CN106756834A - A kind of vacuum splashing and plating machine prevents plate and preparation method thereof - Google Patents
A kind of vacuum splashing and plating machine prevents plate and preparation method thereof Download PDFInfo
- Publication number
- CN106756834A CN106756834A CN201611242850.8A CN201611242850A CN106756834A CN 106756834 A CN106756834 A CN 106756834A CN 201611242850 A CN201611242850 A CN 201611242850A CN 106756834 A CN106756834 A CN 106756834A
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- CN
- China
- Prior art keywords
- plate
- prevents
- vacuum splashing
- plating machine
- prevent
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
Abstract
Prevent plate the invention discloses a kind of vacuum splashing and plating machine, including prevent plate substrate, described to prevent plate substrate surface for uneven structure, described to prevent that plate substrate surface is attached with conductive layer, the conductive layer is formed by electrically-conducting paint coating.Another aspect of the present invention also discloses the preparation method that a kind of vacuum splashing and plating machine prevents plate, comprises the following steps：First, it is that uneven structure prevents plate substrate to take surface, and then electrically-conducting paint is coated in the surface of preventing plate substrate, forms conductive layer.The present invention is processed preventing plate surface using electrically-conducting paint, while electric conductivity is ensured, simple method can be used to remove film layer after the attached full target of plate is prevented, the purpose that No clean prevents plate subordinate list face target is reached, time cost and cost of labor that vacuum splashing and plating machine prevents plate cleaning is reduced.
Description
Technical field
Present invention design vacuum splashing and plating technology, and in particular to a kind of vacuum splashing and plating machine prevents plate and preparation method thereof.
Background technology
Vacuum splashing and plating is a kind of important physical vapour deposition (PVD) (Physical Vapor Deposition, PVD) film forming side
Method, its principle is to utilize electric field accelerating electrons, the electronics after acceleration is collided with the ar atmo being passed through, and is ionized out substantial amounts of
Argon ion and electronics.Argon ion accelerates to bombard target in the presence of electric field, sputters substantial amounts of target atom so that in neutrality
Target atom (or molecule) be deposited on film forming in target base plate, and be finally reached the purpose to substrate surface plated film.
However, during above-mentioned vacuum splashing and plating, the target atom (or molecule) for sputtering or large-sized particle, and
Target substrate surface will not be completely deposited at, part target can inevitably fly to the inner wall surface of sputtering machine, influence its clear
It is clean, so as to influence follow-up quality of forming film.Therefore, generally needing addition to prevent plate in the structure of sputtering machine.
In Application No. CN201020598041.2 Chinese patents, disclose a kind of vacuum splashing and plating prevents hardened structure,
It is described to prevent that plate is located in sputtering machine, it is described to prevent that plate surface has rough structure.It is preferred that described rough
Structure includes there is gap between the multiple boss for preventing plate surface, each boss；The boss in latticed array in
It is described to prevent plate surface.Due to preventing that plate surface has rough structure described so that prevent that plate is more prone to absorption
Target atom or large-sized particle, so as on the one hand increased the Precipitation Potential for preventing plate, improve sputtering machine inwall cleannes；
On the other hand substrate is flown to due to reducing large-size particle, also improves the rate of film build of sputter.
Because there is stronger Electric Field Distribution the inside of vacuum splashing and plating machine, therefore prevent that plate is typically quiet to avoid from metallic plate
Electrodeposition tires out.In order to receive the target of more splashings, the frequency that cleaning prevents plate is reduced, prevent that plate would generally be designed rough
Structure.But, such metallic plate cleaning up is cumbersome, to generally require by sandblasting and prevent plate surface removing to be attached to
Target, therefore, this kind prevents that the plate expense cleaned and the time for being consumed all compare many.
The content of the invention
The present invention is processed preventing plate surface using electrically-conducting paint, while electric conductivity is ensured, is preventing that plate is attached
Film layer can be removed using simple method after full target, reach the purpose that No clean prevents plate subordinate list face target, reduce vacuum
Sputtering machine prevents plate clearance time, disposal costs and human cost.
In order to solve the above technical problems, the present invention provides a kind of vacuum splashing and plating machine prevents plate, including prevent plate substrate, it is described
Prevent that plate substrate surface is uneven structure, it is characterised in that described to prevent that plate substrate surface is attached with conductive layer, it is described to lead
Electric layer is formed by electrically-conducting paint coating.The setting of conductive layer causes maintaining electric conductivity so that preventing accumulation of static electricity, separately
On the one hand can be using solvent impregnated or by the way of removing anti-electric layer；The purpose that No clean prevents plate subordinate list face target is reached,
Reduce vacuum splashing and plating machine and prevent plate clearance time and disposal costs.
Further, the electrically-conducting paint includes conductive material and dispersion liquid.
