CN106783702A - Silicon chip flower basket - Google Patents
Silicon chip flower basket Download PDFInfo
- Publication number
- CN106783702A CN106783702A CN201710082438.2A CN201710082438A CN106783702A CN 106783702 A CN106783702 A CN 106783702A CN 201710082438 A CN201710082438 A CN 201710082438A CN 106783702 A CN106783702 A CN 106783702A
- Authority
- CN
- China
- Prior art keywords
- plate
- gaily decorated
- decorated basket
- silicon chip
- side plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 29
- 239000010703 silicon Substances 0.000 title claims abstract description 29
- 238000005192 partition Methods 0.000 claims abstract description 11
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a kind of silicon chip flower basket, including front end-plate, end plate and gaily decorated basket side plate, some partitions have been equidistantly distributed on the gaily decorated basket side plate, the draw-in groove that silicon chip is put for card is formed between adjacent two partition, also include locating rod and bracing piece, the locating rod is connected through the earhole on the gaily decorated basket side plate with the front end-plate, end plate, and the bracing piece is located at the gaily decorated basket side plate bottom, and the bracing piece is fixedly connected with the front end-plate, end plate.The gaily decorated basket of the present invention is positioned by locating rod, and bottom is strengthened by bracing piece, after gaily decorated basket side plate is positioned with locating ring, it is ensured that altitude datum, is solved and is used gaily decorated basket problem on deformation for a long time, and effectively control benchmark surface error ＜ 30um；The time for frequently changing the gaily decorated basket is saved, the production efficiency of silicon chip is improved；Production capacity is improve, so as to reduce the production cost of monolithic.
Description
Technical field
The present invention relates to a kind of silicon wafer carrying device technology, especially a kind of silicon chip flower basket.
Background technology
At present, most of line photovoltaic modulies and solar silicon wafers supplier products availability would become hard to keep up with demand
The paces for rising, because the demand growth of Chinese market installation amount is swift and violent, the equipment capacity to producing silicon chip proposes requirement higher.City
The silicon chip flower basket capacity that field uses is 25,50, if gaily decorated basket capacity increases to 100, by reducing, inserted sheet link, silicon chip are clear
Wash link, silicon chip sorting link and change the blue time, so as to improve production capacity.
100 silicon chip flower baskets of existing manufacturer's production, poor dimensional stability, the gaily decorated basket is needed by baking oven, so as to silicon chip
Dried, the drying gaily decorated basket thermal deformation of 80~90C ° of process time 5min temperature, by after normal temperature cooling, first piece benchmark is high
Degree exceeds allowable error scope, it is impossible to reuse.Existing silicon chip flower basket is unresolved, and that rear datum level is used for multiple times is high to first piece
The uniformity of degree, it is impossible to meet the requirement of equipment requirement reference plate error ＜ 30um.
The content of the invention
The technical problems to be solved by the invention are the defects for overcoming prior art, there is provided a kind of silicon chip flower basket.
The present invention solves the technical scheme that prior art problem is used：A kind of silicon chip flower basket, including front end-plate, end plate
With gaily decorated basket side plate, some partitions are equidistantly distributed on the gaily decorated basket side plate, formed between adjacent two partition and put silicon chip for card
Draw-in groove, also including locating rod and bracing piece, the locating rod through the earhole on the gaily decorated basket side plate and the front end-plate, after
End plate connection, the bracing piece is located at the gaily decorated basket side plate bottom, and the bracing piece is fixed with the front end-plate, end plate and connected
Connect.
Further, the locating rod is provided with some locating rings, and the locating ring uses multi-point welding and the positioning
Bar is connected.
Further, the partition quantity is 99, can block and put 100 silicon chips.
Further, the silicon chip flower basket also includes hangers axle, and the hangers axle is respectively arranged on the front end-plate, end plate
Outside, the hangers axle is threadedly coupled with the front end-plate, end plate.
Further, the gaily decorated basket side plate is molded using alloy plastic, and heat endurance is strong, it is ensured that first piece benchmark
Height is in the uniformity for recycling.
