CN106784272A - A kind of production technology of LED support - Google Patents
A kind of production technology of LED support Download PDFInfo
- Publication number
- CN106784272A CN106784272A CN201611260507.6A CN201611260507A CN106784272A CN 106784272 A CN106784272 A CN 106784272A CN 201611260507 A CN201611260507 A CN 201611260507A CN 106784272 A CN106784272 A CN 106784272A
- Authority
- CN
- China
- Prior art keywords
- led support
- production technology
- layer
- reflector
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
A kind of production technology of LED support, mainly be input to required LED support model drawing in computer by it, then by 3D metallic prints machine described in computer controls by the LED support printing shaping.LED support in the present invention is printed by 3D metallic prints machine, and compared to traditional Sheet Metal Forming Technology, operating procedure is simple and convenient, and accuracy is higher, and does not result in the waste of material.
Description
Technical field
The present invention relates to a kind of LED production technologies, a kind of production technology of LED support is referred in particular to.
Background technology
LED support is LED lamp bead bottom susceptor before encapsulation, on the basis of LED support, chip is fixed,
Burn-on positive and negative electrode, then it is once in package shape with packaging plastic.
Existing LED support manufacture craft mainly includes punching press, electroplates, is molded, cutting, packing, existing Sheet Metal Forming Technology
It is first to choose appropriate copper material, is processed into sheet, then by stamping mold by its punch forming；Its complex steps is bothered,
And many waste materials occur during punching press, if there is the larger situation of scale error after shaping, the copper material even falls one integral piece
It is waste product, causes larger waste of material.
The content of the invention
The present invention provides a kind of production technology of LED support, and its main purpose is to overcome existing LED support to make work
Skill complex steps are bothered, and the easily defect of waste of materials.
In order to solve the above technical problems, the present invention is adopted the following technical scheme that：
A kind of production technology of LED support, comprises the following steps：
1) copper product is put into 3D metallic print machines；
2) required LED support model drawing is input in computer, then by 3D metallic prints machine described in computer controls
By the LED support printing shaping；
3) the LED support outer layer in the printing shaping electroplates one layer of sour layers of copper；
4) in one layer of nickel dam of sour layers of copper outer layer re-plating；
5) in one layer of silver layer of nickel dam outer layer re-plating；
6) white glue is molded to the reflector on the LED support for having plated silver layer by injection machine；
7) to the reflector cup jacking row brush ink treatment after injection white glue；
8) LED support is cut using automatic cutter.
Further, the length of the LED support is 150mm, and width is 60mm, and thickness is 0.15mm.
Further, the length of the reflector is 3.50mm, and width is 2.80mm, and thickness is 1.85mm.
Further, before to reflector cup jacking row brush ink treatment first to reflector cup jacking row frosted at
Reason.
Further, the white glue is EMC.
Compared to the prior art, the beneficial effect of present invention generation is:
LED support in the present invention is printed by 3D metallic prints machine, and compared to traditional Sheet Metal Forming Technology, operating procedure is simply square
Just, accuracy is higher, and does not result in the waste of material；By reflector cup jacking row brush ink treatment, can be in order to the later stage
Technical staff installs LED chip.
Brief description of the drawings
Fig. 1 is the front view of heretofore described LED support.
Fig. 2 is the side view of heretofore described LED support.
Fig. 3 is the front view of reflector described in Fig. 1.
Fig. 4 is the side view of reflector described in Fig. 2.
Specific embodiment
Specific embodiment of the invention is illustrated with reference to the accompanying drawings.
Reference picture 1, Fig. 2, Fig. 3 and Fig. 4.A kind of production technology of LED support, comprises the following steps：
Step one
Copper product is put into 3D metallic print machines.
Step 2
The required model drawing of LED support 1 is input in computer, then will by 3D metallic prints machine described in computer controls
The LED support printing shaping.
Step 3
One layer of sour layers of copper is electroplated in the LED support outer layer of the printing shaping.
Step 4
In one layer of nickel dam of sour layers of copper outer layer re-plating.
Step 5
In one layer of silver layer of nickel dam outer layer re-plating.
Step 6
White glue is molded to the reflector 2 on the LED support for having plated silver layer by injection machine.The white glue can be EMC.
EMC-Epoxy Molding Compound are epoxy molding material, epoxy-plastic packaging material, are by epoxy resin
Be matrix resin, with High Performance Phenolic Resins as curing agent, it is filler to add silicon powder etc., and add various additive mixtures and
Into powdery moulding compound.
