CN106739589B - Printing and processing method - Google Patents
Printing and processing method Download PDFInfo
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- CN106739589B CN106739589B CN201611228224.3A CN201611228224A CN106739589B CN 106739589 B CN106739589 B CN 106739589B CN 201611228224 A CN201611228224 A CN 201611228224A CN 106739589 B CN106739589 B CN 106739589B
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- ink
- printing
- light
- transmitting substrate
- predeterminable area
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/0009—Obliterating the printed matter; Non-destructive removal of the ink pattern, e.g. for repetitive use of the support
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- Manufacture Or Reproduction Of Printing Formes (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of printing and processing methods.Above-mentioned printing and processing method includes the following steps: the full painting plate ink in light-transmitting substrate, forms ink layer;Silk-screen forms printing layer, and ink layer is between light-transmitting substrate and printing layer;Utilize the ink in infrared picosecond laser coarse scan removal predeterminable area;And utilize remaining ink in infrared picosecond laser fine scanning removal predeterminable area.It is processed using the weaker infrared picosecond laser of energy to be used for backlight transmission in predeterminable area laser ablation ink, avoids laser too strong, destroy light-transmitting substrate.The step of removing ink is divided into coarse scan and fine scanning, coarse scan can quickly remove most of ink of predeterminable area, advantageously ensure that processing efficiency.After coarse scan, further laser processing is closer to light-transmitting substrate, and being changed to fine scanning helps to protect light-transmitting substrate, and ink removal is clean, and translucent effect is good.
Description
Technical field
The present invention relates to the technical fields of printing, more particularly to a kind of printing and processing method.
Background technique
In printing industry, the processing program that traditional ink processing method is related to is complex, limits processing efficiency.
For example, with PC (Polycarbonate, polycarbonate), PVC (Polyvinyl chloride, polyvinyl chloride) or PET
(Polyethylene terephthalate, polyethylene terephthalate) transparent membrane is ground, on the surface of ground
Printing ink layer plays the effects of enhancing shading, insulation and adherency gum transition zone, carries out appearance layer again after printing ink layer
Printing, and silk-screen is done in appearance layer surface, reach functional expression and looking display.
If the pattern that surface is formed needs backlight transmission, in conventional manner, when printing ink layer, needs using silk screen
Empty corresponding region is covered, multilayer set sky is often done, there is the problems such as set position is inaccurate, pattern edge is unintelligible, overall efficiency is low.
Using the method for laser ablation ink, pattern edge can be made clear, improve processing efficiency, but general laser ablation is oily
The method destructible substrate film of ink.
Summary of the invention
Based on this, it is necessary in view of the above technical problems, provide a kind of printing and processing method for avoiding damage to substrate.
A kind of printing and processing method, includes the following steps:
The full painting plate ink in light-transmitting substrate forms ink layer;
Silk-screen forms printing layer, and the ink layer is between the light-transmitting substrate and the printing layer;
Utilize the ink in infrared picosecond laser coarse scan removal predeterminable area;And
Remaining ink in the predeterminable area is removed using infrared picosecond laser fine scanning.
In one of the embodiments, in the oil using in infrared picosecond laser coarse scan removal predeterminable area
Ink step in and the step that remaining ink in the predeterminable area is removed using infrared picosecond laser fine scanning
In rapid, the power of the infrared picosecond laser is 20w to 50w;Pulse duration range is 10ps to 500ps.
In one of the embodiments, in the oil using in infrared picosecond laser coarse scan removal predeterminable area
In the step of ink, the percentage of the output energy of the infrared picosecond laser is 50% to 80%;Repetition rate is 1000khz
To 2000khz.
It is removed in the predeterminable area described using infrared picosecond laser fine scanning in one of the embodiments,
In the step of remaining ink, the percentage of the output energy of the infrared picosecond laser is 20% to 40%;Repetition rate
For 500khz to 1000khz.
It is removed in the predeterminable area described using infrared picosecond laser fine scanning in one of the embodiments,
In the step of remaining ink, scanning times are multiple.
In one of the embodiments, in the oil using in infrared picosecond laser coarse scan removal predeterminable area
Ink step in and the step that remaining ink in the predeterminable area is removed using infrared picosecond laser fine scanning
In rapid, in each scanning process, using detergent injection processing face, surface dust is removed.
In one of the embodiments, described in light-transmitting substrate full painting plate ink, formed ink layer the step of in,
Added with enhancing to the auxiliary agent of laser absorption rate in the ink.
