CN106826130A - Processing method for metal housing of electronic device - Google Patents

Processing method for metal housing of electronic device Download PDF

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Publication number
CN106826130A
CN106826130A CN201710114585.3A CN201710114585A CN106826130A CN 106826130 A CN106826130 A CN 106826130A CN 201710114585 A CN201710114585 A CN 201710114585A CN 106826130 A CN106826130 A CN 106826130A
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CN
China
Prior art keywords
substrate
metal
processing
curved surface
electronic device
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CN201710114585.3A
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Chinese (zh)
Inventor
马育文
李鹏
唐勇
刘晓雷
何成章
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珠海市魅族科技有限公司
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Priority to CN201710114585.3A priority Critical patent/CN106826130A/en
Publication of CN106826130A publication Critical patent/CN106826130A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23POTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/04Metal casings

Abstract

The invention provides a processing method for a metal housing of an electronic device. The metal housing comprises a curved surface. The processing method for the metal housing comprises the following steps: a substrate made of metal is provided; cutting equipment comprising a diamond cutter is provided; the substrate is clamped on the cutting equipment in a positioned manner; the diamond cutter performs feed movement relative to the substrate to cut the substrate, and the curved surface is formed. According to the processing method for the metal housing of the electronic device, the diamond cutter with high hardness is used for curved surface processing, the curved surface with a high-gloss mirror effect can be obtained without polishing and sand blasting processes, and processing procedures and processing cost of the metal housing are reduced.

Description

电子装置的金属外壳加工方法 Metal housing of the electronic device processing methods

技术领域 FIELD

[0001]本发明涉及金属加工领域,特别涉及一种金属外壳加工方法。 [0001] The present invention relates to the field of metal working, particularly to a method of machining metal housing.

背景技术 Background technique

[0002]随着科技的发展,电子装置受到越来越多的关注,消费者们对产品的外观的要求越来越高,例如,具金属外壳的电子装置产品外观要求达到镜面效果。 [0002] With the development of technology, electronic devices are more and more attention, consumers are demanding more and more of the appearance of the product is high, for example, an electronic device with metal shell appearance requirements mirror effect. 现有技术中,金属制成的基材在通过切削设备切削加工后,需进行抛光、喷砂等表面处理,方能得到符合要求的镜面效果。 In the prior art, a substrate made of a metal by a cutting device after the cutting process, the need for polishing, sandblasting, surface treatment, in order to meet the requirements to obtain a mirror effect. 然而,此种加工方式,无疑增加了制程的繁琐及加工的成本。 However, this processing methods, will increase the cost and the complicated process of processing.

发明内容 SUMMARY

[0003] 有鉴于此,有必要提供一种避免上述问题的电子装置的金属外壳加工方法。 [0003] In view of this, it is necessary to provide a method for processing a metal housing of the electronic device to avoid the above problems.

[0004] —种电子装置的金属外壳加工方法,所述金属外壳包括曲面,所述金属外壳的加工方法包括以下步骤: [0004] - The method of processing metal shell, the metal shell of the electronic device comprises a surface processing method, the metal shell comprising the steps of:

[0005] 提供一金属制成的基材; [0005] providing a substrate made of a metal;

[0006] 提供一切削设备,所述切削设备包括金刚石刀具; [0006] providing a cutting apparatus, said cutting apparatus comprising a diamond tool;

[0007] 将所述基材定位装夹于所述切削设备上;及 [0007] clamping the substrate is positioned on said cutting device; and

[0008] 所述金刚石刀具相对所述基材作进给运动,以对所述基材进行切削加工以形成所述曲面,进而获得具有所述曲面的金属外壳。 [0008] The diamond tool relative to the base for feed movement, to the base material by cutting to form the curved surface, said further curved surface to obtain a metal housing.

[0009] 进一步地,所述金刚石刀具包括切削刃,所述切削刃的形状与所述曲面相对应,以一次成型所述曲面。 [0009] Furthermore, the diamond tool comprising a cutting edge, the cutting edge shape of the curved surface corresponding to the curved surface forming.

[0010] 进一步地,所述金刚石刀具包括刀柄及装设于所述刀柄上的刀片,所述刀片为金刚石刀片。 [0010] Furthermore, the diamond tool comprising a handle and the blade is mounted on the handle, the blade is a diamond blade.

[0011] 进一步地,所述金刚石刀具为铣刀,所述金刚石刀具在对所述基材进行切削时高速旋转。 [0011] Furthermore, the diamond milling cutter tool, the diamond tool rotates at high speed when the substrate is cut.