Above-mentioned technical proposal is employed, the present invention has following beneficial effect：The present invention is positioned by locating rod, bottom
Strengthened by bracing piece, after gaily decorated basket side plate is positioned with locating ring, it is ensured that altitude datum, solve to deform using the gaily decorated basket for a long time and ask
Topic, and effectively control benchmark surface error ＜ 30um；The time for frequently changing the gaily decorated basket is saved, the production efficiency of silicon chip is improved；Improve
Production capacity, so as to reducing the production cost of monolithic.
Brief description of the drawings
The invention will be further described with reference to the accompanying drawings and examples.
Fig. 1 is structural representation of the invention；
Fig. 2 is front view of the invention；
Fig. 3 is top view of the invention；
Fig. 4 is the partial enlarged drawing of a certain screens ring of the invention.
In figure：1st, front end-plate, 2, end plate, 3, gaily decorated basket side plate, 4, dividing plate, 5, draw-in groove, 6, locating rod, 7, bracing piece, 8,
Locating ring, 9, hangers axle.
Specific embodiment
In order that present disclosure is easier to be clearly understood, it is right below according to specific embodiment and with reference to accompanying drawing
The present invention is described in further detail.
A kind of silicon chip flower basket as shown in Figure 1 to Figure 3, including front end-plate 1, end plate 2 and gaily decorated basket side plate 3, the gaily decorated basket
Some partitions 4 are equidistantly distributed on side plate 3, the quantity of the partition 4 is 99.Formed between adjacent two partition 4 and put for card
The draw-in groove 5 of silicon chip.Also include locating rod 6, bracing piece 7 and hangers axle 9, the locating rod 6 passes through the ear on the gaily decorated basket side plate 3
Hole is connected with the front end-plate 1, end plate 2, and the bracing piece 7 is located at the bottom of gaily decorated basket side plate 3, the bracing piece 7 with it is logical
The interior hexagonal screwed hole crossed above front end-plate 1, end plate 2 is fixedly connected with front end-plate 1, end plate 2.Set in the locating rod 6
There are some locating rings 8, the locating ring 8 is connected using multi-point welding with the locating rod 6.The hangers axle 9 is respectively arranged on institute
Front end-plate 1, the outside of end plate 2 are stated, the hangers axle 9 is threadedly coupled with the front end-plate 1, end plate 2.
As shown in figure 4, after locating ring of the invention 8 is located at the earhole of locating rod 6 and gaily decorated basket side plate 3.
Specifically, the gaily decorated basket side plate 3 is molded using alloy plastic, and heat endurance is strong, it is ensured that first piece benchmark
Height is in the uniformity for recycling.
The gaily decorated basket of the present invention is positioned by locating rod 6, and bottom is strengthened by bracing piece 7, and gaily decorated basket side plate 3 is positioned with locating ring 8
Afterwards, it is ensured that altitude datum, solve to use gaily decorated basket problem on deformation for a long time, and effectively control benchmark surface error ＜ 30um；Save
The time of the gaily decorated basket is frequently changed, the production efficiency of silicon chip is improved；Production capacity is improve, so as to reduce the production cost of monolithic.
Particular embodiments described above, has been carried out further in detail to the purpose of the present invention, technical scheme and beneficial effect
Describe in detail bright, should be understood that and the foregoing is only specific embodiment of the invention, be not intended to limit the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution and improvements done etc., should be included in guarantor of the invention
Within the scope of shield.
Claims (5)
1. a kind of silicon chip flower basket, including front end-plate (1), end plate (2) and gaily decorated basket side plate (3), it is equidistant on the gaily decorated basket side plate (3)
From some partitions (4) are distributed with, the draw-in groove (5) that silicon chip is put for card is formed between adjacent two partition (4), it is characterised in that：Also
Including locating rod (6) and bracing piece (7), the locating rod (6) is through the earhole and the front end-plate on the gaily decorated basket side plate (3)
(1), end plate (2) connection, the bracing piece (7) located at gaily decorated basket side plate (3) bottom, the bracing piece (7) with it is described before
End plate (1), end plate (2) are fixedly connected.
2. silicon chip flower basket according to claim 1, it is characterised in that：The locating rod (6) is provided with some locating rings
(8), the locating ring (8) is connected using multi-point welding with the locating rod (6).