Step 7
Reflector cup top 21 after injection white glue is carried out brushing black treatment.
Step 8
LED support is cut using automatic cutter.
Reference picture 1, Fig. 2, Fig. 3 and Fig. 4.The length of the LED support 1 is 150mm, and width is 60mm, and thickness is
0.15mm.The length of the reflector 2 is 3.50mm, and width is 2.80mm, and thickness is 1.85mm.To 2 glasss of the reflector
Top 21 is first processed reflector cup jacking row frosted before carrying out brushing ink treatment.
LED support in the present invention is printed by 3D metallic prints machine, and compared to traditional Sheet Metal Forming Technology, operating procedure is simple
Convenient, accuracy is higher, and does not result in the waste of material；By reflector cup jacking row brush ink treatment, can be in order to rear
Phase technical staff installs LED chip.
Specific embodiment of the invention is above are only, but design concept of the invention is not limited thereto, it is all to utilize this
Design carries out the change of unsubstantiality to the present invention, all should belong to the behavior for invading the scope of the present invention.
Claims (5)
1. a kind of production technology of LED support, it is characterised in that comprise the following steps：
1) copper product is put into 3D metallic print machines；
2) required LED support model drawing is input in computer, then by 3D metallic prints machine described in computer controls
By the LED support printing shaping；
3) the LED support outer layer in the printing shaping electroplates one layer of sour layers of copper；
4) in one layer of nickel dam of sour layers of copper outer layer re-plating；
5) in one layer of silver layer of nickel dam outer layer re-plating；
6) white glue is molded to the reflector on the LED support for having plated silver layer by injection machine；
7) to the reflector cup jacking row brush ink treatment after injection white glue；
8) LED support is cut using automatic cutter.
2. as claimed in claim 1 a kind of production technology of LED support, it is characterised in that：The length of the LED support is
150mm, width is 60mm, and thickness is 0.15mm.
3. as claimed in claim 1 a kind of production technology of LED support, it is characterised in that：The length of the reflector is
3.50mm, width is 2.80mm, and thickness is 1.85mm.
4. as claimed in claim 1 a kind of production technology of LED support, it is characterised in that：To reflector cup jacking row
First to reflector cup jacking row frosted treatment before brush ink treatment.
5. as claimed in claim 1 a kind of production technology of LED support, it is characterised in that：The white glue is EMC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611260507.6A CN106784272A (en) | 2016-12-30 | 2016-12-30 | A kind of production technology of LED support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611260507.6A CN106784272A (en) | 2016-12-30 | 2016-12-30 | A kind of production technology of LED support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106784272A true CN106784272A (en) | 2017-05-31 |
Family
ID=58953865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611260507.6A Pending CN106784272A (en) | 2016-12-30 | 2016-12-30 | A kind of production technology of LED support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106784272A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312880A (en) * | 2019-11-05 | 2020-06-19 | 东莞智昊光电科技有限公司 | LED support and production method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103924276A (en) * | 2014-04-29 | 2014-07-16 | 深圳市崇辉表面技术开发有限公司 | Electroplating system and electroplating method for surface-mounted light emitting diode support |
| US20150092429A1 (en) * | 2013-09-27 | 2015-04-02 | Osram Sylvania Inc. | Flexible circuit board for electronic applications, light source containing same, and method of making |
| CN204289527U (en) * | 2014-12-05 | 2015-04-22 | 博罗承创精密工业有限公司 | Waterproof LED support |
| US20150359099A1 (en) * | 2014-06-04 | 2015-12-10 | Apple Inc. | Low area over-head connectivity solutions to sip module |
-
2016
- 2016-12-30 CN CN201611260507.6A patent/CN106784272A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150092429A1 (en) * | 2013-09-27 | 2015-04-02 | Osram Sylvania Inc. | Flexible circuit board for electronic applications, light source containing same, and method of making |
| CN103924276A (en) * | 2014-04-29 | 2014-07-16 | 深圳市崇辉表面技术开发有限公司 | Electroplating system and electroplating method for surface-mounted light emitting diode support |
| US20150359099A1 (en) * | 2014-06-04 | 2015-12-10 | Apple Inc. | Low area over-head connectivity solutions to sip module |
| CN204289527U (en) * | 2014-12-05 | 2015-04-22 | 博罗承创精密工业有限公司 | Waterproof LED support |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111312880A (en) * | 2019-11-05 | 2020-06-19 | 东莞智昊光电科技有限公司 | LED support and production method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
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| RJ01 | Rejection of invention patent application after publication |