Further, the conductive material is selected from carbon dust, metal powder, Graphene or graphene composite material.
Further, it is described to prevent being provided with primer layer between substrate and the conductive layer.
Further, the glue material for forming the primer layer is water-base cement or oily gum.When primer layer is coated using aqueous
Glue, it is to avoid glue material is volatilized in manufacturing process organic solvent and produce injury to people, while the treatment for simplifying glue material after sputter is difficult
Degree.
Another aspect of the present invention, also provides the preparation method that a kind of vacuum splashing and plating machine prevents plate, it is characterised in that including
Following steps：
First, take surface and prevent plate substrate with bulge-structure；Then electrically-conducting paint is coated in and prevents plate substrate
Surface, forms conductive layer.
Further, the electrically-conducting paint is scattered in the dispersion liquid by conductive material and is formed, the conductive material choosing
From carbon dust, metal powder, Graphene or graphene composite material.
Further, it is further comprising the steps of before conductive coating：Preventing plate substrate surface coating primer layer.
Further, the glue material for forming the primer layer selects water-base cement or oily gum.
Further, it is further comprising the steps of before primer layer is coated：With neutral detergent or weak lye to preventing plate
Surface carries out cleaning treatment.The surface for preventing plate substrate is washed with neutral detergent or weak lye；Pre-treatment step is enhanced
The film forming characteristics of glue material so that primer layer strengthens with the adhesion for preventing plate substrate.
A kind of vacuum splashing and plating machine provided in the present invention prevents plate and preparation method thereof, solves in the prior art due to anti-
The uneven difficulty caused by terms of cleaning of plate surface, simple structure of the present invention, it is ensured that while electric conductivity, anti-
Simple method can be used to remove film layer after the attached full target of plate, a kind of purpose of No clean is reached, vacuum splashing and plating machine is reduced
Prevent plate clearance time and disposal costs.
Brief description of the drawings
The invention will be described in more detail below based on embodiments and refering to the accompanying drawings.Wherein：
Fig. 1 is that vacuum splashing and plating machine prevents plate top view in the embodiment of the present invention one；
Fig. 2 is that vacuum splashing and plating machine prevents plate front view in the embodiment of the present invention one；
Fig. 3 is the partial sectional view that vacuum splashing and plating machine prevents plate in the embodiment of the present invention one；
Fig. 4 is the partial sectional view that vacuum splashing and plating machine prevents plate in the embodiment of the present invention two.
In the accompanying drawings, identical part uses identical reference.Accompanying drawing is not according to actual ratio.
Specific embodiment
Describe embodiments of the present invention in detail below with reference to drawings and Examples, how the present invention is applied whereby
Technological means solves technical problem, and reaches the implementation process of technique effect and can fully understand and implement according to this.Need explanation
As long as not constituting conflict, each embodiment in the present invention and each feature in each embodiment can be combined with each other,
The technical scheme for being formed is within protection scope of the present invention.
Embodiment one
As depicted in figs. 1 and 2, it is that vacuum splashing and plating machine in the present embodiment prevents plate, wherein preventing that plate substrate 1 is set above
Have a bulge-structure 2, the present embodiment relief structure butt side cone, the less conical surface of area with prevent plate substrate connection, preferably
Bulge-structure be formed in one structure with plate substrate is prevented.The increase that is disposed to of bulge-structure prevents that plate can receive target
The surface area of material, in certain embodiments, bulge-structure can also be cylinder, hemispherical or other shapes, it is of course also possible to
To prevent that plate substrate is set to rough structure in itself, as long as it possesses larger surface area to be capable of achieving to receive more
Target.
Preferably prevent that plate substrate and the bulge-structure being disposed thereon are metal structure, for example：Can be aluminium, conjunction
Gold etc. (please enumerate can be as the metal material for preventing plate substrate).Due to having stronger Electric Field Distribution inside vacuum splashing and plating machine,
Therefore prevent plate typically from metallic plate to avoid accumulation of static electricity.
As shown in figure 3, in the present embodiment vacuum splashing and plating machine prevent the partial sectional view of plate, it can be seen that
Prevent being coated with conductive layer 3 on the table of plate substrate 1, conductive layer 3 is formed by electrically-conducting paint coating, and electrically-conducting paint includes conductive material
And dispersion liquid, conductive material forms electrically-conducting paint in being dispersed in dispersion liquid, and electrically-conducting paint is preventing plate surface film forming, formed film
It is conductive, as conductive layer.Conductive material can be selected from carbon dust, metal powder, Graphene or graphene composite material etc..