In one of the embodiments, described in light-transmitting substrate full painting plate ink, formed ink layer the step of it
Afterwards, and in the silk-screen form printing layer, the step of ink layer is between the light-transmitting substrate and the printing layer it
Before, further include the steps that printing appearance layer on the ink layer.
It is more in the step of painting plate ink complete in light-transmitting substrate in one of the embodiments, formation ink layer
Secondary full painting plate ink forms multilayer ink layer.
In one of the embodiments, in the oil using in infrared picosecond laser coarse scan removal predeterminable area
Ink step in and the step that remaining ink in the predeterminable area is removed using infrared picosecond laser fine scanning
In rapid, the light-transmitting substrate is clamped on fixture, and the distance between the light-transmitting substrate and workbench are more than or equal to 10cm.
Above-mentioned printing and processing method, it is weaker using energy to be used for backlight transmission in predeterminable area laser ablation ink
Infrared picosecond laser is processed, and avoids laser too strong, destroys light-transmitting substrate.The step of removing ink is divided into coarse scan
And fine scanning, coarse scan can quickly remove most of ink of predeterminable area, advantageously ensure that processing efficiency.Roughly
After scanning, further laser processing is closer to light-transmitting substrate, and being changed to fine scanning helps to protect light-transmitting substrate, and oil
Ink removes clean, and translucent effect is good.Short side formula is covered compared to traditional multilayer, the above method is easy to operate, high in machining efficiency,
And the backlight pattern formed, edge clear, effect are good.
Detailed description of the invention
Fig. 1 is the flow diagram of printing and processing method in an embodiment;
Fig. 2 is the flow diagram of printing and processing method in another embodiment;
Fig. 3 is the schematic diagram of laser ablation ink set in an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figure 1, the printing and processing method in an embodiment includes the following steps:
S200, the full painting plate ink in light-transmitting substrate form ink layer.
S400, silk-screen form printing layer, and ink layer is between light-transmitting substrate and printing layer.
S600 utilizes the ink in infrared picosecond laser coarse scan removal predeterminable area.
S800 utilizes remaining ink in infrared picosecond laser fine scanning removal predeterminable area.
Light-transmitting substrate can be PC (Polycarbonate, polycarbonate), PVC (Polyvinyl in the present embodiment
Chloride, polyvinyl chloride) or PET (Polyethylene terephthalate, polyethylene terephthalate), at it
In his embodiment, light-transmitting substrate is also possible to other translucent materials such as glass.Predeterminable area can be the pattern for needing light transmission, symbol
Number or icon, in predeterminable area laser ablation ink, to be used for backlight transmission, using the weaker infrared picosecond laser of energy into
Row processing, avoids laser too strong, destroys light-transmitting substrate.
The step of removing ink is divided into coarse scan and fine scanning, coarse scan can quickly remove predeterminable area
Most of ink, advantageously ensure that processing efficiency.After coarse scan, further laser processing is closer to light-transmitting substrate,
Being changed to fine scanning helps to protect light-transmitting substrate, and ink removal is clean, and translucent effect is good.Compared to traditional multilayer
Short side formula is covered, the printing and processing method of the present embodiment is easy to operate, high in machining efficiency, and the backlight pattern formed, edge are clear
Clear, effect is good.
In one of the embodiments, in step s 200, added with the auxiliary agent enhanced to laser absorption rate in ink.?
In one embodiment, auxiliary agent can be dark dye, deepen the color of ink layer, and the efficiency for absorbing infrared ray can be improved, so that
Laser more efficiently removes ink, and better effect.It in one embodiment, can multiple full version printing oil in step S200
Ink forms multilayer ink layer.The overall thickness of multilayer ink layer can be 0.1mm to 0.7mm.
In one of the embodiments, in step S400, printing layer can be formed by direct silk-screen on ink layer, at it
In his embodiment, other function layer can also be first formed on ink layer, on a functional by printing layer silk-screen later.
In step S600 and step S800, infrared picosecond laser refers to that the optical maser wavelength of sending is 760nm or more, arteries and veins
Width be picosecond laser.In one embodiment, the optical maser wavelength that infrared picosecond laser issues is in 760nm between 900nm.
The power of infrared picosecond laser is 20w to 50w, and pulse duration range is 10ps to 500ps, within this range, can be preferably real
The removal ink of existing greater efficiency, and light-transmitting substrate can be protected not to be damaged.
