CN106747473B - 制作氮化硅陶瓷微珠的生产工艺 - Google Patents
制作氮化硅陶瓷微珠的生产工艺 Download PDFInfo
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Abstract
本发明涉及一种制作氮化硅陶瓷微珠的生产工艺,属于粉体研磨领域。其特征在于:陶瓷原料的制备按照质量百分比,由如下组分组成:β‑Si3N4为70—90%,AL2O3为5—12%,Y2O3为0.1—5%,TiN为0.1—8%,粘合剂PVA4.8—5%;在同一个转盘中将粘合剂PVA注入陶瓷原料,利用粘合剂PVA在陶瓷原料中成球并固化,直接成型致密的粒径在0.1—3mm的坯珠;对填入海绵中的坯珠进行冷等静压;将冷等静压后的坯珠置于脱胶炉中完成脱胶工序;氮气气氛置于坩埚中烧结,生产陶瓷微珠坯球;将所得陶瓷微珠坯球进行研磨和抛光生产陶瓷微珠。
Description
技术领域
本发明涉及制笔和轴承滚动体制备领域和粉体研磨领域,详细地讲是一种制作氮化硅陶瓷微珠的生产工艺。
背景技术
目前,熔融法对陶瓷材料体系下,主要用于硅酸锆材料体系,不能用于氮化硅陶瓷微珠的成型;滚动成型采用“行星式”旋转装置,将粘合剂PVA和陶瓷粉放入特定的旋转盘和旋转鼓中,转动得到粒径在0.8—2mm的微珠,这种方法工艺简单,但所制备的陶瓷微珠圆度较差,容易出现脱皮和破裂现象;注模成型需要将陶瓷浆料注入模具中,虽然可以克服滚动法带来的空心、分层、致密性差等缺点,提高了产品质量,但该方法对于1mm以下的陶瓷微珠,生产效率低。
发明内容
为了克服现有技术的不足,本发明提出一种制作氮化硅陶瓷微珠的生产工艺, 所生产的陶瓷微珠具有低密度、高硬度、低摩擦系数,耐磨、自润滑及刚性好等,可以广泛地用于笔珠、微型轴承滚动体和粉体磨介球。
本发明解决其技术问题所采用的技术方案是:一种制作氮化硅陶瓷微珠的生产工艺,其特征在于:
1)陶瓷原料的制备:将陶瓷原料过120目筛后,按照比例配成浆料混合均匀,置于砂磨机中球磨7h,经过喷雾造粒干燥后过筛;
其中,所述的陶瓷原料按照质量百分比,由如下组分组成:
β-Si3N4 70—90%
AL2O3 5—12%
Y2O3 0.1—5%
TiN 0.1—8%
粘合剂PVA 4.8—5%;
2)注浆滚动成型:采用“行星式”旋转装置,在同一个转盘中将粘合剂PVA注入陶瓷原料,利用粘合剂PVA在陶瓷原料中成球并固化,直接成型致密的粒径在0.1—3mm的坯珠;
3)冷等静压:在200兆帕压力下,对填入海绵中的坯珠进行冷等静压,时间2-10分钟;
4)脱胶工序:将冷等静压后的坯珠置于脱胶炉中,升温至1200℃时逐渐降温至室温,其中在450℃—1100℃之间保温1小时,12小时可以完成脱胶工序;
5)烧结:氮气气氛中,将所得坯珠置于坩埚中,以15℃/min的升温速度至1750℃,其中在1500℃—1750℃保温2-6小时,停止加热,冷却至室温,生产陶瓷微珠坯球;其中氮气流速为2L/min;
6)研磨抛光:将所得陶瓷微珠坯球进行研磨和抛光生产陶瓷微珠,陶瓷微珠的球度不超过0.08微米,表面粗糙度不超过0.008微米,方法如下:
a.粗磨:载荷压力3—20N/珠,所用粗磨研磨剂中,金刚石颗粒的粒度为20—100um,金刚石颗粒圆度为0.2—0.6;
b.精磨:载荷压力0.5—3N/珠,所用精磨研磨剂中,金刚石颗粒的粒度为1—10um,金刚石颗粒圆度为0.6—0.7;
