CN106768215A - Deformation measurement device - Google Patents
Deformation measurement device Download PDFInfo
- Publication number
- CN106768215A CN106768215A CN201710180157.0A CN201710180157A CN106768215A CN 106768215 A CN106768215 A CN 106768215A CN 201710180157 A CN201710180157 A CN 201710180157A CN 106768215 A CN106768215 A CN 106768215A
- Authority
- CN
- China
- Prior art keywords
- deformation measurement
- base material
- deformation
- measurement device
- sensitive grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01G—WEIGHING
- G01G3/00—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances
- G01G3/12—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing
- G01G3/14—Weighing apparatus characterised by the use of elastically-deformable members, e.g. spring balances wherein the weighing element is in the form of a solid body stressed by pressure or tension during weighing measuring variations of electrical resistance
Abstract
The invention discloses a kind of deformation measurement device, including more than one deformation measurement element, deformation measurement element includes：Base material, is made up of the elastomeric material of material property of enbrittling；Sensitive grid, secure bond is in substrate surface and forms integral structure, and sensitive grid enbrittles material property to eliminate the error that plastic deformation is brought according to output detection value in proportion is deformed using the integral structure and base material of base material and sensitive grid.The present invention can eliminate the influence of plastic deformation, with high accuracy, high duplication and high reliability.
Description
Technical field
The present invention relates to stress determination field, more particularly to a kind of deformation measurement device.
Background technology
Deformation measurement device generally includes deformation measurement element i.e. deformation strain gauge unit, and deformation measurement element is generally fixed
On the elastomer for needing tested deformation, after deformation measurement element is set onto the surface of elastomer, bullet can be tested
The deformation of gonosome.The deformation of the elastomer that deformation measurement element will be measured is converted to test signal such as mechanicalness, electrical resistance, magnetic
Or optical signal output.
Deformation measurement element includes deforming the base material of the sensitive grid and electric insulation that are converted into signal, and sensitive grid is usual
Using resistive foil.In the prior art, elastomer is usually conductive metal (aluminium, steel alloy, stainless steel), with detection deformation
There must be the base material of electric insulation between resistive foil, and this base material is typically organic material, is flexible.
Resistive foil and base material are made of one referred to as strain gauge or deformation strain gauge, deformation strain gauge is by more than one
Deformation strain gauge unit be deformation measurement element composition.After deformation strain gauge is fixed on the surface of elastomer, can survey
Try the deformation of elastomer.When weighing sensor is manufactured, deformation strain gauge is fitted with elastomer using adhesive, this
Sample, it would be desirable to which the load being weighed is placed on elastomer, is deformed elastomer, and the deformation is carried out by deformation strain gauge
Measurement, can convert the weight for being loaded according to measurement result, so as to realize weighing.
When making scale using above-mentioned weighing sensor, scale body is in addition to weighing sensor, in addition it is also necessary to using bearing frame, weigh
The load-carrying members body such as platform, load-carrying members body is different parts from the elastomer in weighing sensor, is needed therebetween strong
Transmission mechanism.
From the foregoing, it will be observed that deformation measurement device includes the deformation measurement element being made up of sensitive grid and base material, deformation is surveyed
Determine element and be fixed on elastomer the deformation for being capable of testing elastic body afterwards；After deformation measurement element and elastomer are combined
Weighing sensor can be formed；And weighing sensor combination load-carrying members body can then form what be can be used directly in daily life
Scale.
In above-mentioned deformation measurement device, the material of sensitive grid can also deform after elastomer deforms, sensitive grid
The test signal that can correspondingly be exported such as mechanicalness, electrical resistance, magnetical or optical is converted to according to the deformation of its material in itself
The signal of property.
The principle of sensitive grid test deformation is, based on Hooke's law, to be widely used centered on weighing at present.
In regime of elastic deformation, the deformation of solid and the ratio of external force are linear, this principle obtained it is widely recognized that, be applied to
Many practical fields such as spring.
The deformation strain of deformation detection and measure is applied in respect of various implementations, all these is all with Hooke's law
Based on, the change for producing will be deformed and be converted to mechanicalness, electrical resistance, the change of magnetical or optical property, and in this, as detector
To be applied.