Further, in one embodiment, in step S600, the percentage of the output energy of infrared picosecond laser is
50% to 80%, repetition rate is 1000khz to 2000khz.In removal ink roughly, using the hundred of higher output energy
Point than with higher repetition rate, more ink can be removed under the premise of not hurting light-transmitting substrate.In one embodiment,
In step S600, scanning times are generally primary, if ink layer is thicker, or repeatedly.It, can be in each scanning process
Using detergent injection processing face, surface dust is removed, guarantees that surface is clean when processing next time.Detergent can use white appliances
Oil, white spirit scientific name normal heptane, structural formula are CH3 (CH2) 5CH3, have fat-solubility and high volatile.Further, white appliances
The injection direction of oil is consistent, and dust flows away to a direction, conducive to cleaning out.
In one embodiment, in step S800, infrared picosecond laser output energy percentage be 20% to
40%, repetition rate is 500khz to 1000khz.In finely removal ink, the position of laser processing is closer from light-transmitting substrate,
The relatively low percentage for exporting energy and lower repetition rate can be used instead, prevent damage light-transmitting substrate.Implement one
In example, in step S800, scanning times are multiple.Thoroughly the ink of predeterminable area can be removed, predeterminable area is more dry
Only, translucent effect is more preferable.In each scanning process, detergent injection processing face can use, remove surface dust, guarantee next
Surface is clean when secondary processing.Detergent can use white spirit, and further, the injection direction of white spirit is consistent, and dust is to one
A direction flows away, conducive to cleaning out.
Referring to fig. 2, in one embodiment, after step S200, and before step S400, ink can also be included in
The step of appearance layer is printed on layer (S300).Specifically, the printing and processing method in the embodiment includes the following steps:
S200, the full painting plate ink in light-transmitting substrate form ink layer.
S300 prints appearance layer on ink layer.
S400, silk-screen form printing layer, and ink layer is between light-transmitting substrate and printing layer.
S600 utilizes the ink in infrared picosecond laser coarse scan removal predeterminable area.
S800 utilizes remaining ink in infrared picosecond laser fine scanning removal predeterminable area.
Appearance layer in step S300 can play the role of protecting ink layer.In step S400, the print of silk-screen formation
Brush layer can be located on appearance layer.In step S600, the appearance layer of predeterminable area can be removed.
Referring also to Fig. 3, step S600 and step S800 can be swashed using shown in Fig. 3 in one of the embodiments,
Light removes ink set 900.Laser ablation ink set 900 includes infrared picosecond laser 920, optic delivery component 940, vibration
Scarnning mirror component 960, fixture 980 and workbench 990.Infrared picosecond laser 920 is located at the side of optic delivery component 940,
Vibration mirror scanning component 960 is located at the lower section of optic delivery component 940, and fixture 980 is located at the lower section of vibration mirror scanning component 960, folder
Tool 980 is fixed on workbench 990, and fixture 980 is for horizontal fixed workpiece to be machined.
The laser beam that infrared picosecond laser 920 issues is incident to vibration mirror scanning component after optic delivery component 940
960, processing is focused to light beam by vibration mirror scanning component 960, makes the workpiece to be machined table that laser beam is fixed in fixture 980
Face forms hot spot, carries out laser processing removal ink.Vibration mirror scanning component 960 carries out oil for that can set corresponding technological parameter
Ink removal, technological parameter include laser frequency, laser power, scanning speed, filling spacing and focal position.
In one embodiment, light-transmitting substrate is clamped on fixture 980, and fixture 980 is vacantly arranged above workbench 990,
Hanging distance between light-transmitting substrate and workbench 990 is more than or equal to 10cm, and workpiece to be machined is avoided to be reflected by workbench 990
Laser influence, improve machining accuracy.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of printing and processing method, which comprises the steps of:
The full painting plate ink in light-transmitting substrate, forms ink layer, and the light-transmitting substrate is polycarbonate or polyvinyl chloride or gathers
Ethylene glycol terephthalate;
Silk-screen forms printing layer, and the ink layer is between the light-transmitting substrate and the printing layer;
Using the ink in infrared picosecond laser coarse scan removal predeterminable area, when coarse scan, is infrared picosecond described
The percentage of the output energy of laser is 50% to 80%;And
Remove remaining ink in the predeterminable area using infrared picosecond laser fine scanning, when the fine scanning described in
The percentage of the output energy of infrared picosecond laser is 20% to 40%, when fine scanning the infrared picosecond laser
With infrared picosecond laser described when being less than the coarse scan at a distance from the light-transmitting substrate at a distance from the light-transmitting substrate.
2. printing and processing method according to claim 1, which is characterized in that described rough using infrared picosecond laser
Scanning removes in the step of ink in predeterminable area and described described pre- using the removal of infrared picosecond laser fine scanning
If in region the step of remaining ink in, the power of the infrared picosecond laser is 20w to 50w;Pulse duration range is 10ps
To 500ps.