c.抛光磨:载荷压力0.1—0.5N/珠,所用抛光磨研磨剂中,金刚石颗粒的粒度为0.01—1um,金刚石颗粒圆度为0.70—0.85。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂与研磨基质的质量比例都为1:1—1:6,所述研磨基质为水。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂按质量百分比组成都为:
金刚石颗粒 25%
分散剂 70%
氧化铈 0.5%
三聚磷酸钠 0.5%
硅酸钠 0.5%
十二烷基磺酸钠 0.5%
三氧化二铬 3%。
所述的分散剂为柠檬酸铵。
本发明的有益效果是,该工艺包括:配方料的制备、陶瓷微珠成型、冷等静压、脱胶、烧结和研磨六个步骤。成型步骤及烧结步骤可以实现在常压下烧结碳化硅陶瓷微珠,在氮气气氛下烧结氮化硅陶瓷微珠;研磨步骤包括各个阶段的研磨剂,含有粗磨研磨剂、精磨研磨剂和抛光磨研磨剂。这些研磨剂在研磨的各个阶段中配合使用,可达到研磨效率高、对陶瓷体污染少、减少研磨时间的效果。该陶瓷微珠具有低密度、高硬度、低摩擦系数,耐磨、自润滑及刚性好等,可以广泛地用于笔珠、微型轴承滚动体和粉体磨介球。
下面结合实施例对本发明进一步说明。
具体实施方式
实施例一:
1)陶瓷原料的制备:将陶瓷原料过120目筛后,按照比例配成浆料混合均匀,置于砂磨机中球磨7h,经过喷雾造粒干燥后过筛;
其中,所述的陶瓷原料按照质量百分比,由如下组分组成:
β-Si3N4 70%
AL2O3 12%
Y2O3 5%
TiN 8%
粘合剂PVA 5%。
2)注浆滚动成型:采用“行星式”旋转装置,在同一个转盘中将粘合剂PVA注入陶瓷原料,利用粘合剂PVA在陶瓷原料中成球并固化,直接成型致密的粒径在0.1—3mm的坯珠。
3)冷等静压:在200兆帕压力下,对填入海绵中的坯珠进行冷等静压,时间2分钟。
4)脱胶工序:将冷等静压后的坯珠置于脱胶炉中,升温至1200℃时逐渐降温至室温,其中在450℃—1100℃之间保温1小时,12小时可以完成脱胶工序。
5)烧结:氮气气氛中,将所得坯珠置于坩埚中,以15℃/min的升温速度至1750℃,其中在1500℃—1750℃保温2小时,停止加热,冷却至室温,生产陶瓷微珠坯球;其中氮气流速为2L/min。
6)研磨抛光:将所得陶瓷微珠坯球进行研磨和抛光生产陶瓷微珠,陶瓷微珠的球度不超过0.08微米,表面粗糙度不超过0.008微米,方法如下:
a.粗磨:载荷压力3N/珠,所用粗磨研磨剂中,金刚石颗粒的粒度为20um,金刚石颗粒圆度为0.2;
b.精磨:载荷压力0.5N/珠,所用精磨研磨剂中,金刚石颗粒的粒度为1um,金刚石颗粒圆度为0.6;
c.抛光磨:载荷压力0.1N/珠,所用抛光磨研磨剂中,金刚石颗粒的粒度为0.01um,金刚石颗粒圆度为0.70。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂与研磨基质的质量比例都为1:1,所述研磨基质为水。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂按质量百分比组成都为:
金刚石颗粒 25%
分散剂 70%
氧化铈 0.5%
三聚磷酸钠 0.5%
硅酸钠 0.5%
十二烷基磺酸钠 0.5%
