through hole again.In workbench cavity Portion's workbench cavity inside.

In order to simultaneously process multiple chips, processing efficiency is improved, the driven gear in step S1 is engaged with second respectively Driven gear and the 3rd driven gear, second driven gear and the 3rd driven gear be coaxially connected with respectively the second rotating shaft and After the upper end of the 3rd rotating shaft, second rotating shaft and the 3rd rotating shaft passes through the first through hole of the workbench, institute is connected to Chip saddle is stated, the flabellum is installed with second rotating shaft and the 3rd rotating shaft,

In order that obtaining milling time is slightly less than inside, it is ensured that the grinding of whole wafer surface is uniform, reduces the generation of turned-down edge, step Grinding head in S1 is connected with connector, and connector includes travel(l)ing rest and support arm, and one end of support arm is fixedly connected on movable branch On frame, and grinding head distribution is arranged on support arm, and the coverage of grinding head is less than wafer surface.

Pressing mechanism in step S1 is pressurizeed using pneumatic shuttle to the grinding head, and pressure is provided with to wafer grinding Power.

Stomata is set on chip saddle in step S2, the suction of the negative pressure produced in workbench cavity is utilized by the stomata Overgrowth piece, the fixed wafer by the way of absorption can be avoided because of the uneven problem of the wafer orientation caused by wax bonding mode With the cleaning problem of wax.

In order to further reduce the generation of turned-down edge, the workbench of step S2 is also using the second drive mechanism to entering including chip The irregular path grinding of row, second drive mechanism is located at the bottom of the workbench, and the second drive mechanism includes being used to Drive the workbench to produce to diametrically reciprocate the first leading screw and be used to drive the workbench to produce front-rear reciprocation movement Second leading screw, for the workbench radially provides power with front-rear reciprocation movement so that carry out irregular path to chip and grind Mill, with balanced substrate interior and the milling time at edge.

Embodiment 2

The equipment used by wafer processing method in embodiment 1 is substantially as shown in Figure 1：

Wafer grinding equipment, including for support the base station 1 of milling apparatus, the chip saddle 2 for fixed wafer, workbench 3, Positioned at the grinding mechanism 4 and the pressing mechanism 5 positioned at the top of grinding mechanism 4 of the top of workbench 3, the pressing mechanism 5 uses air pressure Device；Grinding mechanism 4 includes grinding head 6, the connector 7 for fixing grinding head 6 and is arranged on the driving electricity of the top of grinding head 6 Machine（Do not draw）；Connector 7 includes travel(l)ing rest 8 and support arm 9, and one end of support arm 9 is fixedly connected on travel(l)ing rest 8, grinds First 6 distribution is arranged on support arm 9, and the coverage of grinding head 6 is less than the surface of chip 10 so that the edge grinding time is slightly less than interior Portion, it is ensured that the grinding of whole wafer surface is uniform, reduces the generation of turned-down edge；Stomata is set on chip saddle 2（Do not draw）, it is used to Absorption chip 10, the fixed wafer by the way of absorption can be avoided because of the wafer orientation injustice caused by wax bonding mode The cleaning problem of problem and wax, workbench 3 includes the second drive mechanism 26, and the second drive mechanism 26 is located at the bottom of workbench 3, Including being used to drive the generation of workbench 3 to diametrically reciprocate the first leading screw（Do not draw）Before and after being used to drive workbench 3 to produce Reciprocating second leading screw（Do not draw）, for workbench 3 carries out radially providing power with front-rear reciprocation movement so as to chip Irregular path grinding is carried out, with balanced substrate interior and the milling time at edge, the generation of turned-down edge is further reduced.

As shown in Fig. 2 the surface of workbench 3 is provided with three first through hole 22 inside connection workbench 3, in workbench 3 Portion is provided with the first drive mechanism 11, and the first drive mechanism 11 includes motor 12 and drive mechanism 13, and drive mechanism 13 includes defeated Go out gear 14, governor gear 15 and driven gear 16, output gear 14 is connected with the output shaft of motor 12, governor gear 15 with it is defeated Go out gear 14 to engage, governor gear 15 and driven gear 16 are coaxially connected by rotating shaft 17, driven gear 16 is engaged with the respectively Two driven gears 18 and the 3rd driven gear 19, the second driven gear 18 and the 3rd driven gear 19 are coaxially connected with second respectively The rotating shaft 21 of rotating shaft 20 and the 3rd, the upper end of rotating shaft 17, the second rotating shaft 20 and the 3rd rotating shaft 21 is each passed through three of workbench 3 After one through hole 22, connected with corresponding chip saddle 2 respectively, be used to support chip saddle 2, can simultaneously process three chips, Improve processing efficiency；Flabellum 23 is installed with rotating shaft 17, the second rotating shaft 20 and the 3rd rotating shaft 21；The lower section of workbench 3 is provided with Fuel tank 24, the bottom of workbench 3 is provided with the second through hole 27 of connection fuel tank 24, and fuel tank 24 is connected with petroleum pipeline 25, petroleum pipeline 25 Oil-out be arranged at first through hole 22.