But, Hooke's law is only set up in the limited range of stress, and the overwhelming majority should in height for the material of elastomer
Can be plastically deformed under power, depart from Hooke's law, show nonlinear response.
Because the material of traditional deformation strain gauge base material is plasticity, can also follow elastomer and be plastically deformed so that
Deformation strain gauge loses linearly, it may occur that so-called resume effect causes error.Recuperability is caused to be lost beyond elastic limit simultaneously
Lose, so as to reduce repeatability.Destruction is ultimately resulted in if continuing to meet with stresses.
On the other hand, it is known as the material not almost being plastically deformed or be not in fact plastically deformed completely
Have glass and ceramics etc..These materials, i.e., so-called fragile material hardly shows the characteristic of plastic deformation.So, according to
After Hooke's law offered load, fragile material can occur the deformation proportional to stress, material reach can bear maximum stress with
Can cause brittle break after upper.This shows during using glass or ceramics as the elastomer or base material of detection deformation, reaching fragility
Before destruction, will all the time there is the linear and repeatability of excellent stress-deformation.
Glass and ceramics are for a long time because its elastic deformation limit is too small (generally less than 10-3), therefore prior art is recognized
It is that glass and ceramics are not suitable for being applied to the general deformation measurement such as weighing.
Strain ga(u)ge detection method is to realize that the method that deformation signal is changed is for everybody as sensitive grid using metallic resistance
It is known to deform the assay method for being converted into electric signal, by detecting electricity caused by the Volume Changes by metallic resistance body
Resistive detects deformation.The representative instance of the method is as follows：By metallic resistance line or it is processed into the metallic resistance of circuit shape
Thin slice is fixed on the organic substrate of the electric insulations such as epoxy resin or polyimide resin and constitutes deformation strain gauge, is used glue
Glutinous agent is fitted on the elastomer for needing detection deformation.This kind of deformation strain gauge cost is relatively cheap, in weighing sensor
On be widely used.
But still there are following limitations in this technology：
1), in the deformation strain gauge using metallic resistance as sensitive grid, because sensitive grid needs to be fixed on asphalt mixtures modified by epoxy resin
On the organic substrate of the electric insulation such as fat or polyimide resin, and the base material of these electric insulations is flexible, no elasticity.
When the load excessive of elastomer, more than its yield point, so that when there is plastic deformation, base material can be plastically deformed therewith.This
When resistive foil can still work, the signal of output nonlinear causes error.Due to the flexible parent metal in existing deformation strain gauge
Unavoidably there is plastic deformation characteristic, it is impossible to eliminate the error that plastic deformation is brought.
2) when, deformation strain gauge being done into further application form weighing sensor, as seen from the above description, it is necessary to deform
Strain gauge is fitted on elastomer, not only labor intensive, and due to the limitation of manual work, strain gauge can not be made it is too small,
So as to also limit the miniaturization of weighing sensor.
3) when, weighing sensor being done into further application form scale, in addition it is also necessary to use load-carrying members body, weighing sensor
Integration and strong transmission mechanism cannot be therebetween needed and load-carrying members body between, this is to reducing volume, reducing into
Originally it is all unfavorable, to improve reliability and certainty of measurement.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of deformation measurement device, can eliminate the influence of plastic deformation,
With high accuracy, high duplication and high reliability, moreover it is possible to reduce artificial, simplified and diminution scale structure.
In order to solve the above technical problems, the deformation measurement device that the present invention is provided includes more than one deformation measurement unit
Part, the deformation measurement element includes：
Base material, is made up of the elastomeric material of material property of enbrittling.
Sensitive grid, secure bond is in the substrate surface and forms integral structure, the sensitive grid according to deformation press than
Example output detection value, is enbrittled material property using the integral structure and the base material of the base material and the sensitive grid
To eliminate the error that plastic deformation is brought.Fragile material hardly shows the characteristic of plastic deformation, therefore is also referred to as moulded without substantive
Property deformation material.
Further improvement is that the material of the sensitive grid has elastic limit higher than the material of the base material.