[0012] 进一步地,所述金刚石刀具相对所述基材作进给运动的步骤后,所述金属外壳加工方法还包括对所述具有所述曲面的基材进行阳极处理。 After [0012] Furthermore, the diamond tool relative to the substrate for movement of the feed step, the metal shell processing method further comprises a substrate having the anodized surface.

[0013] 进一步地,对所述具有所述曲面的基材进行阳极处理的步骤后,所述金属外壳加工方法还包括对所述具有所述曲面的基材进行染色处理。 After [0013] Furthermore, the substrate having a curved surface of said anode processing step, the metal shell of said processing method further comprises a substrate having a curved surface of the staining process.

[0014] 进一步地,对所述具有所述曲面的基材进行染色处理的步骤后,还包括对所述具有所述曲面的基材进行封孔处理。 After [0014] Further, the curved surface of a substrate having a step of dyeing, further comprising the substrate having the curved sealing treatment.

[0015] 进一步地,对所述具有所述曲面的基材进行封孔处理的步骤后,所述金属外壳加工方法还包括对所述具有所述曲面的基材进行干燥处理。 After [0015] Further, the surface of the substrate having the sealing treatment step, the metal shell of the processing method further comprises a substrate having a curved surface of the drying process.

[0016] 进一步地,所述金属外壳由金属铝、铝合金、镁、镁合金中的一种制成。 [0016] Further, the metal shell is made of a metal such as aluminum, aluminum alloys, magnesium, magnesium alloy thereof.

[0017] 进一步地,所述金属外壳为一体机、显示器、平板电脑、手机、电子阅读器、遥控器、 笔记本电脑、导航仪、可穿戴设备中其中一种的金属外壳。 [0017] Further, the metal shell integrally, monitor, tablet computer, a mobile phone, an electronic reader, a remote control, a notebook computer, a navigator, in one of the wearable device metal housing.

[0018] 进一步地,所述曲面设置于所述金属外壳的外侧面。 [0018] Further, the curved surface is provided on the outer surface of the metal housing.

[0019]本发明提供的电子装置的金属外壳加工方法,利用高硬度的金刚石刀具进行曲面加工,无需再进行抛光、喷砂工艺,即可得到具高光镜面效果的曲面,减少了金属外壳的加工制程及降低了加工成本。 [0019] The method of processing the metal housing of the electronic device of the present invention provides, using a diamond cutter curved surface machining high hardness, no longer polishing, sandblasting process, to obtain high optical mirror having a curved surface effect, reducing the processing of the metal shell process and reduced processing costs. 此外,所述金刚石刀具的切削刃的形状与所述金属外壳的曲面形状相对应,其能够一次成型所述曲面,进一步节约了加工时间及成本。 Further, the shape of the curved shape of the metal shell of the diamond tool cutting edge corresponds, which is capable of forming the curved surface, further saving processing time and cost.

附图说明 BRIEF DESCRIPTION

[0020]图1是本发明较佳实施例提供的金属外壳的示意图。 [0020] FIG. 1 is a schematic diagram of the metal shell to provide the preferred embodiment of the present invention.

[0021]图2是电子装置的金属外壳加工方法流程图。 [0021] FIG 2 is a flowchart showing the processing method of the metal casing of the electronic device.

[0022]图3是金刚石刀具对基材的加工示意图。 [0022] FIG. 3 is a schematic view of diamond tool machining to the substrate.

[0023]图4是本发明较佳实施方式提供的切削设备的示意图。 [0023] FIG. 4 is a schematic diagram of the preferred embodiment of the cutting apparatus of the embodiment of the present invention provides.

[0024] 主要元件符号说明 [0024] Main reference numerals DESCRIPTION

[0025] 金属外壳10 [0025] The metal housing 10

[0026] 曲面13 [0026] Surfaces 13

[0027] 基材15 [0027] The substrate 15

[0028] 待加工面151 [0028] The surface 151 to be processed

[0029] 切削设备100 [0029] The cutting device 100

[0030] 工作台20 [0030] The table 20

[0031] 定位装置30 [0031] The positioning means 30

[0032] 主轴50 [0032] spindle 50

[0033] 金刚石刀具70 [0033] The diamond tool 70

[0034] 刀柄71 [0034] The shank 71

[0035] 刀片73 [0035] Blade 73

[0036] 切削刃731 [0036] The cutting edge 731

[0037]下具体实施方式将结合上述附图进一步说明本发明。 DETAILED DESCRIPTION [0037] Reference will next be further illustrate the present invention.

