CN106784273A - 一种两脚插件型侧面发光的led支架 - Google Patents
一种两脚插件型侧面发光的led支架 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
本发明涉及一种两脚插件型侧面发光的LED支架,由胶体、支架引脚、发光源架体组成,所述胶体截面由半圆形上部与矩形下部组成并且胶体下方设置支架引脚,该胶体内部增设两个并排的发光源架体;其中一个发光源架体侧面设置发光晶片,此发光源架体底部均匀设置水平顶面,所述发光晶片与胶体之间形成侧向照明区域,所述水平顶面与胶体上表面之间形成垂直角度照明区域。本发明有益效果为:通过改变支架结构,支架两边加大,使晶片平固在支架上,可额外实现插件型LED产品的侧面发光;通过改变常规使用条件及范围,可扩大不同使用范围;可满足不同角度发光需求。
Description
技术领域
本发明涉及LED插件型照明产品,尤其涉及一种用于玩具产品、工艺用品、灯饰产品等领域的两脚插件型侧面发光的LED支架。
背景技术
LED其结构为一个半导体的晶片,晶片的一端附在一个支架上,一端是负极,另一端连接电源的正极,使整个晶片被环氧树脂封装起来。该半导体晶片由两部分组成,一部分是P型半导体,其里面空穴占主导地位,另一端是N型半导体;当电流通过导线作用于晶片时,电子会被推向P区,在P区里电子跟空穴复合,然后以光子的形式发出能量,从而形成LED发光的原理。
但是,普通的两脚插件型LED,由于该类支架晶片固在碗杯中,然后焊线到支架另一边,因此,晶片处于具有一定凹陷深度的碗杯内仅使光能从碗杯的顶部发出,倘若需要侧面发光使用时则无法达到要求,同时,该结构为单一的单面发光面,最终导致发光角度单一,只能实现一种角度;此外,无法使发出的光变得柔和或感观柔和,光明暗度相差大而造成感观差异大。
因此,针对以上方面,需要对现有技术进行有效创新。
发明内容
针对以上缺陷,本发明提供一种可实际侧面发光及90°发光的需求、可扩大不同使用范围、有利于延长使用寿命的两脚插件型侧面发光的LED支架,以解决现有技术的诸多不足。
为实现上述目的,本发明采用以下技术方案:
一种两脚插件型侧面发光的LED支架,由胶体、支架引脚、发光源架体组成,所述胶体截面由半圆形上部与矩形下部组成并且胶体下方设置支架引脚,该胶体内部增设两个并排的发光源架体;其中一个发光源架体侧面设置发光晶片,此发光源架体底部均匀设置水平顶面,所述发光晶片与胶体之间形成侧向照明区域,所述水平顶面与胶体上表面之间形成垂直角度照明区域。
相应地,所述发光源架体两侧均分别设置一个发光晶片并且二者发光颜色不同。
所述水平顶面增设另一发光晶片。
所述胶体内部添加抗沉粉;
所述胶体与支架之间设置封装硅脂。
本发明所述的两脚插件型侧面发光的LED支架的有益效果为:
(1)通过改变支架结构,支架两边加大,使晶片平固在支架上,可额外实现插件型LED产品的侧面发光;
(2)通过改变常规使用条件及范围,可扩大不同使用范围;
(3)可满足不同角度发光需求;
(4)可使发出的光更加柔和,解决光明暗度相差大而造成感观差异大的问题。
附图说明
下面根据附图对本发明作进一步详细说明。
图1是现有技术的两脚插件型LED支架结构示意图;
图2是本发明实施例所述两脚插件型侧面发光的LED支架内部示意图。
图中:
1、胶体;2、支架引脚;3、发光源架体;4、水平顶面;5、发光晶片;6、内凹碗杯结构;7、顶部发光区域。
具体实施方式
实施例1
如图1-2所示,本发明实施例所述的两脚插件型侧面发光的LED支架,由胶体1、支架引脚2、发光源架体3组成,所述胶体1截面由半圆形上部与矩形下部组成并且胶体1下方设置支架引脚2,该胶体1内部增设两个并排的发光源架体3;
进一步地,其中一个发光源架体3侧面设置发光晶片5,此发光源架体3底部均匀设置水平顶面4,其中的发光源架体3两侧均可分别设置一个发光晶片5并且二者发光颜色不同。
相应地,所述发光晶片5与胶体1之间形成侧向照明区域,所述水平顶面4与胶体1上表面之间形成垂直角度照明区域;
相应地,所述水平顶面4可增设的另一发光晶片5。