Further improvement be, the base material spatially structure, the sensitive grid is arranged on three-dimensional six face of the base material
In one or more surfaces.
Further improvement is that deformation measurement device also includes metal elastic gonosome, and the deformation measurement element is fixed on institute
State on metal elastic gonosome, the elastic limit of the elastic limit less than the metal elastic gonosome of the material of the base material, the base material
Surface with the metal elastic gonosome is combined, and the base material is located between the metal elastic gonosome and the sensitive grid.
Further improvement is that deformation measurement device also includes elastomer, and the elastomer and the base material are same portions
Part.
Further improvement be, the deformation measurement device and load-carrying members body constitute scale, the load-carrying members body, described
Elastomer and the base material are same parts.
Further improvement is that the load-carrying members body, second elastomer and the base material are slab construction, are used for
Loading external load.
Further improvement is that the deformation measurement element is that deformation of thin membrane determines element, and the material of the sensitive grid is
Membrane structure is simultaneously formed at the surface of the base material by thin-film technique.
Further improvement is that the material of the base material is glass.
Further improvement is that the thickness of the glass of the base material is more than 0.1mm.
Further improvement is that the material of the base material is ceramics.
Further improvement is that the ceramic thickness of the base material is more than 0.01mm.
Further improvement is that the material of the sensitive grid is metallic resistance body thin film.
Further improvement is that the thickness of the metallic resistance body thin film of the sensitive grid is below 5 μm of more than 10nm.
Further improvement is that the deformation measurement device includes the deformation measurement element of multiple-layer overlapped, each described
Deformation measurement element constitutes multiaxis test structure.
Further improvement is that the deformation measurement device includes that multiple is arranged in the deformation measurement in same plane
Element, each deformation measurement element composition multiaxis test structure.
Further improvement is that the deformation measurement element also includes being mended by the characteristic that possesses for being arranged on the substrate surface
Repay the compensating element, of the material composition of function.
Further improvement is that the corresponding thin-film technique of membrane structure of the material of the sensitive grid includes physical film deposition work
Skill and chemical membrane technique.
Further improvement is that the physical film deposition technique includes MBE or sputtering；The chemical membrane technique includes plating
And CVD.
Further improvement is cushion to be inserted between the base material and the sensitive grid, for strengthening the base
The bond strength of material and the sensitive grid.
Further improvement is that the material of the sensitive grid is semiconductive thin film.
The present invention is specifically designed to deformation measurement element, by the direct secure bond of sensitive grid in by the material that enbrittles
On the base material of the elastomeric material composition of characteristic, thus eliminating the need needing to be fixed on sensitive grid by flexible material in the prior art
The plastic deformation error brought by flexible material when on the base material of composition is expected, so the present invention can eliminate the shadow of plastic deformation
Ring, so that deformation measurement element has the advantages that high accuracy, high duplication and high reliability.
, directly as elastomer, elastomer and change can be realized by by the material of the base material of deformation measurement element of the invention
Shape determines the integration of element, and the deformation measurement element eliminated in weighing sensor in the prior art needs manual assembly to bullet
Defect on gonosome, can not only save the time and cost consumption for manually being brought, moreover it is possible to realize deformation measurement element and weigh
The miniaturization of sensor, moreover it is possible to eliminate the problem of the reliability that the glue in attaching process is brought, so as to further raising
Reliability.
The present invention can also be very easily using the base material of deformation measurement element as elastomer, and be designed into can be direct
The load-carrying members body of load is supported, can also realize that load-carrying members body and elastomer and the base material of deformation measurement element use same
The integral structure of one part composition.Weight body structure need not be set again in addition also without in weight body structure and elastomer
Between set power transferring structure, be not only simple in structure, low cost, and can further improve measuring accuracy and reliability.
With reference to matrix structure, sensitive grid of the invention can be formed directly into substrate surface by thin-film technique, can not only
The strong bonded of sensitive grid and base material is realized, and the thickness of sensitive grid film is very thin relative to base material, to the bullet of substrate
Property deformation have little to no effect；And after sensitive grid film is firmly bonded on base material, the Volume Changes of sensitive grid film are received
To the suppression of base material, under this state, sensitive grid film hardly has plastic deformation, so that with repeatability higher.