具体实施方式 Detailed ways

[0038]下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。 [0038] below in conjunction with the present invention in the accompanying drawings, technical solutions of embodiments of the present invention are clearly and completely described, obviously, the described embodiments are merely part of embodiments of the present invention, but not all embodiments example. 基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。 Based on the embodiments of the present invention, all other embodiments of ordinary skill in the art without any creative effort shall fall within the scope of the present invention. 在不冲突的情况下,下述的实施例及实施例中的特征可以相互组合。 In the case of no conflict, embodiments and features of the embodiments of the following Examples can be mutually combined.

[0039]需要说明的是,在本发明中,当一个组件被认为是与另一个组件“相连”时,它可以是与另一个组件直接相连,也可以是通过居中组件与另一个组件间接相连。 [0039] Incidentally, in the present invention, as may be indirectly connected through a centering component from another component is considered to be another component "joined", it can be directly connected to another component, .

[0040]除非另有定义,本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。 [0040] Unless defined otherwise, the same meaning as all technical and scientific terms and belongs to the technical field of the invention As used herein, the art is generally understood. 本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的,不是旨在于限制本发明。 In the description herein, the terms used in the present invention only for the purposes of describing particular embodiments and are not intended to limit the invention.

[0041] 本发明提供一种金属外壳加工方法。 [0041] The present invention provides a method of machining metal housing. 请参阅图1所示,金属外壳10包括曲面13。 Please refer to FIG. 1, the metal housing 10 comprises a curved surface 13. 本实施方式中,所述曲面13为弧面,所述曲面13为所述金属外壳10朝向外侧设置的外侧面。 In the present embodiment, the curved surface 13 is a curved surface, the curved surface 13 of the metal shell 10 toward the outer surface of the outer set. 所述金属外壳10应用于电子装置(图未示),进一步地,所述金属外壳10为所述电子装置的金属中框。 The metal shell 10 is applied to an electronic device (not shown), further, the metal shell 10 is a metal block of the electronic device. 所述电子装置可以是以下设备,例如:一体机、显示器、平板电脑、手机、电子阅读器、遥控器、笔记本电脑、导航仪、可穿戴设备等设备。 The electronic device may be the device, for example: one, a display, a tablet computer, mobile phone, e-readers, remote controls, laptop computers, navigation systems, wearable device and other equipment.

[0042] 请参阅图2所示,所述金属外壳加工方法,其包括以下步骤: [0042] Please refer to FIG. 2, the metal shell processing method comprising the steps of:

[0043] 步骤201,提供一金属制成的基材15。 [0043] Step 201, providing a substrate 15 made of a metal.

[0044] 本实施方式中,所述基材15通过冲压工艺制成。 [0044] The embodiment according to the present embodiment, the substrate 15 is made by a stamping process. 请参阅图3所示,所述基材15包括待加工面151。 Please refer to FIG. 3, the substrate 15 includes a surface 151 to be processed. 通过对一金属板材进行冲压,其过程是将金属板材经冲压机床冲压、拉伸边缘,再切除其多余的边角,从而使该金属板材形成与金属外壳10形状和尺寸相对应的基材15。 By punching a metal plate material, the process is machine stamped sheet metal stamping, drawing the edges, then cut the excess corners thereof so that the metal plate 15 and the substrate 10 is formed the shape and size corresponding to the metal shell . 具体地,所述基材的材质可以选择铝或铝合金,优选为AL5052系列铝合金。 In particular, the substrate material of aluminum or aluminum alloy may be selected, preferably AL5052 series aluminum alloy. 当然,所述基材可以由其它金属制成,如镁、镁合金、钛、钛合金制成等。 Of course, the substrate may be made of other metals, such as magnesium, magnesium alloys, titanium, titanium alloy and the like. 本实施方式中,所述待加工面151 为弧面。 In the present embodiment, the surface 151 is a curved surface to be machined. 可以理解,所述待加工面151可以为平面,或其它曲面,诸如至少两个面连接成的曲面。 It will be appreciated, the working surface 151 may be flat, or other surfaces, such as two curved surfaces at least connected.

[0045]可以理解,所述基材15并不局限于通过对所述金属板材进行冲压的方法而制得, 其可通过金属射出成型或粉末冶金等方法制得。 [0045] It will be appreciated, the substrate 15 is not limited by the method of pressing sheet metal in the system, which may emit molding or the like prepared by metal powder metallurgy method.

[0046] 步骤202,提供一切削设备100,所述切削设备100包括金刚石刀具70。 [0046] Step 202, there is provided a cutting apparatus 100, the apparatus 100 includes a diamond cutting tool 70.