本结构改进了传统LED支架结构将发光晶片5固在胶体1内凹碗杯结构6中,然后焊线到支架另一边,因此,晶片处于具有一定凹陷深度的碗杯内仅使光能从碗杯的顶部发出,导致最终仅具备顶部发光区域7。
实施例2
如图1-2所示,本发明实施例所述的两脚插件型侧面发光的LED支架,由胶体1、支架引脚2、发光源架体3组成,所述胶体1截面为矩形,该胶体1内部增设发光源架体3;
进一步地,发光源架体3侧面设置发光晶片5,此发光源架体3底部均匀设置水平顶面4;
所述发光晶片5与胶体1之间形成侧向照明区域。
实施例3
如图1-2所示,本发明实施例所述的两脚插件型侧面发光的LED支架,其制作方法由以下步骤组成:
(1)首先,在胶体1内部增设两个并排的发光源架体3;
(2)在发光源架体3侧面设置发光晶片5,此发光源架体3底部均匀设置水平顶面4,或在发光源架体3两侧均可分别设置颜色不同的发光晶片5;
(3)填充胶体,使发光晶片5与胶体1之间形成侧向照明区域,或在水平顶面4与胶体1上表面之间形成垂直角度照明区域。
上述对实施例的描述是为了便于该技术领域的普通技术人员能够理解和应用本案技术,熟悉本领域技术的人员显然可轻易对这些实例做出各种修改,并把在此说明的一般原理应用到其它实施例中而不必经过创造性的劳动。因此,本案不限于以上实施例,本领域的技术人员根据本案的揭示,对于本案做出的改进和修改,例如,晶片型号、各个连接端的设置、支架形状等,若没有产生超出本案范围之外的有益效果,则都应该在本案的保护范围内。
Claims (5)
1.一种两脚插件型侧面发光的LED支架,其特征在于,由胶体、支架引脚、发光源架体组成,所述胶体截面由半圆形上部与矩形下部组成并且胶体下方设置支架引脚,该胶体内部增设两个并排的发光源架体;其中一个发光源架体侧面设置发光晶片,此发光源架体底部均匀设置水平顶面,所述发光晶片与胶体之间形成侧向照明区域,所述水平顶面与胶体上表面之间形成垂直角度照明区域。
2.根据权利要求1所述的两脚插件型侧面发光的LED支架,其特征在于:所述发光源架体两侧均分别设置一个发光晶片并且二者发光颜色不同。
3.根据权利要求1或2所述的两脚插件型侧面发光的LED支架,其特征在于:所述水平顶面增设另一发光晶片。
4.根据权利要求3所述的两脚插件型侧面发光的LED支架,其特征在于:所述胶体内部添加抗沉粉。
5.根据权利要求4所述的两脚插件型侧面发光的LED支架,其特征在于:所述胶体与支架之间设置封装硅脂。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201946591U (zh) * | 2010-10-18 | 2011-08-24 | 鹤山市银雨照明有限公司 | 一种双晶led封装结构 |
CN202352725U (zh) * | 2011-11-18 | 2012-07-25 | 梁清晖 | 水平全向出光led |
CN202855794U (zh) * | 2012-05-25 | 2013-04-03 | 鹤山市银雨照明有限公司 | 一种直插式led封装结构 |
CN203932049U (zh) * | 2014-05-06 | 2014-11-05 | 佛山市国星光电股份有限公司 | 一种全角度出光的led 器件 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN201946591U (zh) * | 2010-10-18 | 2011-08-24 | 鹤山市银雨照明有限公司 | 一种双晶led封装结构 |
CN202352725U (zh) * | 2011-11-18 | 2012-07-25 | 梁清晖 | 水平全向出光led |
CN202855794U (zh) * | 2012-05-25 | 2013-04-03 | 鹤山市银雨照明有限公司 | 一种直插式led封装结构 |
CN203932049U (zh) * | 2014-05-06 | 2014-11-05 | 佛山市国星光电股份有限公司 | 一种全角度出光的led 器件 |
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