In addition, the present invention has abandoned prior art thinks that glass and ceramics are not suitable for being applied to the general deformation survey such as weighing
Fixed prejudice, make use of technique progress in recent years, such as progress of glass manufacturing techniques, the elastic deformation pole of novel reinforced glass
The characteristics of limit has increased significantly, realizes and the fragile materials such as glass and ceramics is applied in deformation measurement, so as to take
Obtained the above-mentioned technique effect for being applied to be brought after deformation measurement by fragile material.
Brief description of the drawings
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description：
Fig. 1 is the schematic diagram with single deformation measurement element of embodiment of the present invention deformation measurement device；
Fig. 2 is the multiaxis device schematic diagram with multiple deformation measurement elements of embodiment of the present invention deformation measurement device；
Fig. 3 is the single axle deformation measurement element characteristic curve test chart of embodiment of the present invention deformation measurement device.
Specific embodiment
As shown in figure 1, being the schematic diagram with single deformation measurement element of embodiment of the present invention deformation measurement device；This
Inventive embodiments deformation measurement device includes more than one deformation measurement element, and a deformation measurement is shown in Fig. 1
Element, the deformation measurement element includes：
Base material 1, is made up of the elastomeric material of material property of enbrittling.
Sensitive grid 2, secure bond is in the surface of the base material 1 and forms integral structure, and the sensitive grid 2 is pressed according to deformation
Ratio output detection value, is enbrittled material using the integral structure and the base material 1 of the base material 1 and the sensitive grid 2
Material characteristic is plastically deformed the error brought to eliminate.
Preferably, the material of the sensitive grid 2 has elastic limit higher than the material of the base material 1.
The spatially structure of the base material 1, the sensitive grid 2 is arranged on the one side or many in three-dimensional six face of the base material 1
Face.In Fig. 1, only show that the sensitive grid 2 is arranged on a face of the base material 1, in other embodiments, the sensitive grid
2 can be arranged on any in three-dimensional six face of the base material 1 on one or more surfaces, be included in three-dimensional six of the base material 1
The sensitive grid 2 is all set on face.
In the embodiment of the present invention, the deformation measurement element is that deformation of thin membrane determines element, and the material of the sensitive grid 2 is
Membrane structure is simultaneously formed at the surface of the base material 1 by thin-film technique.Preferably, the material of the sensitive grid 2 is metal electricity
Resistance body film；The thickness of the metallic resistance body thin film of the sensitive grid 2 is below 5 μm of more than 10nm.In other embodiments,
Can be：The material of the sensitive grid 2 is semiconductive thin film.
The corresponding thin-film technique of membrane structure of the material of the sensitive grid 2 includes physical film deposition technique such as MBE or sputtering
With chemical membrane technique such as plating and CVD.
Preferably, cushion 3 is inserted between the base material 1 and the sensitive grid 2, for strengthening the He of the base material 1
The bond strength of the sensitive grid 2.Matcoveredn 4 is formed on the surface of the sensitive grid 2.The sensitive grid 2 be also formed with and
The output end of the connection of wiring 5, the deformation signal that will be detected by wiring 5 is exported.In Fig. 1, L1 represents the length of the base material 1,
W1 represents the width of the base material 1.
Deformation measurement device also includes elastomer 6, and the deformation measurement element is fixed on the elastomer 6.The bullet
Gonosome 6 and the base material 1 can be same parts.
Deformation measurement device and load-carrying members body constitute scale.The load-carrying members body, the elastomer 6 and the base material 1
It can be same part.Preferably, the load-carrying members body is slab construction, for loading external load.
In other embodiments, the elastomer 6 in Fig. 1 can also be metal elastic gonosome, and the deformation measurement element is set
On the metal elastic gonosome, the elastic limit of the elastic limit less than the metal elastic gonosome of the material of the base material 1 is described
The surface of base material 1 and the metal elastic gonosome is combined, and the base material 1 is located between the metal elastic gonosome and the sensitive grid 2.
