CN106817522A - The structure of photographing module - Google Patents
The structure of photographing module Download PDFInfo
- Publication number
- CN106817522A CN106817522A CN201510891337.0A CN201510891337A CN106817522A CN 106817522 A CN106817522 A CN 106817522A CN 201510891337 A CN201510891337 A CN 201510891337A CN 106817522 A CN106817522 A CN 106817522A
- Authority
- CN
- China
- Prior art keywords
- photographing module
- substrate
- fpc
- camera lens
- way
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses the structure of photographing module, including picture processing chip, substrate, base, camera lens and FPC, described image process chip is pressed together in the cavity of substrate by way of upside-down mounting；The base and camera lens are all threaded structure, and both are locked with together, and thereon is fixed on by way of bonding；FPC is fixed on substrate by way of pressing or welding.The structure of photographing module of the present invention, is manufactured using FPC by the way of the pressing of picture processing chip horizontal direction, the height of whole photographing module can be reduced, in can apply to more lightening equipment.
Description
Technical field
The present invention relates to the technical field that photographing module is manufactured, more particularly to photographing module
Structure.
Background technology
In recent years, the application of photographing module is more and more extensive, and such as equivalent we are close for mobile phone, computer
The electronic product that cut is closed.As the use of these products is increasingly extensive, photographing module is promoted
The fast development of manufacturing industry, and the height limitation of the photographing module thickness of end product, it is existing
End product all tend to lightening development, therefore by the height reduction of photographing module in terminal
The application of product will above be changed more extensively.
The use of to most photographing modules is at present that picture processing chip is directly fitted in production
The structure of assist side upper surface.The height of photographing module is determined that camera lens is arrived by camera lens
The distance on picture processing chip surface is certain.
The content of the invention
The present invention is in order to solve above mentioned problem, there is provided the structure of photographing module.
The required technical problem for solving of the invention can be achieved through the following technical solutions：
The structure of photographing module, including picture processing chip, substrate, base, camera lens and flexibility
Wiring board, described image process chip is pressed together in substrate cavity；The base and camera lens all bands
There is helicitic texture, both are locked with together, and thereon is fixed on by way of bonding；It is soft
Property wiring board press or welding by way of be fixed on substrate.
Further, the substrate is made of ceramics or other materials.
Further, described image process chip is pressed together on the cavity of substrate by way of upside-down mounting
In.
Further, there is built-in circuit cabling on the substrate.
Further, the base and camera lens are made of plastic cement or other materials.
Further, the base is a hollow belt helicitic texture.
Further, the camera lens outer ring is threaded structure.
Further, the FPC is made of FR4 or other materials.
Further, the built-in circuit cabling of the FPC.
Present invention has the advantages that：The structure of photographing module, using FPC at image
The mode of reason chip level direction pressing is manufactured, and can reduce the height of whole photographing module, can
To be applied in more lightening equipment.
Brief description of the drawings
The present invention will be further described with reference to the accompanying drawings and detailed description：
Fig. 1 is the dimensional decomposition structure diagram 1 of photographing module of the present invention；
Fig. 2 is the dimensional decomposition structure diagram 2 of photographing module of the present invention；
Fig. 3 is a kind of structural representation of photographing module of the present invention；
Fig. 4 is the structure and traditional structure contrast schematic diagram of photographing module of the present invention.
Specific embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to
Understand and understand, with reference to being specifically illustrating, the present invention is expanded on further.
With reference to shown in Fig. 1 and Fig. 2, to realize one of which structure used by photographing module of the present invention
Perspective exploded view.The main element that the invention is used includes picture processing chip 1, base
Plate 2, base 3, camera lens 4 and FPC 5.Picture processing chip 1 is by upside-down mounting
Mode is pressed together in the cavity of substrate 2 so that leg 11 and leg 21 are turned on；The He of base 3
Camera lens 4 is all threaded structure, and both are locked with together, and base is fixed on by way of bonding
Above plate 2；FPC 5 is fixed on a substrate 2 by way of pressing or welding, and is made
Obtain leg 52 and leg 22 is turned on.Substrate 2 is made of ceramics or other materials, thereon
There are built-in circuit cabling and the cavity for embedded image sensor 1.Base 3 and camera lens 4 are equal
It is made of plastic cement or other materials, base 3 is a hollow belt helicitic texture, outside camera lens 4
Circle is threaded structure.FPC 5 is made of FR4 or other materials, and its is built-in
Circuit cabling.