[0047]请进一步参阅图4,为本实施方式中,应用于所述金属外壳加工方法的切削设备100。 [0047] Further referring to FIG 4, in the embodiment of the present embodiment, the metal shell is applied to a cutting apparatus 100 processing method. 具体地,所述切削设备100包括工作台20、定位装置30、主轴50及所述金刚石刀具70。 In particular, the apparatus 100 includes a cutting table 20, the positioning means 30, 50 and the spindle 70 of the diamond tool. 所述定位装置30装设于所述工作台20上用于定位基材15,所述金刚石刀具70装设于所述主轴50上用于对所述基材15的待加工面151进行切削加工,以得到曲面13。 The positioning means 30 is mounted on the table 20 for positioning the substrate 15, the diamond tool 70 is mounted on the main shaft 50 to be used for processing surface 151 of the substrate 15 by cutting to obtain surface 13. 可以理解,所述切削设备100还包括其它必要或非必要的结构或模组,如用于支撑的底座、用于驱动所述主轴50 进行直线运动(诸如X/Y/Z方向)的移动装置(图未示)、用于控制各模组工作的控制器、用于换刀的换刀机构等,在此不作赘述。 It will be appreciated, the cutting device 100 further comprises other necessary or unnecessary structure or module, such as a base support for the drive shaft 50 for linear movement (such as X / Y / Z direction) of the mobile device (not shown), a controller for controlling each module to work, tool changing mechanism for the tool change, etc., will not be repeated here.

[0048]本实施方式中,所述切削设备100为数控机床,以保证切削加工的精度及质量。 [0048] In the present embodiment, the cutting apparatus for the NC machine tool 100 to ensure the precision and quality of cutting. 当然,所述切削设备100也可以不为数控机床,其能达到所需要求的加工精度即可。 Of course, the cutting device 100 may not CNC machine tools, which can be required to achieve the required machining accuracy. 进一步地, 所述切削设备1〇〇为数控铣床,所述金刚石刀具70为铣刀,所述金刚石刀具70在所述主轴50 的带动下能够高速旋转,以对所述基材15进行切削。 Further, the cutting device is a CNC milling machine 1〇〇 the diamond cutter 70 is a cutter, the diamond blade 70 can be rotated at a high speed of the spindle 50 is driven to perform cutting of the substrate 15.

[0049]所述工作台20可以固定设置在诸如底座的结构上,也可以设置成能够绕一轴线(单轴)转动的工作台20,或绕多个轴线转动的工作台20,以能够将所述基材定位至一适合加工的位置。 [0049] The table 20 may be fixed at the base structure such as may be provided to be rotatable about an axis (uniaxial) rotating table 20, or about multiple axes of rotation of the table 20, to be able to positioning said substrate to a position suitable for processing.

[0050]所述定位装置30固定于所述工作台20上。 [0050] The positioning means 30 fixed on the table 20. 所述主轴50设于所述定位装置30及所述工作台20的上方,用于固定所述金刚石刀具70。 The shaft 50 is provided above the apparatus 30, and the positioning of the table 20, 70 for fixing the diamond tool. 所述金刚石刀具70可以通过一夹持机构(图未示)固定于所述主轴50邻近所述工作台2〇的一端,以方便换取刀具。 The diamond tool 70 by a clamping mechanism (not shown) fixed to the main shaft 50 adjacent one end of the table 2〇 to facilitate tool exchange. 可以理解,所述金刚石刀具70可以通过其它方式固定于所述主轴50上,例如螺接的方式,仅需满足能够将所述金刚石刀具70固定于所述主轴50上即可。 It will be appreciated, the diamond tool 70 may be fixed to the main shaft 50 by other means, for example screwing manner, only able to meet the diamond tool 70 can be fixed to the main shaft 50.

[0051]本实施方式中,所述金刚石刀具70具有极高的硬度和耐磨性、低摩擦系数、高弹性模量、高热导、低热膨胀系数等优点,有利于保证切削加工的精度及质量。 [0051] In the present embodiment, the diamond tool 70 has a very high hardness and wear resistance, low friction coefficient, high elastic modulus, high thermal conductivity, low thermal expansion coefficient, etc., will help to ensure accuracy and quality of machining . 所述金刚石刀具70包括刀柄71及设置于所述刀柄71—端的刀片73,所述刀柄71与所述主轴50固定连接。 The diamond cutting tool 70 comprises a shank 71 and a blade disposed on said shank 7371- end, the shank 71 is connected to the main shaft 50 is fixed. 所述刀片73由天然金刚石制成。 The blade 73 is made of natural diamond. 本实施方式中,所述刀片73呈薄片状,通过特殊焊接工艺焊接在所述刀柄71上;通过将所述刀片73的切削刃731直接磨成金属外壳10的曲面13所需的外形面,以直接加工出镜面的成型面。 In the present embodiment, the blade 73 a sheet form, through a special welding processes on the shank 71; 13 directly ground into the desired shape of the metal shell 10 by the curved surface of the blade 73 of the cutting edge 731 , directly processed molding surface mirror. 可以理解,不限定为将所述刀片73焊接于所述刀柄71 上,可以通过其它的方式将所述刀片73固定于所述刀柄71上,例如卡持固定、螺接等方式。 It will be appreciated, is not limited to the blade 73 is welded to the shank 71, by way of the other blade 73 is fixed to the shank 71, for example fixed latching, screwing or the like. [0052] 所述刀片73于远离所述刀柄71的末端设有切削刃731。 [0052] The insert end 73 of the shank 71 remote from the cutting edge 731 is provided. 本实施方式中,所述切削刃731与所述曲面13的形状相对应,所述切削刃731为弧形,以能够直接切削成型曲面13。 The present embodiment, the shape of the cutting edge 731 and the curved surface 13 corresponding to the arcuate cutting edge 731 to the molding surface 13 can be directly cut.