3. printing and processing method according to claim 2, which is characterized in that described rough using infrared picosecond laser
Scanning removed in the step of ink in predeterminable area, and repetition rate is 1000khz to 2000khz.
4. printing and processing method according to claim 2, which is characterized in that described fine using infrared picosecond laser
Scanning removed in the step of remaining ink in the predeterminable area, and repetition rate is 500khz to 1000khz.
5. printing and processing method according to claim 1-4, which is characterized in that swashed described using infrared picosecond
Light device fine scanning removed in the step of remaining ink in the predeterminable area, and scanning times are multiple.
6. printing and processing method according to claim 1-4, which is characterized in that swashed described using infrared picosecond
Light device coarse scan removed in the step of ink in predeterminable area and the infrared picosecond laser fine scanning of the utilization is gone
In in the predeterminable area the step of remaining ink, in each scanning process, using detergent injection processing face, table is removed
Flour dirt.
7. printing and processing method according to claim 1-4, which is characterized in that the version complete in light-transmitting substrate
In the step of printing ink, forming ink layer, added with enhancing to the auxiliary agent of laser absorption rate in the ink.
8. printing and processing method according to claim 1-4, which is characterized in that it is described in light-transmitting substrate it is complete
After the step of painting plate ink, formation ink layer, and printing layer is formed in the silk-screen, the ink layer is located at the light transmission
Before the step of between substrate and the printing layer, further include the steps that printing appearance layer on the ink layer.
9. printing and processing method according to claim 1-4, which is characterized in that the version complete in light-transmitting substrate
In the step of printing ink, forming ink layer, multiple full painting plate ink forms multilayer ink layer.
10. printing and processing method according to claim 1-4, which is characterized in that utilize infrared picosecond described
Laser coarse scan removes in the step of ink in predeterminable area and the infrared picosecond laser fine scanning of the utilization
In the step of removing remaining ink in the predeterminable area, the light-transmitting substrate is clamped on fixture, the light-transmitting substrate with
The distance between workbench is more than or equal to 10cm.
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1807112A (en) * | 2004-11-30 | 2006-07-26 | 默克专利股份有限公司 | Laser labeling method on valuable billing |
CN101612860A (en) * | 2008-06-27 | 2009-12-30 | 武汉联合钢铁加工有限公司 | The laser carving method of back surface of silver mirror |
CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
CN102616037A (en) * | 2012-04-06 | 2012-08-01 | 广东兴锐电子科技股份有限公司 | Method for carrying out multi-colour laser carving on surface of silicone rubber keypad |
CN102664980A (en) * | 2012-04-27 | 2012-09-12 | 昆山威茂电子科技有限公司 | Mobile phone keypad fabrication process |
CN103522596A (en) * | 2013-10-18 | 2014-01-22 | 珠海市魅族科技有限公司 | Packaging paper, preparation method of packaging paper and product label |
CN104691201A (en) * | 2014-11-05 | 2015-06-10 | 杭州安费诺飞凤通信部品有限公司 | Process of decorating and processing sapphire glass flakes |
CN105848917A (en) * | 2013-10-14 | 2016-08-10 | 康宁股份有限公司 | Method of printing decorations on substrates |
-
2016
- 2016-12-27 CN CN201611228224.3A patent/CN106739589B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1807112A (en) * | 2004-11-30 | 2006-07-26 | 默克专利股份有限公司 | Laser labeling method on valuable billing |
CN101612860A (en) * | 2008-06-27 | 2009-12-30 | 武汉联合钢铁加工有限公司 | The laser carving method of back surface of silver mirror |
CN102110866A (en) * | 2009-12-24 | 2011-06-29 | 深南电路有限公司 | Manufacturing process of waveguide slot |
CN102616037A (en) * | 2012-04-06 | 2012-08-01 | 广东兴锐电子科技股份有限公司 | Method for carrying out multi-colour laser carving on surface of silicone rubber keypad |
CN102664980A (en) * | 2012-04-27 | 2012-09-12 | 昆山威茂电子科技有限公司 | Mobile phone keypad fabrication process |
CN105848917A (en) * | 2013-10-14 | 2016-08-10 | 康宁股份有限公司 | Method of printing decorations on substrates |
CN103522596A (en) * | 2013-10-18 | 2014-01-22 | 珠海市魅族科技有限公司 | Packaging paper, preparation method of packaging paper and product label |
CN104691201A (en) * | 2014-11-05 | 2015-06-10 | 杭州安费诺飞凤通信部品有限公司 | Process of decorating and processing sapphire glass flakes |
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