During work, chip 10 is placed on chip saddle 2, starts the motor 12 of the first drive mechanism 11, drive output Gear 14 is rotated, and rotating speed is adjusted by governor gear 15, drives driven gear 16 to rotate by rotating shaft 17, so as to drive installation Chip saddle 2 in rotating shaft 17 rotates, because driven gear 16 is respectively at the second driven gear 18 and the 3rd driven gear 19 Engagement, other driven gears have and engages with these three driven gears respectively, so as to realize being arranged on the multiple crystalline substances on workbench 3 Piece saddle 2 is rotated with identical rotating speed.Start the motor of the top of grinding head 6 simultaneously, now pressing mechanism 5 orders about grinding First 6 push down the chip 10 on chip saddle 2 with certain pressure, the effect of multiple grinding heads 6 of grinding mechanism 4 in motor Lower rotation, the steering of grinding head 6 with the steering of its supporting chip saddle 2 conversely, rotating speed is identical, to realize grinding head to chip Grinding.Chip saddle 2 drive 10 rotation of chip while, workbench 3 by the second drive mechanism drive workbench and The chip saddle 2 for setting thereon is diametrically reciprocated and front-rear reciprocation movement so that carry out irregular road to chip 10 Footpath is ground, and with balanced substrate interior and the milling time at edge, further reduces the generation of turned-down edge.

In process of lapping, flabellum 23 follows rotating shaft 17, the second rotating shaft 20 and the 3rd rotating shaft 21 to rotate respectively, and the band of flabellum 23 is started building Make the air inside platform 3 and accelerate flowing, negative pressure is formed at first through hole 22, chip 10 is adsorbed onto by chip saddle by stomata It is ground again on 2, grinds the chip break flour for producing and be inhaled into inside workbench 3, it is to avoid the break flour in process flies Raise, process problem not easy to clean；Meanwhile, the inside of workbench 3 produces negative pressure so that the internal pressure of workbench 3 diminishes, so that So that petroleum pipeline 25 forms pressure difference with the internal cavities of workbench 3 so that machine oil the acting through because of pressure in fuel tank 24 Petroleum pipeline 25 is drawn at first through hole 22, and machine oil is back flowed back into inside workbench 3 from first through hole 22, then from the second through hole 27 Fuel tank 24 is flowed back to, automatically oiling is realized, and the first drive mechanism 11 is lubricated and radiated, without being additionally periodically lubricated And maintenance, then machine oil flow back to fuel tank 24 from the second through hole 27 again, whole process can realize that the automatic cycle of machine oil is utilized, i.e., just Just, save energy is conducive to again.

Above-described is only embodiments of the invention, and the general knowledge such as known concrete structure and characteristic is not made herein in scheme Excessive description.It should be pointed out that for a person skilled in the art, on the premise of structure of the present invention is not departed from, can be with Some deformations and improvement are made, these should also be considered as protection scope of the present invention, these are implemented all without the influence present invention Effect and practical applicability.This application claims protection domain should be defined by the content of its claim, in specification Specific embodiment etc. records the content that can be used for explaining claim.

Claims

1. a kind of wafer processing method, it is characterised in that comprise the following steps：

Wherein, while S2 steps, the flabellum being arranged in rotating shaft follows the rotation of rotating shaft and rotates, and flabellum drives workbench The air of cavity inside accelerates flowing, and negative pressure is formed at the first through hole of the first worktable upper surface, is ground in S2 steps and produced Raw chip break flour is inhaled into workbench cavity inside, meanwhile, workbench cavity inside produces negative pressure so that in workbench cavity Portion's pressure diminishes, so that oil pipe forms pressure difference with workbench cavity inside, by the machine oil in fuel tank because the work of pressure It is drawn at first through hole with by petroleum pipeline, machine oil back flows back into workbench cavity inside from first through hole, and to workbench First drive mechanism of cavity inside carries out automatically oiling, and then machine oil flows back to fuel tank from the second through hole.

2. wafer processing method according to claim 1, it is characterised in that the driven gear in the step S1 is nibbled respectively Conjunction has the second driven gear and the 3rd driven gear, and second driven gear and the 3rd driven gear are coaxially connected with respectively After the upper end of two rotating shafts and the 3rd rotating shaft, second rotating shaft and the 3rd rotating shaft passes through the first through hole of the workbench, respectively The chip saddle is connected with, the flabellum is installed with second rotating shaft and the 3rd rotating shaft.

3. wafer processing method according to claim 1, it is characterised in that set on the chip saddle in the step S2 Stomata, by the stomata using the negative-pressure adsorption chip produced in workbench cavity.

4. wafer processing method according to claim 1, it is characterised in that the grinding head in the step S1 is connected with Fitting, connector includes travel(l)ing rest and support arm, and one end of support arm is fixedly connected on travel(l)ing rest, and the grinding head distribution sets Put on support arm, the coverage of the grinding head is less than wafer surface.

5. wafer processing method according to claim 1, it is characterised in that the workbench of the step S2 also uses second Drive mechanism carries out irregular path grinding to chip, and second drive mechanism is located at the bottom of the workbench, described Second drive mechanism includes being used to drive the workbench generation to diametrically reciprocate the first leading screw and be used to drive the work Platform produces the second leading screw of front-rear reciprocation movement.

6. wafer processing method according to claim 1, it is characterised in that the pressing mechanism in the step S1 uses gas Pressure device pressurizes to the grinding head.