[0053] 步骤203,将所述基材15定位且装夹于所述切削设备100上。 [0053] Step 203, the positioning of the substrate 15 on the cutting and clamping device 100.

[0054] 具体地,所述基材定位且装夹于所述定位装置30上。 [0054] Specifically, the substrate is positioned on said clamping and positioning means 30. 可以理解,所述基材15的数量可以为多个,呈阵列式设置于所述定位装置30上,实现所述切削设备100能够通过一次装夹对多个基材15进行切削加工。 It will be appreciated, the number of said plurality of substrate 15 may be, provided in the form of array on the positioning means 30, the cutting apparatus 100 can be realized by one of a plurality of clamping the substrate 15 by cutting. 需加工时,将所述定位装置30固定于所述工作台20上。 When to be processed, the positioning device 30 is fixed on the table 20.

[0055] 步骤204,所述金刚石刀具70相对所述基材15作进给运动,以对所述基材15进行切削加工以形成所述曲面。 [0055] Step 204, the diamond tool 70 relative to the substrate 15 for the feed movement, to the substrate 15 by cutting to form the curved surface.

[0056] 具体地,移动所述主轴50及所述金刚石刀具70至一初始位置,所述金刚石刀具70 沿预定的加工路径对所述基材15作进给运动并同时作高速旋转运动,以对所述基材15的待加工面151进行切削加工。 [0056] In particular, the movement of the shaft 50 and the diamond tool 70 to an initial position, the diamond tool 70 along a predetermined machining path on the substrate 15 for the feed movement and simultaneously a high speed rotational movement to to be processed surface 151 of the substrate 15 by cutting. 切削加工完成后,得到金属外壳10的曲面13非常光亮,刀纹非常细,达到所需的镜面效果要求。 After machining is completed, to give a metal surface 13 of casing 10 is very light, very fine knife pattern, required to achieve the desired mirror effect. 可以理解,也可以使所述工作台20带动所述基材15相对所述金刚石刀具70运动。 It will be appreciated, it is also possible to drive the stage 20 of the substrate 15 relative to the diamond tool 70 movement.

[0057] 步骤205,对所述具有所述曲面13的基材15进行阳极处理。 [0057] Step 205, the curved surface having the anodized substrate of 15 13.

[0058] 具体地,在强酸或强碱溶液中对所述具有所述曲面13的基材15进行阳极处理工艺,以提高金属外壳的防护性、亮泽度、硬度等性质。 [0058] Specifically, in the acid or alkali solution having a curved surface of the substrate 1513 is subjected to anodic treatment process to enhance the properties of the metal shell protective, glossy, hardness and the like. 将所述具有所述曲面13的基材15置于阳极处理槽(图未示)中进行阳极处理,在所述具有所述曲面13的基材15面形成阳极氧化层。 The substrate of claim 13 having the curved surface 15 disposed Anodizing treatment tank (not shown) are anodized, the surface of the substrate 15 having the curved surface 13 is formed anodized layer. 其中,阳极处理溶液的种类、浓度、处理电压、电流密度、处理时间等依据需要进行设置, 以使金属外壳10表面形成有多孔的氧化物薄膜。 Wherein the type of anodic treatment solution, the concentration of the processing voltage, current density, processing time needs to be set based on, so that the housing 10 is formed with a porous surface of the metal oxide thin film. 例如,本实施方式中,阳极处理溶液为重量百分比浓度为0 • 2〜1 • 0%的磷酸(H3P〇4),处理电压为20〜60V,电流密度在10〜50mA/cm2之间,在室温下处理约20分钟。 For example, in this embodiment, anodization solution is a weight percent concentration of 0 • 2~1 • 0% phosphoric acid (H3P〇4), the processing voltage 20~60V, the current density between 10~50mA / cm2, in at room temperature for about 20 minutes. 可以理解,阳极处理溶液也可采用硝酸盐系、磷酸盐加硝酸盐系、铬酸盐系或硅酸盐系等。 It will be appreciated, anodizing solutions can be nitrate-based, phosphate-based add nitrate, chromate-based or silicate-based and the like. 阳极处理可采用直流电流阳极氧化、交流电流阳极氧化或脉冲电流阳极氧化。 Anodic treatment employed a direct current anodizing, an alternating current or a pulse current anodized anodized.