In the embodiment of the present invention, the material of the base material 1 is glass；The thickness of the glass of the base material 1 be 0.1mm with
On.The glass of the material of the base material 1 may be selected ion exchange chemically reinforced glass, and ion exchange chemically reinforced glass is made simultaneously
It is the base material 1 and the elastomer 6.Below according to glass design parameter be described in further detail it is as follows：The base
The chemical enhanced soda-lime glass that the glass of the material of material 1 is used, by chemical enhanced, it is left that its bending strength can reach about 200MPa
It is right.It is 3 times or so of common soda lime glass up to 0.3% or so if its limit of rupture is represented with deforming.
The ion exchange chemically reinforced glass that can be used in the embodiment of the present invention it is various in style, might not only limit to
In soda-lime glass.The ion exchange chemical glass of the such as aluminum silicate of K displaced types and the ion exchange of Li displaced types
Learning strengthened glass etc. can use.
In these ion exchange chemically reinforced glass, especially K displaced types aluminum silicate glass, bending strength compared with
Greatly, up to more than 800MPa.But because longitudinal elastic coefficient is almost equal with soda-lime glass, so maximum allowable deflection reaches
1% or so.The numerical value is 10 times of the soda-lime glass without reinforcing.The depth and bending strength of this glass ion switching layer
Relation grasped, different purposes are just adapted to by the depth of appropriate selection ion exchange layer.
In other embodiments, also can be changed into：The material of the base material 1 is ceramics；The ceramic thickness of the base material 1 is
More than 0.01mm.The ceramics of the material of the base material 1 can use the zirconium oxide well-known with high strength ceramic material, its longitudinal bullet
Property rate is very big, and bending strength is up to 1000MPa or so.
In the embodiment of the present invention, for the base material 1 and metallic resistance body thin film sensor material that improve chemically reinforced glass are
The bond strength of the sensitive grid 2 and insert cushion 3, if it is necessary, the cushion 3 can also be to neutral and alkali metal of base material 1 etc.
Precipitation it is inhibited.The insulator such as silica and silicon nitride preferably, but also dependent on needing to constitute the cushion 3
Electric conductor.In present example, the base material 1 and metallic resistance body thin film 2 of chemically reinforced glass have enough bond strengths,
And without the concern for the influence of alkalinous metal, it is possible to omit the cushion 3.
In the embodiment of the present invention, the metallic resistance body thin film of the sensitive grid 2 can be used with enough specific insulations
Monometallic, it is possible to use the alloy such as nickel chromium triangle or constantan, can extensively be selected according to the characteristic of required deformation strain element.
Its thickness is very thin relative to base material 1, and the elastic deformation to base material 1 has little to no effect.
And be securely joined with the glass of base material 1 in the metallic resistance body thin film as one of the sensitive grid 2,
Therefore the Volume Changes of the metallic resistance body thin film are suppressed by base material 1.Under this state, metallic resistance body thin film is hardly
Have plastic deformation so that repeatability higher becomes possibility.
Wiring 5 is the coupling part of metallic resistance body thin film, is such as carried out electrically with bridge circuit with external measurement device
The set portion of terminal of connection, the connecting portion should use suitable material according to condition of contact.
In the embodiment of the present invention, the method that the metallic resistance body thin film of the sensitive grid 2 carries out film forming on base material 1 has
The physical film deposition method such as MBE, sputtering, also there is the chemical membrane methods such as plating or CVD, and most suitable membrane formation process is selected with reference to respective material
.To avoid film from being peeled off from base material 1, in general should be pressurizeed using sputtering method and ion using the associated methods of high intensity
Method is more suitable.In a word, if the metallic resistance body thin film of the sensitive grid 2 in scope used it is uniform and firmly into
Film, specific method is simultaneously unrestricted.
When using ion exchange chemical strength glass as substrate being that base material 1 is used, as long as its thickness reaches more than 0.1mm
, have no other special requirement.
As long as the thickness of the metallic resistance body thin film of the sensitive grid 2 can reach homogeneous and should not because of pile up when film in
There is damaged thickness in the reasons such as cumulative stress.The thickness of the metallic resistance body thin film of the sensitive grid 2 is because using material
With film build method and it is different, it is preferable from the thickness below 5 μm of more than 10nm.