It is preferred to use Graphene or graphene composite material as conductive material, common graphene composite material example
Such as：It is polyaniline graphene composite material, graphite oxide alkenyl ultra-high molecular weight polyethylene (UHMWPE) composite, carbon-based compound
Material or metallic graphite carbon alkene composite, now dispersion liquid select polar organic solvent, for example can be selected from benzyl benzene, NMP (N-
Methyl pyrrolidone, 1-METHYLPYRROLIDONE), GBL (Butyrolactone, gamma-butyrolacton), DMA (N, N-
Dimethylaniline, DMA), NVP (NVP) or DMF (N, N-
Dimethylformamide, DMF) etc., dispersion liquid can also be the combination of above-mentioned polar organic solvent.Pole
The surface tension of property organic solvent is close with the surface tension of Graphene, therefore, using polar organic solvent dispersion liquid the most more
Be conducive to the dispersion of Graphene or graphene composite material so that Graphene or graphene composite material can be uniformly dispersed in
In dispersion liquid, the graphite ene coatings more homogeneous such that it is able to obtain property, electric conductivity is well quiet such that it is able to preferably avoid
The accumulation of electricity.Graphene has unique two-dimensional structure, excellent electron transport ability and preferable mechanical performance, with Graphene
The Graphene coating obtained as conductive material, Graphene coating is coated in be prevented forming graphite ene coatings i.e. conduction on plate substrate
Layer, therefore, graphite ene coatings possess preferable electric conductivity, it is possible to prevente effectively from the accumulation of electrostatic.Due to Graphene coated conductive
Property it is higher, therefore coating thickness it is relatively thin i.e. be capable of achieving need electric conductivity.Preventing plate surface a certain amount of target atom of accumulation
(or molecule) afterwards, it is necessary to when being cleared up, in the present embodiment, it is only necessary to which the metal that will be covered with graphite ene coatings prevents that plate is immersed in
A period of time in the polar solvent similar with dispersion properties, graphite ene coatings can be automatically disengaged, so as to reduce cost of labor.
Preferably, graphite ene coatings are by graphene nanometer sheet (0.01~5mg/ml, i.e., every milliliter pole according to a certain percentage
Property organic solvent in disperse 0.01 gram to 5 grams graphene nanometer sheet) ultrasonic disperse in polar organic solvent, polar organic solvent
Can be benzyl benzene, metal is prevented that plate is heated to uniform temperature, in certain embodiments by NMP, GBL, DMA, NVP, DMF etc.
It is 80 DEG C to 180 DEG C (wherein DEG C be degree celsius temperature unit), then graphene nanometer sheet dispersion liquid is sprayed on and prevents plate base
On plate, gained Graphene coating layer thickness is 10 μm to 1000 μm (wherein μm being micron, long measure).Cleaning is needed to prevent on plate
Target atom (or molecule) when, as long as to prevent that plate is immersed in similar with dispersion properties for the metal that will be covered with graphite ene coatings
A period of time in polar solvent, dip time is 1 minute to 3 hours, you can get rid of graphite ene coatings.
Embodiment two
The present embodiment on the basis of embodiment one, as shown in Figure 1, Figure 2 and Figure 4, conductive layer 3 with prevent plate substrate 1
Between be provided with primer layer 4；Film is formed on plate substrate 1 is prevented first, that is, coats primer layer 4；Then conductive layer 3 is coated to bottom
On glue-line 4.Primer layer has certain mechanical strength, therefore prevents target splash on plate (such as needing to remove to be attached to
Target molecule or atom etc.) when, with direct by the way of removing, or the method similar with embodiment one can be used, with molten
Agent dipping removal；Meanwhile, increased primer layer can buffer the target atom (or molecule) for being splashed to and preventing on plate, it is to avoid will
The target bounce-back of sputtering causes secondary sputtering to the other parts of sputtering machine.
The primer material that primer layer 4 is used can select oily gum.Oily gum film forming agent can select phenolic resin, ureaformaldehyde
One kind or its composition in resin, polyurethane, polyacrylic resin；When choosing is with above-mentioned film forming agent, solvent can be adjacent benzene
One kind or composition in dicarboxylic acid esters, formaldehyde, acetone or ethyl acetate.
Preferably, the primer material that primer layer 4 is used is water-base cement.Water-base cement film forming agent can select polyhydroxy polycarboxylic ammonia
Ester resin or acrylate etc.；When choosing is with above-mentioned film forming agent, solvent is water or alcohol, and preferred solvent is deionized water.
Water-base cement is used when primer layer is coated, it is to avoid glue material is volatilized in manufacturing process organic solvent and produce injury to people, while splash
The impregnation process of glue material can will not prevent metal that plate produces any corrosion using deionized water or alcohol as solvent after plating,
Further avoid the volatilization of organic solvent.