During specific implementation, picture processing chip 1 is pressed together on substrate 2 by way of upside-down mounting
In cavity so that leg 11 and leg 21 are turned on；Come with by base 3 and camera lens 4
Helicitic texture 31 and 41, both are locked with together, and substrate is fixed on by way of bonding
Above 2, it is ensured that the sensitivity centre of the central alignment picture processing chip 1 of camera lens 4, by flexibility
Wiring board 5 is fixed on a substrate 2 by way of pressing or welding so that leg 52 and weldering
Pin 22 is turned on.Manufacture the camera-shooting module structure such as accompanying drawing 3 of completion.By the present invention of accompanying drawing 4
The structure A and traditional structure B contrast schematic diagrams of photographing module can be seen that and using identical mirror
D1 is identical in the case of head, and the total height of photographing module of the present invention images mould less than traditional structure
, there is a difference in height Dx in tile height.
The structure of photographing module, is pressed using FPC in picture processing chip horizontal direction
Mode manufacture, the height of whole photographing module can be reduced, can apply to more lightening
Equipment in.
General principle of the invention, principal character and of the invention excellent has been shown and described above
Point.It should be understood by those skilled in the art that, the present invention is not limited to the above embodiments, on
Merely illustrating the principles of the invention described in embodiment and specification is stated, the present invention is not being departed from
Various changes and modifications of the present invention are possible on the premise of spirit and scope, these changes and improvements
All fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended right
Claim and its equivalent are defined.
Claims (9)
1. the structure of photographing module, including picture processing chip, substrate, base, camera lens,
Described image process chip is pressed together in the cavity of substrate；The base and camera lens are all threaded
Structure, both are locked with together, and thereon is fixed on by way of bonding, and its feature exists
In：Also include FPC, the FPC is fixed by way of pressing or welding
On substrate.
2. according to the structure of the photographing module described in claim 1, it is characterised in that：It is described
Substrate is made of ceramics or other materials.
3. according to the structure of the photographing module described in claim 2, it is characterised in that：It is described
Picture processing chip is pressed together in the cavity of substrate by way of upside-down mounting.
4. according to the structure of the photographing module described in claim 2, it is characterised in that：It is described
There is built-in circuit cabling on substrate.
5. according to the structure of the photographing module described in claim 1, it is characterised in that：It is described
Base and camera lens are made of plastic cement or other materials.
6. according to the structure of the photographing module described in claim 5, it is characterised in that：It is described
Base is a hollow belt helicitic texture.
7. according to the structure of the photographing module described in claim 5, it is characterised in that：It is described
Camera lens outer ring is threaded structure.
8. according to the structure of the photographing module described in claim 1, it is characterised in that：It is described
FPC is made of FR4 or other materials.
9. according to the structure of the photographing module described in claim 8, it is characterised in that：It is described
The built-in circuit cabling of FPC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510891337.0A CN106817522A (en) | 2015-12-01 | 2015-12-01 | The structure of photographing module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510891337.0A CN106817522A (en) | 2015-12-01 | 2015-12-01 | The structure of photographing module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106817522A true CN106817522A (en) | 2017-06-09 |
Family
ID=59106050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510891337.0A Pending CN106817522A (en) | 2015-12-01 | 2015-12-01 | The structure of photographing module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106817522A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1992808A (en) * | 2005-12-27 | 2007-07-04 | 三星电机株式会社 | Camera module package |
| JP2007282195A (en) * | 2006-04-11 | 2007-10-25 | Chicony Electronics Co Ltd | Camera lens module and manufacturing method therefor |
| CN101064776A (en) * | 2006-04-27 | 2007-10-31 | 三星电机株式会社 | A camera module package |
| CN104364908A (en) * | 2012-04-12 | 2015-02-18 | 南昌欧菲光电技术有限公司 | Compact camera module |
| US9088705B1 (en) * | 2013-08-30 | 2015-07-21 | Amazon Technologies, Inc. | Camera module package with stiffener-mounted image sensor die |
-
2015
- 2015-12-01 CN CN201510891337.0A patent/CN106817522A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1992808A (en) * | 2005-12-27 | 2007-07-04 | 三星电机株式会社 | Camera module package |
| JP2007282195A (en) * | 2006-04-11 | 2007-10-25 | Chicony Electronics Co Ltd | Camera lens module and manufacturing method therefor |
| CN101064776A (en) * | 2006-04-27 | 2007-10-31 | 三星电机株式会社 | A camera module package |
| CN104364908A (en) * | 2012-04-12 | 2015-02-18 | 南昌欧菲光电技术有限公司 | Compact camera module |
| US9088705B1 (en) * | 2013-08-30 | 2015-07-21 | Amazon Technologies, Inc. | Camera module package with stiffener-mounted image sensor die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170609 |