The top view shapes of the sensitive grid 2 of metallic resistance body namely metallic resistance body thin film composition can be angular comb
Sub- shape or other kind shapes.The part of length L1 and width W1 is marked in Fig. 1 for top view, the bottom of top view is section
Figure.The figure shaping of metallic resistance body can be used the general electrode pattern shaping skill such as metal form method, photoetch method, etch
Art, can select according to the element size of shaping.
Only show in Fig. 1 including a single shaft test structure for the deformation measurement element.In other embodiments,
Or：The deformation measurement device includes that multiple is arranged in the deformation measurement element in same plane, e.g., other each institutes
Stating deformation measurement element can be set in deformation measurement element shown in Fig. 1 all around, each deformation measurement element composition
Multiaxis test structure.The position and direction of each deformation measurement element set different；The structure of each deformation measurement element
Can be identical；Certainly, sensitivity and the configuration of connection electrode also dependent on deformation strain gauge element, survey to each deformation
The figure for determining element is changed accordingly.
In addition, as shown in Fig. 2 being the multiaxis with multiple deformation measurement elements of embodiment of the present invention deformation measurement device
Device schematic diagram；The deformation measurement element of the deformation measurement device including multiple-layer overlapped, mark 101a in such as Fig. 2,
Shown in 101b and 101c, each deformation measurement element composition multiaxis test structure, structure shown in Fig. 2 possesses 3 axles 3 of intersecting axle
It is deformation measurement element that layer piles up stratotype deformation strain gauge element.Isolation has SiO2 etc. no between each layer deformation measurement element
The dielectric film of plastic deformation is produced, such as after the deformation measurement element 101a of the bottom is formed, in deformation measurement unit
The dielectric film of plastic deformation is not produced on part 101a via SiO2 etc., the deformation readily can be formed with any angle of the crossing and surveyed
Determine element, the deformation measurement element 101b shown in such as Fig. 2.Multiple deformation strain gauge elements can so be carried out at many levels
Making forms the deformation strain gauge element of multiaxis, the strain of respective direction is detected, so as to manufacture multi dimension sensor.
In the embodiment of the present invention, the deformation measurement element also includes possessing characteristic by be arranged on the surface of the base material 1
The compensating element, of the material composition of compensation function, such as：Mended by temperature in nearby also being formed for above-mentioned deformation strain gauge element
Repay the temperature element of film composition.
As shown in figure 3, being the single axle deformation measurement element characteristic curve test of embodiment of the present invention deformation measurement device
Figure；Transverse axis is stress for load, and the longitudinal axis is the voltage that output voltage is that resistance change is formed, and the corresponding point of mark 201 is represented
Load gradually increases each test value for obtaining, and the corresponding point of mark 202 represents that load gradually decreases each test value for obtaining, can be with
Find out that the corresponding point of mark 201 and 202 all overlaps substantially, the fit line of the two is also basically identical, and the fit line of the two is in figure 3
It is same single line 203；As can be seen that since zero load to close to bursting stress, the deformation measurement device shows excellent
Linear index.Knowable to Fig. 3 shows, the resume relevant with the increase and decrease of load are not changed in substantially.
The present invention has been described in detail above by specific embodiment, but these are not constituted to limit of the invention
System.Without departing from the principles of the present invention, those skilled in the art can also make many deformations and improvement, and these also should
It is considered as protection scope of the present invention.
Claims (21)
1. a kind of deformation measurement device, it is characterised in that including more than one deformation measurement element, the deformation measurement element
Including：
Base material, is made up of the elastomeric material of material property of enbrittling；
Sensitive grid, secure bond is in the substrate surface and forms integral structure, and the sensitive grid is defeated in proportion according to deforming
Go out detected value.
2. deformation measurement device as claimed in claim 1, it is characterised in that：Material of the material of the sensitive grid than the base material
Material has elastic limit higher.
3. deformation measurement device as claimed in claim 1 or 2, it is characterised in that：The base material spatially structure, the sensitivity
Grid are arranged on one or more surfaces in six faces of base material solid.