Preferably, before primer layer is coated, can be with neutral detergent or weak lye to preventing that it is pre- that plate surface is carried out
Treatment, i.e., wash the surface for preventing plate substrate with neutral detergent or weak lye；Pre-treatment step enhances the film forming of glue material
Characteristic, enhances primer layer and prevents the adhesion of plate substrate.
Preferably, in certain embodiments, the matter of the electrically-conducting paint for preparing conductive layer and the primer material for preparing primer layer
Amount is than being 0.5:100 to 20:100, the gross thickness of primer layer and conductive layer (μm is micron, length list for 200 μm to 1000 μm
Position).
Although by reference to preferred embodiment, invention has been described, is not departing from the situation of the scope of the present invention
Under, various improvement can be carried out to it and part therein can be replaced with equivalent.Especially, as long as in the absence of structure punching
Prominent, the every technical characteristic being previously mentioned in each embodiment can combine in any way.The invention is not limited in text
Disclosed in specific embodiment, but all technical schemes including falling within the scope of the appended claims.
Claims (10)
1. a kind of vacuum splashing and plating machine prevents plate, including prevents plate substrate, described to prevent plate substrate surface for uneven structure, its
It is characterised by, described to prevent that plate substrate surface is attached with conductive layer, the conductive layer is formed by electrically-conducting paint coating.
2. vacuum splashing and plating machine according to claim 1 prevents plate, it is characterised in that the electrically-conducting paint includes conductive material
And dispersion liquid.
3. vacuum splashing and plating machine according to claim 2 prevents plate, it is characterised in that the conductive material is selected from carbon dust, gold
Category powder, Graphene or graphene composite material.
4. plate is prevented according to any described vacuum splashing and plating machines of claim 1-3, it is characterised in that it is described prevent substrate with it is described
Primer layer is provided between conductive layer.
5. vacuum splashing and plating machine according to claim 4 prevents plate, it is characterised in that the glue material for forming the primer layer is water
Property glue or oily gum.
6. a kind of vacuum splashing and plating machine prevents the preparation method of plate, it is characterised in that comprise the following steps：
First, it is that uneven structure prevents plate substrate to take surface；Then electrically-conducting paint is coated in the table for preventing plate substrate
Face, forms conductive layer.
7. vacuum splashing and plating machine according to claim 6 prevents the preparation method of plate, it is characterised in that the electrically-conducting paint by
Conductive material is formed in being scattered in the dispersion liquid, and the conductive material is compound selected from carbon dust, metal powder, Graphene or Graphene
Material.
8. the preparation method of plate is prevented according to any described vacuum splashing and plating machines of claim 6-7, it is characterised in that led in coating
It is further comprising the steps of before electric layer：Preventing plate substrate surface coating primer layer.
9. vacuum splashing and plating machine according to claim 8 prevents the preparation method of plate, it is characterised in that form the primer layer
Glue material select water-base cement or oily gum.
10. vacuum splashing and plating machine according to claim 8 prevents the preparation method of plate, it is characterised in that in coating primer layer
It is before further comprising the steps of：With neutral detergent or weak lye cleaning treatment is carried out to preventing plate surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611242850.8A CN106756834A (en) | 2016-12-29 | 2016-12-29 | A kind of vacuum splashing and plating machine prevents plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611242850.8A CN106756834A (en) | 2016-12-29 | 2016-12-29 | A kind of vacuum splashing and plating machine prevents plate and preparation method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN106756834A true CN106756834A (en) | 2017-05-31 |
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| CN201611242850.8A Pending CN106756834A (en) | 2016-12-29 | 2016-12-29 | A kind of vacuum splashing and plating machine prevents plate and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023241A (en) * | 2018-09-18 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | The cleaning method of mask plate and mask plate |
| CN109750262A (en) * | 2017-11-07 | 2019-05-14 | 黄钲为 | In the method for the cavity inner wall arrangement protective film of vacuum splashing and plating machine |
| CN111041434A (en) * | 2020-03-17 | 2020-04-21 | 上海陛通半导体能源科技股份有限公司 | Physical vapor deposition apparatus for depositing insulating film |
| CN111876746A (en) * | 2020-07-09 | 2020-11-03 | Tcl华星光电技术有限公司 | Anti-adhesion board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109750262A (en) * | 2017-11-07 | 2019-05-14 | 黄钲为 | In the method for the cavity inner wall arrangement protective film of vacuum splashing and plating machine |
| CN109023241A (en) * | 2018-09-18 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | The cleaning method of mask plate and mask plate |
| CN111041434A (en) * | 2020-03-17 | 2020-04-21 | 上海陛通半导体能源科技股份有限公司 | Physical vapor deposition apparatus for depositing insulating film |
| CN111876746A (en) * | 2020-07-09 | 2020-11-03 | Tcl华星光电技术有限公司 | Anti-adhesion board |
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Application publication date: 20170531 |