三氧化二铬 3%。
所述的分散剂为柠檬酸铵。
实施例二:
1)陶瓷原料的制备:将陶瓷原料过120目筛后,按照比例配成浆料混合均匀,置于砂磨机中球磨7h,经过喷雾造粒干燥后过筛;
其中,所述的陶瓷原料按照质量百分比,由如下组分组成:
β-Si3N4 90%
AL2O3 5%
Y2O3 0.1%
TiN 0.1%
粘合剂PVA 4.8%。
2)注浆滚动成型:采用“行星式”旋转装置,在同一个转盘中将粘合剂PVA注入陶瓷原料,利用粘合剂PVA在陶瓷原料中成球并固化,直接成型致密的粒径在0.1—3mm的坯珠。
3)冷等静压:在200兆帕压力下,对填入海绵中的坯珠进行冷等静压,时间2-10分钟。
4)脱胶工序:将冷等静压后的坯珠置于脱胶炉中,升温至1200℃时逐渐降温至室温,其中在450℃—1100℃之间保温1小时,12小时可以完成脱胶工序。
5)烧结:氮气气氛中,将所得坯珠置于坩埚中,以15℃/min的升温速度至1750℃,其中在1500℃—1750℃保温6小时,停止加热,冷却至室温,生产陶瓷微珠坯球;其中氮气流速为2L/min。
6)研磨抛光:将所得陶瓷微珠坯球进行研磨和抛光生产陶瓷微珠,陶瓷微珠的球度不超过0.08微米,表面粗糙度不超过0.008微米,方法如下:
a.粗磨:载荷压力20N/珠,所用粗磨研磨剂中,金刚石颗粒的粒度为100um,金刚石颗粒圆度为0.6;
b.精磨:载荷压力3N/珠,所用精磨研磨剂中,金刚石颗粒的粒度为10um,金刚石颗粒圆度为0.7;
c.抛光磨:载荷压力0.5N/珠,所用抛光磨研磨剂中,金刚石颗粒的粒度为1um,金刚石颗粒圆度为0.85。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂与研磨基质的质量比例都为1:6,所述研磨基质为水。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂按质量百分比组成都为:
金刚石颗粒 25%
分散剂 70%
氧化铈 0.5%
三聚磷酸钠 0.5%
硅酸钠 0.5%
十二烷基磺酸钠 0.5%
三氧化二铬 3%。
所述的分散剂为柠檬酸铵。
实施例三:
1)陶瓷原料的制备:将陶瓷原料过120目筛后,按照比例配成浆料混合均匀,置于砂磨机中球磨7h,经过喷雾造粒干燥后过筛;
其中,所述的陶瓷原料按照质量百分比,由如下组分组成:
β-Si3N4 80%
AL2O3 10%
Y2O3 0.1%
TiN 5%
粘合剂PVA 4.9%。
2)注浆滚动成型:采用“行星式”旋转装置,在同一个转盘中将粘合剂PVA注入陶瓷原料,利用粘合剂PVA在陶瓷原料中成球并固化,直接成型致密的粒径在0.1—3mm的坯珠。
3)冷等静压:在200兆帕压力下,对填入海绵中的坯珠进行冷等静压,时间8分钟。
4)脱胶工序:将冷等静压后的坯珠置于脱胶炉中,升温至1200℃时逐渐降温至室温,其中在450℃—1100℃之间保温1小时,12小时可以完成脱胶工序。
5)烧结:氮气气氛中,将所得坯珠置于坩埚中,以15℃/min的升温速度至1750℃,其中在1500℃—1750℃保温4小时,停止加热,冷却至室温,生产陶瓷微珠坯球;其中氮气流速为2L/min。
6)研磨抛光:将所得陶瓷微珠坯球进行研磨和抛光生产陶瓷微珠,陶瓷微珠的球度不超过0.08微米,表面粗糙度不超过0.008微米,方法如下:
a.粗磨:载荷压力15N/珠,所用粗磨研磨剂中,金刚石颗粒的粒度为60um,金刚石颗粒圆度为0.4;
b.精磨:载荷压力2N/珠,所用精磨研磨剂中,金刚石颗粒的粒度为8um,金刚石颗粒圆度为0.6;
c.抛光磨:载荷压力0.3N/珠,所用抛光磨研磨剂中,金刚石颗粒的粒度为0.1um,金刚石颗粒圆度为0.80。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂与研磨基质的质量比例都为1:4,所述研磨基质为水。
所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂按质量百分比组成都为:
金刚石颗粒 25%
分散剂 70%
氧化铈 0.5%
三聚磷酸钠 0.5%
硅酸钠 0.5%
十二烷基磺酸钠 0.5%
三氧化二铬 3%。
所述的分散剂为柠檬酸铵。
Claims (4)
1.一种制作氮化硅陶瓷微珠的生产工艺,其特征在于:
1)陶瓷原料的制备:将陶瓷原料过120目筛后,按照比例配成浆料混合均匀,置于砂磨机中球磨7h,经过喷雾造粒干燥后过筛;
其中,所述的陶瓷原料按照质量百分比,由如下组分组成:
β-Si3N4 70%—90%
Al2O3 5—12%
Y2O3 0.1—5%
TiN 0.1—8%
粘合剂PVA 4.8—5%;
2)注浆滚动成型:采用“行星式”旋转装置,在同一个转盘中将粘合剂PVA注入陶瓷原料,利用粘合剂PVA在陶瓷原料中成球并固化,直接成型致密的粒径在0.1—3mm的坯珠;
3)冷等静压:在200兆帕压力下,对填入海绵中的坯珠进行冷等静压,时间2-10分钟;
4)脱胶工序:将冷等静压后的坯珠置于脱胶炉中,升温至1200℃时逐渐降温至室温,其中在450℃—1100℃之间保温1小时,12小时可以完成脱胶工序;
5)烧结:氮气气氛中,将所得坯珠置于坩埚中,以15℃/min的升温速度至1750℃,其中在1500℃—1750℃保温2-6小时,停止加热,冷却至室温,生产陶瓷微珠坯球;其中氮气流速为2L/min;
6)研磨抛光:将所得陶瓷微珠坯球进行研磨和抛光生产陶瓷微珠,陶瓷微珠的球度不超过0.08微米,表面粗糙度不超过0.008微米;所述研磨抛光方法的步骤依次为粗磨、精磨和抛光磨,其中粗磨、精磨和抛光磨所用的研磨剂按质量百分比组成为:
金刚石颗粒 25%
分散剂 70%
氧化铈 0.5%
三聚磷酸钠 0.5%
硅酸钠 0.5%
十二烷基磺酸钠 0.5%
三氧化二铬 3%。
2.根据权利要求1所述制作氮化硅陶瓷微珠的生产工艺,其特征在于所述的研磨抛光方法如下:
a.粗磨:载荷压力3—20N/珠,所用粗磨研磨剂中,金刚石颗粒的粒度为20—100μm,金刚石颗粒圆度为0.2—0.6;
b.精磨:载荷压力0.5—3N/珠,所用精磨研磨剂中,金刚石颗粒的粒度为1—10μm,金刚石颗粒圆度为0.6—0.7;
c.抛光磨:载荷压力0.1—0.5N/珠,所用抛光磨研磨剂中,金刚石颗粒的粒度为0.01—1μm,金刚石颗粒圆度为0.70—0.85。
3.根据权利要求2所述制作氮化硅陶瓷微珠的生产工艺,其特征在于所述的粗磨研磨剂、精磨研磨剂和抛光磨研磨剂与研磨基质的质量比例都为1:1—1:6,所述研磨基质为水。
4.根据权利要求1所述制作氮化硅陶瓷微珠的生产工艺,其特征在于所述的分散剂为柠檬酸铵。
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