[0059] 步骤206,对所述具有所述曲面13的基材15进行染色处理。 [0059] Step 206, the curved surface having the dyeing process of the substrate 1513.

[0060] 为实现金属外壳的颜色多样性,经所述阳极处理后进行染色处理。 [0060] In order to achieve color variety metal housing, after the anodic treatment staining process. 由于具有所述曲面13的基材15上的氧化物薄膜的孔具有吸附染料的作用,当具有所述曲面13的基材15放置于染色槽中时,可将具有所述曲面13的基材15进行染色,以达到所需颜色。 Due to the curved base 13 having a porous oxide film on a substrate 15 has a function of adsorbing a dye, when the substrate 15 having the curved surface 13 is placed in a dyeing tank having the curved surface may be 13 15 dyed to achieve the desired color. 在染色处理中通过选择需要的染剂,进而选择具有所述曲面13的基材15的顔色,比如粉色,黑色,银色等等。 Dye in the dyeing process by selecting desired, thereby selecting the color of the substrate 13 having the curved surface 15, such as pink, black, silver and the like.

[0061] 步骤207,对所述具有所述曲面13的基材15进行封孔处理。 [0061] Step 207, the sealing treatment with the curved surface of the substrate 1513.

[0062] 具体地,将具有所述曲面13的基材15放入装有封孔液的容槽中进行反应,使封孔液中的树脂悬浮颗粒植入氧化物薄膜中,使其表面形成硬膜,以提高所述具有所述曲面13 的基材15的耐磨性及耐腐蚀性,且使所述具有所述曲面13的基材15的表面更具有光泽亮度。 [0062] Specifically, the substrate 15 having the curved sealing liquid into the receiving groove 13 containing a reaction, the resin sealing liquid particles in suspension implant oxide thin film, its surface is formed dura mater, having the curved surface in order to improve the wear resistance and corrosion resistance of the base material 13 15, and the surface of the substrate 15 having the curved surface 13 of the luminance is more glossy. 所述容槽中的封孔液含有醋酸镍等封孔剂。 The sealing liquid tank accommodating sealing agent containing nickel acetate. 可以理解,封孔处理液也可含有其它类型封孔剂,如硫酸镍、硫酸钴等。 It will be appreciated, sealing treatment solution may also contain other types of sealing agent, such as nickel sulfate, cobalt sulfate and the like.

[0063] 步骤208,对所述具有所述曲面13的基材15进行烘干处理,以使所述具有所述曲面13的基材15干燥,获得所述金属外壳10。 [0063] Step 208, the substrate 15 having the curved surface 13 for a drying process, so that the curved surface 15 having the dried base 13, the metal shell 10 is obtained.

[0064] 在进行封孔处理后,可以将所述具有所述曲面13的基材15进行烘千处理,以使所述具有所述曲面13的基材15干燥进而获得所述金属外壳10。 [0064] After the sealing treatment is performed, it may be the substrate 15 having the curved surface 13 of the one thousand-baking process, so that the substrate 13 having the curved surface 15 and further drying to obtain the metal casing 10.

[0065] 可以理解,在所述具有所述曲面13的基材15的表面不够洁净的情况下,在对所述具有所述曲面13的基材15进行阳极处理前,即所述步骤205前,可以对所述具有所述曲面13 的基材15进行阳极预处理,以去除所述具有所述曲面13的基材15的缺陷、油污或自然氧化膜。 [0065] It will be appreciated, the lower surface of the substrate having a curved surface 15 of the case 13 is insufficient clean, before having the curved surface of said anodized substrate 13, 15, i.e., the front step 205 , preprocessing the anode can having the curved surface 13 of the substrate 15, having the curved surface to remove defects, the base oil or a natural oxide film 15 13. 可以理解,阳极前预处理可包括脱脂、碱咬及剥黑膜等步骤,其中,脱脂采用弱碱性溶液,如焦磷酸钠;碱咬采用强碱性溶液;剥黑膜采用强酸性溶液。 It will be appreciated, before pre-treatment may include degreasing anode, a black film base biting and stripping step, wherein, with a weak alkaline degreasing solution, such as sodium pyrophosphate; alkali bite using strong alkaline solution; desmut using a strong acid solution. 可以理解,脱脂、碱咬或剥黑膜处理也可分别采用其它化学溶液。 It will be appreciated, degreasing, alkali or biting desmut treatment may also be employed other chemical solution, respectively.