4. deformation measurement device as claimed in claim 1 or 2, it is characterised in that：Deformation measurement device also includes metallic elastic
Body, the deformation measurement element is arranged on the metal elastic gonosome, and the elastic limit of material of the base material is less than the metal
The surface of the elastic limit of elastomer, the base material and the metal elastic gonosome combines, and the base material is located at the metallic elastic
Between body and the sensitive grid.
5. deformation measurement device as claimed in claim 4, it is characterised in that：The elastomeric material and the base material are same
Part.
6. deformation measurement device as claimed in claim 5, it is characterised in that：The deformation measurement device and load-carrying members body structure
Into scale, the load-carrying members body, the elastomer and the base material are same parts.
7. deformation measurement device as claimed in claim 6, it is characterised in that：The load-carrying members body, the elastomer and institute
Base material is stated for slab construction, for loading external load.
8. the deformation measurement device as described in claim 1 or 2 or 3, it is characterised in that：The deformation measurement element becomes for film
Shape determines element, and the material of the sensitive grid is membrane structure and the surface of the base material is formed at by thin-film technique.
9. deformation measurement device as claimed in claim 8, it is characterised in that：The material of the base material is glass.
10. deformation measurement device as claimed in claim 9, it is characterised in that：The thickness of the glass of the base material be 0.1mm with
On.
11. deformation measurement devices as claimed in claim 8, it is characterised in that：The material of the base material is ceramics.
12. deformation measurement devices as claimed in claim 11, it is characterised in that：The ceramic thickness of the base material is 0.01mm
More than.
13. deformation measurement devices as claimed in claim 8, it is characterised in that：The material of the sensitive grid is metallic resistance body
Film.
14. deformation measurement devices as claimed in claim 13, it is characterised in that：The metallic resistance body thin film of the sensitive grid
Thickness is below 5 μm of more than 10nm.
The 15. deformation measurement device as described in claim 1 or 2 or 3, it is characterised in that：The deformation measurement device includes many
The deformation measurement element that layer is overlapped, each deformation measurement element composition multiaxis test structure.
The 16. deformation measurement device as described in claim 1 or 2 or 3, it is characterised in that：The deformation measurement device includes many
The individual deformation measurement element being arranged in same plane, each deformation measurement element composition multiaxis test structure.
The 17. deformation measurement device as described in claim 1 or 2 or 3, it is characterised in that：The deformation measurement element also includes
The compensating element, being made up of the material for possessing characteristic compensation function for being arranged on the substrate surface.
18. deformation measurement devices as claimed in claim 8, it is characterised in that：The membrane structure pair of the material of the sensitive grid
The thin-film technique answered includes physical film deposition technique and chemical membrane technique.
19. deformation measurement devices as claimed in claim 18, it is characterised in that：The physical film deposition technique includes MBE or splashes
Penetrate；The chemical membrane technique includes plating and CVD.
The 20. deformation measurement device as described in claim 1 or 2 or 3, it is characterised in that：In the base material and the sensitive grid
Between be inserted with cushion, the bond strength for strengthening the base material and the sensitive grid.