3. silicon chip flower basket according to claim 1, it is characterised in that：Partition (4) quantity is 99.
4. silicon chip flower basket according to claim 1, it is characterised in that：Also include hangers axle (9), the hangers axle (9) point
She Yu not the front end-plate (1), the outside of end plate (2), the hangers axle (9) and the front end-plate (1), end plate (2) spiral shell
Line is connected.
5. silicon chip flower basket according to claim 1, it is characterised in that：The gaily decorated basket side plate (3) is molded using alloy plastic
Form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710082438.2A CN106783702A (en) | 2017-02-16 | 2017-02-16 | Silicon chip flower basket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710082438.2A CN106783702A (en) | 2017-02-16 | 2017-02-16 | Silicon chip flower basket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106783702A true CN106783702A (en) | 2017-05-31 |
Family
ID=58957401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710082438.2A Pending CN106783702A (en) | 2017-02-16 | 2017-02-16 | Silicon chip flower basket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106783702A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107893802A (en) * | 2017-12-19 | 2018-04-10 | 无锡优耐特能源科技有限公司 | A kind of silicon chip correcting mechanism |
| CN108899293A (en) * | 2018-07-06 | 2018-11-27 | 天长市百盛半导体科技有限公司 | A kind of solar battery crystalline silicon cleaning device at anti-cleaning dead angle |
| CN110034056A (en) * | 2019-05-16 | 2019-07-19 | 通威太阳能（安徽）有限公司 | A kind of slow lifting trough body structure preventing silicon wafer adhesion |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202384375U (en) * | 2011-11-10 | 2012-08-15 | 北京市塑料研究所 | Assembled high-capacity silicon wafer flower basket with metal framework |
| CN204966463U (en) * | 2015-08-05 | 2016-01-13 | 江苏荣马新能源有限公司 | Diffusion silicon chip turnover box |
| CN106057714A (en) * | 2016-08-17 | 2016-10-26 | 常州亿晶光电科技有限公司 | Silicon chip bearing basket |
| CN206480608U (en) * | 2017-02-16 | 2017-09-08 | 常州市科沛达超声工程设备有限公司 | Silicon chip flower basket |
-
2017
- 2017-02-16 CN CN201710082438.2A patent/CN106783702A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202384375U (en) * | 2011-11-10 | 2012-08-15 | 北京市塑料研究所 | Assembled high-capacity silicon wafer flower basket with metal framework |
| CN204966463U (en) * | 2015-08-05 | 2016-01-13 | 江苏荣马新能源有限公司 | Diffusion silicon chip turnover box |
| CN106057714A (en) * | 2016-08-17 | 2016-10-26 | 常州亿晶光电科技有限公司 | Silicon chip bearing basket |
| CN206480608U (en) * | 2017-02-16 | 2017-09-08 | 常州市科沛达超声工程设备有限公司 | Silicon chip flower basket |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107893802A (en) * | 2017-12-19 | 2018-04-10 | 无锡优耐特能源科技有限公司 | A kind of silicon chip correcting mechanism |
| CN108899293A (en) * | 2018-07-06 | 2018-11-27 | 天长市百盛半导体科技有限公司 | A kind of solar battery crystalline silicon cleaning device at anti-cleaning dead angle |
| CN108899293B (en) * | 2018-07-06 | 2023-11-17 | 天长市百盛半导体科技有限公司 | Solar cell crystalline silicon cleaning device capable of preventing dead angles from being cleaned |
| CN110034056A (en) * | 2019-05-16 | 2019-07-19 | 通威太阳能（安徽）有限公司 | A kind of slow lifting trough body structure preventing silicon wafer adhesion |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 213000 299 Fu Min Road, Lucheng street, Wujin District, Changzhou, Jiangsu Applicant after: CHANGZHOU KEPEIDA CLEANING TECHNOLOGY Co.,Ltd. Address before: 213025 299 Fu Min Road, Lucheng street, Wujin District, Changzhou, Jiangsu Applicant before: KEPEIDA ULTRASONIC ENGINEERING EQUIPMENT (CHANGZHOU) CO.,LTD. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |
|
| RJ01 | Rejection of invention patent application after publication |