[0066] 目前,金刚石刀具由于硬度大,加工难度高,通常只运用于加工直面,斜面。 [0066] Currently, the hardness of the diamond tool, high processing difficulty, usually only used in machining face, bevel. 本发明提供的电子装置的金属外壳加工方法,利用高硬度的金刚石刀具70进行曲面加工,无需再进行抛光、喷砂工艺,即可得到具高光镜面效果的曲面,减少了金属外壳的加工制程及降低了加工成本。 Metal shell processing method of the electronic apparatus of the present invention provides the use of diamond tools with high hardness 70 for surface processing, no longer polishing, sandblasting process, can be obtained with high optical mirror effect surface, reducing the metal shell machining process and reducing processing costs. 此外,所述金刚石刀具70的切削刃731的形状与所述金属外壳10的曲面形状相对应,其能够一次成型所述曲面,进一步节约了加工时间及成本。 Further, the curved shape of the cutting edge of the diamond tool 70 with the shape of the metal case 10 corresponding to 731, which is capable of forming the curved surface, further saving processing time and cost. 进一步地,再通过阳极处理及染色处理,以在保证镜面效果的同时,使产品具有高硬度,耐磨,耐腐蚀,耐热,绝缘物性。 Further, through the anodic treatment and dyeing treatment, in order to ensure the mirror effect at the same time, the product has high hardness, wear resistance, corrosion resistance, heat insulating properties.

[0067]可以理解,所述曲面13不限于设置于所述金属外壳10的外侧面,其也可以设置于所述金属外壳10的内侧面或其它结构上。 [0067] It will be appreciated, it is not limited to the curved surface 13 is provided on the outer surface of the metal housing 10, which may be provided on the inner side surface of the metal housing 10 or other structure.

[0068] 可以理解,所述金属外壳10不限定为电子装置的金属外壳,其可以为电子装置的其它结构,如按键等。 [0068] It will be appreciated, the metal housing 10 is not limited to a metal housing of the electronic device, the electronic device may be of other configurations, such as a key or the like.

[0069] 可以理解,所述曲面13不限定为弧面,所述曲面13可以为至少两个面连接的曲面, 所述切削刃731的形状与所述曲面13相对应,以一次切削加工成型所述曲面13。 [0069] It will be appreciated, the curved surface 13 is not limited to arc, the curved surface 13 may be connected to the at least two curved surfaces, a shape of the cutting edge 13 and the curved surface 731 corresponding to a forming machining the curved surface 13.

[0070]可以理解,在一变换实施例中,当对金属外壳10的亮泽度等无进一步要求的情况下,所述步骤205可以省略,即对所述金属外壳10进行阳极处理的步骤可以省略;当对金属外壳10的颜色不要求的情况下,所述步骤206可以省略,即对所述金属外壳10进行染色处理的步骤可以省略;当对金属外壳10的耐磨性要求相对较低时,所述步骤207可以省略,即对所述金属外壳10的封孔处理可省略;所述步骤208也可省略,而使金属外壳10自然干燥,gp, 所述电子装置的金属外壳加工方法包括以下步骤: [0070] It will be appreciated, in an alternative embodiment, when the brightness of the case where a metal housing 10 without further requirement, the step 205 may be omitted, i.e., the step of anodizing the metal housing 10 may It is omitted; in the case where the color of the metal casing 10 is not required, the step 206 may be omitted, i.e., step 10 may be omitted dyeing process the metal shell; wear resistance when the metal casing 10 is relatively low when, step 207 may be omitted, i.e., can be omitted to sealing treatment of the metal casing 10; step 208 may be omitted, so that the metal shell 10 natural drying, GP, the metal housing of the electronic device processing method comprising the steps of:

[0071] 提供一金属制成的基材; [0071] providing a substrate made of a metal;

[0072] 提供一切削设备,所述切削设备包括金刚石刀具; [0072] providing a cutting apparatus, said cutting apparatus comprising a diamond tool;

[0073] 将所述基材定位且装夹于所述切削设备上; [0073] The substrate is positioned on said cutting and clamping device;

[0074] 所述金刚石刀具相对所述基材作进给运动,以对所述基材进行切削加工以形成所述曲面。 [0074] The diamond tool relative to the base for feed movement, to the base material by cutting to form the curved surface.