21. deformation measurement devices as claimed in claim 8, it is characterised in that：The material of the sensitive grid is semiconductive thin film.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710180157.0A CN106768215A (en) | 2017-03-24 | 2017-03-24 | Deformation measurement device |
| PCT/CN2017/081800 WO2018170998A1 (en) | 2017-03-24 | 2017-04-25 | Deformation measurement device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710180157.0A CN106768215A (en) | 2017-03-24 | 2017-03-24 | Deformation measurement device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106768215A true CN106768215A (en) | 2017-05-31 |
Family
ID=58967594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710180157.0A Pending CN106768215A (en) | 2017-03-24 | 2017-03-24 | Deformation measurement device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106768215A (en) |
| WO (1) | WO2018170998A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291533A (en) * | 1986-06-11 | 1987-12-18 | Nippon Soken Inc | Pressure detector |
| CN103047927A (en) * | 2012-12-18 | 2013-04-17 | 无锡莱顿电子有限公司 | Piezoresistive strain gauge with ceramic substrate |
| CN103674408A (en) * | 2012-09-14 | 2014-03-26 | 森萨塔科技公司 | Hermetically glass sealed pressure sensor |
| CN105849521A (en) * | 2013-12-25 | 2016-08-10 | 日立汽车系统株式会社 | Pressure measurement device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62226029A (en) * | 1986-03-28 | 1987-10-05 | Tokyo Electric Co Ltd | Temperature correcting method for load cell |
| CN2231415Y (en) * | 1995-02-24 | 1996-07-17 | 黄国伟 | Ceramic thick film strain pressure sensor |
| CN2247331Y (en) * | 1995-09-13 | 1997-02-12 | 中国科学院合肥智能机械研究所 | Strain type thick film force sensor |
| CN200944058Y (en) * | 2006-06-08 | 2007-09-05 | 霍丁格·包尔文(苏州)电子测量技术有限公司 | Elastomer of weighting sensor |
| CN202974180U (en) * | 2012-12-18 | 2013-06-05 | 无锡莱顿电子有限公司 | Piezoresistive strain gauge of ceramic base |
| CN105865321B (en) * | 2015-12-04 | 2018-06-29 | 浙江工业大学 | It can measure the interdigital metal strain plate of three sensitive grid of axial deviation of axial local derviation on the outside of biasing sensitive grid |
-
2017
- 2017-03-24 CN CN201710180157.0A patent/CN106768215A/en active Pending
- 2017-04-25 WO PCT/CN2017/081800 patent/WO2018170998A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62291533A (en) * | 1986-06-11 | 1987-12-18 | Nippon Soken Inc | Pressure detector |
| CN103674408A (en) * | 2012-09-14 | 2014-03-26 | 森萨塔科技公司 | Hermetically glass sealed pressure sensor |
| CN103047927A (en) * | 2012-12-18 | 2013-04-17 | 无锡莱顿电子有限公司 | Piezoresistive strain gauge with ceramic substrate |
| CN105849521A (en) * | 2013-12-25 | 2016-08-10 | 日立汽车系统株式会社 | Pressure measurement device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018170998A1 (en) | 2018-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3697917A (en) | Semiconductor strain gage pressure transducer | |
| EP0831315B1 (en) | Pressure sensor | |
| EP0373010B1 (en) | Pressure sensor usable in oil wells | |
| US7441466B2 (en) | Weight sensor | |
| US7444879B2 (en) | Displacement transducer | |
| US6272929B1 (en) | High pressure piezoresistive transducer suitable for use in hostile environments | |
| CN101983303B (en) | Pressure-measuring glow plug | |
| CN113639902B (en) | Pressure sensor and manufacturing method thereof | |
| KR102021103B1 (en) | Silicon strain gage with high sensitivity and pressure transducer comprising the same | |
| CN114354033A (en) | Force sensor and manufacturing method thereof | |
| CN114061797B (en) | MEMS piezoresistive pressure sensor with double-bridge structure and preparation method thereof | |
| CN111238361A (en) | Graphene temperature strain sensor | |
| KR102179016B1 (en) | Loadcell With Semiconductor Strain Gauge | |
| CN106768215A (en) | Deformation measurement device | |
| CN101694409A (en) | Method for manufacturing all-silica pressure chips of SOI oil pressure sensor | |
| RU2397460C1 (en) | Pressure sensor based on tensoresistor thin-film nano- and micro-electromechanical system | |
| US3913391A (en) | Strain gage configurations employing high di-electric strength and efficient strain transmission | |
| US7021154B2 (en) | Force sensing element | |
| KR101573367B1 (en) | Piezoresistive typed ceramic pressure sensor | |
| CN210893522U (en) | MEMS pressure sensor | |
| US3297971A (en) | Load cell | |
| CN217585654U (en) | Strain sensor | |
| CN217304218U (en) | Flexible pressure sensor | |
| CN116519178B (en) | Nano thin film strain gauge, spoke force sensor and preparation method of spoke force sensor | |
| JP4019876B2 (en) | Force sensing element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170531 |