[0075]可以理解的是,本领域技术人员还可在本发明精神内做其它变化等用在本发明的设计,只要其不偏离本发明的技术效果均可。 [0075] It will be appreciated that those skilled in the art may be made to change within the spirit of the present invention is designed for use in the present invention, as long as it does not departing from the technical effect of the invention can be. 这些依据本发明精神所做的变化,都应包含在本发明所要求保护的范围之内。 These changes made according to the spirit of the present invention, the present invention is intended to be included within the scope of the claims.

Claims (10)

1. 一种电子装置的金属外壳加工方法,所述金属外壳包括曲面,所述金属外壳加工方法包括以下步骤: 提供一金属制成的基材; 提供一切削设备,所述切削设备包括金刚石刀具; 将所述基材定位且装夹于所述切削设备上;及所述金刚石刀具相对所述基材作进给运动,以对所述基材进行切削加工以形成所述曲面。 A method of processing metal housing of an electronic device, said shell comprising a metal surface, the metal shell processing method comprising the steps of: providing a substrate made of a metal; providing a cutting apparatus, said cutting apparatus comprising a diamond tool ; the substrate is positioned on said cutting and clamping device; and the diamond cutting tool relative to the base for feed movement, to the base material by cutting to form the curved surface.
2. 如权利要求1所述的电子装置的金属外壳加工方法,其特征在于:所述金刚石刀具包括切削刃,所述切削刃的形状与所述曲面相对应,以一次成型所述曲面。 2. The metal shell processing method according to claim 1 of the electronic device, wherein: said diamond cutting tool comprising a cutting edge, the cutting edge shape of the curved surface corresponding to the curved surface forming.
3. 如权利要求1所述的电子装置的金属外壳加工方法,其特征在于:所述金刚石刀具包括刀柄及装设于所述刀柄上的刀片,所述刀片为金刚石刀片。 Metal housing according to one method of processing electronic device as claimed in claim 3, wherein: said diamond cutting tool comprising a handle and a blade mounted on the handle to the blade is a diamond blade.
4. 如权利要求3所述的电子装置的金属外壳加工方法,其特征在于:所述金刚石刀具为铣刀,所述金刚石刀具在对所述基材进行切削时高速旋转。 4. The method of processing metal housing electronic device according to claim 3, characterized in that: said diamond cutting tool is a milling cutter, high speed rotation of the diamond tool during cutting of the substrate.
5. 如权利要求1所述的电子装置的金属外壳加工方法,其特征在于:所述金刚石刀具相对所述基材作进给运动的步骤后,所述金属外壳加工方法还包括对所述具有所述曲面的基材进行阳极处理。 5. The method of processing the metal housing of the electronic device of claim 1, wherein: after the diamond cutting tool relative to the substrate for movement of the feed step, the processing method further comprises a metal casing having the the substrate surface is anodized.
6. 如权利要求5所述的电子装置的金属外壳加工方法,其特征在于:对所述具有所述曲面的基材进行阳极处理的步骤后,所述金属外壳加工方法还包括对所述具有所述曲面的基材进行染色处理。 6. The method of processing metal casing 5 of the electronic device according to claim, wherein: said rear surface of said substrate having anodized step, the processing method further comprises a metal casing having the the substrate surface staining process.
7. 如权利要求6所述的电子装置的金属外壳加工方法,其特征在于:对所述具有所述曲面的基材进行染色处理的步骤后,所述金属外壳加工方法还包括对所述具有所述曲面的基材进行封孔处理。 7. The method of processing metal housing of the electronic device according to claim 6, wherein: the curved surface of said substrate having said step of dyeing process, the processing method further comprises a metal casing having the the substrate surface is subjected to a sealing process.
8. 如权利要求7所述的电子装置的金属外壳加工方法,其特征在于:对所述具有所述曲面的基材进行封孔处理的步骤后,所述金属外壳加工方法还包括对所述具有所述曲面的基材进行干燥处理。 8. The method of processing metal housing of the electronic device according to claim 7, wherein: the curved surface of the substrate having the sealing treatment step, the metal shell of the processing method further comprises It said substrate having a curved surface is dried.
9. 如权利要求1至8项任意一项所述的电子装置的金属外壳加工方法,其特征在于:所述金属外壳由金属铝、铝合金、镁、镁合金中的一种制成。 The method of processing metal casing 9. The electronic device 1-8 according to any one of claims, wherein: said metal case is made of metal such as aluminum, aluminum alloys, magnesium, magnesium alloy thereof.
10. 如权利要求1至8项任意一项所述的电子装置的金属外壳加工方法,其特征在于:所述曲面设置于所述金属外壳的外侧面。 The method of processing metal shell 10. The electronic device 1-8 according to any one of claims, wherein: the curved surface is provided on the outer surface of the metal housing.
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